國立成功大學數位論文
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- 冽弄 司徒
- 7 years ago
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1 Sn-Ag-xSb The Microstructure and Low Cycle Fatigue of Sn-Ag-xSb Lead-Free Solder Joints Cheng-Shyan Lee Hwa-Teng Lee
2
3 Sn-Ag (Sb, 0~10 wt%) Sb 150 C Sn-3.5Ag wt% Sb 1.7mm 150 C Sn-Ag-xSb Sb Sn-3.5Ag C C( 10.05%) Sb Sn-Ag ß-Sn 1.73% Sb Sb ß-Sn % Sb µm SbSn ß-Sn Sb 10.05% 20~30µm SbSn Sb Sn-3.5Ag 89.3N 114.2N(1.73%) 129.0N(3.85%) 140.5N(5.12%) 183.2N(10.05%) ±0.025mm Sb 10.05%Sb Sb Sb II
4 Sb III
5 Abstract The goal of this research is to evaluate the effect of Sb additions (0~10 wt%) on the melting point and microstructure of Sn-Ag solder. The reliability of low cycle fatigue of the solder joint is evaluated by the thermal storage test for 150 C. The materials tested are Sn-3.5Ag with 1.73, 3.85, 5.12 and wt% Sb additions respectively. Single-lap specimens were used to simulate real solder joints. Solder balls of 1.7mm in diameter were prepared in the lab, and re-flowed between two pure Cu substrates. The 150 C thermal storage test is conducted after soldering, and the storage time is 225 and 625 hours respectively. Experimental result shows melting points of the Sn-Ag-xSb solder are increased with greater Sb additions. The melting points are C(Sn-3.5Ag) and C(adding 10.05%) respectively, and the solid-liquid regions also expand as the content of Sb increases. Microstructures of the Sn-Ag solder with different Sb additions are similar and can be characterized as consisting of ß-Sn dendrite and interdenritic eutectic network. Sb atoms are solved in the ß-Sn when adding 1.73 wt% Sb into the Sn-Ag solder, and SbSn compounds of several µm in size are formed in the ß-Sn when adding 3.85 and 5.12 wt% Sb. As Sb addition reaches wt%, cubic SbSn compounds of 20~30 µm in length form in the solder. Shear strength of the as-soldered solder joints is increased with greater Sb additions. The shear strengths are 89.3N(Sn-3.5Ag), 114.2N(1.73%), 129.0N(3.85%), 140.5N(5.12%) and 183.2N(10.05%). In the condition with constant ±0.025mm displacement, fatigue life of the as-soldered joint is approximately increases with greater Sb additions. The reason is the plastic strain of the solder joint is decreases with greater Sb additions. The lesser plastic strain the better fatigue life and the rate of load-drop is increased with greater Sb additions. After 150 C thermal storage, fatigue life will improve IV
