T2 Internal Engineer Prober basic Training Manual T2 Internal Engineer Prober basic training manual - 1 -

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宸笑秦
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1 T2 Internal Engineer Prober basic training manual - 1 -

2 1.Prober 2 2. New device set up(3hr) 12 Index size Reference pattern 14 Needle alignment pad Operation (6hr) 20 Wafer ID 20 Lot management 26 Map output/input 29 Multi-pass 37 Map pass/fail 46 Needle Clean 49 Yield Check 52 Continuos Fail 54 Miscellaneous 56 4.Utility (3hr) 57 Wafer Handling 57 System Login Data 59 Make User s File 62 Printer Utility 65 Parameter Mask Utility 66 5.Maintence (27hr) 67 Camera system Calibration(12hr) 67 Chuck Level Calibration(3hr) 82 Clean Pad level Calibration (2hr) 85 Head stage Level Calibration(2hr) 88 PM process(4hr) 90 Hinge of category & adjustment(2hr) Installation process (2hr) - 2 -

3 1.Prober - 3 -

4 Probe Card Holder Inner Headstage Headstage M arker Switch(Inking ) Z (Chuck ) Z UP( ) DATA IN() JOY STICK STOP() START() - 4 -

5 Emergency switch ( ) Power On RESET( ) Single Elevator1 Inspection Tray Loader unit - 5 -

6 Inspection Tray ( 8,6,5 Wafer) Elevator2 Elevator2 OCR(Wafer ID read) Elevator1 Turntable Arm1, Pre-alignment sensor Sub-chuck Two Elevator Type Elevator1 12 TFT Display Keyboard - 6 -

7 1.44Mbyte F/D Internal Printer ( :1.3cm, :1cm,:11cm,:30M) Chuck X Axis Y Axis X axis - 7 -

8 F Axis Clearing Pad Axis motor Chuck E2 Camera (Needle alignment Camera) Profile sensor E1 Camera(Wafer alignment Camera) - 8 -

9 SCSI FDD HDD HDD FDD - 9 -

10 E2 VIDEO CN E1 VIDEO I/F Relay COGNEX Board Board

11 A. Main Body 5 axis,. B. PGEN Driver Slot17 LD LD PIO SENSE SENSOR MK II LD Driver Slot 18 MK II LD PGEN Motor Driver Valve

12 2. New device set up

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20 3.Operation Wafer ID

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22 window Window wafer (wafer ID)

23 Cross-mark Cross-mark Cross-mark

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27 Lot management SEQUENCE LOAD SETTINGS

28 ASSIGN LOAD SAMPLE LOAD

29 Map output/input

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37 Multi-pass

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41 LOT SETTING LOT MUNBER MAP PROBER FAIL BIN

42 3. MAP OPERATION SETTING MULTI-PASS PROBING SETTING, : FAIL DIE PROBING

43 BIN 3:Specified Category, CA TEGORY DATA FOR MULTI PASS PROBING, : SETTING END

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45 Operation Settings, MULTI PASS PROBING SETTING, : MULTI PASS PROBING MULTI PASS PROBING, : ENT. LOT SETTING LOT MUNBER **LOT NIMBER WAFER SLOT ***

46 Map pass/fail Wafer Map for Pass/fail MAP DISPLAY/ PRINT SETTING 2/2 MAP DISPLAY ATTRIBUTE SETTIN <Pass Die><Fail Die> <Display/No Display Setting> <Pass Die><Fail Die> OFF ON <Display Character Setting>

47 120 <Pass Die><Fail Die> Wafer Map <ENT> Wafer Map for Category <BASIC OPERATIONAL PARAMETER SETTING> <MISCELLANEOUS SETTING> <Category Number> <Map Display/Print Setting> <Map Display Attribute Setting>

48 <CATEGORY DATA> <Display /No Display Setting>OFF ON <Category Display Char> Category Number Tester <Display Character Setting> Category Bin Size <ENT>

49 Needle Clean 1. OPERATION SETTING 2. PROBER MODE SETTING 3.3/6 Needle Cleaning Setting 4. UNIT NEEDLE CLEANING SETTING 6. X Y

