Meeting Date: November 11, 2016 Meeting Location: Shanghai, China IBIS Open Forum Minutes VOTING MEMBERS AND 2016 PARTICIPANTS ANSYS Curtis Clark, Toru Watanabe Broadcom (Avago Technologies) Bob Miller Cadence Design Systems Ken Willis, Brad Brim, Aileen Chen*, Lanbing Chen* Zhiyu Guo*, Mohan Jiang*, Rachel Li*, Ping Liu* Haisan Wang*, Yitong Wen*, Clark Wu*, Dingru Xiao* Benny Yan*, Haidong Zhang*, Wenjian Zhang* Zhangmin Zhong*, Hui Wang*, Jinsong Hu*, Wei Dai* Rong Zhang* Cisco Systems Giuseppi Selli, Brian Baek, Hannah Bian*, Tonghao Ding* Amanda Liao*, Cassie Yan* CST Stefan Paret Ericsson Anders Ekholm*, David Zhang*, Zilwan Mahmod Guohua Wang* GLOBALFOUNDRIES Steve Parker Huawei Technologies Yuanbin Cai*, Haiping Cao*, Zhenxing Hu*, Peng Huang* Xusheng Liu*, Longfang Lv*, Guanjiang Wang* Chen Yu*, Cheng Zhang*, Gezi Zhang*, Zhengyi Zhu* Fangxu Yang*, Huajun Chen*, Xiao Peng* Zhengrong Xu*, Xianbiao Wang*, Lin Shi* Hongcheng Yin* IBM Adge Hawes, Luis Armenta, Trevor Timpane Infineon Technologies AG (Christian Sporrer) Intel Corporation Hsinho Wu, Mohammad Bapi, Michael Mirmak, Masahi Shimanouchi, Todd Bermensolo, Zao Liu, Gong Ouyang, Udy Shrivastava, Gianni Signorini, Richard Mellitz, Youqing Chen*, Jennifer Liu* Luping Liu*, Bruce Qin*, Yuyang Wang* IO Methodology Lance Wang* Keysight Technologies Radek Biernacki, Heidi Barnes, Jian Yang, Fangyi Rao, Stephen Slater, Pegah Alavi, Edwin Young Maxim Integrated Yan Liang, Don Greer, Thinh Nguyen, Joe Engert, Hock Seon, Ahmed Gendy Mentor Graphics Arpad Muranyi, Vladimir Dmitriev-Zdorov, John Angulo, Mikael Stahlberg Micron Technology Randy Wolff, Justin Butterfield Signal Integrity Software Mike LaBonte*, Walter Katz, Todd Westerhoff, Richard Allred 2016 IBIS Open Forum 1
Synopsys Teraspeed Labs Xilinx ZTE Corporation Zuken Ted Mido, Kevin Li, Massimo Prando, Xuefeng Chen* Andy Tai*, Jinghua Huang* Bob Ross (Raymond Anderson) Shunlin Zhu*, Fengling Gao*, Lili Wei*, Zhongmin Wei* Bi Yi*, Changgang Yin*, Yang Yang*, Xiaoli Yu* Michael Schaeder, Amir Wallrabenstein OTHER PARTICIPANTS IN 2016 Alcatel-Lucent Aurora System BasiCAE Software Technology Celestica easic Edadoc FiberHome Technologies Fujitsu Advanced Technologies Ghent University Gowin Semiconductor H3C Hamburg University of Technology Hanghou Hikvision Digital Technology Hisilicon Independent Info TM Microelectronics Institut Supérieur des Sciences Appliquées et de Technologie de Sousse Inventec JEITA John Baprawski, Inc. KEI Systems Lattice Semiconductor Leading Edge Marvell MathWorks Monsoon Solutions Mostec Northrup Grumman NXP Politecnico di Torino Qualcomm Technologies Rambus Yishan Li*, Yiqing Mao* Dian Yang* Darcy Liu* Allen Wang*, Vincent Wen* David Banas Deheng Chen*, Hong Zhang* Yejing Jia* Shogo Fujimori Paolo Manfredi Xiaozhi Lin*, Qi Zhou* Bin Chen*, Mao Jun, Xing Hu* Jan Preibisch, David Dahl Wenquan Hu* Wei Zhen*, Carl Gabrielson Aofeng Qian* Wael Dghais Zhong Peng* Yosuke Kanamaru John Baprawski Shinichi Maeda Dinh Tran, Maryam Shahbazi Pietro Vergine Jie Pan*, Weizhe Li*, Liang Wu*, BL Qian*, Fang Lv* Mike Mulligan, Corey Mathis Nathan Hirsch Ninghua Li*, Kaihe Zhang* Alex Golian Jon Burnett Claudio Siviero, Stefano Grivet-Talocia, Igor Simone Stievano Guobing Han* John Yan 2016 IBIS Open Forum 2
Raytheon Joseph Aday SAE International (Logen Johnson) SAIC Motor Corp Weng Yang* Shanghai Zhaoxin Semiconductor Jude Ji* Shenzhen Zhongzeling Electronics Nick Huang* SILABTECH Biman Chattopadhyary Signal Metrics Ron Olisar SiGuys Donald Telian SMICS Sheral Qi* Sony Corporation Hiroaki Ammo Sony LSI Design Takashi Hasegawa SPISim Wei-hsing Huang* Spreadtrum Communications Junyong Deng*, Steven Guo*, Baoping Bian* Yanbiao Chu*, Nikki Xie*, Zhi Wang* STMicroelectronics Fabio Brina, Olivier Bayet Technoprobe Alberto Berizzi, Lorenzo Bernasconi, Simona Cucchi Teledyne LeCroy Denny Li*, Yifeng Wu* Université de Bretagne Occidentale Mihai Telescu Vendorchain Jun Zhao*, Jing Luo*, Dong Lei* Xpeedic Technology Max Cang*, Mingcan Zhao*, Zhouxiang Su*, Rui Wang* Qionhui Gui*, Wenliang Dai*, Yuqing Shen* Haitao Zhang* Zhejiang Uniview Technologies Weiqi Chen*, Jiayun Dai* In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password November 14, 2016 Asian IBIS Summit Taipei no teleconference November 18, 2016 Asian IBIS Summit Tokyo no teleconference December 2, 2016 628 078 024 IBISfriday11 For teleconference dial-in information, use the password at the following website: https://sae.webex.com/sae/j.php?mtid=m0a07ee0ddc25e28af96b4bbad3c17f4b All teleconference meetings are 8:00 a.m. to 9:55 a.m. US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. NOTE: "AR" = Action Required. 