6 because of the softening of solder joints. While the creaks that propagate along the interface due to the increased thickness of the Intermetallic Compound (IMC) greatly reduce the fatigue life. Therefore, the fatigue life after thermal storage is influenced by two factors. Fatigue cracks initiate at the location between the IMC layers and the neck of hourglass-shaped specimens. The fracture mode transits from solder fracture mode to mixture mode then to IMC fracture mode with increasing Sb additions and longer storage time. V
7 SEM V
8 ... I... II...IV...VI...VII...IX...XII Sn-3.5Ag Sn-Ag-X Sn-Ag-Sb Sn-Sb Sn-Ag-Sb Coffin-Manson equation VII
9 XRD Sn-3.5Ag Sb Sn-Ag VIII
10 2-1 [1,2,8,12] Sn-Sb [11] Sn-Ag-Sb [34] [43] [57] [68] [63] [63] Shimadzu AG-I Sb DSC XRD Sb Sn-Ag OM Sn-2.91Ag-1.73Sb (500x) Sn-3.14Ag-3.85Sb SEM Sn-2.96Ag-5.12Sb SEM (BSE) EDS Sn-3.08Ag-10.05Sb SEM EDS (1)...50 IX
11 4-8 Sn-3.08Ag-10.05Sb SEM EDS (2) SEM (a)sn-3.5ag (b) 1.73% Sb (c) 3.85% Sb Sn-3.08Ag-10.05Sb Ag 3 (Sn,Sb) EDS Sn-2.96Ag-5.12Sb SEM EDS Sn-3.08Ag-10.05Sb SEM SbSn EDS Sb Sn-3.5Ag hysteresis loops Sn-3.5Ag hysteresis loops Sn-3.5Ag hysteresis loops Sn-3.5Ag Sn-2.91Ag-1.73Sb hysteresis loops Sn-3.14Ag-3.85Sb hysteresis loops Sn-2.96Ag-5.12Sb hysteresis loops Sn-3.08Ag-10.05Sb X
12 hysteresis loops Sb Sn-2.91Ag-1.73Sb Sn-3.14Ag-3.85Sb Sn-2.96Ag-5.12Sb Sn-3.08Ag-10.05Sb Sb Sb (90% load-drop) Sn-3.5Ag (a) (b) (50% load-drop) (c) (50% load-drop) Sn-3.14Ag-3.85Sb ( 50% load-drop) Sn-3.08Ag-10.05Sb ( 50% load-drop) Sn-2.91Ag-1.73Sb ( % load-drop) Sn-3.08Ag-10.05Sb ( % load-drop) [72,73]...91 XI
13 2-1 [17] NCMS 7 [2] Sn-Ag-Sb [9,35] (wt%) Sn-3.5Ag (wt%) [25] (wt%) XII
14 63Sn-37Pb (soldering) 50mg/dl (Environmental Protection Agency) 17 [1] 1990 Lead Exposure Reduction Act S2637 and S (National Center for Manufacturing Sciences, NCMS) IDEALS(Improve Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering) 1994 (Lead-Free Soldering Research Council)[2] 1
15 WEEE(Waste Electrical and Electronic Equipment) I/O BGA(ball grid array) (flip chip) CSP(chip scale package) DCA(direct chip attachment) [3~5] (coefficient of thermal expansion, CTE) (NCMS) 72 7 [2] Sn-3.5Ag (Sn-Ag) [2,6~8] Sn-Ag Ag 3 Sn Sn-3.5Ag Sn-Ag 2
16 Sb Sn SbSn [9~11] Sb Sn-Ag Sn Sb Ag 3 Sn Sn ε-ag 3 (Sn,Sb) SbSn ε-ag 3 (Sn,Sb) SbSn [12,13] [14] Sn-Ag Sb(1.75~8.78 wt%) Ag 3 Sn Sb Ag 3 Sn Sb Ag 3 Sn Sn Cu 6 Sn 5 Cu 3 Sn Sb [14] Sb 3
17 (soldering) Sn-Pb 231 C Sn-Pb [15,16] 1. Sn-Pb
18 [17] 2-1 [8] ( 200 C) Sn Bi In Sn-58Bi Sn-52In Sn-Pb Sn-9Zn Sn-8Zn-3Bi 2. ( 200~230 C) Sn Cu Ag Bi Sb Sn-3.5Ag Sn-0.7Cu Sn-3.4Ag-4.8Bi Sn-3.8Ag-0.7Cu Sn-2.6Ag-0.8Cu-0.5Sb 3. ( 230 C) Sn-20Au Sn-5Sb Sn-25Ag-10Sb 5
