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1 5/3/2010 1

2 IC LED / 2

3 3

4 () (IC/LED) // // // ( : ) // 4

5 2008 :8,532 :5,224 16, ,531 >1002% 30>>10018% <3080% (45%) (480) (1050) (220) ICFPD(40) (5433) (18%) (230) ICFPD(60) (70) (150) (2379) (37%) (1300) (500) ICFPD(100) (100) (300) (3640)

6 IC FPD () : (f)

7 2~3 ICLED

8 8

9 (NT$1,000/G8.5G7.5) (NT$600/G8.5G6) (NT$60/) :(CNY455/G6G8.5)(CNY280/G8.5) (CNY138/G6)(CNY250/G8.5) 5/CNY1,225 AMAT3/G8.5PVD8.5CF Ulvac : Q170%

10 :

11 Samsung SonyLG NokiaApple Motorola

12 LCD (e) () () () , () % 60% 50% 40% 30% 20% 10% 0% (e )

13 ARRAY 65% () CELL 25% LCD () LCM 10% ADI AEI PS AOI 1% 6% 25% 6% 0.8% 25% 5% 0.8% 5.5% 4.5% 8% 12.4% 30% 30% 7% 5% 15% 15% 30% 30% 10% 15% 60% 60% (93%) (40%) PI ODF 6% 10% 3% 10% 15% 15% 10% 2% 6% 8% 9% 6% 95% 2% 35% 35% 0% 0% 0% 40% 85% 100% 100% 20% (20%) (80%) ACF IC / 25% 25% 10% 11% 14% 15% 70% 40% 100% 100% 100% 100% CF Total Pitch Bali /Burr

14 TFT LCD G8.5 AOI G6 slit coater AMOLED Oxide TFT G6 G5 G8.5 (3u) AOI PI G6 AOI IC OLB bonding R2R R2R ODF G5 A

15 IC IC 15

16 2009NT$1, % 2010NT$3,000-(NT$1500/22) (NT$450/28)DRAM-(NT$520/42) (NT$450)Cu wire bonding % % IC

17 :SEMI :SEMI

18 IC IC BenQ Acer Asus

19 DRAM DRAM SoC IC

20 : (e) 5,269 6,529 8,188 10,990 11,179 13,933 14,667 13,473 12, ,908 1,433 2,064 2,544 2,318 1, ,798 1,334 1,922 2,336 2,108 1,725

21 / (3D18) / (SEMATECH)

22 (3D IC) () () () X 20% X () 30% Via Oxide Cu Cu CMP X X X X X X X X X X () 10% 80% 80% X 20% 80% 30% 80% X 30% 5% X X X (BGA) 20% 10% 60% (WLCSP/ QFN/BGA) X 10% 90% 20% 10% 80%

23 200mm start when 150mm is 33% of total capacity 300mm start when 200mm is 45% of total capacity 450mm Trigger 450mm when 300mm capacity is over 50% of total capacity

24 24

25 GW 2009 CIGSCIGS

26 , PV Japan 2008FIT 500% Korea 2, FIT2004 EGGPV ,200 1,560 1,200 Germa ny 2007FIT MW 500 2, Spain (MW)

27 Solar Cell Wafer Based Thin-Film Compound (C-Si) (Poly-Si) GaAs (A-Si)SiGe,SiC Cds,CdTe,CIS,CIGS Organic Nanotech Spherical 27

29 Technology Module Efficiency (%) Energy payback time (Year) Available resource (GW p ) Advantages Disadvantages Equipments Applications Efficiency PECVD, LPCVD (BIPV) a-si 6.4 (Kaneka) x10 5 (TCO) Cost, non-toxicity, raw materials (BIPV) Cost, the highest efficiency Toxicity, availability of raw materials, yield Evaporator, Sputter, Painting CIGS 12 (Wurthsolar) (In) 9.3 (First Solar) Cost efficiency Toxicity, availability of raw materials, Uniformity CBD, close space sublimation CdTe (Te)

30 % 62.3% 11.8% 3.4% % 10% 20% 30% 40% 50% 60% 70% PV PV PV

31 CIGS CIGS CIGS CIGS AOI PECVD CVD / CIGS

32 LED LED 32

33 LED LED LEDNT$55LED LEDMOCVD MOCVDLED50040% 1023LG MOCVD300

35 LEDMOCVD/ MOCVD MOCVD1/3 35% 14% LED 14% MOCVD 37% LED 288

36 2010MOCVD

37 2010MOCVD

38 () HVPE MOCVD () X X 5% X 10% X X / () 30% 30% 1% 30% 30% 70% 50% (/) () 80% 10% 10% 40% () 20% 10% 80% 10% X 30% 30% 30% 20%

