m120613

Size: px

Start display at page:

Download "m120613"

郦右沈
4 years ago
Views:

1 Meeting Date: December 6, 2013 Meeting Location: Teleconference IBIS Open Forum Minutes VOTING MEMBERS AND 2013 PARTICIPANTS Agilent Technologies Radek Biernacki*, Pegah Alavi, Heidi Barnes, Fangyi Rao, Colin Warwick, Tarun Kalwani, Ming Yan, Xingdong Xue, Zaokai Yuan, Xianzhi Zhao, Ming-Chih Lin, Peter Lin, Hiroaki Sasaki, Toshinori Kageura Altera David Banas, Hsinho Wu ANSYS [Luis Armenta], Ben Franklin, Dan Dvorscak, Steve Pytel, Lan Chen, Timothy (Gang) Chen, Minggang Hou, Jianbo Liu, Roger Luo, Peng Wang, Shulong Wu, Guoli Yi, Daniel Chang, Richard Chen, Naijen Hsuan, Charlotte Wang, Jean Wang, Jerry Wang, Benson Wei, Shigeru Sano Applied Simulation Technology Fred Balistreri, Norio Matsui Cadence Design Systems [Terry Jernberg], Joy Li, Yingxin Sun, Ambrish Varma, Kevin Yao, Brad Brim*, Aileen Chen, Lanbing Chen, Raymond Y. Chen, Heiko Dudek, Jiayuan Fang, Zhiqiang (Johnny) Fang, Henry He, Jinsong Hu, Li Li, Maofeng Li, Ping Liu, Yubao Meng, Zuli Qin, Aaron Tang, Haisan Wang, Yun Wang, Yitong Wen, Janie Wu, Yanrui (Clark) Wu, Dingru Xiao, Benny Yan, Wenjian Zhang, Zhangmin Zhong, Tric Chiang, Thunder Lay, Jack (Wei-Chang) Lin, Paddy Wu, Candy Yu, Yukio Masuko, Takuya Moriya, Morihiro Nakazato, Watanabe Yasuyuki Ericsson Anders Ekholm, Martina Fiammengo, Markus Janis Foxconn Technology Group Leo Cheng, Po-Chuan (Eric) Hsieh, Alex Tang Huawei Technologies Yu Chen, Xiaoqing Dong, Jing Fu, Chen Han, Peng Huang, Jinjun Li, Lingfei Li, Luya Ma, Xiao Peng, Xinlu Peng, Haili Wang, Shengli (Victory) Wang, Zhengrong Xu, Hongxian Yi, Gezi Zhang, Zhengyi Zhu IBM Greg Edlund, Adge Hawes*, Dale Becker Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak, Mohammad Bapi, Stewart Gilbert, Ravindra Rudraraju, Kang Nan, Weifeng Shu, Ming Wei, Jimmy Hsu, Thomas (YiRen) Su IO Methodology Lance Wang LSI Brian Burdick, Sarika Jain, Xingdong Dai, Anaam Ansari, Min Huang

2 Maxim Integrated Products Mentor Graphics Micron Technology Signal Integrity Software Synopsys Teraspeed Consulting Group Toshiba Xilinx Zuken Hassan Rafat, Mahbubul Bari, Ron Olisar Arpad Muranyi*, Ed Bartlett, Vladimir Dmitriev-Zdorov Randy Wolff* Walter Katz*, Mike LaBonte*, Mike Steinberger, Todd Westerhoff John Ellis, Ted Mido, Scott Wedge, Rinsha Reghunath, Xuefeng Chen, Jinghua Huang, Yu Wang Bob Ross*, Tom Dagostino Yuui Shimizu, Yoshinori Fukuba (Raymond Anderson) Masaud Raeisi, Reinhard Remmert, Michael Schaeder, Alfonso Gambuzza, Kiyohisa Hasegawa OTHER PARTICIPANTS IN 2013 Abeism Corp Accton Technology Group AET AMD ASE Group Astrodesign ASUSTek Computer AU Optronics Corp Avant Technology Bayside Design C-Tech Canon Canon Components Casio Computer Celestica Chinese Electronics Technology Company Institute #52 (CETC52) Chino Cisco Systems Computer Simulation Technology Compal Electronics Contech Coriant Cybernet Systems Delta Networks Eastwell ECL Advantage Elpida Memory Etrain China FiberHome Technologies Group Nobuyuki Kiyota Ching-Hwei Tsend, Xian-Wei Wang Norihide Taguchi Tadashi Arai Hink Chung, Jarris Kuo Nishi Yoshiaki Vincent Lu Jason Kuo, Joe Shih Elvis Li, Linda Sun, Jyam Huang, Enson Lee Elliot Nahas Hideki Inada Yuji Ishikawa, Takamasa Sakuragi Hisayuki Tamura Yasuhisa Hayashi, Ikuo Imada Lei Liu, Fei Xue Shujun Wei, Tianjiao Wu Akio Nakanishi Biao Chen, Feng Wu, Iris Zhao Heiko Grubrich Scott C.H. Li Zheng Tang Bruce (Zhenshui) Qin Takayuki Tsuzura, Wataru Nakagawa Skipper Liang Xuanjiang Shen, Xiuqing Ye Thomas Iddings Toshio Oki Weichun Lu Shengyao Wan, Xuanjun Xia