19 2-1 [17] 6
20 280 Sn-20Au Sn-5Sb Sn-0.7Cu Sn-3.5Ag Sn-3Ag-1~10Sb Sn-3.8Ag-0.7Cu Sn-25Ag-10Sb Sn-3.5Ag-0.5Cu-1Zn Sn-2.6Ag-0.8Cu-0.5Sb 210 Sn-3.4Ag-4.8Bi Sn-9Zn Sn-37Pb Sn-8Zn-3Bi Sn-2.8Ag-20In 140 Sn-58Bi Sn-52In 2-1 [1,2,8,12] 7
21 (NCMS) [2] 2-2 NCMS 7 [2] Code Composition Melting point ( C) A4 Sn-3.5Ag 221 A6 Sn-58Bi 139 E4 Sn-3Ag-2Bi 220 F2 Sn-2.6Ag-0.8Cu-0.5Sb 211 F17 Sn-3.4Ag-4.8Bi 210 F21 Sn-2.8Ag-20In 187 F27 Sn-3.5Ag-0.5Cu-1Zn NCMS 7 Sn-58Bi Sn-Ag Sn-Ag Sn-3.5Ag Sn-Ag Sn-3.5Ag 221 C Ag Sn Ag 3 Sn Ag 3 Sn [18~20] (dispersion hardening) Sn-3.5Ag β-sn Sn Ag 3 Sn Sn 8
22 (eutectic network) Kim [19] Sn-Ag β-sn Suganuma [21] 0~4% Ag Sn Ag Ag 3 Sn 4% Ag (primary)ag 3 Sn Ag 3 Sn Flanders [22] Sn-3.5Ag (Imtermetallic Compound, IMC) Cu 6 Sn 5 Cu 3 Sn Ag 3 Cu 6 Sn 5 Sn Ag 3 Sn Cu Bae [23] Sn-3.5Ag Cu Cu Sn-3.5Ag Cu Cu Sn-Ag-Cu Cu (scallop-shaped)cu 6 Sn 5 Cu 6 Sn 5 Sn Cu 6 Sn 5 Yang [18,20] Cu 6 Sn 5 Cu Cu 6 Sn 5 Cu 6 Sn 5 Yu [24] Cu 6 Sn 5 Cu 6 Sn 5 Sn-Ag Ag 3 Sn Sn-3.5Ag [25,26] Sn-Ag 9
23 2-1.2 Sn-Ag-X Sn-3.5Ag [27] Sn-3.5Ag Bi In Zn Cu Sb Bi In Zn Sn-Ag Sn-Pb Kariya [28,29] Sn-3.5Ag Bi In Zn Bi 2 wt% Bi Sn-37Pb 10 wt% In [29] Sn-Ag Yoon [30] Sn-Ag-In -65~150 C β-sn γ-insn 4 β-sn γ-insn 4 Sn-Ag-In Sn-Ag-In Zn [29] Zn Sn-Zn Zn Sn-Ag-Cu Cu Sn-Ag Sn-3.5Ag-0.7Cu 10
24 217.5 C Cu Sn Sn-Ag-Cu Sn-Ag Sn-Ag [29] Sn-Ag [30,31] Sn-Ag-Cu Sn-Ag-Cu Sn-Ag-Cu Sn-Ag-Cu Sn-Ag Sn Cu Ni Cu 6 Sn 5 Ni 3 Sn Sn-Ag-Sb Sb Sn-Ag Sn-Ag Motorola 1977 Sn-25Ag-10Sb [12,13] Sb Ag Ag Sn-Ag-Sb Sb Sn-Ag-Sb Sb 10% Sb β-sn Sn Sn-Sb 1971 Predel Sn-Sb ( 2-2)[11] 11
25 Sb Sn 9.6 wt% Sb Predel 250 C β-sbsn 43~60.5 at% Sb 2 Sn 3 324~242 C Sb 2 Sn 3 43 at% Sb SbSn 9.4 at% Sb β-sn 2-2 Sn-Sb [11] 1997 Vassiliev [32] Predel Sn-Sb β-sbsn β-snsb β -Sn 12 Sb 13 β -Sn 2 Sb 3 β -SnSb 2 Sb at% β β β β fcc NaCl 1998 Oberndorff[74] (diffusion couple) 12
26 Sn Sb 220 C 264 SnSb Sn 3 Sb 4 Sn 4 Sb 3 McCabe [33] Sb Sb 2.9 wt% 126 nm 2 3~5µm SbSn β-sn SbSn Sn-Ag-Sb Sn-Ag-Sb ( 2-3)[34] Sb Sn-Ag Sb β-sn SbSn ζ-ag 9 (Sn,Sb) ε-ag 3 (Sn,Sb) [9,34~36] ζ-ag 9 (Sn,Sb) Ag Masson [9] ε-ag 3 (Sn,Sb) Sn-Ag-Sb Ag-Sn Ag-Sb ε-ag 3 (Sn,Sb) Sn-Ag-Sb Sn-Ag-Sb (invariant equilibria) C C Eq. 2-1 Eq. 2-2 [9,34,35] C Sb Oh [35] C Eq. 2-3 Eq. 2-2 (metastable equilibrium) 2-3 Masson Oh Ag 3 (Sn,Sb) SbSn Sb Sb 13
27 2-3 Sn-Ag-Sb [34] L (Sb) Ag 3 (Sn,Sb) SbSn C... Eq. 2-1 L SbSn Ag 3 (Sn,Sb) β-sn C... Eq. 2-2 L Sb 2 Sn 3 Ag 3 (Sn,Sb) β-sn C... Eq Sn-Ag-Sb [9,35] Reference Reaction Phases Masson and Kirkpatrick [9] Oh et al. [35] C C C C Compositions Ag Sb Sn Ag 3 (Sn,Sb) SbSn Ag 3 (Sn,Sb) SbSn Ag 3 (Sn,Sb) SbSn Ag 3 (Sn,Sb) Sb 2 Sn