40 Semes (19%) (18%) Micro (15%) AKT (82%) ULVAC (4%) Nikon (51%) Canon (49%) (UV)PVDCVD Track Track Track AOI PS CF Total Pitch Bali/Bu rr ADI AEIRoller Coater/DNS (35%) Toray (20%) TEL (18%) Koyo Thermo System (32%) Clean Technology (32%) ESPEC (16%) DNS (38%) TEL (30%) (19%) TEL (66%) YAC (15%) ADP (6%) DNS (45%) Semes( 32%) Micro (5%) TEL (58%) DNS (13%) Semes (12%) Murata / / / /// /// / / / / / 2.3% 22.5% 10% 9.6% 29% 1.5% 7% 4.3% 1% 1.5% 3.3% 8% CFPSCFTotal PitchBali/BurrULVAC (79%) AKT (8%) Canonanelva (8%) /2009 TFT TFT-LCD Array LCD Array 1 (1/4)

41 Nakan (70%) (15%) (6%)/PI Nakan (31%) ESPEC (23%) Denko (19%) Techno (46%) (31%) (14%) (77%) (9%) Lemi (4%) Medec (73%) SFA (13%) Takatori (4%) Toshiba Yasugawa FUNAC Murata ODF / / / / / / / 4% 10% 4% 2% 8% 5% 6% 9% 10% 20% 12% 10% AOI (29%) ULVAC (28%) Techno (19%) Kornic System (10%)TFT TFT-LCD Cell LCD Cell / (2/4)

42 ACF (25%) Toray (20%) Panasonic Factory Solution (5%) ICACFCOGTAB/ Aging ovenpanasonic Factory Solution (43%) (37%) Toray (10%) (53%) (20%) (18%) Yamato scientific (78%) (4%) Micronics Japan (66%) Cathode (12%) Toray (7%) Murata / / / / / / / / / 25% 25% 15% 10% 14% 11% TFT TFT-LCD Module LCD Module / (3/4)

43 Laser Repair Charm & Ci(24%) OLFT(22%) V Technology (14%) PDI(9%)Laser Repair Macro Inspection Micro Inspection RGV AGV/MG V Sorter AGV/MGV Sorter Stocker Olympus V Technology Takano ADP Olympus (50%) DE&T ADP Suntech Murata Daifuku Suntech / / / / Stocker Macro Inspection Micro Inspection CDOL Measure CD Measure RGV Cassette Station Cassette Station Sokkia V Technology Murata / / / / TFT TFT-LCD LCD / (4/4)

44 44 (PVD) (CVD) () (ECD) (CMP) (Dry Strip) / / (Track) (Stepper) , AMAT (41.4%) Novellus (21.1%) TEL (20.2%) Novellus (57.4%) Semitool (36.0%) AMAT (4.2%) AMAT (79.5%) Novellus (8.0%) Ulvac (6.1%) AMAT (72.4%) Ebara (23.5%) Tokyo Seimitsu (2.0%) Mattson (24.4%) PSK (23.4%) Novellus (19.3%) TEL (79.1%) Sokudo (12.7%) SEMES (5.0%) ASML (62.7%) Nikon (22.8%) Canon (14.5%) Lam Research (40.9%) TEL (25.5%) AMAT (23.4%) (Dry Etch) 1,494.3 () 2IC(1/3) /2009

45 45 / (Furnace) (RTP) (Critical Dimensio n Insp.) (Defect Insp.) (Thin Film Insp.) () (Automa tion) (Ion Implant) (Wet Station) (Single Wafer Processor) AMAT (70.6%) Mattson (18.5%) DNS (4.6%) TEL (43.0%) Hitachi Kokusai (35.1%) ASM (13.3%) Hitachi High -Tech. (64.1%) AMAT (16.7%) KLA-Tencor (12.2%) KLA-Tencor (38.4%) Rudolph (14.2%) Nanometrics (9.7%) KLA-Tencor (56%) AMAT (16.7%) Hitachi High Tech. (7.7%) Brooks (26.9%) Asyst (21.4%) HP (10.1%) Varian (43.1%) SEN (16.6%) AMAT (15.2%) Axcelis (14.3%) Nissin (10.0%) DNS (51.3%) TEL (21.3%) SES (14.1%) SEZ (42.7%) DNS (34.0%) Semitool (8.7%) () /2009 2IC(2/3)

