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http://www.maihui.net PCB PCB... 2 PCB... 4 1. 50... 4 2 PCB... 5 3 (SMT)... 7 4 PCB... 8 5 PCB... 8 6... 9 7. PCB... 9 DFM... 12 1 DFM... 12 2... 13 1

http://www.maihui.net PCB 1. Test Coupon: test coupon TDR (Time Domain Reflectometer) PCB test coupon ) (ground TDR (probe) (probe test coupon ti 2. Edge-Conncetion (Gold Finger (Connector) 140 Knoop 30u in (Substrate) COB chip on board " " wire bond 100 Knoop 3., :Hard Gold; soft Gold IC 4. SMT Additive Process() PCB ) Angle of attack() Anisotropic adhesive() Z Application specific integrated circuit (ASIC ) Artwork() PCB 3:1 4:1 Automated test equipment (ATE ) Blind via() PCB Buried via() PCB ( ) Bonding agent() 2

http://www.maihui.net Bridge() Circuit tester() PCB Cladding() PCB CTE---Coefficient of the thermal expansion() (ppm) Cold cleaning() Component density() PCB Conductive epoxy() Copper foil( ) PCB Copper mirror test() Defect() Delamination() Desoldering() () DFM() Environmental test() Functional test() Fiducial() Fine-pitch technology (FPT ) 0. Fixture () PCB Lead configuration() Machine vision() Mean time between failure (MTBF ) Photo-plotter() PCB ( Pick-and-place(-) PCB Placement equipment() PCB SMD X/Y Reflow soldering() / Schematic() Solder bump() Soldermask() 3

http://www.maihui.net Type I, II, III assembly( ) PCB(I) SMD (II) SMD () (III) Ultra-fine-pitch() 0.010 (0.25mm) Void() Yield() 5 Keying Slot 6. Mounting Hole Insertion Hole,Lead Hole 7. Laminate : CCL Copper per Claded Laminates 8. Prepreg 9. Silk Screen 10. Screen Printing 11. Screen ability 12. Solder Bump 13. Substractive Process 14. Surface-Mount Device(SMD) SMD 15. Surface Mount Technology SMT 16. Thin Core 17. Through Hole Mounting 18. Twist PCB 1. 50 PCB 50 6 1 PWB 1936 ~ 4

http://www.maihui.net 1936 2 PWB 1950 ~ PP PWB PWB PP PWB 3 PWB 1960 ~ GE PWB GE PWB GE 1965 GE GE PP 4 PWB 1970~ MLB PWB 4 6 8 10 20 40 50 0.5mm 0.35 0.2 0.1mm PWB PWB TMT SMT PWB 20 SMT PWB 5 MLB 1980 ~ 1982 ~1991 10 PWB 3 1982 3615 1991 10940 MLB 1986 1468 1989 2784 MLB 1980 PCB 62 MLB MLB 6 21 1990 ~ MLB 1991 PWB 1994 MLB 1998 MLB IC BGA CSP 50 PWB 1947 IC ISI VLSI MCM BGA CSP IC 21 21 2 PCB PCB (Printed Circuit Board) PCB PCB 5

http://www.maihui.net 6 PCB 100 PCB UV UV / : B / PCB

http://www.maihui.net 1 2 3 4 MCM MCM (Multi Chip Module ) MCM MCM MCM MCM MCM-D Mulit Chip Module Deposited Thin Film 500Mhz 10-25 1050 PCB 3 (SMT) 1) SMT 1/10 SMT 40%~60% 60%~80% 7

http://www.maihui.net 30%~50% 2) (SMT) (IC) (IC) 3) SMT / Surface Mount Technology SMT SMT SMT SMT SMT CIMS SMT SMT SMT FMS SMT 4 PCB 2.44 5 PCB MIL STD 275 0.001 8

http://www.maihui.net 6 7. PCB (HASL, hot air solder leveling) (OEM, original equipment manufacturer) OEM HASL (PWB, printed wiring board) ( ) OSP 20 ~ 30% HASL ENIG OSP HASL PWB HASL OSP organometallic)( ) (ENIG) OSP OSP PWB 1 OSP 9

http://www.maihui.net PWB ENIG ENIG PWB OSP PWB HASL OSP 2,3 OSP / (intrusive reflow) (selective solder fountain)(compliant pin) (through-hole) (paste-in-hole) PWB HASL (com 4 HASL OEM OSP OSP PWB PWB HASL (key contact) (component shielding)(edge connector) PWB (wire bonding) PWB (HDI, high-density interconnect) ENIG 10

http://www.maihui.net OSP PWB OSP ( ) (gold wire bonding) / OSP PWB OSP OSP ( ) OSP ENIG OSP (area array package) OSP ENIG 5,6 300,000 0.020" 10oz 100% #1 #2 #3 OSP BTH 10370KG2 0.500 1.25 0.500 OSP 10370KKY 0.500 0.500 0.500 BTH 10370KGM 0.025 0.025 0.025 10370KHW 0.025 0.025 0.025 BTH 10370K9Z 0.025 0.025 0.025 10370K8Y 0.025 0.025 0.025 / 0.025 0.025 0.025 11

http://www.maihui.net Sn63/Pb37 0.025 0.025 0.025 PWB (whisker) (30 ) ~ 50 millionths (ICT, in-circuit test) ICT OSP PWB OSP (chip-scale)(flip chip) / (TAB, tape automated bonding) (wire bondable) ICT OSP HASL HASL DFM DFM(Design For Manufacture) DFM DFM 1 DFM DFM DFM DFM DFM DFM DFM DFM DFM DFM DFM DFM 12