2016 IBIS Open Forum 3
------------------------------------------------------------------------------------------------------------------------------- OFFICIAL OPENING The Asian IBIS Summit took place on Friday, November 11, 2016 at the Parkyard Hotel in Shanghai. About 112 people representing 34 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.ibis.org/summits/nov16a/ Gezi Zhang of Huawei welcomed the participants to the 12 th annual Asian IBIS Summit (China) on behalf of Shuyao Liu of Huawei. She expressed her appreciation to the IBIS Open Forum and all the sponsors for co-organizing the event. She looked forward to working with IBIS members in China and to expanding participation in the region. She noted that Huawei hopes to resolve high speed link issues with the IBIS Open Forum, EDA vendors and IC vendors. Mike LaBonte welcomed participants on behalf of the IBIS Open Forum and convened the meeting, noting that only technical presentations would be on the agenda, and there would be no voting. Mike continued by thanking all the co-sponsors. The primary sponsor was Huawei Technologies, and the co-sponsors were Cadence Design Systems, IO Methodology, SPISim, Synopsys, Teledyne LeCroy, Xpeedic Technology and ZTE Corporation. IBIS CHAIR S REPORT Mike LaBonte (Signal Integrity Software (SiSoft), USA) Mike LaBonte presented updates on work in progress in the ATM, Interconnect and Quality task groups. This includes an IBIS 6.2 release, backchannel support, C_comp model enhancements, redriver flow enhancements, and an interconnect modeling BIRD. Several BIRDs have been approved for IBIS 6.2 while some are still in progress. The IBIS Open Forum has 22 members and regular teleconference and Summit meetings. The China regional forum is a new group affiliated with IBIS. IBIS MODEL SIMULATION WITH RLC_DUT Xuefeng Chen (Synopsys, PRC) Xuefeng Chen presented an enhanced IBIS algorithm to support the R/L/C_dut subparameters in V-T tables. The algorithm shows a large improvement in matching IBIS to Spice transistorlevel models when these subparameters are used versus traditional algorithms. The Ku and Kd results of V-T solving are sensitive to R/L/C_dut subparameters, so using these subparameters requires caution. With the new algorithm, a more complicated C_comp model could also be supported. One attendee noted that very few IBIS models are seen that contain R/L/C_dut subparameters 2016 IBIS Open Forum 4
and questioned the importance of the new algorithm. Xuefeng responded that the algorithm will give more accurate results if the subparameters are used. CASE STUDY: MODELING IBIS FOR OPEN_DRAIN TRUE DIFFERENTIAL PAIR BUFFER Lance Wang*, Yan Liang** (*IO Methodology and **Maxim Integrated, USA) Lance Wang presented. An Open_drain differential pair presents a special case for IBIS modeling. The Open_drain model type does not use Pullup I-V data, but this data is useful for modeling this type of buffer. Using an Output or I/O model type to model this type of buffer allows inclusion of Pullup I-V data and is a better solution. Improvements to the C_comp model to capture voltage and frequency dependencies would improve the model further. A question was asked why one should use the Output model type instead of the Open_drain type. Lance responded that there needs to be Pullup curve data in the IBIS model to capture the current due to the true differential buffer features. DIFFERENTIAL MODELING FLOW WITH SERIES MODEL IN VERILOG-A