1.1 Wire Bonding TAB(Tape Automated Bonding) Flip Chip [1] Wire Bonding IC Pad TAB LCD(Liquid Crystal Display) LCD IC Flip Chip LCD COG(Chip on Glass) IC LCD ITO Flip Chip [1] Flip Chip MBB(Micro Bump Bonding) (Anisotropic Conductive Film, ACF) LCD(Liquid Crystal Display, LCD) IC COG(Chip on 1
Glass) COG IC []-[4] 1. IC Bump ACF ACF 0%~90%
ACF COG COG 3
ACF COG.1 IC ITO 1. AgPd IC. IC 150 IC ITO 3. (Anisotropic Conductive Adhesive, ACA) (Anisotropic Conductive Film, ACF) [5 ] (Anisotropic Conductive Film, ACF) COG 4
Hitachi AC-8304Y (Double- ACF Layer ACF ) (Single-Layer ACF) (Short). [6] ITO(Indium Tin Oxide) IC Pad (LCD) ITO ITO STN-LCD(Super Twisted Nematic -LCD) ITO Photo Layout COM SEG I-CON ITO Pin [7] COG(Chip on Glass) ITO Layout IC ITO COG(Chip 5
on Glass) ITO [][3] R Rpu Rcu Rtu Rblk Rtb Rcb Rpb Upper plate Particle Bottom plate Rpu Upper substrate Bottom substrate Rcu Rtu Rblk 6
Rtb Rcb Rpb (constriction resistance) b u b b R pu = bu ρ πζ dζ = ρ πb u R pb ρ = πb b R cu = bu ru ρ πζ dζ = ρ π 1 ru 1 b u R cb = ρ π 1 rb 1 b b r b 7
R blk = ρ π( a x a ru = a r b dx ) ρk ( a, r r ) u, πa b k ( a, r, r u b ( a + ) = ln ( a a a r r u u )( a + )( a a a r r b b ) ) ρ R = πr u ρ + πr b + R tu + R tb ρk ( a, r, r u b ) + πa Rtu Rtb Pad r u r b ρ R = + π r R blk 1 R r.3 COG(Chip on Glass) (Anisotropic Conductive Film, ACF) COG(Chip on Glass) IC ITO 8
ACF Pin IC Pad IC 0.5~1 (Head) 50 ~60 IC COG 90 100 3.5kg 5 COG COG COG COG IC Pad ITO IC Pad ITO Bump 9
COG Bump 5 Pad Bump Pad ITO.5 COG [8] a = 3 3πP ( k1 + k) R1R 4( R + R ) 1 α = 3 9π P ( k1 + k) ( R1 + 16R R 1 R ) k 1 1 ν = πe 1 1 k 1 ν = πe a α 10
P k Kyung-Wook Paik [] NE * 1 3 ρ1 0.69( ρ p + ρs )( ) + Rc = FD 0.54D N 1 1 ν p 1 ν = + E * Ep Es s N D F ν ρ (s p ).6 [9] IC Pad 11
0% 30% 40%~60% 0%~60% IC Pad 0%.7 TAB COG LCD TAB(Tape Automated Bonding) STN-LCD Duty Pin PDA TAB 1
64Duty COG COG TAB TCP (Tape Carrier Package) TAB ( back light ) LCD 0.7 1.4mm 1.mm TCP 1.5mm TAB 4.1mm COG.6 mm LCD 0.7 1.4mm 1.mm COG TAB COG TAB COG LCD IC TAB LCD TAB COG [10] 13
COG (Head) 100 COG COG Bump ACF 3.1 45.6 x 7x1.9 mm 16.7 x 4 mm DOT-16*3 + I-CON 1/5 Duty 1/5 Bias 14
5.3V 5 ìm 0000pcs/mm 3 ìm IC SPLC093(SUNPLUS) IC 630 00ìm Pad Pitch 75.6ìm IC Pad 3. COG COG 90 5 3.5kg 100 50 70 90 4 5 6 15
5 (50 90%RH 1000 ) 40-45.6 x 7 x 1.9 (mm) 1. IC ACF IC - SPLC093C ACF AC-8304Y 3.5kg 100 90 70 50. 5 secs A C E 4 secs B D F 3. 5 4. 5. (50 90%RH) 40hrs 6. 1000hrs ( ) bump 7. 8. 16
3.3 COG 3.5kg 90 100 5 1.0 5.0kg 0.5kg 9 5 (-30 [30mins]<- ->70 [30mins]) 30 cycles 10cycles 4 8 Bump 8 Pad 69 41 14 7 163 14 84 77 ACF 17
- 45.6 x 7 x 1.9 (mm) 1. IC ACF IC - SPLC093C ACF AC-8304Y Head 90 5secs 100. 9 1.0 1.5.0.5 3.0 3.5 4.0 4.5 5 kg 3. 5 4. 5. (-30 [30mins]<- ->70 [30mins]) 30 cycles 10cycles 6. 8 Bump 7. 8. 3.4 Bump COG Bump Bump COG ACF 18
10 Bump IC 163 Pad 3.5 ACF 90 70 50 100 ACF thermocouple COG ACF COG 19
