2325 http://mops.twse.com.tw http://www.spil.com.tw
SPIL (3)579-5678 3671 E-mailbyronc@spil.com.tw (4)2534-1525 1511 E-mailchien@spil.com.tw 123 123 153 8 (4)2534-1525 (4)2534-1525 (4)2534-1525 (4)721-8888 4 (3)577-3151 1517 (3)578-5599 1-1 (3)578-7799 835 http://www.chinatrust.com.tw (2)2181-1911 33327 http//www.pwc.tw (2)2729-6666 http//www.nasdaq.com SPIL http//www.spil.com.tw
SPIL 2 SPIL 2 PHILOSOPHY To achieve the outer performances by inner operations. (SPIL)(SPIL) SPIL SPIL SPIL Overview 735 NASDAQ
Contents index 1 3 4 35 3 3 4 5 17 31 31 31 32 33 33 35 35 36 37 37 38 38 38 39 39 39 4 4 4 4 4
SPIL 41 55 2 26 41 46 49 5 52 54 55 63 69 69 7 136 2 21 22 22 23 23 25 26 28 28 28 28
SPIL Win customers confidence and create the high-tech future together
Win customers confidence and create the high-tech future together 12 13 12 12693.6646.5 7.3%58.955.95.3% 1.91.824.4% (IC) 11 12 % % 35 145 39 144 % % 174 157 168 151 % 7 6 % % 9 9 1 8 1.82 1.9 1
() 12 4.9%34 () 12358 13 () 1. 13 2. 93 () 1. 2. 3. 4. 5. 6. 2
Win customers confidence and create the high-tech future together 73 5 8 77 2 78 8 82 1 4 ISO 91 2325 84 1 1 12 898 86 7 1.38 88 1 5 QS 9 ISO 141 89 6 9 12 NASDAQSPIL 9 12 () 91 1 2 92 3 8 SONY(Green Partner) ISO/TS 16949 93 2 12 2 OHSAS 181 96 7 97 8 11 QC 8 (IECQ HSPM) CNS1556 98 8 11 99 11 12 1 ISO1464-1 1 9 1 PAS 25 TSV()/2.5D/3DIC 11 8 11 () (AEO) 3 12 8 9 11 1 ISO 51
4
Win customers confidence and create the high-tech future together () (%) (%) 1.6.22 73.8.16 68,674,75 2.2 68,674,75 2.2 1.6.22 73.8.16 43,175,555 1.39 43,675,555 1.4 1.6.22 94.6.13 2,754,751.67 2,754,751.67 1.6.22 73.8.16 12,256,417.39 11,683,417.37 1.6.22 8.6.24 5,391,914.17 4,481,914.14 1.6.22 1.6.22 746,737.2 746,737.2 1.6.22 94.6.13 311,.1 35,.1 1.6.22 94.6.13 146,292. 146,292. Randy Hsiao-Yu Lo 1.6.22 1.6.22 472. 472. 1.6.22 91.6.3 1,133,937.33 1,133,937.33 1.6.22 1.6.22 7,438,972.24 7,438,972.24 1.6.22 1.6.22 11,2,.36 11,2,.36 5
13331 () (%) (%) 641,64.2. 9,463,524.3... 2,64,297.8. 23,659.1. 12,251,189.39... 2,387.... Purdue University Siliconware USA,Inc. 262,44.1. 11,61.... 6
7 Win customers confidence and create the high-tech future together (%) (%) (%) 1.4 2.2.37.2...1.1.2....1...1 43,675,555 68,674,75 11,683,417 516,29 36,668 14,48 23,894 26,39 6,164 32,737 12, 166, 4, 7, 225, 73.8.13 73.8.13 9.5.7 99.1.1 88.9.16 96.7.1 99.2.26 9.9.24 94.8.1 1.3.1 1.4.1 1.4.29 11.1.1 11.1.1 11.1.1 11.1.1 () 9,463,524 641,64 2,64,297 773 78 1,49 65,588.3.2.8.............................
8 () 13331 Microcircuit Technology (S) Pte. Ltd.
