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1 Meeting Date: November 20, 2009 Meeting Location: Teleconference IBIS Open Forum Minutes VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Brian Andresen, Radek Biernacki, Saliou Dieye, Yutao Hu, Fangyi Rao, Xuliang Yuan AMD Nam Nguyen*, Tadashi Arai Ansoft Corporation Steve Pytel, Chris Eric, Dan Hou, Baolong Li, Jack Qiu, Davis Yan Apple Computer (Matt Herndon) Applied Simulation Technology (Fred Balistreri) ARM V. Muniswara Reddy Cadence Design Systems Terry Jernberg, Ambrish Varma, Aileen Chen, Lanbing Chen, Wenliang Dai, Fenghua Gao, Feng Li, Ping Liu, Yubao Meng, Jian (John) Peng, Qian (Candy) Shen, Muker Wang, Yifong Wen, Jun Wu, Zhi (Benny) Yan, Wayne Zhang, Wenjiang Zhang, Qi (Alex) Zhao, Yukio Masuko, Morihiro Masuko Cisco Systems Luis Boluna, Tram Bui, Bill Chen, Syed Huq*, Mike LaBonte, Pedo Miran, Huyen Pham, [AbdulRahman (Abbey) Rafiq], Ashwin Vasudevan, Zhiping Yang, Guan (Greg) Fu, Jin (Leo) Hu, Chunhai Li, Weifeng Shu, Xinghai Tang Ericsson Anders Ekholm* Green Streak Programs Lynne Green Huawei Technologies Xiaoqing Dong, Chunxing Huang, Guan Tao, Yu Chen, Zengzing Hu, Chun Huang, Jun Li, Han Li, Jinjun Li, Benguo Lin, Bo Liu, Shuyao (Charles) Liu, Longfang Lu, Luyu Ma, Huang Peng, Lin Qiang, Kaler Ren, Minghua Wu, Jianhong Xiang, Hang Yan, Xubo Ye, Hongcheng Yin, Xuequan (Tony) Yu, Cheng Zhang, Gezi Zhang, Yi Zhao, Yi Zhou Hitachi ULSI Systems Shinmei Hirano, Kazuyoshi Shoji, Yoshiyuki Yagami IBM Adge Hawes* Infineon Technologies AG (Christian Sporrer) Intel Corporation Myoung J. Choi, Michael Mirmak, Vishram Pandit, Jon Powell, Sirisha Prayaga, Lili Deng, Leo Fang, Haifeng (Bill) Gong, Fanghui Li, Jenny Li, Wenjie Mao, Yiunglei Ren, Yang Wu, Maoxin Yin, Xinjun Zhang IO Methodology Li (Kathy) Chen, Lance Wang*, [Zhi (Benny) Yan]

2 LSI Mentor Graphics Micron Technology Nokia Siemens Networks GmbH Samtec Signal Integrity Software Sigrity Synopsys Teraspeed Consulting Group Toshiba Xilinx ZTE Zuken Brian Burdick* Weston Beal, Vladimir Dmitriev-Zdorov, Zhen Mu, Arpad Muranyi* Randy Wolff* Eckhard Lenski* (Corey Kimble) Barry Katz, Walter Katz, Todd Westerhoff* Brad Brim, Sam Chitwood, Raymond Chen, Jiangsong Hu, Li Li, Xianfeng Li, Lily Lou, Zhangmin Zhong Ted Mido, Xuefeng Chen, Wenyun Gu, Jinghua Huang, Bo Liu, Qin (Kitty) Zhang Bob Ross* Yoshihiro Hamaji [David Banas] Xiaolin Chen, Yanbin Chen, Jinku Guan, Mai Hu, Nan Jiang, Fei Lu, Xiaorong Lu, Xianyu Meng, Junwei Zhang, Shunlin Zhu Michael Schaeder, Ralf Bruening, Motoyuki Matsuawa, Hirohiko Matsuawa OTHER PARTICIPANTS IN M AET Altera Apache ATE Bayside Design Canon Celestica Circuit Spectrum CST Curtiss-Wright Embedded Computing Cybernet Systems EM Integrity EMC Corporation Elpida Memory Exar Freescale Fujitsu Advanced Technologies Fujitsu VLSI H3C Kylin Chen, Shiang Yao Mikio Kiyono Hui Fu Yu Lin, Junyong Deng, Shulong Wu Nob Tanak, Kenny Suga, Hideaki Endo, Ytaka Honda, Kotaro Iida, Hiroyuik Itabashi, Kenji Kagawa Stephen Coe, Elliot Nahas Takamasa Sukuragi Fajiang Liu, Cao Wang, David Wu, Baoshu Xu, Fei Xue, Van Zhu Zaven Tashjian Antonio Ciccomancini, Martin Schauem J. Phillips Golden Qian, Takayuki Tsuzura Guy de Burgh Mingchang Wang, Vincent Yan Masakazu Koso Helen Nguyen Jon Burnett, Om Mandhama, Jesse Qin Shogo Fujimori, Hikoyuki Kawata Tetsuya Inoue Huanyang Chen, Xiaoqun Li