28 2-3 (surface mount technology, SMT) SMT (pin through hold, PTH) BGA Flip Chip CSP [4,5] PTH SMT BGA Flip Chip (solder bump) (bending) (vibration) (creep) (thermal cycling) (isothermal fatigue) (thermomechanical fatigue) [37] (thermal shock) [38-40] [41-43] 15
29 1. (bulk solder sample)[41,44-48] ASTM E E E ASTM E Au/Ni/Cu [49] 2. (simple shear sample)[42,50-56] single/double shear lap sample 2-4 (reflow) (hot 16
30 dipping)[57,58] 2-5 Solder Joint Solder Joint Solder Joint Solder Joint 2-4 [43] 2-5 [57] 17
31 3. (actual SMT solder joint)[37,43,59-63] IC IC Coffin-Manson equation (63Sn-37Pb) 0.65T m [64] Cutiongco [65] 18
32 63Sn-37Pb 150 C 2 Coffin-Manson equation f α = ε N θ... Eq. 2-4 p ε p plastic strain range N f fatigue life α fatigue ductility exponent θ fatigue ductility coefficient Tien [64] 25 C 100 C (Sn-rich) (Pb-rich) Shi [41] 63Sn-37Pb 25 C 1~50% Coffin-Manson equation Kanchanomai [46-48] ASTM E Sn-37Pb Sn-3.5Ag Coffin-Manson equation 20 C 0.1Hz 63Sn-37Pb Sn-3.5Ag α Sn-3.5Ag 63Sn-37Pb 63Sn-37Pb (colony) Sn-3.5Ag β-sn 19
33 Ag 3 Sn 2-3µm J da c ( J ) n / dn = C... Eq Sn-37Pb C = n = Sn-3.5Ag C = n =1. 5 Zhao [44,45] ASTM E a 63Sn-37Pb 95Pb-5Sn Sn-3.5Ag CT 63Sn-37Pb (threshold value) K th 0.6MPa m 1/2 95Pb-5Sn 0.4MPa m 1/2 K th (stress ratio)r J th 63Sn-37Pb 95Pb-5Sn 6N/m Sn-3.5Ag 20N/m 63Sn-37Pb Sn-3.5Ag (R= ) (10 Hz) (R 0.5) (0.1 Hz) Sn-3.5Ag Ag 3 Sn Ag 3 Sn Ag 3 Sn Ag 3 Sn Sn Guo [57] 8mm ( 2-5 ) 63Sn-37Pb (load drop parameter)φ φ 20
34 K J W p (area of hysteresis loop) Coffin-Manson equation Solomon[53] LCC/PWB (leaded chip carrier printed wiring board) 63Sn-37Pb 35C 0.3Hz Hz 0.3Hz 1/ Hz 0.3Hz 1/ C 0.3Hz Hz 0.3Hz 1/35 Shi [41] 63Sn-37Pb Hz Hz 10-3 Hz 10-3 Hz α θ Solomon [53,66] Shi [41] frequency-modified Coffin-Manson relationship ( ( ) α k 1 ε p N ν ) = θ... Eq. 2-6 f ν frequency k frequency exponent 21
35 Kanchanomai [67] Hz Sn-3.5Ag hysteresis loop (plastic strain range, ε p hysteresis loop ) (stress range, hysteresis loop ) frequency-modified Coffin-Manson relationship Sn-3.5Ag Mei [52] single lap 63Sn-37Pb [49] Cu 6 Sn 5 Cu 6 Sn 5 22
36 Cu 6 Sn [14,25,26] Chan Li [59,60] LCCC(leadless ceramic chip carriers) FR-4 IMC ( 25 ) IMC 2.8µm IMC 68% Wu [61] SCSP(stacked chip scale package) FR-4 IMC BGA (barrel type) (cylinder type) (hourglass type) 2-6 Ju [63]
37 [68] 2-7 [63] 24
38 2-8 [63] [69] 25