Win customers confidence and create the high-tech future together () Randy Hsiao-Yu Lo (1) (2) (3) (4) (5) (6) (7) (8) (9) 3 (1) 27 9
1 () 2 1 3 4 5 6 7 8 9 1 13331 ()
Win customers confidence and create the high-tech future together () (A) (B) (C) (D) ABCD Randy Hsiao-Yu Lo 41,67 41,67 51 51.71%.71% 1,6 (A+B+C+D) 2,, 2,,() ~ 5,,() 5,,() ~ 1,,() 1,,() ~ 15,,() 15,,() ~ 3,,() 3,,() ~ 5,,() 5,,() ~ 1,,() 1,, Randy Hsiao-Yu Lo 9 Randy Hsiao-Yu Lo 9 11
12 121231 (G) ABCDE FG 1.93% 1.53% 3,534 17,15 17,15 66 54,66 48 (E) (F) (H) (I) (A+B+C+D+E+F+G) Randy Hsiao-Yu Lo 9 9 Randy Hsiao-Yu Lo
Win customers confidence and create the high-tech future together () 121231 (A) (B) 13,869 13,869 (C) ABC 9 9.24%.24% (A+B+C) 2,, 2,,() ~ 5,,() 5,,() ~ 1,,() 1,,() ~ 15,,() 15,,() ~ 3,,() 3,,() ~ 5,,() 5,,() ~ 1,,() 1,, 3 3 13
() 121231 (A) (B) (C) (D) 42,398 42,398 1,157 1,157 47,45 47,45 27,271 27,271 ABCD (%) 2.1% 2.1% 1,6 14
Win customers confidence and create the high-tech future together 2,, 2,,() ~ 5,,() 5,,() ~ 1,,() 1,,() ~ 15,,() 15,,() ~ 3,,() 3,,() ~ 5,,() 5,,() ~ 1,,() 1,, 16 16 15
16 11 12 11 12 48,61 56,77 1,959 118,276 48,61 56,77 1,959 118,276.87%.95% 1.8% 2.1%.87%.95% 1.8% 2.1% () 121231 (%).46% 27,271 27,271 ()
Win customers confidence and create the high-tech future together () 127 () () (%) 7 1% 6 1 86% 6 1 86% 7 1% 7 1% 6 1 86% 6 1 86% 7 1% Randy Hsiao-Yu Lo 4 3 57% 143 12321 12 Randy Hsiao- Yu Lo 5 1286 11 Randy Hsiao- Yu Lo 5 NASDAQ 126 17
() 1. 2. 127 (%) 5 71% 7 1% 7 1% () () 121~31239 12 18
Win customers confidence and create the high-tech future together () 19
1.976NASDAQ3 2. 13 1. 126 2. 1825 122 3. () 12 () 89 () 2
Win customers confidence and create the high-tech future together () 1. (1) 1 2 (1) (2) (3) (4) (5) (6) (7) (8) 3 3 65 21
1 2 (2) 3 4 5 6 7 8 (3) 2. (1) 3 (2) 1825136212 (%) 2 1% 2 1% 2 1% 22
Win customers confidence and create the high-tech future together () 23
24 88ISO141 QC-8ISO1464-1 1PAS25(TFBGA) () 94 99ISO1464 96(Carbon Disclosure Project, CDP)1 96 1294/Kpcs ISO51 RoHS 11 11 ()12 97
Win customers confidence and create the high-tech future together QC8(IECQ HSPM) 12(SGS Taiwan Ltd.) GRI 3.1 A+AA 1 AS 28 25
EICC 12 (1) (2) (3) 12 AA1GRI11 213 ()Top 5 (http://www.spil.com.tw) 1211 26
Win customers confidence and create the high-tech future together () () 1. 2. 3. 4. 5. 6. 7. (http://www.spil.com.tw) 27
1. 2. 3. () 1. 2. 2-28
() Win customers confidence and create the high-tech future together 1. () 1332 12 1. 2.3.4.5. 121231 1332 2. 29
() () (1) 1212614 1. 11 2. 11 3. 4. 5. 6. 7. (2) 1. 12 2. 111211 3. 12 4. 5. 6. 6~7 7. 13 8. 13 9. 13 1. 12 11. 12 12. 13. 13 14. 12 15. 16. 13 17. 1213 () () () (CPA) 1 (CIA) 1 (US CPA) 2 3 1 (CCMA) 2 1 3
Win customers confidence and create the high-tech future together 12 2 21,187 1,59 1,59 12 1 1 2 11321 11 11321 15123 31
32 Randy Hsiao-Yu Lo (12,) (9,) (32,) (18,) (41,) (2,) 5, (93,) (35,) 2, 44, 9, 29, 13, 11, 2, 138, 85, 3, 7, 15, 12 331 1. 2. 1%
Win customers confidence and create the high-tech future together (%) (%) 328,687,565 1.55% 22,563,3 6.5% 12,437, 3.29% 94,744, 3.4% 76,594,864 2.46% 68,674,75 2.2% 641,64.2% 66,7, 2.14% 56,112,878 2,754,751 1.8%.67% 43,675,555 1.4% 9,463,524.3% 42,29,463 1.36% (%) SPIL (B.V.I.) Holding Ltd. 128,4 1% Microcircuit Technology (S) Pte. Ltd. 24,39 42.27% Vertical Circuits Inc. 15,71 3.68% 2,367 11.99% 76,52 4.97% ChipMOS Technologies (Bermuda) Ltd. 2,244 7.6% 133, 15.78% 57,81 7.58% Mega Mission Limited Partnership 4.% 6, 33