3 Hua Symantec Senliang Han Ibiden Kiyohisa Hasegawa ICT Solutions Steven Wong Interactive Devices Technology Zhiguang (Andy) Li (IDT) IdemWorks Michelangelo Bandinu Japan Aviation Electronics Industry Hiroaki Ikeda JEITA EC Center Atsushi Ishikawa Juniper Kevin Ko Kineret Design Ricardo Teliuteuesh Kyocera Elco Corporation Noniyuki Akai LeCroy Corporation Weidong (Derek) Hu, Scott Zhang Leventhal Design & Roy Leventhal Communications Marvell Mingzhen (Jane) Liu, Fang Lv, Yuyang Wang Maxim Integrated Products Ron Olisar Mindspeed Technologies Bobby Alkay NEC Electronics Corp. Takeshi Watanabe NetLogic Microsystems Eric Hsu Politecnico di Torino Igor Stievano Sanmina SCI Vladimir Drivanenko Sedona International Joe Socha Shanghai ITG Information Rongsheng Yuan Technology Siemens Manfred Maurer Signal Consulting Group Timothy Coyle, Nicole Mitchell Signal Khobho Atsuhito Noda Simberian Yuriy Shlepnev Sony Toshiro Honda, Yasuhiko Iguchi, Hiroshi Takamizawa TechAmerica (GEIA) (Chris Denham) Texas Instruments Pavani Jella TDK Yoshikazu Fujishiro THine Electronics Yohei Izhizone Towa Electronics Yoshikazu Suzuki Vendor Chain International Jing Lou Xsigo Systems Robert Badel Zuken Support and Service Seikou Go, Ryosuke Tokonami, Tomotaka Unose, Yin Yi Independent Ian Dodd In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS

4 The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password December 11, IBIS For teleconference dial-in information, use the password at the following website: All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: NOTE: "AR" = Action Required INTRODUCTIONS AND MEETING QUORUM No new participants. CALL FOR PATENTS Bob Ross called for any patents or pending patents related to the IBIS 3.2, IBIS 4.2, IBIS 5.0 or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Bob Ross reported that we will likely finish the year with 30 paid members. We will probably pick up a few members next year. We also sold another parser license. This makes 6 parser purchases so far. Bob is making sure the parser purchases are properly credited to the IBIS account. REVIEW OF MINUTES AND ARS Bob Ross called for comments regarding the minutes of the October 30, 2009 IBIS Open Forum teleconference, the November 4, 2009 Asian IBIS Summit (China) and the November 6, 2009 Asian IBIS Summit (Japan). Randy Wolff noted that Hildesheim, the city in Germany that will host the SPI conference in 2010, was misspelled in the October 30 minutes. The minutes were approved with the noted change. WEB PAGE UPDATES Syed Huq reported a few updates. The home page added a link to the ibischk5 parser. He

5 removed old members from the poster page. He changed the order of events and updated the DesignCon logo on the events page. Bob Ross mentioned that he has a list of changes he will submit to Syed. The FAQ page needs to be reviewed to change all references of GEIA to TechAmerica and update the IBIS parser price to $2500. Also, we will need to add a link to the new IBIS Quality document somewhere on the site. MAILING LIST ADMINISTRATION No update. MODEL LIBRARY UPDATE No update. PRESS UPDATE None. MISCELLANY/ANNOUNCEMENTS None. OPENS FOR NEW ISSUES None. INTERNATIONAL/EXTERNAL ACTIVITIES - DASC No update. The DASC file and archive may be found at: - P1735 Encryption No update. The IEEE Study Group on Encryption web reflector archives are found at: -Conferences The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. Lance Wang of IO Methodology planned to present a paper entitled "2-Pin-Pair Oriented Extraction Method for True Differential Pair Buffer Behavioral Modeling." Lance was unable to attend.

