附件 7 版本号 :FH-2012-003 风华高科 一 概述 电容器及介质种类 : 高频类 : 此类介质材料的电容器为 Ⅰ 类电容器, 包括通用型高频 COG COH 电容器和温度补偿型高频 HG LG PH RH SH TH UJ SL 电容器 其中 COG COH 电容器电性能最稳定, 几乎不随温度 电压和时间的变化而变化, 适用于低损耗, 稳定性要求高的高频电路,HG LG PH RH SH TH UJ SL 电容器容量随温度变化而相应变化, 适用于低损耗 温度补偿型电路中 X7R X5R: 此类介质材料的电容器为 Ⅱ 类电容器, 具有较高的介电常数, 容量比 Ⅰ 类电容器高, 具有较稳定的温度特性, 适用于容量范围广, 稳定性要求不高的电路中, 如隔直 耦合 旁路 鉴频等电路中 Y5V: 此类介质材料的电容器为 Ⅱ 类电容器, 是所有电容器中介电常数最大的电容器, 但其容量稳定性较差, 对温度 电压等条件较敏感, 适用于要求大容量, 温度变化不大的电路中 Z5U: 此类介质材料的电容器为 Ⅱ 类电容器, 其温度特性介于 X7R 和 Y5V 之间, 容量稳定性较差, 对温度 电压等条件较敏感, 适用于要求大容量, 使用温度范围接近于室温的旁路, 耦合等, 低直流偏压的电路中 SUMMARY Types of Dielectric Material and Capacitor HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as ClassⅠcapacitor, including high frequency COG COH capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH, TH, UJ, SL. The electrical properties of COG COH capacitor are the most stable one and change invariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required, HG,LG,PH,RH, SH,TH,UJ,SL capacitor s capacitance changes with temperature.they are suited for applications where low-losses and temperature compensating circuits. X7R X5R:X7R X5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class Ⅱ capacitor whose capacitance is higher than that of class Ⅰ. These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc. Y5V:The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc. Z5U:The capacitor made of this kind of material is considered as ClassⅡ capacitor, whose temperature characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature. 第 1 页共 25 页
二 尺寸及结构 DIMENSIONS AND STRUCTURE 尺寸 DIMENSIONS L L W W T 英制表示 British expression WB 型号 Type 尺寸 Dimensions (mm) 公制表示 Metric expression L W T WB 0201 0603 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.10 0402 1005 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10 0603 1608 1.60±0.10 0.80±0.10 0.80±0.10 0.30±0.10 0805 2012 2.00±0.20 1.25±0.20 1206 3216 3.20±0.30 1.60±0.30 0.55 0.80±0.20 1.00±0.20 1.25±0.20 0.80±0.20 1.00±0.20 1.25±0.20 1.60±0.30 0.50±0.20 0.60±0.30 1210 3225 3.20±0.30 2.50±0.30 2.80 0.80±0.30 1808 4520 4.50±0.40 2.00±0.20 2.20 0.80±0.30 1812 4532 4.50±0.40 3.20±0.30 3.50 0.80±0.30 2220 5750 5.70±0.40 5.00±0.40 3.50 1.00±0.40 2225 5763 5.70±0.50 6.30±0.50 6.20 1.00±0.40 3012 7632 7.60±0.50 3.20±0.30 8.10 1.00±0.40 3035 7690 7.60±0.50 9.00±0.50 8.10 1.00±0.40 备注 : 可根据客户的特殊要求设计符合客户需求的产品 Note:We can design according to customer special requirements WB T 结构 STRUCTURE 序号 NO W L 1 1 2 3 4 5 2 3 4 5 名称 Name 陶瓷介质 Ceramic dielectric 内电极 Inner electrode 外电极 Substrate electrode 镍层 Nickel Layer 锡层 Tin Layer 第 2 页共 25 页
三 型号规格表示方法 HOW TO ORDER 0805 CG 101 J 500 N T 1 2 3 4 5 6 7 说明 NOTES: 1 尺寸 DIMENSIONS 尺寸规格 SizeCode 0201 0402 0603 0805 1206 1210 1808 1812 2220 2225 3035 长 宽 (L W) inch 0.02 0.01 0.04 0.02 0.06 0.03 0.08 0.05 0.12 0.06 0.12 0.10 0.18 0.08 0.18 0.12 0.22 0.20 0.22 0.25 0.30 0.35 长 宽 (L W) mm 0.60 0.30 1.00 0.50 1.60 0.80 2.00 1.25 3.20 1.60 3.20 2.50 4.50 2.00 4.50 3.20 5.70 5.00 5.70 6.30 7.60 9.00.2 介质种类 DIELECTRIC STYLE 介质种类 (DielectricCode) CG CH HG LG PH RH SH TH UJ SL X B E F 介质材料 (Dielectric) COG COH HG LG PH RH SH TH UJ SL X5R X7R Z5U Y5V 3 标称容量 NOMINAL CAPACITANCE 表示方式 实际值 (Express Method) (Actual Value) 0R5 0.5 1R0 1.0 102 10 10 2 224 22 10 4 单位 (unit):pf 注 : 头两位数字为有效数字, 第三位数字为 0 的个数 ;R 为小数点 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point. 4 容量误差 CAPACITANCE TOLERANCE 代码 B C D F G J K M S Z (Code) 误差 ± ± ±0.5pF ±1.0% ±2.0% ±5.0% ±10% ±20% +50% +80% (Tolerance) 0.10pF 0.25pF -20% -20% 备注 :B C D 级误差适用于容量 10pF 的产品. Note:These capacitance tolerance B, C, D are just applicable the capacitance that equals to or less than 10pF. 第 3 页共 25 页