34 (%) 128,4 24,39 15,71 2,367 76,52 2,244 133, 57,81 1% 42.27% 3.68% 11.99% 4.97% 7.6% 15.78% 7.58% 4.% (%) (%) 121231 12721()
Win customers confidence and create the high-tech future together () () () () () 98.9 1 3,6,, 36,,, 3,116,361,139 31,163,611,39 1%36,228,732 13331 () 3,116,361,139 483,638,861 3,6,, 1/8/9~1/9/9 38,42, 12/6/24 12721() 4 54 23 651 76,32 76,944 24 399,53,689 297,525,638 1,733,462,861 685,841,927 3,116,361,139 % 12.82% 9.55% 55.62% 22.1% 1.% 35
36 98/9/28 982481 () () () () 13331 1 1, 5,1 1,1 15,1 2,1 3,1 4,1 5,1 1,1 2,1 4,1 6,1 8,1 999 5, 1, 15, 2, 3, 4, 5, 1, 2, 4, 6, 8, 1,, 1,,1 27,386 34,592 7,443 2,584 1,269 1,195 59 348 673 325 185 8 56 42 257 76,944 6,34,511 74,741,325 53,447,467 3,577,1 22,438,87 29,7,664 17,398,21 15,795,434 47,111,687 45,118,652 51,999,783 39,142,1 39,22,26 37,73,657 2,66,283,31 3,116,361,139.2% 2.4% 1.72%.98%.72%.93%.56%.51% 1.51% 1.45% 1.67% 1.26% 1.26% 1.21% 83.62% 1.% 12721()
Win customers confidence and create the high-tech future together 12721() 328,687,565 22,563,3 12,437, 94,744, 76,594,864 68,674,75 66,7, 56,112,878 43,675,555 42,29,463 (%) 1.55% 6.5% 3.29% 3.4% 2.46% 2.2% 2.14% 1.8% 1.4% 1.36% 11 12 13331 36.5 39.5 42.3 26.65 3 35.4 32.8 34.18 38.2 19.7 17.42 2.5 (2) 3,78,319 3,98,226 3,116,361 1.82 1.82 1.9 (2) 1.67(1) (2) (2) 17.63 17.99 19.21(1) (2) 5.2%(1) (2) 1 : 11 2 : 13 37
38 1. 5% 2. 121.8 12 1. 2. (1%1% ) 12623,27255,477 3. 12 11 48,13,374 468,588,58 1.82 12 55,476,59 623,272,227 1.9
Win customers confidence and create the high-tech future together 13331 1 (%) 1/8/9~1/9/9 183 38,42, 964,187,864 38,42, () 1/8/9~1/9/938,42,12/6/24 39
() 13331 8967 8967 254,7 8.49 3,,(1) 5 15,, Citibank N.A. Citibank Taiwan Ltd. 54,496,997 (2) 6.5 12 13331 () () () () () 5.6 5.68 6.89 5.62 6.24 1. 89 2. 13331 124,828,7154,496,997 4
Win customers confidence and create the high-tech future together 1. 26 2. 12 (%) 559.6 81% 78. 11% 56. 8% 693.6 1% 3. (SO) (QFP) (QFN) (CSP) (BGA) (FCBGA) (FCCSP) (WLCSP) 8/12 (8 " /12" wafer bumping) 8/12 (8 " /12" wafer sort) (Final Test) (System Level Test) 41
4. (1) FCCSP 2mm x 2mm (2mmx2mm FCCSP) (FC-ETS(Embedded Trace Substrate)+EPS (Embedded Passive Substrate)) (FC-MISBGA (Molded-Interconnection-System BGA)+EPS (Embedded Passive Substrate)-Multi Layer) (2) FCBGA 65mm x 65mm (65mm x 65mm large size FCBGA) (FCBGA with Low Loss Organic Substrate) (FCBGA with EPS(Embedded Passive Substrate)) TIM (FCBGA with High Thermal Performance TIM (Thermal Interface Material)) 2.5D/ 3D (2.5D/ 3D IC) (3) CSP / (Panel-FO/ Panel-FO MCM) (MISBGA) () (FC-QFN(Cu pillar bump)) (4) (/) (MCM-WB-SFCCSP(Cu pillar bump/ Cu wire bonding)) (PoP with Coreless Substrate Technology) (High Bandwidth PoP) (SiP Module with Partition EMI Shielding Technology) (Antenna in SiP Module) (IPD in SiP Module) (SiP Module with Stack Die on Passive Technology) (FO-POP(Fan Out PoP)) (LCI(Low Cost Interposer)-POP) 2.5D/ 3D (2.5D/ 3D IC) 42