http://www.maihui.net ( ) DFM DFM DFM ( DFM DFM 2 DFM DFM DFM : DFM PCB DFM / ) DFM : : DFM ( dpm, defects per million) DFM PCB DFM PCB ( ) PCB X DFM 13

http://www.maihui.net DFM PCB 66% DFM DFM 10% DFM PCB * Standards PCB X before DFM PCB X after DFM Process dpm S/U Run Variable S/U Run Quantity S/U Run Quantity Stencil Print(T) 20 5 0.5 (PCB) 5 0.5 1 5 0.5 1 Chip Place 100 10 0.012 (SMT) 10 0.048 4 10 0.312 26 IC Place 200 15 0.025 (SMT) 0 0 0 0 0 0 Reflow 25 5 - Internal 5 0.3 1 5 0.3 1 Stencil Print(B) 20 5 0.5 (PCB) 0 0 0 0 0 0 Chip Place 100 10 0.012 (SMT) 0 0 0 0 0 0 IC Place 200 15 0.025 (SMT) 0 0 0 0 0 0 Reflow 25 5 - Internal 0 0 0 0 0 0 Clean 10 5 0.3 (PCB) 0 0 0 0 0 0 DIP 5000 15 0.1 (Comp) 0 0 0 0 0 0 Sequence 1500 20 0.02 (Comp) 20 0.26 13 0 0 0 VCD 1500 15 0.03 (Comp) 15 0.39 13 0 0 0 Radial 5000 30 0.04 (Comp) 0 0 0 0 0 0 Stake 6000 10 0.14 (Comp) 0 0 0 0 0 0 Mask 2500 10 0.05 (Point) 10 0.15 3 0 0 0 Adhesive Dispense 50 5 - Internal 5 0 50 5 0 50 Chip Place 100 10 0.12 (SMT) 10 0.6 50 10 0.6 50 IC Place 200 15 0.025 (SMT) 0 0 0 0 0 0 Cure 25 5 - Internal 5 0 1 5 0 1 Clean 10 5 0.3 (PCB) 0 0 0 0 0 0 Prep 5000 15 0.1 (Comp) 15 0.7 7 0 0 0 14

http://www.maihui.net Prewave 7500 10 0.2 (Comp) 10 2 10 10 0.8 4 Wave Solder/Clean 2000 5 0.7 (PCB) 5 0.7 1 5 0.7 1 Postwave Difficult 15000 10 3 (Comp) 10 9 3 0 0 0 Postwave Easy 10000 10 1 (Comp) 0 0 0 0 0 0 Clean 500 5 0.3 (PCB) 5 0.3 1 0 0 0 Depanel 5000 5 1.5 (PCB) 5 6 4 5 1.5 1 Conformal Coat 10000 20 10 (PCB) 20 10 1 20 10 1 Inspection 500 5 0.007 (Solder Joint) 5 1.12 160 5 1.12 160 Enter Lot Size 50 50 Enter Realization 0.55 0.8 I.E. Minutes 165 32.068 90 15.832 Prorated Setup 3.3 1.8 Total I.E. Min. 35.368 17.632 Total I.E. Hours 0.589 0.294 Expected Cycle Time 1.072 0.367 Expected Cost $32.15 $11.02 Expected Yield 89.40% 98.70% * All numbers are fictitious and are intended for instructioal purposes only.. DFM : PCB 18 DFM 1 0 (1 = 0 = ) ( 1 2 ) 1 0 (1 = 0 = ) ( 18) ( ) DFM 15

http://www.maihui.net Design for Manufacturability Scoring Project: X Board #: Y Components Specs Proto 1 Proto 2 Manufacturing Model Production <1% sole-sourced components 1 0 0 1 1 >95% PPSL compliance 1 1 1 1 1 Process compatible packaging 1 0 1 1 1 Component count - single pass 1 1 1 1 0 <2% hardware 1 0 0 0 1 Correct Strategy selected 1 0 0 0 1 Design Optimal PCB panel 1 0 1 1 1 Fabrication DRC resolved 1 0 0 0 0 Zero defect documentation 1 0 0 1 1 CAM ready data 1 1 1 1 1 Within PCB design guidelines 1 1 1 1 1 Process compatible orientation 1 0 1 1 1 Manufacturing Process Correct material packaging 1 0 0 1 1 Automation content >90% 1 1 1 1 1 <1% post wave process 1 0 0 0 1 Process steps <10 1 0 0 0 1 No fixtures/tools required 1 1 1 1 1 6 sigma yield possible 1 0 0 1 1 DFM Score 18% 33% 50% 72% 89% 93-100% World Class 16

http://www.maihui.net 85-92% Highly Manufacturable 77-84% Acceptable 69-76% Poor 0-68% Unacceptable : DFM X Y ( ) 10 10 75 50 10 100 100 DFMDFM DFM DFM DFM DFMM DFM 20 DFM CAE DFM DFM DFM IPC Association Connecting Electr onics Industries, (846) 509-9700. Surface Mount Equipment Manufacturers Association (SMEMA), (847) 831-1002. Electronic Industries Alliance (EIA), (703) 907-7500. SMC-WP-004 Design For Excellence 17

http://www.maihui.net IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes IPC-D-325 Documentation Requirements for Printed Boards, Assemblies, and Support Drawings IPC-D-330 Design Guide Manual IPC-D-390 Automated Design Guidelines IPC-C-406 Design and Application Guidelines for Surface Mount Connectors IPC-SM-782 Surface Mount Design and Land Pattern Standard IPC-EM-782 Surface Mount Design and Land Pattern Standard Spreadsheet EIA-JEP-95 JEDEC Registered and Standard Outlines for Semiconductor Devices SMEMA 3.1 Fiducial Design Standard PCB 18

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