5 额定电压 RATED VOLTAGE 单位 (unit):v 表示方式 实际值 (Express Method) (Actual Value) 注 : 头两位数字为有效数字, 第三位数字为 0 的个数 ; 6R3 6.3 R 为小数点 500 50 10 0 Note: the first two digits are significant; third digit 201 20 10 1 denotes number of zeros; R=decimal point. 102 10 10 2 6 端头材料 TERMINAL MATERIAL STYLES 端头类别 (Termination Styles) 表示方式 (Express Method) 纯银端头 (Silver Solderable Termination) S 纯铜端头 (Copper Solderable Termination) C 三层电镀端头 (Nickel Barrier Termination) N 7 包装方式 PACKAGE STYLES B T 散包装 (Bulk Bag) 编带包装 (Taping Package) 四 温度系数 / 特性 Temperature Coefficient /Characteristics 介质种类 Dielectric 参考温度点 Reference Temperature Point 标称温度系数 Temperature Coefficient 工作温度范围 Operation Temperature Range COG 20 C 0±30 ppm/ -55 ~125 COH 20 C 0±60 ppm/ -55 ~125 HG 20 C -33±30 ppm/ -25 ~85 LG 20 C -75±30 ppm/ -25 ~85 PH 20 C -150± 60 ppm/ -25 ~85 RH 20 C -220± 60 ppm/ -25 ~85 SH 20 C -330± 60 ppm/ -25 ~85 TH 20 C -470± 60 ppm/ -25 ~85 UJ 20 C -750± 120 ppm/ -25 ~85 SL 20 C -1000~+140 ppm/ -25 ~85 X7R 20 C ±15% -55 ~125 X5R 20 C ±15% -55 ~85 Z5U 20 C -56%~+22% 10 ~85 Y5V 20 C -80%~+30% -25 ~85 备注 :Ⅰ 类电容器标称温度系数和允许偏差是采用温度在 20 C 和 85 C 之间的电容量变化来确定的, 而 Ⅱ 类电容器标称温度系数是按照工作范围之间的电容量相对 20 C 的电容量变化来确定的 Note : Nominal temperature coefficient and allowed tolerance of class Ⅰ are decided by the changing of the capacitance between 20 C and 85 C. Nominal temperature coefficient of class Ⅱ are decided by the temperature of 20 C.. 第 4 页共 25 页
五 容量范围及其电压 Capacitance Range and Operating Voltage 尺寸规格 Size Code 0201 *0402 *0603 *0805 额定电压 容量范围 Capacitance Rated Voltage COG(NPO)(PF) X7R(PF) X5R(uF) Y5V (Z5U)(PF) 6.3V 0.015 uf~0.22uf 10,000~100,000 10V 100~10,000 0.015 uf~0.1 uf *16V 100~10,000 10,000 *25V 100~10,000 50V 0.5~100 4V 0.1uF~4.7uF 6.3V 100~100,000 0.1uF~4.7uF 1,000~1,000,000 10V 100~100,000 0.1uF~2.2uF 1,000~470,000 16V 100~47,000 0.047uF~1uF 1,000~220,000 25V 100~22,000 0.022uF~0.1uF 1,000~220,000 50V 0.1~1,000 100~4,700 0.0047uF~0.047uF 1,000~68,000 4V 150~470,000 0.47uF~10uF 6.3V 150~470,000 0.47uF~10uF 1,000~10,000,000 10V 150~470,000 0.47uF~10uF 1,000~2,200,000 16V 150~470,000 0.47uF~4.7uF 1,000~2,200,000 25V 150~470,000 0.47uF~2.2uF 1,000~1,000,000 50V 0.1~10,000 150~470,000 1,000~1,000,000 4V 150~1,000,000 1uF~22uF 6.3V 150~1,000,000 1uF~22uF 1,000~22,000,000 10V 150~1,000,000 1uF~22uF 1,000~22,000,000 16V 150~1,000,000 1uF~10uF 1,000~10,000,000 25V 150~1,000,000 1uF~2.2uF 1,000~4,700,000 50V 0.3~22,000 150~1,000,000 1,000~2,200,000 4V 200~2,200,000 2.2uF ~100uF 6.3V 200~2,200,000 2.2uF~47uF 1,000~47,000,000 *1206 10V 200~2,200,000 2.2uF~22uF 16V 200~2,200,000 2.2uF~10uF 1,000~22,000,000 25V 200~1,500,000 1.5uF~4.7uF 1,000~10,000,000 50V 0.3~100,000 200~1,000,000 1.0uF ~2.2uF 1,000~4,700,000 第 5 页共 25 页