Win customers confidence and create the high-tech future together (1) 124um (Wafer Thinning) 4um (4um linear pitch, Cu wire bonding) 4um (Flip Chip with 4um pitch Cu pillar bumping) 22/2/16/14/ (Flip Chip/ Wire Bond technology on 22/2/16/14nm XLK wafer) (SD(Stealth Dicing) Laser Technology) (NCF(Non-Conductive-Film) FC Technology) (TSV) (Si-Interposer Technology) (Organic-Substrate-Interposer Technology) (2) 8/12 (8 /12 Cu pillar bump) 22/2/16/14( Bumping on 22/2/16/14nm XLK wafer) 4um (4um pitch Cu pillar bumping) (3) epopsites (16GHz) sites () 1. 11 12 2. 26IC11 3153711 3. (1) (3D) () () () () 43
(2) (SiP Module)3D IC(Higher I/O Density) (3) I/O 2X nm/1x nm (4) 13 () 1. 123,46,72 1313331834,278 2. (1) FCCSP 3mm x 3mm (3mm x 3mm size FCCSP) (Cu pillar bump FCCSP) (Exposed Die FCCSP) - (FC-ETS(Embedded Trace Substrate)) - (FC-MISBGA (Molded-Interconnection-System BGA)) (2) FCBGA 55mm x 55mm/ 6mm x 6mmRoHS (55mm x 55mm / 6mm x 6mm large size FCBGA) 11mm x 11mm (11mm x 11mm small size FCBGA) (Exposed Die FCBGA) 2.5DIC 45mm x 45mm (45mm x 45mm size FCBGA) (3) CSP (Large size WLCSP) (Ultra-Thin CSP) - (SLP) (EHS-TFBGA) 44
Win customers confidence and create the high-tech future together (4) (WB-PoP) (FC-PoP) -/ (FC Enhanced PoP) (Exposed Die FC Enhanced PoP) (9 die-stacked) 16 (16 die-stacked) (1) 8/1225um (Wafer Thinning) 126um (Wafer Thinning) 28/ (Wire bonding Tech. on 28nm ULK/ELK wafer) 28() (Bumping on 28nm ULK/ELK wafer) 45um (45um pitch, linear Cu wire bonding) 13um (Flip Chip with 13um pitch bumping) 6um (6um pitch Cu pillar Bumping) (TCB(Thermo-Compression-Bonding) Technology) (Integrated Passive Devices) (2) () (Lead free bump) 1um (1um pitch eutectic bump) 1um (1um pitch lead free bump) 4um (4um pitch Cu pillar bump) 2 (Bumping on 2nm ULK/ELK wafer) 8 /12 (8 /12 Ball On Trace WLBGA) (3) 2 5um PoP Direct 11.x GPU/APU USB3. 4G-LTE 45
() 1. (1) (2) (3) 2. (1) (2) () 1. 12 () 151.8 339.8 22. 693.6 (%) 22% 49% 29% 1% 2. 131Gartner-Forecast Analysis: Semiconductor Assembly and Test Services, Worldwide, 4Q13 Update13() 2888.6% 3. (1) (2) (3) (4) 4. (1) (2) (ASP) (3) (A) (B) (C) (D) 46
Win customers confidence and create the high-tech future together () 1. 2. IC () IC () Samsung Techwin Co., Ltd. MK ELECTRON Co., Ltd. HEESUNG METAL LTD. Sumitomo Bakelite Hitachi Chemical Co., Ltd. Kyocera Chemical Corporation. MK ELECTRON Co., Ltd. Heesung Metal LTD. 47
() ()() 1. 11 (%) 12 (%) 4,387,91 17% 3,88,21 15% MK ELECTRON 3,345,348 13% 3,559,939 14% 3,27,687 12% 2,464,11 1% 15,227,729 58% 15,76,59 61% 26,231,665 1% 25,592,66 1% 2. () () 11 12 5,793,57 44,451,6 6,85,591 44,494,789 2,93,673 4,959,235 2,267,257 6,29,184 793 2,978,511 1,8 4,15,742 7,887,523 52,389,346 8,353,856 54,629,715 12-7,759-382 () 11 12 () 2,114,48 12,77,8 3,665,862 4,397,49 2,244,482 14,239,54 3,86,375 41,714,968 162,596 194,623 1,93,43 6,67,47 138,77 214,1 2,232,214 7,583,673 11 788,778 688 4,435,838 96 729,593 914 4,874,84 2,277,15 13,754,21 5,596,98 5,9,357 2,383,285 15,182,747 6,93,53 54,173,445 48
Win customers confidence and create the high-tech future together 13331 11 12 13331 6,452 6,952 6,816 3,321 11,793 3,427 12,416 3,359 12,181 21,566 22,795 22,356 31.62 32.5 32.37 4.65 4.88 5.5.6.7.9 4.16 4.56 4.63 % 47.52 47.61 47.64 42.56 42.55 42.49 5.7 5.19 5.15 49
