IC : ( ) TEL03-5639999 ext 102 E-Mail: jclin@mail.kingbond.com.tw http://www.kingbond.com.tw IC IC Standard Assembly Process Taping Grinding Detaping Wafer Mount Curing Die Saw Die Bond Cure Wire Bond Die Coating Back Marking Molding Cure Trim Plating Top Marking Cure Forming O/S Test Packing & Delivery 1
(Dicing) (Die Bond) (Wire Bond) (Molding) (Visual Inspection) 1.BGA (Ball Grid Array) PBGA MiniBGA T 2 BGA 2.CSP (Chip Scale Package) µbga mbga Ultra-thin package 3.FC (Flip Chip) C4 ACP ACF NCP COG 4.MCM Multi chip module Side by side Stack Die 3D package 5.TCP (Tape Carry Package) ILB COF 6.COB(Chip On Board) Direct Chip on Board Flip Chip on Board 7.WLP (Wafer Level Package) I/O redistribution 2
Stacked CSP Roadmap by Sharp Chip Level Interconnection PBGA (Plastic Ball Grid Array) Trend of IC Packaging CSP (Chip Scale Package) Wire Bond CSP Flip Chip CSP Solder Bumped Flip Chip on Board Printed Circuit Board DCA (Direct Chip Attach) Wire Bonded on Board Gold stud Flip Chip on Board Die Stacked Chip Size Package Structure Au Wire Chip Insulation Film Molding Compound 0.8mm Solder Ball Die Thickness 4 mil 0.8mm Polyamide tape µbga 3
Flip Chip Technology Inner Lead Bonder - Inner Lead Tape & COF Tape- Device hole IC Chip TAB TAPE Inner lead IC Chip COF TAPE BGA Assembly Process mbga (CSP) Assembly Process Taping Grinding Detaping Wafer Mount Receive Flex Frames in Magazine Receive Customer Die/Wafers Die Saw Die Bond Cure Plasma Cleaning Wire Bond Die Attach Lead Bond Ship Tape/Reel, Gel Pak Singulation Molding Cure Marking Cure Ball Mount Encapsulate Test, Mark Flux Clean Singulation Packing & Delivery Solder Ball Wafer arrives from IC mfr. tested Add flux to substrate Flip Chip Bumping Pick & place flip chip Dicing Reflow Place on tap reel or waffle pack Clean IC ( ) (Defect) (Resolution) FMEA Underfill Underfill Cure Complete PC Based Mapping SECS Flip Chip ACF ACP NCP PBGA FC-BGA T 2 BGA MCM STACKED CSP CSP MiniBGA MBGA TCP 4
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Die Picked-up Motion Programmable: -Position control -Velocity control -Force control PasswordF MainFrm IOFrm MotorFrm rm MainCpp new ThreadOP IO Motor Bond Tool CONTROL Mod1Cpp DRIVER ThreadOP Mod1->Init Mod1->Operation Mod1->End MSD1 MSD2 MSD3 IOCpp IO->Input IO->Output Mod2Cpp Execute Mod2->Init Mod2->Operation Mod2->End MororCpp Die Eject ModnCpp Mod3->Init MSD1 Mod3->Operation Mod3->End MSD2 MSD3 TIMING CHART PLANING TIMING CHART SECS I/II Wafer MAPPING SECS (Semiconductor Equipment Communication Standard) Wafer Mapping EMS Controller (Host) SECS (RS232 / Ethernet) 6
1. 2. 3. (Defect) 4. (Resolution)... Consta nt Force D ie Vacu um Pick-up tool Pick up VCM Linear Motor Ejec t Self Adjustment Program dispense motion control Up-speed 2 Up-speed 1 Height Time - 1 Time - 2 7
Class 1K/10K Open/short test Class 100K 1. 2. 3.(or ) 4. DIE BONDER 5. 6. 7. 8. FLIP CHIP BONDER CHIP SORTER SLUG MOUNTING -- IC -- DIP QFP BGA Mini BGA CSP Wafer Level Package Wire Bonder (HN-942S) 1. Multi-step 2. 3. 4. 5. 6.Fine pitch 100 um 75 um 50 um 30 um 25 um 10(or5) um 8
Die Bonder (KB-2000) 1. L/F Substrate TAB ( 25 m, 0.5 ) Leadframe Loading 2. 4 mil Die 3. 6 8 12" wafer tray 4. Stack Die 5. 6. 7. Dispensing Dispense Unit Die Ejector Wafer Loading Die Bonder - Process Flow - PRS Gray Scale Leadframe Positioning Die Eject & Pick Up PRS Die Bonding Gauging Non Contact Gray Scale Bonding Head Die Transfer Indexing PRS Binary Scale Unloading Magazine Output Flip Chip Bonder vacuum Epoxy Bonding System 1. 2. 3., taker,tray, Hoop 4. Changeover 5. windows 6. die substrate PRS Flip Chip Bonder - PRS Detect by 2 Side - Die Chip sorter(ks-120) IC, IC 0.25x0.25 mm Downgrade DRAM LED, Discrete IC :, Glass 9
(KS-600F) Heat Sink Mounter (KP-1000) PICK & PLACE 1 PICK & PLACE 3 PICK & PLACE 2 TRAY LOADER RING EXCHANGE XY TABLE EJECTE R FLIP UNI T PRS1 PRS3 TRAY FEEDER BUFFER UNIT WAFER PRS2 CASSETTE LOADER TRAY UNLOADER T R A N S F E R Wafer to JEDEC tray Open / short testing Vision inspection Flip function Wafer buffer station Rework tray Inner Lead Bonding Inner Lead Bonder - LCD Driver s Application- Open / Short Test M/C Open / Short Tester : 1. Molding Open/Short Test 2. 3. package PBGA, Flip chip 4. 5. ( ) 10
Vision Check Solder Ball Inspection (1) Ball Misalignment (2) Ball Size (3) Ball Shape (4) Ball Height (5) Coplanarity (6) Missing Ball (7) Big/Small Ball (8) Bridge Coplanarity Pitch Width Offset Deform Missing IC (1), (2), (3), (4), (5), (6), IC 1., IC 2. IC, IC 3. IC, 4. IC, IC, 11