39 3-1 Sn-Ag [26] Sn-Ag Sb(1~2%) 1mm Sb [25] L Sb 150 C [14] Sb 8.78% Sb 4.75 wt% SbSn FR-4 Sb Sb 8.78% Sb 26
40 Sb Sn-Ag McCabe Fine[33] Sb 2.9% SbSn ( 3-1) 3 wt% Sb SbSn 150 C ( ) 8.78 wt% Sb 3-1 ( wt% ) (wt%) Sn Ag Sb SA S S S S
41 Sn-3.5Ag Sn-3Ag-1.5Sb Sn-3Ag-3Sb Sn-3Ag-5Sb Sn-3Ag-10Sb 150 C 0 ~ 625 ICP XRD DSC EDS OM SEM
42 3-2 Sn-3.5Ag Sb Sn-3.5Ag Sn 99.9% Sb 1 Sn-3.5Ag Sn-3.0Ag-xSb (x= ) Sn-3.5Ag 600 C Sn Sb C ( mm) ( 4000 XRD OM SEM mm 0.09mm 6mm ( BS-10) 300 C mm 29
43 1mm 99.95% 50 10mm 3µm ( 30 C) ( 50 C) [18,20] 15 3~4 Sn-Ag Sb C Diameter of solder balll (mm) Sn-3.5Ag Adding 1.73%Sb Adding 3.85%Sb Adding 5.12%Sb Adding 10.05%Sb
44 3-2 Sn-3.5Ag 190 C 270 C Sn-3Ag-1.5Sb 190 C 270 C Sn-3Ag-3Sb 190 C 275 C Sn-3Ag-5Sb 195 C 275 C Sn-3Ag-10Sb 200 C 280 C 3-3 D min =1.8 mm D max =2.3 mm 0.8 mm
45 Sn-Ag Sb Sn-Ag-Sb (Differential Scanning Calorimeter, Shimadzu DSC-50) 2. Sn Sb (ICP-AES, Inductively Coupled Plasma Atomic Emission Spectrometer) ASTM E56[71] EDS(Energy Dispersive X-Ray Spectrometer) 3. Philips XL 40 FEG JXA-840A Leitz Metallux C mm 20 Sb 5 Shimadzu AG-I 3-5 (load cell) 5kN 7 ±0.5% mm/min 1µm (cross head) 0.5mm/min 32
46 % ±0.025mm Shi[41] 1~50% Coffin-Manson model Xie[46] Park[50] Mei[52] Solomon[66] Sb 10% Sn-3.5Ag Sn-3Ag-10Sb Sn-3.5Ag Sn-3Ag-10Sb 3-8 ±0.02~±0.05mm 0.005mm Sn-3.5Ag Sn-3Ag-3Sb Sn-3Ag-10Sb ±0.02mm Sn-3Ag-3Sb Sn-3Ag-10Sb ±0.03mm Sn-3.5Ag 250 ±0.025mm Sn-3.5Ag Sn-3Ag-10Sb 33
47 [64,65] Shi [41] Kanchanomai [67] Sn-37Pb Sn-3.5Ag 1~10-3 Hz 0.1Hz ASTM E [70] 50% (load-drop) 50% 50~90% Sb 90% 3-5 Shimadzu AG-I 34
48 3-3 (25 C) ±0.025mm 0.1Hz 90% F F
49 % Sb Load(N) % Sb 3.85% Sb 1.73% Sb Sn-3.5Ag Displacement(mm) 3-8 Sb 36
50 4-1 Sn-3.5Ag Sn Sb Sn-3.5Ag 4-1 Sn Sb Sn-3.5Ag ( 4-2) 4-3 ICP-AES Ag Sb 1.5wt% 3wt% 1.73wt% 3.85wt% Sn (DSC) ( Sn-3.5Ag ) Sb 1.73%Sb 5.0 C 3.85% 5.12% Sb C C 7.6 C 8.0 C 5.12%Sb 3.85% 5.12% Sb 37
51 Sb 10.05% C 9.1 C Sb 4-1 Sn-3.5Ag (wt%) Sn Ag Sb Pb Bi Fe As
52 4-2 [25] Symbol Sn Ag Sb Density at 20 C, g/cm Coefficient of thermal expansion to / C Electrical resistivity at 18 C, µω-cm % Electrical conductivity Lattice type at 20 C Tetra FCC Rhome Lattice parameter (length), Å Lattice parameter (height), Å Distance of closest approach, Å Specific heat,(at room temperature) cal/g C Heat of fusion, H fus Melting point, C (wt%) Sn Ag Sb Sn-3.5Ag Sn-3Ag-1.5Sb Sn-3Ag-3Sb Sn-3Ag-5Sb Sn-3Ag-10Sb
53 6 5 Sn-3.5Ag 4 mw % 3.85% 5.12% 10.05% Temperature ( ) 4-1 DSC 4-4 ( C) ( C) ( C) Sn-3.5Ag Sn-2.91Ag-1.73Sb Sn-3.14Ag-3.85 Sb Sn-2.96Ag-5.12 Sb Sn-3.08Ag-10.05Sb