尺寸规格 Size Code 额定电压 Rated Voltage 容量范围 Capacitance COG(NPO)(PF) X7R(PF) X5R(uF) Y5V (Z5U)(PF) 6.3V 47uF~100uF 4,700~100,000,000 10V 3.3uF~47uF 4,700~47,000,000 *1210 16V 220~3,300,000 3.3uF~22uF 4,700~47,000,000 25V 220~2,200,000 2.2uF~10uF 4,700~22,000,000 50V 10~100,000 220~1,500,000 4,700~10,000,000 6.3V 220~4,700,000 4.7uF~100uF 4,700~100,000,000 10V 220~4,700,000 4.7uF~47uF 4,700~47,000,000 *1808 16V 220~4,700,000 4.7uF~47uF 4,700~47,000,000 25V 220~4,700,000 4,700~22,000,000 50V 10~100,000 220~1,000,000 4,700~10,000,000 6.3V 10uF~100uF 10,000~100,000,000 10V 10uF~100uF 10,000~100,000,000 *1812 16V 470~6,800,000 6.8uF~33uF 10,000~47,000,000 25V 470~6,800,000 6.8uF~22uF 10,000~22,000,000 50V 10~220,000 470~1,000,000 10,000~10,000,000 6.3V 100uF *2220 2225 10V 68uF~100uF 16V 470~12,000,000 10,000~100,000,000 25V 470~12,000,000 10,000~47,000,000 50V 10~120,000 470~3,300,000 10,000~22,000,000 6.3V 10uF~100uF 10V 10uF~100uF *3035 16V 470~18,000,000 10uF~47uF 10,000~100,000,000 25V 470~10,000,000 10uF~22uF 10,000~47,000,000 50V 10~47,000 470~4,700,000 10,000~22,000,000 备注 : 可根据客户的特殊要求设计符合客户需求的产品 Note:We can design according to customer special requirements. 第 6 页 共 25 页
六 高 Q 值 COG 电容器 Hi-Q COG MLCC 应用 : 适合于射频 RF 电路及要求 Hi-Q 低 ESR 高频率响应的微波电路中 CQ CG 电容器说明 : 下述 Q 值标准是相对通用客户而制定的, 对要求更高 Q 值产品的客户, 可专门设计和生产 使用频率在 1MHz~2.4GHz 之间, 对要求更高频率产品的客户, 可根据客户的要求另外专门设计 CQ 比 CG 相对可应用频率略高, 请客户依需选定 Application: Hi-Q COG capacitors are ideally suited for RF and microwave application requiring high Q, low ESR, and high resonant frequency Note for CQ and CG: The following Q value is just confirmed by general customer. If there is a higher requirement for Q value requirements, we can design and produce according to the special requirements For the customer whose requirements for frequency is between 1MHz and 2.4GHz or higher frequency, we can design it according to their requirements The frequency of CQ is a little higher than that of CG. Please choose them according to your requirements CQ 电容器的容量值及其 Q 值 CQ Capacitance value and Q value 容量 Capacitance (pf) 300MHz 时的 Q 值 Qvalueat300MHz 容量 Capacitance 300MHz 时的 Q 值 Qvalueat300MHz 0805 0603 (pf) 0805 0603 (pf) 0805 0603 容量 Capacitance 300MHz 时的 Q 值 Qvalueat300MHz 4.7 1000 800 12 400 320 30 150 120 5.2 900 720 13 375 300 33 140 112 5.6 850 680 14 350 280 36 130 104 6.2 800 640 15 325 260 39 120 96 6.8 700 560 16 300 240 43 110 88 7.5 650 520 18 250 200 47 100 80 8.2 575 460 20 225 180 56 80 80 9.1 525 420 22 215 172 62 80 80 10 500 400 24 200 160 68 80 80 11 450 360 27 175 140 82 80 80 第 7 页共 25 页
七 中高压电容器 HIGH VOLTAGE MLCC 中高压多层片状陶瓷电容器是在多层片状陶瓷电容器的工艺技术 设备基础上, 通过采用特殊工艺制作的一种具有良好高压可靠性的产品, 该产品适合于表面贴装, 适合于多种直流高压线路, 可以有效的改善电子线路的性能 应用范围 模拟或数字调制解调器 局域网 / 广域网接口界面 日光灯启动辉器照明电路 倍压电器 直流变送器 背光源驱动电路 Middle & high voltage MLCC is a kind of special design special technology MLCC that bases on the technology of general MLCC. This kind of MLCC has stable high voltage reliability and suitable to SMT. Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the performance of the circuit. APPLICATIONS Analog & Digital Modems LAN/WAN Interface Lighting Ballast Circuits Voltage Multipliers DC-DC Converters Back-lighting Inverters 容量范围及其电压单位 /unit: pf 尺寸规格工作电压容量范围 Capacitance Size Code Rated Voltage NPO X7R Y5V 0603 100V 0.5~1,000 150~47,000 2,200~100,000 200V 0.5~1,000 150~10,000 1,000~68,000 250V 0.5~1,000 150~10,000 1,000~68,000 0805 1206 100V 0.5~4,700 150~100,000 10,000~100,000 200V 0.1~4,700 150~33,000 10,000~56,000 250V 0.1~3,300 150~33,000 10,000~56,000 500V 0.1~560 150~12,000 --------- 630V 0.1~560 150~12,000 --------- 1000V 0.1~100 --------- --------- 100V 0.5~5,600 150~470,000 15,000~470,000 200V 0.1~4,700 150~120,000 10,000~220,000 250V 0.1~2,700 150~100,000 10,000~220,000 500V 0.1~2,700 150~33,000 ---------- 630V 0.1~1,500 150~33,000 ---------- 1000V 0.1~1,000 150~10,000 ---------- 2000V 0.1~470 150~2,700 ----------- 第 8 页共 25 页