46 ( ) () /2009 2IC(3/3) IC / Advantest Disco (52.7%) (37%) (55.6%) TEL(38.4%) Delta Design Hanmi Electroglas (31.3%) (18.2%) (4.8%) Seiko Epson (10.8% ) (17%) / / K&S TOWA ASM Shibuya ICOS Laserfront(5 (30.2%) (25.8%) (23.8%) (50.5%) (78%) 1.7%) ASM Dai-Ichi Disco Athlete Athlete (28.8%) (24.8%) (21.8%) (14.2%) (4.5%) Shinkawa BESI Yamada (24.5%) (19.2%) (16.3%) / Renesas (23.2%) ESEC (22.5%) ASM (19.8%) Panasonic( 32.2%) BESI (26.5%) Toray (17.6%) BTU (30%) Tamura (25%) RAM (23%) 46

47 PV / I-V a. b. c. PECVD a. b. Endeas Wacom Berger Oriel AMAT ULVAC Novellus TEL ESPEC Nakan TEL DNS TEL Hitachi Kokusai ASM Lam Research TEL AMAT TEL DNS AMAT Hitachi KLA TEL DNS 3(1/2) /2009

48 Glas s PECV D Testin g Clean er Las er Sputt er Wirin g Framin g Clean er Clean er Clean er Sputt er Las er Las er PV : EPV Berger NPC Endeas Belval Olbriht NPC Spire Panamac Meier Olbriht AMAT ULVAC Oerlikon Nano PV Adema NHT Asaki /2008 3(2/2)

49 HVPE MOCVD --- ID Saw, Wire Saw Sumitomo, AXT / Sumitomo Aixtron Wafer Bonder Finetech, Research Devices 0% <5% 0% X X X (Speed Fam) 10% S /2009 4LED(1/4) () LED LED LED(GaN LED(GaN) Laser Lift Off JPSA NA 0% 0% HVPE LED MOCVD Aixtron()80% Veeco(Emcore)10% Thomas Swan ()8% Nippon Sanso 2% X

50 / CVD Oxford STS ()30 Samco 30% AMAT Plasmatherm Novellus (Photoresist Spinner) Kyowariken Karl-Suss (Aligner) Karl-Suss 50% Canon 20% Quintel 15% EVG (UV-Ozone Stripper) ULVAC Samco ACT(Ashland) (RIE) (ICP) Oxford STS Samco Unaxis Anelva TEL / / AMAT ULVAC Anelva (Furnace) (RTA) ULVAC ARTs Unaxis () () 50% 30% 30% 30% 30%70% 50% /2009 Clean Bench 4LED(2/4) () Samco GaN (80%) (DBR)thin film

51 4LED(3/4) () 10% LED/ LED Prober/Tester P.W.S 20 () (Wafer Back Grinder) LED LED Logitech() GN() LED LED Opto system // (Dicing Saw/Scriber/Breaker) Dicing Saw Disco()80 Scriber/breaker Opto System Tecdia Newwave()70% Speedfan 20% Opto system 50 () 25 (Tester) (Tester) 80% 10% /2009 LED LED Logitech 80 Dicing Saw Disco80 LED (Die Sorter) ASM() 60% 30 45% ASM() 90

52 (Die Bonder) ASM 80% K&S NEC TOSHIBA /2009 Flip Chip Bonding Flip Chip Bonder ASM 10 IC LED ChipIC 4LED(4/4) () (Wire Bonder) ASM 70% KAIJO 20% K&S TOSHIBA 80 (Molding) ASM LED (GaN) ASM 20% 80% 10% 30% 30% 20% 20% Trim/Form LED Nihon Garter Ismeca

051208光電產業設備發展趨勢分析-2

051208光電產業設備發展趨勢分析-2 FPD Http://www.kingroup.com.tw Kingroup@ms.kingroupauto.com Tel: 04-23503313 Fax: 04-23503237 Kingroup Kingroup Kingroup Kingroup Kingroup 1970 1980 1990 2000 ABS PU IC LCD WLAN PDA Kingroup Kingroup GNP,000,000