4.1 COG 90 70 50 4 5 COG 50 90%RH 1000 50 90%RH 1000 40 4 (OK) (NG) -- 100% 0
100% / 90/5 90/4 100% 70/5 3 40% 70/4 1 80% 50/5 1 75% 50/4 60% 90 4 5 70 50 90 4 5 4 OK 4 NG IC ITO ITO Layout COG Bump 0.18mA~0.188mA 1
1000 0.193mA~0.10mA 0.011~0.0mA 0.~0.5mA COG IC ACF 5 d(ma)/dt 0.0003 (ma/ ) 4 5 90 4 5 0.004mA 0.mA 85 Pilot Run Pilot Run
COG LCD ITO 90 3.5kg 4 5 90 5 9 ( 1 ) COG 10.5 3000 5 4 3
3400 400 13.3% 98.5% 4. COG ACF 5ìm Bump (t) 6 0~4 0%~90% 1~3 (%) (t) (ìm) 0 0~10 4.5~5 1 0~40 3~4 1 40~60 ~3 60~80 1~ 3 90 0.5 4 100 0 4
(t) Deformatio n t = 0 t 100(%) t t 0 (5ìm) t t 0%~90% 90 5 100 9 1.0kg~5.0kg 0.5kg -- 30 cycles COG COG -30 1 70 30-30 30 5
10.5kg 40%.5kg NG 3.0kg 30 OK 3.0kg 0%~90% 1~3 [9] ANSYS 50%~70% 1~ 60%~80% Pad 7 69 Bump 1.0kg 5.0kg 3.0kg 6
3 4.5kg 5.0kg 3.0kg.5kg 1 3.5kg 3 4 8 Bump IC Pad 69 41 14 7 163 14 84 77 1~3 41.9 163 1.9 15~19 1.0kg~3.0kg 10 0 5 /kg 3.0kg~5.0kg 7
0 4.5~5kg 4.3 Bump 10 163 Bump 13 39 3 5.5 4.88 Bump 3 Pad Size 80 50 ìm ACF 0000 /mm Bump 80 5 13 3 6 0 ACF 5000 /mm ACF 8
ACF 4.4 ACF ACF ACF 30 1 90% 07 30 50 70 90 thermocouple COG ACF -- ACF 1 14.8 3 4.9 3 4.4 4 5 1.1 3 5 90 3 4.1 ACF 0 ACF 15 9
90 70 1 07 70 70 1 08. 07 1. 4 30.1 30 0.1 90 1 07 15 4 44.5 30 14.5 80 1 14. 9 3 34 4 36.4 5 37.5 90 70 80 4 5 90 80 30
4 5 ACF 90 3 4.1 ACF 3 3800 6.6% 31
1. 100 3.5kg 90 4 5 4 5 400 13.3%. COG 4 COG IC ACF 0.193~0.10mA 0.0~0.50mA 3. 90 5 100 3.0kg 4. 0%~90% [9] ANSYS 3
50%~70% 60%~80% 3.0kg 5. 0%~90% 1.0kg 3.0kg 3.0kg~5.0kg 3.0kg 6. Bump 13~39 5.5 4.88 -- 3 7. ACF ACF 0000 /mm 5000 /mm ACF 33
8. ACF 30 1 90% Thermocouple 90 9. ACF 80 1 14. 9 3 34 4 36.4 5 37.5 10. 90 3 4.1 3 5 800 6.6% 100 COG -- 3kg 80~90 3~5 34
[1],, 147, 88,pp93~98. [] Myung-Jin Yim andktung-wood Paik, Design and Understanding of Anisotropic Conductive Films (ACS s) for LCD Packaging,IEEE Transactions on Components, Packaging, and Manufacturing Technology-Park A, Vol.1,No.,JUNE 1988, pp.6~34. [3] Rainer Dudek,Stefan Meinel,Andreas Schubert, Bernd Michel,Lutz Dorfmuller, Peter M, Knoll and Jorg Baumbach, Flow Characterization and Thermo-Mechanical Response of Anisotropic Conductive Films, IEEE Transactions on Components and Packaging Technology, Vol.,No.,JUNE 1999, pp.177~185. [4] Rajeev Joshi, Chip on glass-interconnect for row/column driver packaging Microelectronics Journal, Vol.9,No.6,JUNE 1998, pp.343~349. [5] John H. Lau, Flip Chip Technologies, McGraw-Hill,1996,pp89~338. [6] F.G.Shi, Mikrajuddin Abdullah, S. Chungpaiboonpatana,K. Okuyama,C. Davidson,J.M.Adams, Electrical conduction of anisotropic conductive 35
adhesives effect of size distribution of conducting filler particles, Materials Science in Semiconductor Processing, Vol.,1999, pp.63~69. [7],,,, 85,pp3~31. [8] S. P. Timoshenko,J N. Goodier, Theory of Elasticity,3 rd, McGraw-Hill, 1970,pp409~414. [9], COG,, 89,pp33~4 pp67. [10], SMT,, 86,pp5-3~5-13. 36