54 4-2 XRD XRD ( 4-2) Sn-3.5Ag β-sn ε-ag 3 Sn 1.73% Sb Sn-3.5Ag Sn-Sb ( 2-2) Sb Sn 9.6wt% 2wt% Sb Sn Sn 1.73% Sb Sb Sn Sb 3.85% β-sn ε-ag 3 Sn SbSn Sb 3.85% [9,35] Sn-Ag-Sb ( 2-3)[34] Sn-Ag-Sb C (Eq. 2-2) L SbSn Ag 3 (Sn,Sb) β-sn C Sn-Ag-Sb Sn 10.05% Sb 10.05% Sb C C 10.05% Sb SbSn SbSn SbSn Ag 3 (Sn,Sb) β-sn SbSn Sn-Sb SbSn Sn-Ag-Sb 41
55 4-3 Sb Sn-Ag OM Sn-3.5Ag β-sn (dendrite) Sn (eutectic network) ε-ag 3 Sn Sn-3.5Ag 500 Ag 3 Sn Sb 1.73~5.12%Sb Sn-3.5Ag β-sn 500 β-sn ( 4-4 ) XRD Sb 3.85% SbSn OM SbSn Sb 10.07% β-sn 30~40µm XRD 10.05% Sb SbSn [75] % Sb Ag 3 Sn 10.05% Sb Ag 3 (Sn,Sb) Ag 3 Sn 42
56 4-2 XRD 43
57 200X 500X Sn-3.08Ag-10.05Sb Sn-2.96Ag-5.12Sb Sn-3.14Ag-3.85Sb Sn-2.91Ag-1.73Sb Sn-3.5Ag 4-3 Sb Sn-Ag OM 44
58 4-4 Sn-2.91Ag-1.73Sb (500x) 45
59 OM SbSn % 5.12% Sb 4-5(a) Sn-3.5Ag β-sn Ag 3 Sn β-sn 4-5(b) EDS ( 4-6,4-7) Sb β-sn Sb Sb XRD Sb 3.85% SbSn SbSn EDS Sb 50% µm SbSn 10.05% Sb OM SbSn EDS 40% Sb Sb SbSn 1971 Predel Sn-Sb ( 2-2)[11] Sb 2 Sn 3 324~242 C Sb 2 Sn 3 43% Sb SbSn 9.4% Sb β-sn Sn-3.5Ag β-sn Sb Sn Ag Sn Sb Sn Sn-Sb Sb 10.05% Sb 2 Sn 3 Sb 2 Sn 3 Predel 43% Sb SbSn 9.4% Sb β-sn 43% Sb SbSn Sb β-sn 46
60 Sb 2 Sn 3 EDS 40% Sb 3.85% 5.12% Sn Sb 9.6% SbSn β-sn SbSn Oh C (Eq.2-3) L Sb 2 Sn 3 Ag 3 (Sn,Sb) β-sn C Oh Sn-Sb Sn-Ag-Sb Predel Masson Oh Sn-3.08Ag-10.05Sb C Sb 2 Sn 3 Sb 2 Sn 3 β-sn 43% Sb SbSn β-sn Ag 3 (Sn,Sb) SbSn β-sn 1998 Oberndorff [74] SbSn Sb 3 Sn 4 Sb 4 Sn 3 Sb 3 Sn 4 Sb 43% 1971 Predel Sn-Sb SbSn Sb 43~60.5% Sb 43~60.5% [32] Predel 43% Sb SbSn Sb 3 Sn 4 47
61 (a) (b) 4-5 Sn-3.14Ag-3.85Sb SEM 48
62 (A) Element Wt% At% A B Ag L Sn L Sb L Total Ag L Sn L Sb L Total (B) 4-6 Sn-2.96Ag-5.12Sb SEM (BSE) EDS 49
63 (A) Element Wt% At% A B Ag L Sn L Sb L Total Ag L Sn L Sb L Total (B) 4-7 Sn-3.08Ag-10.05Sb SEM EDS (1) 50
64 (A) Element Wt% At% A B Ag L Sn L Sb L Total Ag L Sn L Sb L Total (B) 4-8 Sn-3.08Ag-10.05Sb SEM EDS (2) 51
65 SbSn Ag 3 Sn β-sn 4-9 β-sn Ag 3 Sn OM Sb Ag 3 Sn Sb 5.12% Ag 3 Sn 10.02% Ag 3 Sn C Ag 3 Sn Sn Sb Ag 3 (Sn,Sb) 4-10 EDS 10.05% Sb Ag 3 Sn Sb 3.85% 5.12% Sb Ag 3 Sn EDS EDS WDS(Wavelength Dispersive X-Ray Spectrometer) 3.85% 5.12% Sb Ag 3 (Sn,Sb) 1.73% Sb Sb β-sn Ag 3 Sn Sb Sb 3.85% SEM SbSn β-sn β-sn Sb β-sn SbSn 10.05% Sb SbSn
66 SbSn 4-13 EDS SbSn Ag Sn-Ag-Sb ε-ag 3 (Sn,Sb) ε-ag 3 (Sn,Sb) SbSn 1µm Sb 53
67 (a) (b) (C) 4-9 SEM (a)sn-3.5ag (b) 1.73Sb (c) 3.85Sb 54
68 (A) Element Wt% At% Ag L A Sn L Sb L Total Ag L B Sn L Sb L Total Ag L C Sn L Sb L Total (B) (C) 4-10 Sn-3.08Ag-10.05Sb Ag 3 (Sn,Sb) EDS 55
69 (A) (B) Element Wt% At% A B Ag L Sn L Sb L Total Ag L Sn L Sb L Total Sn-2.96Ag-5.12Sb SEM EDS 56