() 1. 2. 88ISO 141()93 94(24)ISO 141 3. 923SONY (Green Partner) 4. 93OHSAS 18196(27)OHSAS 181 (()) 5. 941226~27 6. 97QC 8 (IECQ HSPM) (EICC)(CNS 1556) 7. 99ISO1464-1() 8. 1PAS 25() 9. 12(Carbon Disclosure Project, CDP) 1. 11 11. 11 12. 11 13. 12() () 1. 2. 3. 4. 5. 1232(VOCs) () 1. 2. 3. 4. 5. () 1. 2. 126,666% 3. 5
Win customers confidence and create the high-tech future together () 1. (GHG) 2. 124,698CO2 3. ISO51 () 1. 2. OHSAS 181(CNS 1556) () RoHS 92 SONY 97QC 8 (IECQ HSPM) RoHS () 1. 568,65 (1) 13 483,65 (2) 14 85, 2. 51
() / EAP() () () 12731595 66 (1) (2) (3) 52
Win customers confidence and create the high-tech future together (1) (2) (3) (4) TOEIC () 6% () 83 84 85 86 87~92 9 94 95~96 98 99TTQS 991 1TTQS 1-11 11 11() 12 12() 12() 53
54 12.4~14.4 1.7~13.7 12.7~14.7 12.8~14.8 1.11~13.11 11.11~13.1 12.1~13.9 () () 11.8~12.6 11.8~12.6 11.12~12.9 13.1~13.6 11.8~12.6 11.12~12.9 12.1~12.8 12.12~13.2 13.1~13.5 1.1~14.12 1.12~ 11.8~12.6 11.8~12.6 11.8~12.6 13.1~13.5 11.8~16.8 12.11~17.12 12.8.~14.2 99.1~14.1 11 11 6 2 Freescale Advanpack 13.1~13.8 13.1~13.8
Win customers confidence and create the high-tech future together 1. (1) 11 12 33,445,67 37,825,131 49,927,46 516,87 7,958,35 91,847,45 55,196,751 355,313 8,432,376 11,89,571 19,224,723 24,365,516 22,53,164 (2) 13,19,616 16,89,471 32,415,339 37,556,132 39,339,635 (2) 59,432,111 31,163,611 16,471,19 62,469,936 31,163,611 15,771,853 12,662,95 8,445,68 14,417,65 (2) 98,764 1,116,867 (964,188) 59,432,111 54,291,318 62,469,936 (2) 1 21333112 55
56 () 2. (1) 11 64,654,558 11,738,959 6,389,668 385,745 6,775,413 5,593,322 5,593,322 (227,47) 5,366,275 5,593,322 5,366,275 1.82 1 () () 12 69,356,192 14,43,518 7,937,33 (481,397) 7,455,933 5,892,283 5,892,283 1,97,817 6,99,1 5,892,283 6,99,1 1.9
Win customers confidence and create the high-tech future together 3. (1) 11 12 29,522,652 32,7,72 43,472,169 59,67 14,379,35 87,883,733 48,981,194 345,33 16,547,179 97,944,396 15,26,87 2,41,663 18,728,791 (2) 13,19,752 16,745,669 28,451,622 33,592,415 35,474,46 (2) 59,432,111 31,163,611 16,471,19 62,469,936 31,163,611 15,771,853 12,662,95 8,445,68 14,417,65 (2) 98,764 1,116,867 (964,188) 59,432,111 54,291,318 62,469,936 (2) 1 21333112 57
58 () 4. (1) 11 57,71,116 1,98,343 5,79,124 1,558,59 6,637,714 5,593,322 5,593,322 (227,47) 5,366,275 5,593,322 5,366,275 1.82 1 () () 12 6,739,52 11,757,44 5,728,935 1,184,554 6,913,489 5,892,283 5,892,283 1,97,817 6,99,1 5,892,283 6,99,1 1.9
59 Win customers confidence and create the high-tech future together (1) 11 33,784,7 5,717,112 49,888,659 1,831,32 91,22,873 18,978,47 24,119,263 12,38,181 496,3 31,512,654 36,653,447 31,163,611 16,471,911 13,281,489 9,64,192 (2,126) 118,35 (36,783) 59,78,219 54,567,426 1 31,651,674 5,34,398 44,144,84 2,59,18 83,69,984 14,882,373 19,253,586 9,532,335 481,46 24,896,114 29,267,327 31,163,611 16,453,527 12,33,11 7,661,888 111,72 375,51 (377,34) 58,794,87 54,423,657 99 31,192,68 6,485,268 42,926,795 1,952,94 82,557,71 16,543,66 21,592,111 4,368,158 349,126 21,26,89 26,39,395 31,163,611 16,453,527 12,244,363 7,195,858 1,788,512 (85,264) (268,568) 61,296,181 56,247,676 98(2) 35,983,154 4,141,187 36,316,125 1,87,121 78,31,587 15,4,988 23,45,2 224,373 15,229,361 23,269,573 31,163,611 16,453,527 14,657,668 6,617,456 767,157 28,577 (169,314) 63,81,226 55,41,14 1 298831 1.