3 Freescale Semiconductor Jon Burnett, Takahiro Sato Fuji Xerox Tadamasa Sakamaki Fuji Xerox Manufacturing Rumi Maeda Fujitsu Advanced Technologies Yoshiyuki Iwakura, Kazuhiro Kanai, Hikoyuki Kawata, Ryo Mizutani, Syougo Fujimori, Hidenobu Shiihara, Kumiko Teramae Fujitsu Interconnect Technologies Hiromi Hayasaka Fujitsu Laboratories Toshiki Iwai, Satoshi Matsubara Fujitsu Microelectronics Solutions Saharu Kamimura, Jyun Uchita, Yutaka Ide Fujitsu Semiconductor Hirokazu Yamazaki, Yu Kamata, Motoaki Matsumura, Shintaro Ohtani, Megumi Oono Fujitsu VLSI Shizue Katoh, Hiroki Kubota Giga Hertz Technology Ryuji Kawamura Granite River Labs Vamshi Kandalla, Miki Takahashi H3C Lichen Li, Xiaoxiang Li Hewlett-Packard Yongjin Choi, Ting Zhu Himax Technologies Falco Chuang, Lee Renee, Austin Wang, Josh Wu Hisense Aofeng Qian Hitachi Ritsurou Orihashi Hitachi Information & Yoshifumi Takada Communication Hitachi Kokusai Electric Kunihito Seguchi Hitachi ULSI Systems Co. Hiroshi Uematsu, Sadahiro Nonoyama ILI Technology Corp Tieyan Chang, Chia-Chen (Trevor) Wu Inventec Zhong Peng Innotech Corporation Tasuku Kanomata Japan Aviation Electronics Industry Norihiro Andou Japan Radio Co. Takashi Satoh JEITA Atsushi Ishikawa JVC Kenwood Corporation Takuo Fujimura, Hidetoshi Suzuki KEI Systems Shinichi Maeda Kyocera Circuit Solutions Kiyohiko Kaiya, Toshiyuki Kaneko Kyoden Co. Shinichi Mochida Lapis Semiconductor Yuki Akyama Lenovo John Lin, Alan Sun Marvell Technology Group Weizhe Li, Fang Lv, Banglong Qian, Yuyang Wang Mediatek Gerald Hsu, Fandy Huang MD Systems Hidetoshi Ogawa Megachips Corporation Yoshimasa Yahata Meidensha Corporation Ryu Neruson Mitsubishi Electric Corporation Suzuki Yusuke, Takumi Kurihara Micro-Star International Ethan Huang, Anthony Liang, PeterTsai, Cloud Tseng Molex Davi Correia, Greg Fu, Satish National Instruments Lee Mohrmann Nikon Corporation Kazuomi Tominaga, Manabu Matsumoto