6 TECHAMERICA STATUS Bob Ross noted that there will be a new accounting system at TechAmerica in IEC APPROVAL ACTIVITIES Randy Wolff reported that the IEC meeting was September 28-30, He has not heard any update from Victor Berman on the status of IEC approval of the IBIS 4.2 specification. SUMMIT STATUS -China Summit Review The meeting was held Wednesday, November 4 at the Four Points Hotel in Shanghai. Cosponsors included Huawei Technologies, Agilent Technologies, Ansoft, Cadence Design, Cybernet Systems, Intel, IO Methodology, Mentor Graphics, SiSoft, Sigrity, Synopsys and ZTE Corporation. Lance Wang shared a slide show of the event. He noted that this is the fifth year of the event, and it was a successful meeting. 112 people attended, not including vendor table staffers. There were 12 presentations on methods, quality, system integration, AMI, S-parameters and package models. Lance shared results of a survey. All responders found the meeting valuable. He also showed results of the question What was your favorite topic? In the future, people would like to see the IBIS community focus on higher model quality, AMI improvements, more package model support, improved industry leadership, and support for higher speeds. The survey also asked for additional comments. Many people noted that the meeting was successful. Others added that they would like the meeting to be more interactive, have better technical focus, and see IC vendors pushed to provide more and better IBIS models. The presentation can be viewed at: Bob Ross noted that many of the presentations were in Chinese, and Lance helped with translation and running the meeting. The meeting was break-even financially. There is still some leftover money from previous years to use towards next years meeting. -Japan Summit Review The meeting was held Friday, November 6 at the JEITA headquarters from 2:00 PM to 6:00 PM. Co-sponsors included Japan Electronics and Information Technology Industries Association (JEITA), ATE (Sigrity Distributor), Cadence and Zuken. Bob Ross noted that 39 people attended. There were 10 presentations. One presentation needed to be stopped due to too much product promotion. The Open Forum tries to review all presentations ahead of time to catch this issue early, but not all presentations were seen in advance. However, all the presentations contained useful information and the attendance was greater than expected. -DesignCon Summit Planning The meeting is scheduled for Thursday, February 4, The agreement is signed between

7 IEC and IBIS. Bob Ross noted that the first announcement will go out in December. We already have three presentation proposals. We will probably not have a booth due to the extra fees associated with one. -European Summit Planning Eckhard Lenski noted that he thinks the summit will be held at the SPI conference in May in Hildesheim, Germany. Bob Ross noted that some members of the IBIS Committee are planning to attend. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Bob Ross reported that the group started discussing the IBIS Accuracy handbook and looked at a checklist associated with the existing IBIS Quality specification. Bob noted that the new IBIS Quality specification will be linked to the main IBIS page. The Quality Task Group checklist and other documentation can be found at: IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that there was a consensus at the last meeting on the AMI flow that will be in the IBIS 5.1 specification. Walter Katz wrote a BIRD that is being reviewed now. The draft BIRD is on the ATM website. Task group material can be found at: AD HOC TASK GROUPS (INTERCONNECT) Bob Ross reported that the group is reviewing proposed sparse matrix mapping syntax. There will be a meeting next Wednesday. Task group material can be found at:

8 MODEL CONNECTION PROTOCOL AND OTHER PROPOSALS Bob Ross reported that there was a proposal from Sigrity presented at the Asian summit meetings as well as in the Interconnect task group. The model connection protocol provides a way to link dies to package models to boards. We are considering helping to standardize the protocol through IBIS. Bob also mentioned a subcircuit package connection proposal from Cadence, the Electrical Module Description the ATM group has discussed, as well as Touchstone file connection ideas. NEW ISSUES None. TSCHK2 PARSER STATUS Bob Ross noted that the alpha6 release of the parser has been sent to the parser committee. Bob thinks it looks very good, so it should be close to official release. This parser also checks Touchstone 1 files. There is also a flag that uses the parser to upgrade the file to Touchstone 2, although this doesn t work for all situations. Bob hopes the parser will be released within a month. IBISCHK5 BUG STATUS Bob Ross noted that there are no new BUGs to report. There are six open BUGs right now. We might prepay a parser developer to fix BUGs if we have extra money to spend at the end of the year. ICMCHK1 BUG STATUS All BUGs have been closed. No new BUGs have been filed. NEW ISSUES Arpad Muranyi inquired about how do we feel about the ICM specification now that we ve heard about all the other model connection protocols and modeling standards. Todd Westerhoff noted that he does not know of anyone using it. Arpad noted that there are still links missing to connect ICM files to IBIS, but he thought there was some EDA software implementing its features. Bob Ross knows of two vendors that have implemented it, but there is minimal usage. There are not enough models, and he is not sure what the tools can really do with existing models. Bob felt this was a fair question to ask on the IBIS reflector or si-list reflector. NEXT MEETING The next IBIS Open Forum teleconference will be held December 11, 2009 from 8:00 to 10:00 AM US Pacific Standard Time. ========================================================================