6 () 2. (1) 11 64,654,558 11,777,61 6,445,925 994,667 (619,794) 6,82,798 5,619,62 5,619,62 1.83 1 61,236,892 9,49,417 5,9,151 714,876 (26,899) 5,544,128 4,837,243 4,837,243 1.56 99 63,857,47 9,816,26 6,376,247 34,523 (26,99) 6,389,78 5,626,97 5,626,97 1.81 1 298831 98(2) 59,294,592 11,442,82 8,143,3 2,26,611 (19,53) 1,213,138 8,789,829 8,789,829 2.82
61 Win customers confidence and create the high-tech future together (1) 11 $29,86,38 12,38,792 43,433,276 1,621,94 87,296,316 15,2,639 2,161,432 12,38,181 529,277 27,588,97 32,728,89 31,163,611 16,471,911 13,281,489 9,64,192 (2,126) 118,35 (36,783) 59,78,219 54,567,426 1 $28,6,227 11,155,765 39,48,841 2,374,8 81,178,841 12,327,576 16,698,789 9,532,335 524,6 22,383,971 26,755,184 31,163,611 16,453,527 12,33,11 7,661,888 111,72 375,51 (377,34) 58,794,87 54,423,657 99 $28,533,143 11,282,53 38,324,221 1,82,444 79,96,311 13,898,392 18,946,897 4,368,158 397,58 18,664,13 23,712,632 31,163,611 16,453,527 12,244,363 7,195,858 1,788,512 (85,264) (268,568) 61,296,181 56,247,676 98(2) $34,582,364 7,778,66 33,358,411 1,74,73 77,459,58 14,13,284 22,143,496 274,998 14,378,282 22,418,494 31,163,611 16,453,527 14,657,668 6,617,456 767,157 28,577 (169,314) 63,81,226 55,41,14 1 298831 3.
62 () 4. (1) 11 57,71,116 1,136,816 5,135,213 2,1,997 (553,111) 6,683,99 5,619,62 5,619,62 1.83 1 56,553,391 8,599,556 4,378,392 1,283,19 (211,47) 5,45,175 4,837,243 4,837,243 1.56 99 6,72,283 9,46,751 5,778,44 859,51 (33,751) 6,333,344 5,626,97 5,626,97 1.81 1 298831 98(2) 56,886,354 11,62,913 7,876,257 2,495,248 (162,649) 1,28,856 8,789,829 8,789,829 2.82 98 99 1 11 12
Win customers confidence and create the high-tech future together () (%) 11 35.29 145.46 12 38.64 143.63 (%) 173.97 157.1 35.46 167.87 151. 28.61 () 5.5 4.84 66 75 () 14.4 15.6 () 8.64 25 8.87 23 () 1.37 1.32 ().74.72 (%) 6.54 6.32 (%) 9.49 9.67 (%) 21.74 23.93 (%) 8.65 8.5 () 1.82 1.9 (%) 69.53 78.77 (%) 81.74 8.43 (%) 7.84 1. (1) 5.32 1.3 4.82 1.4 (2%) 1 63
64 () (%) (%) 11 32.37 167.6 193.45 173.89 41.87 5.64 65 14.23 8.55 26 1.4.68 6.76 9.49 21.3 9.69 1.82 77.91 83.21 6.8 5.95 1.3 12 36.22 161.73 171.24 152.53 3.58 5.13 71 15.1 8.79 24 1.31.65 6.55 9.67 22.18 9.7 1.9 83.8 79.35 8.65 5.77 1.4 (2) (1) (%) () (%) (%) (%) (%) (2%) 112 2 () () () () () (%) (%)
Win customers confidence and create the high-tech future together 1. (1) (2) () 2. (1) (2) () (3) 3. (1) () () (2) 365 (3) (4) () () (5) 365 (6) (7) 4. (1) (1) (2) (3) (4) () 5. (1) (2) () (3) ()( ) 6. (1) () (2) () 65