70 4-12 Sn-3.08Ag-10.05Sb SEM Element Wt% At% A B Ag L Sn L Sb L Total Ag L Sn L Sb L Total (A) (B) SbSn EDS 57
71 4-3 (single lap) 1.7mm±0.05 (15X) (500X) 4-14 ( φ = 1.7mm) ( mm) β-sn Ag 3 Sn 10.05% Sb SbSn 20µm 58
72 15X 500X Sn-3.08Ag-10.05Sb Sn-2.96Ag-5.12Sb Sn-3.14Ag-3.85Sb Sn-2.91Ag-1.73Sb Sn-3.5Ag
73 Sb Sn-3.5Ag 89.3N 114.2N(1.73%) 129.0N(3.85%) 140.5N(5.12%) 183.2N(10.05%) 1.73% Sb Sb β-sb 3.85% 5.12% Sb SbSn 10.05% 4-16 Sb Sb Sb ( 4-17) [14] [25] 60
74 Max. Load (N) Sn-3.5Ag adding 1.73Sb adding 3.85Sb adding 5.12Sb addind 10.05Sb Load (N) % 3.85% 5.12% 1.73% Sn-3.5Ag Displacement (mm) 4-16 Sb 61
75
76 4-5 Coffin-Manson model [41,46-48,51,53,55,67] Coffin-Manson Hysteresis Loop X 150 C [63,68] [49] 63
77 4-5.1 Sn-3.5Ag 4-18 Sn-3.5Ag Hysteresis Loop 4-19 Sn-3.5Ag (load-drop) 4-18 (+0.025mm) 56N (-0.025mm) -60N 60N -60N ( 5N) Sn-3.5Ag ±0.025mm (cyclic softening) ( ) 0.018mm (ε total ) 2.25% N % Sn-3.5Ag Sn-3.5Ag ( 0.6T m ) Sb Sn-3.5Ag 64
78 ( ) 65
79 Sn-3.5Ag nd,3th 10th 1st 100th 200th Load (N) 0 500th Displacement (mm) 4-18 Sn-3.5Ag hysteresis loops 80 Sn-3.5Ag 40 Load (N) 0 Cycles Sn-3.5Ag 66
80 4-5.2 Sb Sn-Ag Sb 1.73% Sb β-sn 3.14% 5.12% SbSn 10.05% SbSn 4-20 Sn-Ag Sb hysteresis loop (±0.025mm) Sn-3.5Ag Sb 10.05% ±0.025mm 10.05% Sb Sb Sn-3.5Ag 60N 69N( 1.73%) 93N( 3.85%) 108.6N( 5.12%) 113.1N( 10.05%) Sb 5.12% 10.05% 4-21 Sb 1.73%Sb Sn-3.5Ag Sn-3.5Ag Sn-3.5Ag 67
81 Sn-3.5Ag Sb 1.73Sb 3.85% 5.12% Sb Sn-3.5Ag 3.85% 5.12% Sb Sb SbSn 10.05% Sb % Sb 3.85% 5.12% 10.05% Sb 10.05% Sn-3.5Ag Sb Sb (Cu 6 Sn 5 ) 68
82 0hr %Sb,10.05%Sb 3.85%Sb 1.73%Sb Sn-3.5Ag Load (N) Displacement (mm) 4-20 hysteresis loops 150 0hr 100 Load (N) Sn-3.5Ag 1.73%Sb 3.85%Sb 5.12%Sb 10.05%Sb Cycles
83 C Sn-3.5Ag ±0.025mm Hysteresis Loop Cutiongco [65] 4-23 Sn-3.5Ag Sn-3.5Ag 225 Sn-3.5Ag Sb hysteresis loop 4-24~ % Sb
84 4-28 Sb % Sb % Sb ( 4-30) % Sb 625 Sn-3.5Ag Sb 1.73% 225 Sb 3.85% % 3.85% Sb
85 5.12% 10.05% Sb % Sb % Sb [14,25,26] ( 4-33 ) 4-34 ( 6 ) Sb Sb Sn-Ag Sb Sb 5.12% 72
86 Sb Sb Sb 1.73%Sb Sn-3.5Ag Sb Sn-3.5Ag 225 Sb Sb Sb 3.85% 73
87 Sn-3.5Ag 120 Load (N) hr_2nd 225hrs_2nd 625hrs_2nd 625hrs_500th 0hr_500th Displacement (mm) 4-22 Sn-3.5Ag hysteresis loops 80 Sn-3.5Ag 40 Load (N) 0 0hr 225hrs 625hrs Cycles Sn-3.5Ag 74
88 1.73Sb hr 225hrs 625hrs 40 Load (N) Displacement (mm) 4-24 Sn-2.91Ag-1.73Sb hysteresis loops 3.85Sb hr 225hrs 625hrs 40 Load (N) Displacement (mm) 4-25 Sn-3.14Ag-3.85Sb hysteresis loops 75