9 NOTES IBIS CHAIR: Bob Ross (503) , Fax: (503) Staff Scientist, Teraspeed Consulting Group SW Lancaster Road Portland, OR VICE CHAIR: Lance Wang (978) President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA SECRETARY: Randy Wolff (208) , Fax: (208) rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc S. Federal Way Mail Stop: Boise, ID LIBRARIAN: Anders Ekholm (46) , Fax: (46) ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan Stockholm, Sweden WEBMASTER: Syed Huq (408) , Fax: (408) huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA POSTMASTER: Mike LaBonte (978) milabont@cisco.com Signal Integrity Engineer, Cisco Systems Mail Stop BXB01/1/ 1414 Massachusetts Ave Boxborough, MA This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following addresses are used:

10 In the body, for the IBIS Open Forum Reflector: subscribe ibis <your address> In the body, for the IBIS Users' Group Reflector: subscribe ibis-users <your address> Help and other commands: help To join, change, or drop from either or both: IBIS Open Forum Reflector IBIS Users' Group Reflector State your request. To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at:

11 Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: Check the IBIS file directory on eda.org for more information on previous discussions and results: Other trademarks, brands and names are the property of their respective owners.

12 IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) Organization Interest Category Standards Ballot Voting Status October 30, 2009 November 4, 2009 November 6, 2009 November 20, 2009 Actel Producer Inactive Advanced Micro Devices Producer Active Agilent Technologies User Inactive Ansoft User Inactive Apple Computer User Inactive Applied Simulation User Inactive Technology ARM Producer Inactive Cadence Design Systems User Active Cisco Systems User Active Ericsson Producer Active Green Streak Programs General Interest Inactive Huawei Technologies Producer Inactive Hitachi ULSI Systems Producer Inactive IBM Producer Inactive Infineon Technologies AG Producer Inactive Intel Corp. Producer Inactive IO Methodology User Active LSI Producer Inactive Mentor Graphics User Inactive Micron Technology Producer Inactive Nokia Siemens Networks Producer Inactive Samtec Producer Inactive Signal Integrity Software User Inactive Sigrity User Inactive Synopsys User Inactive Teraspeed Consulting General Interest Active Toshiba Producer Inactive Xilinx Producer Inactive ZTE User Inactive Zuken User Inactive CRITERIA FOR MEMBER IN GOOD STANDING: MUST ATTEND TWO CONSECUTIVE MEETINGS TO ESTABLISH VOTING MEMBERSHIP MEMBERSHIP DUES CURRENT MUST NOT MISS TWO CONSECUTIVE MEETINGS INTEREST CATEGORIES ASSOCIATED WITH GEIA BALLOT VOTING ARE: USERS - MEMBERS THAT UTILIZE ELECTRONIC EQUIPMENT TO PROVIDE SERVICES TO AN END USER. PRODUCERS - MEMBERS THAT SUPPLY ELECTRONIC EQUIPMENT. GENERAL INTEREST - MEMBERS ARE NEITHER PRODUCERS NOR USERS. THIS CATEGORY INCLUDES, BUT IS NOT LIMITED TO, GOVERNMENT, REGULATORY AGENCIES (STATE AND FEDERAL), RESEARCHERS, OTHER ORGANIZATIONS AND ASSOCIATIONS, AND/OR CONSUMERS.

Microsoft Word - m doc

Microsoft Word - m doc Meeting Date: November 6, 2009 Meeting Location: Tokyo, Japan IBIS Open Forum Minutes VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Brian Andresen, Radek Biernacki, Saliou Dieye, Yutao