容量范围及其电压 单位 /unit: pf 尺寸规格 工作电压 容量范围 Capacitance Size Code Rated Voltage NPO X7R Y5V 100V 1.0~6,800 150~1,000,000 15,000~1,000,000 200V 1.0~4,700 150~330,000 15,000~470,000 250V 1.0~3,300 150~220,000 15,000~470,000 500V 1.0~2,700 150~68,000 ---------- 1210 630V 1.0~2,000 150~68,000 ---------- 1000V 1.0~1,200 150~22,000 ----------- 2000V 1.0~680 150~10,000 ----------- 3000V ----------- 150~680 4000V ----------- 150~680 100V 2.0~4,700 150~1,000,000 150,000~1,000,000 200V 2.0~4,700 150~220,000 10,000~390,000 250V 2.0~4,700 150~220,000 10,000~390,000 500V 2.0~4,700 150~100,000 -------- 1808 630V 2.0~4,700 150~100,000 -------- 1000V 2.0~4,700 150~22,000 --------- 2000V 2.0~2,000 150~10,000 --------- 3000V 2.0~1,000 150~4,700 --------- 4000V 2.0~470 150~2,200 ---------- 5000V 2.0~33 ----------- ---------- 100V 3.0~10,000 150~2,200,000 150,000~2,200,000 200V 3.0~8,200 150~1,000,000 100,000~470,000 250V 3.0~6,800 150~820,000 100,000~470,000 500V 3.0~4,700 150~220,000 ---------- 1812 630V 3.0~4,700 150~220,000 ---------- 1000V 3.0~4,700 150~56,000 ---------- 2000V 2.0~2,000 150~12,000 ---------- 3000V 2.0~1,000 150~4,700 ---------- 4000V 3.0~470 150~3,300 --------- 5000V 3.0~68 ---------- ---------- 第 9 页共 25 页
尺寸规格 工作电压 容量范围 Capacitance Size Code Rated Voltage NPO X7R Y5V 100V 5.0~27,000 150~3,300,000 250,000~3,300,000 200V 5.0~12,000 150~2,200,000 220,000~2,200,000 250V 5.0~12,000 150~1,200,000 220,000~2,200,000 500V 5.0~6,800 150~470,000 ---------- 2220 2225 630V 5.0~6,800 150~470,000 ---------- 1000V 5.0~3,900 150~56,000 ---------- 2000V 5.0~1,000 150~47,000 ---------- 3000V 5.0~1,000 150~12,000 ---------- 4000V 5.0~1,000 150~8,200 ---------- 5000V 5.0~120 ----------- ---------- 100V 5.0~27,000 150~3,300,000 15,000~1,500,000 200V 5.0~12,000 150~2,200,000 15,000~1,000,000 250V 5.0~12,000 150~1,200,000 ---------- 500V 5.0~6,800 150~1,000,000 ---------- 3012 630V 5.0~6,800 150~470,000 ---------- 1000V 5.0~3,900 150~56,000 ----------- 2000V 5.0~1,000 150~47,000 ----------- 3000V 5.0~1,000 150~12,000 4000V 5.0~1,000 150~10,000 100V 5.0~27,000 150~3,300,000 10,000~2,200,000 200V 5.0~22,000 150~2,200,000 10,000~2,200,000 250V 5.0~22,000 150~2,200,000 10,000~2,200,000 3035 500V 5.0~22,000 150~1,000,000 -------- 630V 5.0~6,800 150~470,000 -------- 1000V 5.0~3,900 150~56,000 --------- 2000V 5.0~1,000 150~47,000 --------- 备注 : 可根据客户的特殊要求设计符合客户需求的产品 Note:We can design according to customer special requirements. 第 10 页共 25 页
中高压电容器介质耐电强度的测试方法 : Measurement method of dielectric withstanding voltage for high voltage MLCC 额定电压范围 Rated voltage range 100V Vr<500V 500V Vr 1000V 1000V<Vr 2000V 2000V<Vr 5000V 八 可靠性测试 项目 Item 容量 Capacitance 损耗角正切 (DF, tanδ) Dissipation Factor Ⅰ 类 ClassⅠ Ⅱ 类 Class Ⅱ Ⅰ 类 ClassⅠ Reliability Test 技术规格 Technical Specification 耐电性能的测试方法 Measuring Method 施加额定电压的 200%, 5 秒, 最大电流不超过 50mA Force 200%Rated voltage for 5 second. Max..current should not exceed 50 ma. 施加额定电压的 150%, 5 秒, 最大电流不超过 50mA Force 150%Rated voltage for 5 second. Max..current should not exceed 50 ma. 施加额定电压的 120%, 5 秒, 最大电流不超过 50mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 50 ma. 施加额定电压的 120%, 5 秒, 最大电流不超过 10mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 10 ma. 应符合指定的误差级别 Should be within the specified tolerance. 应符合指定的误差级别 Should be within the specified tolerance. 