Wei-hsing Huang* and Sanjeev Gupta** (*SPISim, USA and **Sigintegrity Solutions, India) Wei-hsing Huang presented. Half/true differential buffers are modeled including a series model for the effects of differential current and differential capacitance. The rigid syntax of the series model can lead to many inaccuracies. Replacing the series model with a Verilog-A model using [External Model] syntax streamlines the modeling flow, improves V-T extraction accuracies, and removes the rigid series model syntax. A modeling flow for creating the Verilog-A model was presented. IBIS-AMI MODEL GENERATION WITH QUALITY Skipper Liang (Cadence Design Systems, ROC) Yitong Wen presented starting with an overview of channel simulation equations and IBIS-AMI models. IBIS-AMI model generation flow involves many steps, and validation is the key. Validation includes comparisons to Spice transistor-level model simulations. An example was shown of USB 3.0 RX and TX IBIS-AMI models in simulation including real channel characteristics. A comment was made that IBIS-AMI model validation cannot just look at waveforms and eye openings. SUGGESTION ON ISSUING VSR/CAUI-4 BASED IBIS-AMI MODEL Zhengrong Xu (Huawei Technologies, PRC) Zhengrong Xu presented. For electrical interface compliance testing of a VSR/CAUI-4 optical module, the test point is inside the CDR device after the CTLE. This test point can t be 2016 IBIS Open Forum 5
measured, so a standard Reference CTLE and Golden PLL model is defined. This model can be used as a software reference in an oscilloscope to post process measurement waveforms. An equivalent simulation solution is needed. Zhengrong suggested the IBIS organization issue a standard VSR/CAUI-4 compliant IBIS-AMI model including the reference CTLE and golden PLL. This may also provide a way for optical CDR vendors to do correlation between their settings and the equalization settings defined in the standard. NECESSITY FOR INTEGRATING FEC FUNCTIONALITY FOR PAM4 IN AMI SIMULATIONS Xiaoqing Dong* and Nick Huang** (*Huawei Technologies, **Shenzhen Zhongzeling Electronics, PRC) Nick Huang presented. Conventional IBIS-AMI simulation does not take into account forward error correction (FEC) functionalities. Industry standards on PAM4 require FEC to achieve basic BER targets given similar channel insertion loss as NRZ systems. FEC gain can be modeled using error propagation theories. The concept was proven for feasibility of PAM4 simulation to integrate FEC functionalities through two case studies. It is recommended that IBIS-AMI consider FEC simulation functionality for PAM4. THE IMPACT OF CHANNEL PERFORMANCE TO 56G PAM4 SYSTEMS Changgang Yin, Shunlin Zhu (ZTE Corporation, PRC) Changgang Yin presented. The 56G PAM4 standard is still a work in progress. IBIS-AMI modeling for PAM4 is new but works well in simulation. A detailed analysis was performed to determine the impact of channel characteristics on 56G PAM4 systems. One conclusion was that the insertion loss resonance frequency should be greater than 29 GHz and the resonance depth should be as small as possible. The impedance tolerance is recommended to be smaller than +/- 8% and impedance discontinuity points should be reduced as much as possible. Crosstalk is dominated by NEXT, so more attention should be paid to NEXT than FEXT. ICN of crosstalk must be less than 4mV and is recommended to be less than 3mV. A question was asked if other channels were used to verify the methodology. Changgang responded that only the channel shown was used. DISCUSSION Lance Wang introduced the IBIS China Regional Forum and discussed its formation. The group is led by Huawei, ZTE and Celestica for now. The main purpose for this regional forum is to have an environment for Chinese engineers to be involved in IBIS developments and changes. The group plans to have its own technical teleconference and even a face-to-face conference to have discussions about recent IBIS changes, new technologies and anything that needs to feed back to the IBIS Open Forum for IBIS specification updates. Lance also introduced the freelists mailing list and WeChat group. ACHIEVING FULL SYSTEM SIGNAL INTEGRITY FOR HIGH SPEED BACKPLANE SYSTEM Wenliang Dai (Xpeedic Technology, PRC) 2016 IBIS Open Forum 6
