半導體元件概論講義 (4/8) 校外專家演講 (1/2) (2007 年教育部影像顯示科技人才培育計畫 ) 液晶顯示器製程簡介 ( 一 ),( 二 ) 瀚宇彩晶前瞻整合部經理陳威州博士 2007 年 8 月 -12 月 黎明技術學院電機系
TFT-LCD Process Flow
液晶顯示器的製作過程 Array 製程 ( 陣列 ) 製作薄膜電晶體 (TFT) 彩色濾光片製程 製作顏色像素 Cell 製程 組合成面板 / 灌入液晶 模組製程 搭上驅動電路 / 背光模組
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Array 基板的製作流程 玻璃 鍍膜 上光阻 重覆 4~5 次 曝光 顯影 蝕刻 薄膜電晶體基板 去光阻
C/F 基板的製作流程 玻璃 重覆步驟 (R) 黑色矩陣 保護層 上色阻 (G) 透明導電層 曝光 顯影 重覆步驟 (B)
Cell 製作流程 Array 玻璃 C/F 玻璃 配向 配向 灑間隙子 (spacer) 塗框膠 灌液晶 貼付偏光板 兩片組立
LCD 模組製作流程 驅動 IC 貼付 背光模組及外框組裝 電路板貼付 LCD 模組成品
Array Process Glass Substrate Sputtering CVD TFT Production Process CF Process Cell Process Form black matrix Apply PI Film Module Process Completed Cell Coat Photoresist Coat color resist Rub repeat 4-6 times Expose through Mask Develop Expose through Mask Develop Post-back Apply Sealant Attach Spacers Panel assembly TAB IC Bond Drivers to Glass & PCB Etch Repair for Green and Blue Inject LC Backlight Unit Strip Photoresist Completed Array Structure Apply Protective film Deposit ITO Common electrode Seal Attach Polarizers Completed TFT Module Page- 9
TFT LCD Cross Section - Array Process TFT Glass Substrate Capacitor Display Electrode Page- 10
TFT LCD Cross Section - CF Process TFT Glass Substrate Black Matrix Color Filter Protective Film Common Electrode Capacitor Display Electrode Page- 11
TFT LCD Cross Section - Cell Process TFT Polarizer Film Glass Substrate Black Matrix Color Filter Protective Film Sealant Common Electrode Alignment Film Liquid Crystal Capacitor Display Electrode Polarizer Spacer Page- 12
TFT LCD Cross Section - Module Process TFT Polarizer Film Glass Substrate Black Matrix Color Filter Protective Film Sealant Anistoropic Conductor Film Common Electrode Alignment Film Connection TAB Liquid Crystal Control IC Capacitor Display Electrode Driver LSI Polarizer Printed Circuit Board Edge Light Light Diffuser Spacer Waveguide Plate Prism Sheet Reflector Page- 13
Glass Input Page- 14
Glass Cleaning Spray Nozzle Page- 15
MoW Film Sputtering Page- 16
Resist Coat Page- 17
Mask Photo Exposure Page- 18
Developer Spray Nozzle Page- 19
Mow Etching Page- 20
Resist Remove Spray Nozzle Page- 21
Bottom Gate Etch Stop TFT - Cross SiOx a-si SiNx n a-si S/D Metal Gate Metal ITO Glass Substrate Page- 22
Bottom Gate Etch Stop TFT - Process Flow Step Clean Deposition Lithography Etcher Strip Other Gate Formation Gate Metal Titler CDE (Gate Metal) O3 O/S Teser Etch Stop SiOx 4 Layer (SiO& SiN&a-Si&SiN) Back Exposure Wet (SiNx) O3 TFT Island BOE (O3) n a-si CDE 3 Layer ( a-si & n a-si & SiN) O3 Pixel Electrode ITO Wet (ITO) O3 Contact Hole Wet (SiOx) IPA S/D Metal BOE S/D Metal PE (S/D Metal) Wet (n a-si) IPA Passivation SiNx PE (SiNx) IPA Anneal Array Teser Page- 23
Bottom Gate BCE TFT - Cross a-si n a-si S/D Metal SiNx Gate Passivation SiOx ITO Glass Substrate Page- 24
Bottom Gate BCE TFT - Process Flow Step Clean Deposition Lithography Etcher Strip Other Gate Formation SiOx Gate Metal Titler Dry (Gate Metal) O/S Teser Isand 3 Layer (SiN & a-si & na-si) Dry 2 Layer (n a-si & a-si) Pixel Electrode ITO Wet (ITO) Contact Hole Dry (SiNx) S/D Metal S/D Metal Dry (S/D Metal ) Wet (n a-si) Passivation SiNx Dry (SiNx) Anneal Array Teser Page- 25
Top Gate TFT - Cross Light Shield Metal a-si n a-si Gate Metal S/D Metal SiNx SiOx ITO Glass Substrate Page- 26