标称容量 Capacitance 测试方法 Test Method and Remarks 测试频率 Measuring Frequency 测试电压 Measuring Voltage 1000pF 1MHZ±10% 1.0±0.2Vrms >1000 pf 1KHZ±10% 测试温度 : 25 ±3 Test Temprature: 25 ±3 C 10µF: 测试频率 : 1KHZ±10% 测试电压 : 1.0±0.2Vrms Test Frequency: 1KHZ±10% Test Voltage: 1.0±0.2Vrms C>10µF X7R X5R Y5V: 测试频率 : 120±24 HZ 测试电压 :0.5±0.1Vrms Test Frequency: 120±24 HZ Test Voltage: 0.5±0.1Vrms Z5U: 测试频率 :1±0.1KHZ 测试电压 :0.5±0.05Vrms Test Frequency: 1±0.1KHZ Test Voltage: 0.5±0.05Vrms 测试频率标称容量 DF Measuring Capacitance Frequency 0.56% Cr<5 pf 1MHZ±10% 1.5[(150/Cr)+7] 10-4 5pF Cr<50 pf 1MHZ±10% 0.15% 50pF Cr 1000 pf 1MHZ±10% 0.15% >1000 pf 1KHZ±10% 测试电压 Measuring Voltage 1.0±0.2Vrms 第 11 页共 25 页
项目 Item 损耗角正切 (DF, tanδ) Dissipation Factor 绝缘电阻 (IR) Insulation Resistance 介质耐电强度 (DWV) Dielectric Withstanding Voltage X7R/ X5R Ⅱ 类 Class Ⅱ Y5V Z5U 技术规格 Technical Specification 25V 16V 10V 6.3V 50V 2.5% 3.5% ( C < 0.47µF) 10.0% ( C 0.47µF) 3.5% ( C < 0.47µF) 10.0% ( C 0.47µF) 3.5% (C < 0.15µF) 10.0% (C 0.15µF) 5.0% ( C < 0.15µF) 10.0% ( C 0.15µF) 25V 16V 10V 6.3V 7.0% (C<1.0µF) 9.0% (C 1.0µF) 15% 15% 15% Ⅰ 类 ClassⅠ C 10 nf, Ri 50000MΩ C>10 nf, Ri CR 500S X7R/ C 25 nf, Ri 10000MΩ X5R C>25 nf, Ri CR>100S Ⅱ 类 Class Ⅱ Y5V C 25 nf, Ri 4000MΩ Z5U C>25 nf, Ri C R>100S 不应有介质被击穿或损伤 No breakdown or damage. 测试方法 Test Method and Remarks C 10µF 测试频率 : 1KHZ±10% 测试电压 : 1.0±0.2Vrms Test Frequency: 1KHZ±10% Test Voltage: 1.0±0.2Vrms C>10µF X7R X5R Y5V 测试频率 : 120±24 HZ 测试电压 :0.5±0.1Vrms Test Frequency: 120±24HZ Test Voltage: 0.5 ±0.1Vrms Z5U: 测试频率 :1±0.1KHZ 测试电压 :0.5±0.05Vrms Test Frequency: 1±0.1KHZ Test Voltage: 0.5±0.05Vrms 测试电压 : 额定电压 ( 最高 500V) 测试时间 : 60±5 秒测试湿度 : 75% 测试温度 : 25 ±3 测试充放电电流 : 50mA Measuring Voltage: Rated Voltage ( Max 500V) Duration: 60±5s Test Humidity: 75% Test Temprature: 25 ±5 Test Current: 50mA 测量电压 : Ⅰ 类 :300% 额定电压 Ⅱ 类 :250% 额定电压时间 :1~5 秒充 / 放电电流 : 不应超过 50mA ( 这部分说明不包括中高压 MLCC) Measuring Voltage: ClassⅠ:300% Rated voltage ClassⅡ:250% Rated voltage Duration: 1~5s Charge/ Discharge Current: 50mA max. (This method excludes high-voltage MLCC) 第 12 页共 25 页
项目 Item 可焊性 Solderability 耐焊接热 Resistanceto SolderingHeat 抗弯曲强度 Resistance to Flexure of Substrate (Bending Strength) 上锡率应大于 95% 外观 : 无可见损伤. 技术规格 Technical Specification At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. 项目 Item Δ C/C DF IR NPO 至 SL NPOtoSL X7R/ X5R ± 0.5% 或 ± 0.5PF, 取较大值 -5~+10% -10~+20% ±0.5%or ±0.5PF, whicheverislarger 同初始标准 Same to initial value. 同初始标准 Same to initial value. 外观 : 无可见损伤上锡率 : 95% Appearance:No visible damage.at least 95% of the terminal electrode is covered by new solder. 外观 : 无可见损伤. Appearance: No visible damage. ΔC/C ±10% 测试方法 Test Method and Remarks 将电容在 80~120 的温度下预热 10~30 秒. Preheating conditions:80 to 120 ; 10~30s. 有铅焊料 :(Sn/Pb:63/37) 浸锡温度 :235±5 浸锡时间 :2±0.5s SolderTemperature:235±5 Duration:2±0.5s 无铅焊料 : 浸锡温度 :245±5 浸锡时间 :2±0.5s SolderTemperature:245±5 Duration:2±0.5s Y5V Z5U 将电容在 100~200 的温度下预热 10±2 分钟. 浸锡温度 : 265±5 浸锡时间 : 10±1s 然后取出溶剂清洗干净, 在 10 倍以上的显微镜底下观察. 放置时间 :24±2 小时放置条件 : 室温 Preheatingconditions:100to200 ;10±2min. Solder Temperature: 265±5 Duration: 10±1s Clean the capacitor with solvent and examine it with a 10X(min.) microscope. Recovery Time: 24±2h Recovery condition: Room temperature 试验基板 :Al2O3 或 PCB 弯曲深度 :1mm 施压速度 :0.5mm/sec. 单位 :mm 应在弯曲状态下进行测量 T=10 45±2 45±2 Test Board: Al 2O 3 or PCB Warp: 1mm Speed: 0.5mm/sec. Unit: mm The measurement should be made with the board in the bending position. 第 13 页共 25 页