4 Nisoul Co. Nokia Siemens Networks Novatek Microelectronics Corp Nvidia Oki Electric Industry Co. Open Silicon Pegatron Corp Polar Instruments Qualcomm QLogic RDA Microelectronics Ricoh Company Rohm Co. SAE Sanei Hytechs Co. Seiko Epson Corporation Semiconductor Manufacturing International Corp. Shanghai Microsystem and Information Technology Institute Shanghai United-Imaging Shibaura Institute of Technology Spreadtrum Communications Shanghai Signalkhobho Silvaco Sony Corporation Sony Engineering Corporation Sony LSI Design Stanley Electric Co. Success International Corporation Sunplus Technology TDK-EPC Corporation TechAmerica Tektronix Teledyne LeCroy Teradyne Test Research TFF Corporation Toshiba Information Systems Toshiba Microelectronics Toshiba Semiconductor & Storage Kaoru Tazaki Xuhui (Helen) Chen, Gino Guo, Gang Zheng Jasper Cheng, Willy Lin, Frank Pai Eric Hsu, David Chen, Alan (Chia Yuan) Hsieh, MT Lin, Chih Wei Tsai Atsushi Kitai, Kenichi Saitou Norman Chang Lawrence Ting Tetsuya Koizumi Scott Powers James Zhou Ke Cao Daisuke Koya, Kazuki Murata, Kazumasa Oaki, Mitsuo Kaibara, Miyoko Goto, Toshihiko Makino, Yasuhiro Akita Noboru Takizawa (Chris Denham) Hiroyuki Kai Minoru Kozaki Sheral Qi Chi Xu Xi Huang, Yuan Liu, Jirui Lu, Chun Yuan, Yi Zhao Seiju Ichijo Lily Dai, Steven Guo Atsuhito Noda Kunio Hitomi Haruhiro Saito, Sachio Iida Atsushi Yoshimoto Naoyuki Morinaga Motoharu Kishi Tatsuo Futai Forest Hsu, Yi-Tzeng Lin Katsufumi Ehata [(Chris Denham)] Hitoshi Hatakeyama Xuanfeng Wu, Ting Zhao Raymond Yakura Mike Wang Katsuhiko Suzuki Mari Kuroki Junya Masumi Yasunobu Umemoto

5 Towa Electronics Université de Brest University of Illinois VeriSilicon VIA Labs VIA Telecom Vitesse Semiconductor Wadow Winbond Electronics Corp YDC Corporation YDK Co. Zhejiang Uniview Technologies ZTE Corporation Yoshikazu Suzuki Mihai Telescu Tom Comberiate, José Schutt-Ainé, Xu Chen Tina Xu Sheng-Yuan Lee Jen-Hung (Eddie) Lin, Jacky Liu Sirius Tsang Kazuhiko Kusunoki Albert (Cheng-Han) Lee, Marko (Chien-Cheng) Lin Yoshiaki Manabe Yoshio Takemura Huanyang Chen, Fei Ye Huifeng Chen, Fengling Gao, Tao Guo, Hui Jiang, Zhi Zhou, Shunlin Zhu In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password January 10, IBIS January 31, 2014 DesignCon IBIS Summit no teleconference For teleconference dial-in information, use the password at the following website: All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: NOTE: "AR" = Action Required INTRODUCTIONS AND MEETING QUORUM Randy Wolff declared that a quorum was reached and the meeting could begin.

6 Bob Ross noted that Mike LaBonte is conducting the meeting as Michael Mirmak is unable to attend. CALL FOR PATENTS Mike LaBonte called for any patents or pending patents related to the IBIS 3.2, IBIS 4.2, IBIS 5.1, IBIS 6.0, Touchstone 2.0 or ICM 1.1 specifications. No patents were declared. REVIEW OF MINUTES AND ARS Randy Wolff called for comments regarding the minutes of the November 1, 2013 IBIS Open Forum teleconference. The minutes were approved without changes. He then called for comments regarding the minutes of the November 15, 2013 IBIS Summit in Shanghai. He noted that minutes incorrectly show Stephen Guo associated with Cadence when he actually is associated with Spreadtrum Communications. The minutes were approved with the noted change. Randy then called for comments regarding the minutes of the November 19, 2013 IBIS Summit in Taipei. The minutes were approved without changes. Finally, Randy called for comments regarding the minutes of the November 22, 2013 IBIS Summit in Yokohama. The minutes were approved without changes. MISCELLANY/ANNOUNCEMENTS None. CALL FOR NEW ISSUES Walter Katz requested time to give a short presentation on interconnect modeling. MEMBERSHIP STATUS AND TREASURER'S REPORT Bob Ross reported that we may have 22 members. We have accumulated a large amount of money ~$14,500 from summits, parser payments and an additional membership. This puts us in good shape for 2014 activities. Bob will be inquiring with SAE about sending out membership invoices for If anyone needs an invoice in 2013, contact Bob for help. There may also be one additional membership payment for 2013 coming in. Mike LaBonte asked if the $14,500 was purely from Summits. Bob responded that no, this includes other payments. Mike asked if the accounting is from SAE. Bob responded that no, this is his own accounting. Radek asked if we can we move forward with parser development using this money. Mike noted that we d like to get other payments first, as this money is more of a backup. Bob responded that some of this money will also be used for the DesignCon IBIS Summit. WEB PAGE AND MAILING LIST ADMINISTRATION Mike LaBonte reported that the IBIS home page has a DesignCon promotional banner on it due to our contract with DesignCon. There are 413 subscribers on the mailing list and this is the third largest on eda.org. He is doing some checking to make sure there are not broken links on