50 / Die Wafer Wafer Prober Card contact : 5000 Contact

51 Clean Unit: 200mm * 100mm 20mm For a new clean plate, the first line of needle contact begins from the front right side (away from the 20 mm wide cutout and 3 mm edge margin) to the upper right direction at the angle of 45. Each line of needle contact is always from the lower left to the upper right after the full span of the preceding line at the angle of 45. The Shift distance is applied in both of X/Y directions for 45 route with the overdrive pitch determined in the division of the distance by Driving times per cycle, 500um/5=100um in this case. The reference point of this pitch movement is the card center calculated from its configuration

52 Yield Check : DUT Bin Cat

53 DUT DUT Bin DUT Bin BIN NO. DUT BIN Cat

54 Continuous Fail : continuous Fail? Continuous Fail Fail check Back Cont. Fail Continuous fail Fail Continuous fail

55 1 Continuous Fail 5 2, fail Miscellaneous / Chuck Chuck Pin / ID

56 Prober Device Device Category LOT Slot Sequence back Device Wafer End Log

57 4.Utility Wafer Handling Cassette Fix tray, Cassette

58 load wafer FIXED TRAY

59 System Login Data :

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62 Make User s File utility, Make user s File(EASY SETTING:BASIC OPE) BASIC OPE. PARAMETER SETTING, ALL SELECT, : ALL SELECT

63 , : DATA STORE/RESTORE, prober, : device parameter, User s define setting, : USER DEFINE DATA SETTING

64 , :, :, DATA STORE,, DEVICE PARAME TER SETTING SETTING END Make User s file, SETTING END,, :

65 Printer Utility

66 Parameter Mask Utility

67 5.Maintence : Camera system Calibration

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79 E5 H/L camera position : configuration data change, Initialize data,x,y,. :

80 prober initialize, calibrate device, wafer load prober. prober, Interrupt 2, : : UITILTY, Maintenance/ Adjustment, ITV Camera ADJUSTMENT, :

81 ALIGMENT CAMERA ADJUSTMENT, : ENT, :,prober wafer alignment, :

82 , E5 Camera,. Image change. :,, Image change, joystick ENT, : ENT, :

83 Chuck Level Calibration joystick chuck, B Chuck A B: A, C : ( ) C

84 Chuck

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86 4-86 -

87 b a c OP

88 1.x, y, z axis, prober center move, chuck, : 2. pick gauge chuck, (0), : 3. ring 7. 7, (30UM), : 4., head stage,e5 camera, :

89 , :. 5., : 6. head stage holder block, : (, ) ) 8,

90 PM process

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93 , : UTILLITY MAINTENANCE /ADJUSTMENT TOUCH PANEL SWITCH ADJUSTMENT

94 KEYBOARD ADJUSTMENT

95 INTERNAL PRINTER STATUS DIS_PLAY/CHANGE TEST PRINTOUT

96 Prober

97 Prober Loader MAINTENANCE/ ADJUSTMENT EQUIPMENT POSITION ADJUSTMENT

98 PROFILE SENSOR ADJUSTMENT ENT

99 PROFILE SENSOR

100 CH1 CH2 GND

101 CH1 CH2 GND

102

103 µ µ

104 Customer: Customer contact: Prober Model: Prober S/N: Calibration Step Original position Correct position Remark Chuck Flatness Pass Fail Inner 10um Clean Pad Flatness Pass Fail Inner 5 um Clean pad Height um um X um X um E1 Camera Position Y um Y um Z um Z um X um X um Pro-file sensor Y um Y um Z um Z um V V X um X um E1 Camera H/L Position Y um Y um Z um Z um X um X um E2 Camera H/L Position Y um Y um Z um Z um X um X um Reticle Mark Position Y um Y um Z um Z um X um X um E2 Camera Position Y um Y um Z um Z um Perform Needle Mark Pass Fail Store Configuration Pass Fail Perform Needle Mark Again Pass Fail Calibration & Verify Engineer (SPIROX)/Date: Customer Representative/Date:

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