项目 Item 端头结合强度 Termination Adhesion 温度循环 Temperature Cycle 潮湿试验 Moisture Resistance 技术规格 Technical Specification 外观无可见损伤 No visible damage. ΔC/C: Ⅰ 类 : ±1% 或 ±1pF, 取两者中最大者 Ⅱ 类 : B,X: ±10% E,F: ±20% ClassⅠ: ±1% or ±1pF, whichever is larger. ClassⅡ: B,X: ±10% E,F: ±20% Δ C/C DF IR Ⅰ 类 : ±2% 或 ±1pF, 取两者之中较大者 Ⅱ 类 : B,X: ±10% E,F: ±30% ClassⅠ: ±2% or ±1pF, whichever is larger. ClassⅡ: B,X: ±10% E,F: ±30% 2 倍初始标准 Not more than twice of initial value. Ⅰ 类 :Ri 2500MΩ 或 Ri CR 25S 取两者之中较小者. ClassⅠ: Ri 2500MΩ 或 Ri C R 25S whichever is smaller. Ⅱ 类 :Ri 1000MΩ 或 Ri C R 25S 取两者之中较小者. ClassⅡ: Ri 1000MΩ 或 Ri CR 25S whichever is smaller. 外观 : 无损伤 Appearance: No visible damage. 测试方法 Test Method and Remarks 施加的力 :5N 时间 :10±1S Applied Force: 5N Duration: 10±1S 预处理 (2 类 ): 上限类别温度,1 小时 恢复 :24±1h 初始测量 循环次数 :5 次, 一个循环分以下 4 步 : 阶段 温度 ( ) 时间 ( 分钟 ) 第 1 步 NPO/X7R: -55 下限温度 ( Y5V:-25 Z5U:+10) 30 第 2 步 常温 (+20) 2~3 第 3 步 上限温度 ( NPO/X7R:+125 Y5V/Z5U: +85) 30 第 4 步 常温 (+20) 2~3 试验后放置 ( 恢复 ) 时间 :24±2h Preheating conditions: up-category temperature, 1h Recovery time: 24±1h Initial Measurement Cycling Times: 5 times, 1 cycle, 4 steps: Step Temperature( ) Time (min.) 1 NPO/X7R: -55 Low- category temp. ( Y5V:-25 Z5U:+10) 30 2 Normal temp. (+20) 2~3 3 NPO/X7R: +125 Up- category temp. ( Y5V/Z5U: +85) 30 4 Normal temp. (+20) 2~3 Recovery time after test: 24±2h 温度 :40±2 湿度 :90~95%RH 时间 :500 小时放置条件 : 室温放置时间 :24 小时 (Ⅰ 类 );48 小时 (Ⅱ 类 ) Temperature:40±2 Humidity:90~95%RH Duration:500h Recovery conditions:room temperature Recovery Time:24h (Class1) or 48h (Class2) 第 14 页共 25 页
项目 Item 寿命试验 Life Test 中高压产品寿命试验 Middle &high voltage Life Test 技术规格 Technical Specification Ⅰ 类 : ±2% 或 ±1pF 取两者之中较大者 Ⅱ 类 :B,X: ±20% E,F: ±30% ΔC/C ClassⅠ: ±2% or ±1pF, whichever is larger. ClassⅡ: B,X: ±20% E,F: ±30% 2 倍初始标准 DF Not more than twice of initial value. Ⅰ 类 :Ri 4000MΩ 或 Ri CR 40S 取两者之中较小者. Class Ⅰ : Ri 4000M Ω 或 Ri C R 40S whichever is smaller. IR Ⅱ 类 :Ri 2000MΩ 或 Ri C R 50S 取两者之中较小者. Class Ⅱ : Ri 2000M Ω 或 Ri CR 50S whichever is smaller. 外观 : 无损伤 Visual Appearance: No visible damage. Ⅰ 类 : ±2% 或 ±1pF 取两者之中较大者 Ⅱ 类 :B,X: ±20% Δ E,F: ±30% C/C ClassⅠ: ±2% or ±1pF, whichever is larger. ClassⅡ: B,X: ±20% E,F: ±30% 2 倍初始标准 DF Not more than twice of initial value. Ⅰ 类 :Ri 4000MΩ 或 Ri C R 40S 取两者之中较小者. Class Ⅰ : Ri 4000M Ω 或 Ri CR 40S whichever is smaller. IR Ⅱ 类 :Ri 2000MΩ 或 Ri C R 50S 取两者之中较小者. Class Ⅱ : Ri 2000M Ω 或 whichever is smaller. 外观 : 无损伤 Visual Appearance: No visible damage. Ri CR 50S 测试方法 Test Method and Remarks 低压产品 ( 100V) 电压 :1.5 倍额定工作电压时间 :1000 小时温度 :125 (NPO X7R)85 (X5R Y5V) 充电电流 : 不应超过 50mA 放置条件 : 室温放置时间 :24 小时 (Ⅰ 类 ), 或 48 小时 (Ⅱ 类 ), Low-Voltage( 100V) Applied Voltage: 1.5 Rated Voltage Duration: 1000h Temperature : 125 ( NPO X7R ) 85 (X5R Y5V) Charge/ Discharge Current: 50mA max. Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 中高压产品 : 100V 额定电压 <500V:2 倍工作电压 500V 额定电压 1000V:1.5 倍工作电压额定电压 >1000V:1.2 倍工作电压时间 :100 小时充电电流 : 不应超过 50mA 温度 :125 (NPO X7R);85 (X5R Y5V) 放置条件 : 室温放置时间 :24 小时 (Ⅰ 类 ), 或 48 小时 (Ⅱ 类 ), Applied Voltage: 100V Rated Voltage<500V:2 Multiple 500V Rated Voltage 1000V:1.5 Multiple >1000V Rated Voltage:1.2 Multiple Duration: 100h Charge/ Discharge Current: 50mA max. Temperature:125 (NPO X7R);85 (X5R Y5V) Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 注解 : 专门预处理 ( 仅对 2 类电容器 ): 将电容器放在上限类别温度或按详细规范中可能规定的更高温度下经 1h 后, 接着在试验的标准大气条件下恢复 24 ±1h Note:Pretreatment (only for class2 capacitor) Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement. First, place the capacitor in the up-category temperature or other specified higher temperature environment for 1hour. Then recovery the capacitor at standard pressure conditions for 24±1hours 第 15 页共 25 页