7 the web page. The upcoming event page was updated to move the Asia Summits down the list. MODEL LIBRARY UPDATE No update. INTERNATIONAL/EXTERNAL ACTIVITIES - Conferences None. - Press Update Bob Ross noted that Michael Mirmak sent a link to a paper recently mentioning IBIS-AMI modeling. The paper is Advancements in High-Speed Link Modeling and Simulation (An Invited Paper for CICC 2013). The paper was presented at the Custom Integrated Circuits Conference by authors Mike Peng Li, Masashi Shimanouchi, and Hsinho Wu of Altera. The abstract for the paper can be viewed at: SUMMIT PLANNING AND STATUS - Asia Events Mike LaBonte thanked Lance Wang for his role in facilitating the Summits. Bob Ross summarized the Summits. They were all successful. The Shanghai meeting had 109 participants, Taipei had 64 participants and Yokohama had 107 participants. Lance conducted meetings in Shanghai and Taipei, and Michael Mirmak conducted the meeting in Yokohama. Attendance was a bit lower than expected, so some sponsorship money was not used. Extra funds will be carried over to Sponsors of the Shanghai event included Huawei as the major sponsor and cosponsors including Agilent, ANSYS, Cadence, Intel, IO Methodology, Teledyne LeCroy and Synopsys. For the Taipei event, ANSYS was the major sponsor and cosponsors included Cadence, Intel, IO Methodology and Synopsys. For the Yokohama event, JEITA and the IBIS Open Forum were major sponsors and cosponsors included ANSYS, Cadence, Mentor Graphics and Zuken. - DesignCon 2014 Mike reported that the Summit is scheduled for Friday, January 31, IBIS is an official cosponsor of DesignCon. The first call for papers should go out mid-december. Mike noticed a few companies giving presentations during the morning of our Summit meeting, so he hoped that some of those papers would be presented in the afternoon. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. QUALITY TASK GROUP

8 Mike LaBonte reported that the group is doing two things recently including working on the ibischk6 parser and a document describing the parser operation. Work is progressing slowly. The group is continuing to meet weekly on Tuesdays at 8:00 am PT. The Quality Task Group checklist and other documentation can be found at: ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group is meeting regularly on Tuesdays at 12:00 p.m. PT. They are discussing how to implement package modeling using IBIS-ISS. Task group material can be found at: NEW ADMINISTRATIVE ISSUES None. BIRD125.1: MAKE IBIS-ISS AVAILABLE FOR IBIS PACKAGE MODELING BIRD128: ALLOW AMI_PARAMETERS_OUT TO PASS AMI_PARAMETERS_IN DATA ON CALLS TO AMI_GETWAVE BIRD145.3: CASCADING IBIS I/O BUFFERS WITH [EXTERNAL CIRCUIT]S USING THE [MODEL CALL] KEYWORD BIRD147: BACK-CHANNEL SUPPORT BIRD157: PARAMETERIZE [DRIVER SCHEDULE] BIRD158.3: AMI TOUCHSTONE ANALOG BUFFER MODELS

9 BIRD161.1: SUPPORTING INCOMPLETE AND BUFFER-ONLY [COMPONENT] DESCRIPTIONS IBISCHK5 PARSER AND BUG STATUS Bob Ross reported no new bugs. IBISCHK6 PARSER PLANNING Bob Ross reported that we are reviewing the development contract. The parser contract is scoped to include two open bugs and at least 6 BIRDs. If everything gets signed and approved, delivery will be in April. There are sufficient funds in the bank account, so we will be able to pay the developer when he is done. There are commitments for payments for at least four licenses. All that is needed is to finalize the contract, get the legal verbiage approved by SAE and start the signature process. Bob noted that one request in the contract was to have source code work with the GCC compiler, but is the earliest version the developer can work with. The contract will be modified for this. Mike LaBonte noted that it would be good to get some feedback from parser purchasers if they have any specific compiler requirements. NEW TECHNICAL ISSUES Walter Katz showed a presentation he gave at the ATM task group meeting on Tuesday related to on-die and package interconnect modeling. A decision was made about what types of models will be supported with EMD and what models could be supported within the.ibs file by enhancing [Component]. The most significant decision meant that for signal (I/O) pins, there is a one-to-one correspondence between pin number, die pad and buffer. Upcoming decisions include: will we support touchstone files directly without requiring they be wrapped in a subckt, port naming options, and support of corners for parameters. Developing a port naming protocol will be critical to supporting all the modeling options. Walter hoped a presentation could be given at the DesignCon Summit that would show a nearly complete syntax. NEXT MEETING The next IBIS Open Forum teleconference will be held January 10, 2014 from 8:00 a.m. to 10:00 a.m. US Pacific Time. The DesignCon IBIS Summit will be held January 31, No teleconference will be available for the Summit meeting. Radek Biernacki moved to adjourn. Brad Brim seconded the motion. There were no objections. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) , Fax (916) michael.mirmak@intel.com