66 () 19.45 173.7 239.81 219.45 278.15 5.95 61 17.3 7.48 21 1.58.78 11.63 14.36 26.13 32.77 14.82 2.82 13.25 112.97 9.76 3.55 1. 98 25.75 152.97 188.54 166.94 544.65 5.79 63 16.26 7.6 22 1.61.79 7.1 9.5 2.46 2.5 8.81 1.81 87.8 98.85 6.24 4.53 1. 99 29.75 154.78 212.68 185.3 63.1 6.1 61 13.54 7.53 27 1.41.74 5.88 8.6 16.33 17.79 7.9 1.56 87.59 9.26 7.26 5.77 1.1 1 (%) (%) 11 34.55 143.81 178.1 16.92 35.69 5.5 66 14.42 8.63 25 1.38.74 6.61 9.48 2.68 21.89 8.69 1.83 7.43 81.74 7.83 5.17 1.3 (%) () () () () () (%) (%) (%) () (%) (%) (%)
67 Win customers confidence and create the high-tech future together () 18.56 189.1 245.21 225.45 338.18 6.3 61 18.4 7.43 2 1.64.76 11.77 14.36 25.27 32.76 15.45 2.82 13.3 115.86 8.99 3.51 1. 98 23.34 171.34 25.3 181.93 928.92 5.82 63 16.82 7.4 22 1.68.76 7.16 9.5 18.54 2.32 9.37 1.81 96.3 11.96 5.34 4.67 1. 99 27.57 174.98 232. 22.39 78.1 6.9 6 13.85 7.44 26 1.46.7 6.5 8.6 14.5 17.49 8.55 1.56 94.14 92.13 6.14 6.12 1.1 1 (%) (%) 11 31.6 165.19 198.8 178.92 42.15 5.64 65 14.21 8.54 26 1.4.69 6.83 9.48 16.48 21.45 9.74 1.83 79.18 83.65 6.78 5.74 1.3 (%) () () () () () (%) (%) (%) () (%) (%) (%)
1. (1) (2) () 2. (1) (2) () (3) 3. (1) () () (2) 365 (3) (4) () () (5) 365 (6) (7) 4. (1) (1) (2) (3) (4) () 5. (1) (2) () (3) ()() 6. (1) () (2) () 68
Win customers confidence and create the high-tech future together 69
1211 (2325) Financial Report
~ 3 ~ 72
~ 4 ~ 73
~ 5 ~ 74
75 ~6 ~
: : ~ 7 ~ 76
~ 8 ~ 77
~9~ 78
~1~ 79
~11~ 8
~12~ 81
~13~ 82
~14~ 83
~15~ 84
85 ~16~
~17~ 86
87 ~18~
~19~ 88
89 ~2~
~21~ 9
~22~ 91
~23~ 92
93 ~24~
~25~ 94
~26~ 95
~27~ 96
~28~ 97
~29~ 98
~3~ 99
~31~ 1
~32~ 11
~33~ 12
13 ~34~
~35~ 14
15 ~36~
~37~ 16
17 ~38~
~39~ 18
19 ~4~
~41~ 11
111 ~42~
~43~ 112
113 ~44~
~45~ 114
~46~ 115
~47~ 116
117 ~48~
~49~ 118
~5~ 119
~51~ 12
121 ~52~
~53~ 122
~54~ 123
~55~ 124
~56~ 125
~57~ 126
127 ~58~
~59~ 128
129 ~6~
~61~ 13
131 ~62~
~63~ 132
133 ~64~
~65~ 134
135 ~66~
1211 (2325) Financial Report
139 ~4 ~
~ 5 ~ 14
~ 6 ~ 141
~8~ 143
~9~ 144
~1~ 145
~11~ 146
~12~ 147
~13~ 148
~14~ 149
~15~ 15
151 ~16~
~17~ 152
153 ~18~
~19~ 154
155 ~2~
~21~ 156
157 ~22~
~23~ 158
~24~ 159
~25~ 16
161 ~26~
~27~ 162
~28~ 163
~29~ 164
~3~ 165
~31~ 166
~32~ 167
~33~ 168
169 ~34~
~35~ 17
171 ~36~
~37~ 172
173 ~38~
~39~ 174
175 ~4~
~41~ 176
177 ~42~
~43~ 178
179 ~44~
~45~ 18
181 ~46~
~47~ 182
183 ~48~
~49~ 184
~5~ 185
~51~ 186
~52~ 187
~53~ 188
~54~ 189
~55~ 19
191 ~56~
~57~ 192
193 ~58~
~59~ 194
195 ~6~
~61~ 196
197 ~62~
~63~ 198