九 包装 PACKAGE 纸带卷盘结构 PAPER TAPING Top cover tape 面胶 Carrier tape(paper) 传送带 Chip hole(pocket) 芯片孔 Polystyrene reel 胶盘 Bottom tape 底胶 0402 纸带编带尺寸大小 Dimensions of paper taping for 0402 type 代号 Code W1 L1 D C B P1 P2 P0 d t 0201 0.37± 0.10 0.67± 0.10 8.00± 0.10 3.50± 0.05 1.75± 0.10 2.00± 0.05 2.00± 0.05 ± 0.10 1.50-0/+0.10 0.80 Below 0402 0.65± 0.10 1.15± 0.10 8.00± 0.10 3.50± 0.05 1.75± 0.10 2.00± 0.05 2.00± 0.05 ± 0.10 1.50-0/+0.10 0.80 Below 适合 0603,0805,1206 常规尺寸产品的纸带尺寸 Dimensions of paper taping for 0603,0805,1206 types. 第 16 页共 25 页
送带孔 Feeding hole J 芯片方穴 Chip pocket A E B D C T Chip cap H G F Tape running direction 纸带运行方向 代号 Code 纸带规格 papersize 0603 0805 1206 Unit:mm A B C D E F G H J T 1.10 1.45 ± 0.15 1.80 ± 0.20 1.90 2.30 ± 0.15 3.40 ± 0.20 8.00 8.0 ± 0.15 8.00 ± 0.20 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 1.75 1.75 1.75 注意 : 表示此处对尺寸的要求非常精确 Note: The place with * means where needs exactly dimensions. 2.00 2.00 2.00 1.50-0/+0.10 1.50-0/+0.10 1.50-0/+0.10 1.10 Max 1.10 Max 1.10 Max 塑胶卷盘结构 EMBOSSED TAPING Top cover tape 面胶 Carrier tape(paper) 传送带 Chip hole(pocket) 芯片孔 Polystyrene reel 胶盘 塑胶带尺寸结构 ( 适合 0805~1812 型产品 ) Dimensions of embossed taping for 0805~1812 type 第 17 页共 25 页
送带孔 Feeding hole J 芯片方穴 Chip pocket A B E D C T Chip cap H G F Tape running direction 塑胶带传送方向 代号 Code 规格 Tapesize 0805 1206 1210 1808 1812 A B C D* E F G* H J T 1.55 ± 0.20 1.95 ± 0.20 2.70 2.20 3.66 2.35 ± 0.20 3.60 ± 0.20 3.42 4.95 4.95 8.00 ± 0.20 8.00 ± 0.20 8.00 12.00 12.00 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 5.50 ± 0.05 5.50 ± 0.05 1.75 1.75 1.75 1.75 1.75 8.00 备注 :* 表示此处对尺寸的要求非常精确 Note:The place with * means where needs exactly dimensions. 2.00 2.00 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 ± 0.1 1.50-0/+0.10 1.50-0/+0.10 1.55-0/+0.10 1.50-0/+0.10 1.55-0/+0.10 1.50 Max 1.85 Max 3.2 Max 3.0 Max 4.0 Max 传送带的前后结构 Structure of leader part and end part of the carrier paper 尾部 ( 空带 ) 芯片传送空带带头 ( 面胶面 ) End (Vacant position) Chip carrier Vacant position Leader part(cover) tape) 大于 200 mm over 200mm 大于 200 mm over 200mm 大于 200 mm /Over 200 mm 传送方向 / Moving Direction 第 18 页共 25 页
卷盘尺寸 Reel Dimensions (unit: mm) 尺寸代码 (CODE) 卷盘型号 A B C D E F G 7 REEL φ178±2.0 3.0 φ13±0.5 φ21±0.8 φ50 或更大 φ50 ormore 10.0±1.5 12max 13 REEL φ330±2.0 3.0 φ13±0.5 φ21±0.8 φ50 或更大 φ50ormore 10.0±1.5 12max 关于卷带的说明 Taping specification 面胶剥离强度 Top tape peeling strength (a) 纸带 Paper Taping Cover tape peeling direction 面胶剥离方向 Cover tape 面胶 0~15 Carrier tape 传送带 (b) 塑料胶盘 Embossed Taping Cover tape peeling direction 面胶剥离方向 Cover tape 面胶 0~15 Carrier tape 传送带 标准 :0.1N< 剥离强度 <0.7N Standard: 0.1N < peeling strength < 0.7N 在剥离时, 纸带不能有纸碎, 也不能粘在底 面胶上 No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. 第 19 页共 25 页