10 Data Center Platform Applications Engineering Intel Corporation FM Prairie City Rd., Folsom, CA VICE CHAIR: Lance Wang (978) President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA SECRETARY: Randy Wolff (208) , Fax: (208) SI Modeling Manager, Micron Technology, Inc S. Federal Way Mail Stop: Boise, ID LIBRARIAN: Anders Ekholm (46) , Fax: (46) ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan Stockholm, Sweden WEBMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA POSTMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA This meeting was conducted in accordance with ANSI guidance. The following addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis <your address>

11 In the body, for the IBIS Users' Group Reflector: subscribe ibis-users <your address> Help and other commands: help To join, change, or drop from either or both: IBIS Open Forum Reflector IBIS Users' Group Reflector State your request. To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs as well as tschk2 parser BUGs. The BUG Report Form for ibischk resides along with reported BUGs at: The BUG Report Form for tschk2 resides along with reported BUGs at: icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at:

12 Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: Check the IBIS file directory on eda.org for more information on previous discussions and results: Other trademarks, brands and names are the property of their respective owners.

13 IBIS SAE STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) Organization Interest Category Standards Ballot Voting Status November 15, 2013 November 19, 2013 November 22, 2013 December 6, 2013 Agilent Technologies User Active X X X X Altera Producer Inactive ANSYS User Active X X X - Applied Simulation Technology User Inactive Cadence Design Systems User Active X X X X Ericsson Producer Active X X X - Foxconn Technology Group Producer Inactive - X - - Huawei Technologies Producer Inactive X IBM Producer Inactive X Infineon Technologies AG Producer Inactive Intel Corp. Producer Active X X X - IO Methodology User Inactive X X - - LSI Producer Inactive Maxim Integrated Products Producer Inactive Mentor Graphics User Inactive X Micron Technology Producer Inactive X Signal Integrity Software User Inactive X Synopsys User Inactive X Teraspeed Consulting General Interest Inactive X Toshiba Producer Inactive - - X - Xilinx Producer Inactive Zuken User Inactive - - X - CRITERIA FOR MEMBER IN GOOD STANDING: MUST ATTEND TWO CONSECUTIVE MEETINGS TO ESTABLISH VOTING MEMBERSHIP MEMBERSHIP DUES CURRENT MUST NOT MISS TWO CONSECUTIVE MEETINGS INTEREST CATEGORIES ASSOCIATED WITH SAE BALLOT VOTING ARE: USERS - MEMBERS THAT UTILIZE ELECTRONIC EQUIPMENT TO PROVIDE SERVICES TO AN END USER. PRODUCERS - MEMBERS THAT SUPPLY ELECTRONIC EQUIPMENT. GENERAL INTEREST - MEMBERS ARE NEITHER PRODUCERS NOR USERS. THIS CATEGORY INCLUDES, BUT IS NOT LIMITED TO, GOVERNMENT, REGULATORY AGENCIES (STATE AND FEDERAL), RESEARCHERS, OTHER ORGANIZATIONS AND ASSOCIATIONS, AND/OR CONSUMERS.

2019 Chinese Taipei National High School Athletic Game Boxing Championship Junior Men Division Top 8 As of WED 24 APR 2019 Men s Mosquito(38-41Kg) Ran

2019 Chinese Taipei National High School Athletic Game Boxing Championship Junior Men Division Top 8 As of WED 24 APR 2019 Men s Mosquito(38-41Kg) Ran Junior Men Division Men s Mosquito(38-41Kg) 1 CHANG, CHI-EN TPE 2 HUANG, YU-CHEN TPE 3 YANG, MIN-SHUN TPE 3 CHIU, CHENG TPE 5 WU, CHIA-TING TPE 5 LIN, KUAN-YI TPE 7 TSAI, MING-FENG TPE 7 CHOU, MING-HSIEN