11 12 (%) 33,445,67 37,825,131 4,379,524 11.6 49,927,46 55,196,751 5,269,345 9.5 8,474,437 8,787,689 313,252 3.7 91,847,45 11,89,571 9,962,121 9.8 19,224,723 22,53,164 3,35,441 14.7 13,19,616 16,89,471 3,618,855 21.5 32,415,339 39,339,635 6,924,296 17.6 31,163,611 31,163,611. 16,471,19 15,771,853 (699,166) -4.4 12,662,95 14,417,65 1,754,7 12.2 59,432,111 62,469,936 3,37,825 4.9 1. (2%) 11 2. 2
Win customers confidence and create the high-tech future together () 11 12 () (%) 64,654,558 69,356,192 4,71,634 7.3 (52,915,858) (54,926,74) 2,1,846 3.8 11,738,7 14,429,488 2,69,788 22.9 259 1,3 771 297.7 11,738,959 14,43,518 2,691,559 22.9 (5,349,291) (6,493,188) 1,143,897 21.4 6,389,668 7,937,33 1,547,662 24.2 385,745 (481,397) (867,142) (224.8) 6,775,413 7,455,933 68,52 1. (1,182,91) (1,563,65) 381,559 32.3 5,593,322 5,892,283 298,961 5.3 (2%) 1. 2. 3. Tessera Inc. 4. () 21
22 15,852,492 (A) 17,747,956 (B) 113,399 (D) 16,738,6 (C) 16,975,247 () (A+B-C+D) 16,975,247 (A) 24,676, (B) 23,943, (C) 17,78,247 () (A+B-C) () 12 1. 12 (1) (2) (3) 2. () 36,35,46 5,46,448 13 13 14,157,79 985,213 11 12,631,536 2,347,15 12 13,583,73 1,84,764 13 () () 138 (1) (2) (3)
Win customers confidence and create the high-tech future together 12 () ()317,323 () MISBGA 112,5 Microcircuit Technology (S) Pte. Ltd. 42.27% 6,96 1216 42.27% () WiFiBluetoothGPSFMMobile TV 19,364 () PCBIC12 956,245 () ChipMOS Technologies(Bermuda) Ltd. DRAMIC125,66 2,323,254 () 12119,45 () Mega Mission1239,545 () 1. 2. 3. 12.79% 12 () 12 23
() 42 4~5% () 12 1. (CSR) 2. 3. 12.4.111212999() 4. 12112% 5.17%4.91% 5. () () () () 24
Win customers confidence and create the high-tech future together () 1. 2. 3. () () () Siliconware USA, Inc. (SUI) Tessera Inc. () 1243 () 25
() 1. 1% SPIL(B.V.I.) Holding Ltd. 1% Siliconware USA, Inc. SPIL(Cayman) Holding Ltd. 1% 2. SPIL(B.V.I.) Holding Ltd. 2.12 B.V.I. US$ 128,4 Siliconware USA, Inc. 1996.3 San Jose, CA USA US$ 1,25 SPIL(Cayman) Holding Ltd. 22.1 Cayman US$ 13,2 21.12 US$ 13, 26
Win customers confidence and create the high-tech future together 3. 3693 4. 5. 121231 SPIL (B.V.I.) Holding Ltd. 128,4 1% Siliconware USA, Inc. Randy Hsiao-Yu Lo 1,25 1% Randy Hsiao-Yu Lo SPIL (Cayman) Holding Ltd. 13,2 1% () 1% 13, 27
() () () () () SPIL (B.V.I.) Holding Ltd. 3,827,64 8,67,656 65 8,67,6 (694) 1,53,716 (1) Siliconware USA, Inc. USD 1,25 USD 7,318 USD 1,818 USD 5,5 USD 13,211 USD 677 USD 374.3 (2) SPIL (Cayman) Holding Ltd. 3,881,262 8,435,557 1 8,435,457 (1) 1,522,877 (1) () RMB 973,494 RMB 2,55,46 RMB 825,272 RMB 1,725,188 RMB 1,837,22 RMB 397,412 RMB 317,323 (1) 1 2 28
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