Top Gate TFT - Process Flow Step Clean Deposition Lithography Etcher Strip Other Light Shield LS Metal Wet (LS Metal) SiOx S/D Metal S/D Metal Wet (S/D Metal) ITO ITO Wet (ITO) Isand 3 Layer (SiN & a-si & na-si) Dry (a-si & na-si) Contact Hole Dry (SiNx) Gate Gate Metal Dry (Gate Metal) Anneal Array Teser Page- 27
Top Gate IPS TFT - Cross Light Shield Metal a-si n a-si Gate Metal S/D Metal Pixel Electrode SiNx Common Electrode SiOx Glass Substrate Page- 28
Top Gate IPS TFT - Process Flow Step Clean Deposition Lithography Etcher Strip Other Light Shield LS Metal Wet (LS Metal) SiOx S/D Metal S/D Metal Wet (S/D Metal) Isand 2 Layer (a-si & na-si) Dry (a-si & na-si) Gate, Pixel and Common Electrode SiNx Metal Wet (Metal) Anneal Array Teser Page- 29
Anneal Tester AGV AGV Pass-SiNx Micro. Laser Repair S-8 S-5 AGV AGV Resist Remove Page- 30 FAB1 3F Array Layout Dry Etcher SS-1 S-3 ASP Micro. O/S Tester Micro. Wet Etcher AGV AGV OHV AGV Coater Developer Stepper PECVD AGV AGV S-0 Cleaner S-2 S-1 Measure EQ Sputter AGV AGV
FAB1 2F & 1F Cell Layout Rubbing Main Cure PI Inspec. PI Print Pre Clean Clean Edge Grind 1st Cut Array Glass Input Rubbing Main Cure PI Inspec. PI Print Pre Clean CF Clean CF Glass Input Clean Sealant Clean Seal Inspec. Spacer Spray Seal Cure Density Inspection Teansfer Assembly Seal Press Seal Harden Inspection Visual Inspection Anneal Clean End Seal LCM Injection Vacuum Anneal 2nd Cut Outward Grind Suface Polishing Clean Polarizer Attachment Auto Clave Cell Panel Final Tester Page- 31
PI 噴嘴 Doctor Plate Main Curing PI Print 開口為 60um 正方, 深度為 18um; 尤其是深度的部份, 除了影響 PI 膜厚之外,CF 及 TFT 也有各不相同的深度 Anylox Roller 印刷 Roller 印刷凸板 Glass 基板石英基板 IR 板 Glass 基板石英基板 IR 板 共 24 段 Glass 基板 Stager 基板行進方向 Glass 基板石英基板 IR 板 Rubbing Glass 基板 LC Twist Direction (TOSHIBA 使用正材料, 故往左旋轉 ) TFT Rubbing 方向 ( 基板在下 ) CF Rubbing 方向 ( 基板在上 ) Rubbing 角度 45.7 Stage 行進方向 CF 與 TFT Rubbing 的方向為交叉 ( ) 的方向, 是為了面板顯示的均一性的關係 ; 故不用十字方向的交叉 Page- 32
Spacer 噴嘴 Spacer 散布槽 SpacerSpray TFT 基板 Spacer TFT 基板 Sealing Transfer Seal CF 基板 Seal 噴嘴 Transfer Seal CF 基板 Transfer 噴嘴 CF 基板 Seal CF 基板 Transfer 液晶注入口 液晶注入口 Page- 33
UV 假固定膠 CF 基板 CF Black Martix Spac Array ITO Pixel TFT 基板 Seal Assembly 基板位置對照所用的十字 150um 1mm Assembly 時所用的十字 3 21.5 300um 4.5 27 54 20 CF Alignment TFT Alignment 40um 107um Page- 34
2nd Cut 以此方式堆疊 64 片基板 CF 基板 TFT 基板 Sealing Press Cell 基板 均熱板 Polyfron Seal UV 假固定膠 Cut 的順序 : 先切 CF ( 翻面 ) CF Beak 切 TFT ( 翻面 ) TFT Beak 往上加壓 LCM Injection Seal Transfer Cell 基板 液晶 裝液晶的 Boat 液晶 裝液晶的 Boat: 長 180mm, 寬 54mm, 高 10mm 實際裝載液晶的部份 : 長 168mm, 寬 32mm, 深 0.7mm 裝液晶的 Boat Page- 35
加壓 反轉 90 後 再塗上封止劑 Cell 基板一次為 64 片, 若少於 56 片, 則須加以 spac End Sealing 300kg 加壓至 20um 270kg 70min End Seal Seal 120kg 90min 液晶注入狀態 基板 End Seal 塗佈 Seal Page- 36
1. 長 短邊研磨 :( 磨掉 0.1mm) CF 基板 2. 長 短邊研磨 :( 取彎角 ) 3. 轉角研磨 : Outward Grinding TAB 端子 TFT 基板 Seal 磨石 End Seal 液晶注入口 液晶注入口 OLB Pass S/R 可研磨的範圍 二次切割線 TFT 基板 CF 基板 Polarizer Attachment CF 基板 TFT 基板 偏光片 偏光片 Page- 37
Module Process Flow & FAB Layout Process Step Process Name Material Cell Panel Input TAB-IC Punching Array Glass Input OBL PCB Soldering Soldering Inspection OLB OLB Inspection PCB PCB Soldering I/F Card Setting Bezel Setting FPC Setting Cell Setting Soldering Inspection Backling, Frame Spacer Cell Setting Brun-in Final Inspection FPC FPC Setting Bezel Bezel Setting I/F Card I/F Card Setting Burn-in Final Inspection Page- 38
Module Assembly Process Cell Lead Cleaning ACF Application TAB Pre-Bonding TAB Final Bonding ACF Application PCB Final Bonding Cell with TAB & PCB Page- 39