89 5.12Sb hr 225hrs 625hrs 40 Load (N) Displacement (mm) 4-26 Sn-2.96Ag-5.12Sb hysteresis loops 10.05Sb Load (N) Displacement (mm) 0hr 225hrs 625hrs 4-27 Sn-3.08Ag-10.05Sb hysteresis loops 76
90 140 Max. Load at 2nd cycle (N) %Sb 5.12%Sb 3.85%Sb 1.73%Sb Sn-3.5Ag Storage time (hrs) 4-28 Sb 77
91 Sb Load (N) 0 0hr 625hrs 225hrs Cycles Sn-2.91Ag-1.73Sb Sb hrs Load (N) 0 625hrs 0hr Cycles Sn-3.14Ag-3.85Sb 78
92 Sb 100 Load (N) hrs_fracture in solder 225hrs_fracture in IMC 0hr Cycles Sn-2.96Ag-5.12Sb Sb hrs_fracture in solder 0hr Load (N) 0 625hrs_fracture in IMC Cycles Sn-3.08Ag-10.05Sb 79
93
94 100% 80% 60% Sn-3.5Ag 40% 20% 0% 0 hr 225hrs 625hrs 100% 80% Adding 1.73% Sb 100% 80% Adding 3.85% Sb 60% 60% 40% 40% 20% 20% 0% 0 hr 225hrs 625hrs 0% 0 hr 225hrs 625hrs 100% 80% Adding 5.12% Sb 100% 80% Adding 10.05% Sb 60% 60% 40% 40% 20% 20% 0% 0 hr 225hrs 625hrs 0% 0 hr 225hrs 625hrs 4-34 Sb 81
95 hr 225hrs 625hrs Nf (90% load-drop) Sn-3.5Ag 1.73Sb 3.85Sb 5.12Sb 10.05Sb 4-35 Sb (90% load-drop) 82
96 4-5.4 Sb Sb 4-36 Sn-3.5Ag 1.73% Sb (necking) 3.85% 5.12% Sb 10.05% 4-37 Sn-3.5Ag (a) (b) (c) % % Sn-3.5Ag % Sb 50% 83
97 β-sn % 4-38 SbSn SbSn β-sn SbSn SbSn SbSn % Sb % Sb John[72,73] 84
98 Sn-3.5Ag Sn-2.91Ag-1.73Sb Sn-3.14Ag-3.85Sb Sn-2.96Ag-5.12Sb Sn-3.08Ag-10.05Sb
99 (a) (b) (50% load-drop) (c) (50% load-drop) Sn-3.5Ag 86
100 A B A B 4-38 Sn-3.14Ag-3.85Sb ( 50% load-drop) 87
101 A B A B 4-39 Sn-3.08Ag-10.05Sb ( 50% load-drop) 88
102 A B A B 4-40 Sn-2.91Ag-1.73Sb ( % load-drop) 89
103 4-41 Sn-3.08Ag-10.05Sb ( % load-drop) 90
104 (a) (b) 4-43 [72,73] 91
105 1. Sn-Ag Sb Sn-3.5Ag C C(1.73%) C(3.85%) C(5.12%) C(10.05%) 5.0 C(1.73%) 7.6 C(3.85%) 8.0 C(5.12%) 9.1 C(10.05%) 2. Sn-3.5Ag β-sn Sb( 3.85wt%) Sn-Ag 1.73wt% Sb β-sn 3.85wt% 5.12wt% Sb β-sn µm SbSn Sb 10.05% 20~30µm SbSn Sb 2 Sn 3 Sb 2 Sn 3 43%Sb SbSn β-sn 3. Sb SbSn Sb Sn-3.5Ag 89.3N 114.2N(1.73%) 129.0N(3.85%) 140.5N(5.12%) 183.2N (10.05%) Sb Hz 25 C ±0.025mm Sn-3.5Ag 50% Sn-3.5Ag 5. ±0.025mm Sb 10.05%Sb 92
106 Sb Sb Sb Sn-ag Sb 3.85wt% 225 Sb Sb 5.12wt% Sb 3.85wt% 8. Sb SbSn β-sn 9. 93
107 1. Single Lap 1.8mm 0.8mm Sn-Ag-xSb BGA 2. Sb Sn-Ag SbSn XRD EDS EPMA Sn Sb Sn-Sb SbSn 3. Sn-Ag-xSb Sn-Ag-xSb 94
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116
117
118 Cheng-Shyan Lee (06) ~ ~ ~ ~ ~ ~ Hwa-Teng Lee, Chuan-Lien Yang, Ming-Hung Chen, Cheng-Shyan Li, "Effect of Sb Addition on Microstructure and Shear Strength of Sn-Ag Solder Joints," The 5th International Conference on Fracture & Strength of Solids (FEOFS2003), Tohoku University, Sendai, Japan, , "Sn-Ag-xSb ",,
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