Wenliang Dai presented. The presentation included an introduction of backplane systems, challenges to backplane system simulation, components of EM simulation, an analysis workflow, and details of full backplane system SI simulation. Wenliang concluded that passive channel modeling and simulation is essential to high speed channel design. Optimal channel design requires user friendly EDA tools to do layout extraction, via optimization, trace simulation, S-parameter cascading and S-parameter exploration. Full backplane system SI simulation is achieved by sweeping all the channels with correct models. ON-DIE DECOUPLING MODEL IMPROVEMENTS FOR IBIS POWER AWARE MODELS Randy Wolff# and Aniello Viscardi## (Micron Technology, #USA, ##Italy) Lance Wang presented. He noted that on-die decoupling models for power aware modeling must be added external to the IBIS model currently. To correlate an IBIS model simulation with a transistor model simulation, the decoupling model may need multiple terminals. A Spice model may include a pre-driver on a separate power supply from the driver, and coupling may exist between the pre-driver supply and the final driver supply. The pre-driver and final driver may also share a common ground. One method for creating a non-proprietary decoupling model involves creating an S-parameter model. The S-parameter model could have multiple port options and may require a node 0 reference. Lance showed results of two simulations including package models with either an ideal or non-ideal connection to the pre-driver supply of the Spice model. A 2-port decoupling model was necessary for good correlation in the case with the ideal connection to the pre-driver supply. A 3-port decoupling model was necessary for good correlation in the case with the non-ideal connection to the pre-driver supply. Lance concluded that a multi-port decoupling model is most versatile. Unused ports not connected to a package model should be connected to node 0, which is also the reference port for the S- parameter model. IBISCHK6 V6.1.3 AND EXECUTABLE MODEL FILE CHECKING Bob Ross (Teraspeed Labs, USA) Mike LaBonte presented. New ibischk6 version 6.1.3 executables are available that resolve BUGs 174-180. The executable names include 32 and 64-bit operating system designations. An enhancement is executable model file checking per BUG179 for [Algorithmic Model] executable lines. Executable files are checked for the existence of required functions based on.ami file Reserved_Parameters settings. TOUCHSTONE CONVERSION WRAPPER Anders Ekholm (Ericsson, Sweden) Anders Ekholm presented. The tschk2 Touchstone file parser can be used to convert Touchstone models to Touchstone 2 models using the canonical option. Using this option strips out any comments from the original Touchstone file which may contain useful port information. Anders wrote a Perl script named TS1toTS2 that solves this issue. The script is available on the IBIS Open Forum website. 2016 IBIS Open Forum 7
CLOSING REMARKS Mike LaBonte surveyed participants to see their relationship to IBIS. A show of hands revealed that the group was predominantly IBIS users, followed by IC companies, with EDA vendors last. Mike also brought up the China Regional Forum, expressing a hope that this group would at some point be working on BIRDs originating in China, so that IBIS could be more responsive to their needs. Mike thanked the co-sponsors, presenters and attendees for their participation and support. The meeting adjourned at 5:30 PM. NEXT MEETING The next IBIS Open Forum teleconference meeting will be held December 2, 2016. The Asian IBIS Summit in Taipei will be held November 14, 2016. The Asian IBIS Summit in Tokyo will be held November 18, 2016. No teleconferences will be available for the Summit meetings. ======================================================================== NOTES IBIS CHAIR: Mike LaBonte mlabonte@sisoft.com IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place, Suite 250 Maynard, MA 01754 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764 rrwolff@micron.com Principal Engineer, Silicon SI Group Lead, Micron Technology, Inc. 8000 S. Federal Way P.O. Box 6, Mail Stop: 01-711 Boise, ID 83707-0006 TREASURER: Bob Ross (503) 246-8048 bob@teraspeedlabs.com Engineer, Teraspeed Labs 10238 SW Lancaster Road Portland, OR 97219 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 2016 IBIS Open Forum 8