塑料盒散包装 Bulk Case Package 单位 (unit):mm Symbol A B T C D E Dimension 6.80±0.10 8.80±1.00 12.00±0.10 15.00+0.10/-0 2.00+0/-0.10 4.70±0.10 Symbol F W G H L I Dimension 31.50+0.20/-0 36.00+0/-0.20 19.00±0.35 7.00±0.35 110.00±0.70 5.00±0.35 包装数量 Packing Quantity 尺寸 (SIZE) 包装形式和数量 ( PACKAGE STYLE & QUANTITY) unit: pcs 纸带卷盘 (PT) 胶带卷盘 (ET) 塑料盒散装 (BC) 一般散装 (BP) 0201 15000 ------ 20000 5000 0402 10000 ------ 20000 5000 0603 4000 ------ 15000 5000 0805 4000 3000 10000 5000 1206 4000 1210 ------- T 1.35mm 3000 T>1.35mm 2000 T 1.80mm 2000 T>1.80mm 1000 5000 5000 ------- 2000 1410 ------- 2000 ------- ------- 1808 ------- 2000 ------- 2000 1812 -------- 1825 2220 T 1.85mm 1000 T>1.85mm 500 ------- 2000 2025 2225 -------- 500 ------- 500 3035 注意 : 包装的形式和数量可根据客户的要求来定 Note:We can choose packing style and quantity can be according to the customer s requirement. 第 20 页共 25 页
外包装 Outer packing 小包装 The first package 大包装 The second package Quantity: 5 reels (Max 25000pcs) Quantity: 12 cases (Max 300000pcs) 数量 : 5 卷 (25000pcs 最多 ) 数量 :12 盒 ( 最多 300000pcs) 65mm 185mm 200mm 197mm label 标签 385mm 425mm Label 标签 十 储存方法 PART No 型号规格 QUANTITY : 数量 DATE 日期 Storage Methods 确保芯片可焊性良好的贮存期限为 6 个月 ( 在包装好已交付的情况下 ) The guaranteed period for solderability is 6 months (Under deliver package condition). 储存条件 /Storage conditions: 储存温度 /Temperature 5~40 储存相对湿度 /Relative Humidity 20~70% 十一 使用前的注意事项 Precautions For Use 多层片式瓷介电容器 (MLCC) 在短路或开路的电路中都有可能失效, 在超出本承认书或相关说明书中所述使用频率的恶劣工作环境, 或外界机械力超压作用下, 电容芯片都有可能着火 燃烧甚至爆炸, 所以在使用的时候, 首先应考虑按本承认书的有关说明来进行, 如有不明之处, 请联系我们技术部 品管部或生产部. The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory. 1. 焊接的条件与相关图表 Soldering Profile Production name 产品名称 Quantity 数量 Weight 重量 为避免因温度的突然变化而引起的芯片开裂或局部爆炸的现象发生, 请按有关温度曲线图表来进行.( 请参考附页中的图表 ) To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). 第 21 页共 25 页
2. 手工焊接 Manual Soldering 手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部爆炸的现象, 在焊接时, 如果操作者不小心, 会使烙铁头直接同电容芯片的瓷体部分接触, 这样很容易使电容芯片因热冲击而受损或出现其他意外. 因此, 使用电烙铁手工焊接时应仔细操作, 并对电烙铁的尖端的选择和尖端温度控制应多加小心. Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator s careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. 3. 适量的焊料 焊料过多 Too much solder 这样会因端头压力过大而可能引起芯片受损 Cracks tend to occur due to large stress. 焊料太少 Not enough solder 固定力量不足, 可能会引起电容芯片与线路接触不良 Weak holding force may cause bad connection between the capacitor and PCB. 4. 推荐焊料用量 *4.1 回流焊接的最佳焊料用量 4.2 波峰焊接的最佳焊料用量 4.3 使用烙铁返修时的最佳焊料量 第 22 页共 25 页
十二 推荐焊接方式 Recommended Soldering Method 规格尺寸 温度特性 额定电压 容量范围 焊接方式 Size Temperature Characteristics RatedVoltage Capacitance Soldering Method NPO / R 0201 X7R/X5R / R Y5V / R NPO / R 0402 X7R/X5R / R Y5V / R NPO / R/W 0603 X7R/X5R / C 1uf C<1uf R R/W Y5V / C 1uf C<1uf R R/W NPO / / R/W 0805 X7R/X5R / C 4.7uf C<4.7uf R R/W Y5V / C 1uf C<1uf R R/W NPO / / R/W 1206 X7R/X5R / C 10uf C<10uf R R/W Y5V / C 10uf C<10uf R R/W NPO / / R 1210 X7R/X5R / / R Y5V / / R 焊接方式 Soldering method:r 回流焊 Reflow Solering W 波峰焊 Wave Soldering 第 23 页共 25 页
十三 推荐焊接温度曲线图 The temperature profile for soldering 回流焊接 (Re-flow soldering ) Temperature 温度 ( ) 300 250 200 150 100 50 预热 焊接 Peak Temperature 超过一分钟超过一分钟 30~60S 自然冷却 Pb-Sn 焊接 无铅焊接 尖峰温度 230 ~250 240 ~260 波峰焊接 (Wave soldering) Temperature ( ) 300 温度 250 200 150 100 50 预热 Preheating Peak Temperature Over 1 minute 3s max. Gradual 超过一分钟 cooling 自然冷却 Pb-Sn 焊接 无铅焊接 尖峰温度 230 ~260 240 ~270 在预热时, 请将焊接温度与芯片表面温度之间的温差维持在 T 150 第 24 页共 25 页
手工焊接 (Hand soldering) Temperature ( ) 300 250 温度 200 150 100 50 预热 Preheating Peak Temperature 条件 : Over 1 minute 3s max. Gradual cooling 超过一分钟 自然冷却 预热烙铁头温度烙铁功率烙铁头直径焊接时间锡膏量限制条件 130 最高 300 最大 20W 建议 1mm 最长 3s 1/2 芯片 厚度 请勿使用烙铁头直 接接触陶瓷元件 以最新版本的内容为准.. 第 25 页共 25 页