ibis-librarian@ibis.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Mike LaBonte mlabonte@sisoft.com IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place, Suite 250 Maynard, MA 01754 POSTMASTER: Curtis Clark curtis.clark@ansys.com ANSYS, Inc. 150 Baker Ave Ext Concord, MA 01742 This meeting was conducted in accordance with ANSI guidance. All inquiries may be sent to info@ibis.org. Examples of inquiries are: To obtain general information about IBIS. To ask specific questions for individual response. To subscribe to the official ibis@freelists.org and/or ibis-users@freelists.org email lists (formerly ibis@eda.org and ibis-users@eda.org). To subscribe to one of the task group email lists: ibis-macro@freelists.org, ibisinterconn@freelists.org, or ibis-quality@freelists.org. To inquire about joining the IBIS Open Forum as a voting Member. To purchase a license for the IBIS parser source code. To report bugs or request enhancements to the free software tools: ibischk6, tschk2, icmchk1, s2ibis, s2ibis2 and s2iplt. The BUG Report Form for ibischk resides along with reported BUGs at: http://www.ibis.org/bugs/ibischk/ http://www.ibis.org/ bugs/ibischk/bugform.txt The BUG Report Form for tschk2 resides along with reported BUGs at: http://www.ibis.org/bugs/tschk/ http://www.ibis.org/bugs/tschk/bugform.txt The BUG Report Form for icmchk resides along with reported BUGs at: http://www.ibis.org/bugs/icmchk/ http://www.ibis.org/bugs/icmchk/icm_bugform.txt 2016 IBIS Open Forum 9
To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.ibis.org/bugs/s2ibis/bugs2i.txt http://www.ibis.org/bugs/s2ibis2/bugs2i2.txt http://www.ibis.org/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.ibis.org/ Check the IBIS file directory on ibis.org for more information on previous discussions and results: http://www.ibis.org/directory.html Other trademarks, brands and names are the property of their respective owners. 2016 IBIS Open Forum 10
SAE STANDARDS BALLOT VOTING STATUS Organization Interest Category Standards Ballot Voting Status September 23, 2016 October 14, 2016 November 4, 2016 November 11, 2016 ANSYS User Active X X X - Broadcom Ltd. Producer Inactive - X - - Cadence Design Systems User Active X X X X Cisco Systems User Inactive - - - X CST User Inactive - - - - Ericsson Producer Inactive - - - X GLOBALFOUNDRIES Producer Active X X X - Huawei Technologies Producer Inactive - - - X Infineon Technologies AG Producer Inactive - - - - IBM Producer Active X X X - Intel Corp. Producer Active X X X X IO Methodology User Active X X X X Keysight Technologies User Active X X X - Maxim Integrated Producer Inactive - - - - Mentor Graphics User Active X X X - Micron Technology Producer Active X X X - Signal Integrity Software User Active X X X X Synopsys User Active X X X X Teraspeed Labs General Interest Active X X X - Xilinx Producer Inactive - - - - ZTE User Inactive - - - X Zuken User Inactive - - - - Criteria for SAE member in good standing: Must attend two consecutive meetings to establish voting membership Membership dues current Must not miss two consecutive meetings Interest categories associated with SAE standards ballot voting are: Users - members that utilize electronic equipment to provide services to an end user. Producers - members that supply electronic equipment. General Interest - members are neither producers nor users. This category includes, but is not limited to, government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers. 2016 IBIS Open Forum 11