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1 The Rise of China IC Industry - As A Global Ecosystem Partner Lung Chu 居龙 President,SEMI China July 13,2017

Manufacturing Assembly & Test Equipment & Material Summary Global Ecosystem Partner AMERICA S

2 Outline China s IC Development Why? Government Initiatives vs Market Forces Investments Opportunities and Challenges IC Design Manufacturing Assembly & Test Equipment & Material Summary Global Ecosystem Partner AMERICA S 476 Companies EUROPE 255 Companies INDIA 25 Companies SINGAPOR E 33 Companies CHINA 330 Companies JAPAN 414 KOREA Companies 203 Companies TAIWAN 215 Companies 2

3 Global Semiconductor Market Growth Rate Has Slowed Down until 2017 Mobile Computing, Internet of Things PC Mobile Phone

4 China Consumption/Demand Has Driven Recent Global Semiconductor Growth Source:McKinsey & Company 4

5 China: Largest and Growing Share of WW IC Market 5

6 China Continues to Outpace the Rest of World in IC Industry Growth Sales (0.1B of CNY) YoY Growth Rate 6

7 Growth in all Segments IC Design: Package/Test IC Mfg 7

8 But Dominated by Imports Semiconductor: #1 Import and Huge Trade Deficit 8

9 Big Gap Between Local IC Supply and Demand China IC Market: Heavy Dependency on Imports 数据来源 : SEMI 2016 年 8 月 9

10 The Shift of Global Electronics Industry to Asia Pac Electronics Mfg: US/EU/JP SE Asia TW, China Semiconductor Mfg:US/EU JP KR, TW, China(?) 2000 年全球半导体产能按地区分布 2015 年全球半导体产能按地区分布 10

11 High Lights of 2014 China Government National IC Development Guidelines Design Key Words 1.Supply Chain Collaboration 2.M&A Development Strategy Near Term: Mobile Smart Terminal and Network Communication: Mobile terminal, Digital TV, Network Communication, Smart Wearable and OS Mid Term Term:Cloud Computing, IOT, Big Data Break Through:Smart Card/Electricity/Transportation Satellite Navigation Industrial Control Financial Electronics, Automotive, Medical and Embedded software Mfg Pkg/test EquipmentM aterial 1.Capex 2.Advanced Node 1. M&A 2. Evolution 1. Key Equipment and Material Break-through 2.Manufacturing Synergy Speed up the 45/40nm foundry capacity ramp up and 32/28nm line set up, 3D process R&D, capability set up of 22/20nm and 16/14nm foundry production capability. Excel the specialized production line such as Analog and mix circuit, MEMS, high voltage and RF CSP, WLP, TSV and 3D Stack R&D in key equipment such as Lithography, Etching, and Implant R&D of key material such as Photoresist and large wafer Source: SEMI

12 China National IC Industry Development Guideline - Highlights of Key Goals in

IC Design: M&A under market mechanism Packaging & Test: M&A and

13 纲要的两个重点 Sino IC (Big) Fund 集成电路产业基金兼并重组 M&A Estimated Initial Phase amount: RMB300Billion (including local government) Type: Equity Fund IC Design: M&A under market mechanism Packaging & Test: M&A and consolidation Majorly for Fab capacity and M&A 数据来源 : SEMI 2016 年 8 月 13

14 China IC Funds Central & Local About 14

15 IC Investment Funds Enabled by China Government 15

16 All Over the Map. National Fever in Pursuing IC Industry 4 Major Regions Yangzi Delta: Design, Manufacturing, OSAT, Equipment Beijing/Tianjing/Bohai Area: M&A Pan Zhujiang Delta: Design, System and Applications Center-West China: Memory and Special Processes Beijing/Tianjing/Bohai Area: Manufacturing, Equipment, M&A Center-West China: Memory and Special Processes Yangzi River Delta: Design, Manufacturing, OSAT, Equipment Pan Pearl River Delta: Design, System and Applications 16

17 全球并购意向金额创纪录 17

18 2016 年至今 : 并购 M&A~1000 亿美元 US$98.5B 成长壮大 China related is less than 5% 减少运营成本传统行业逻辑协同供应链协同生产制造消灭竞争对手战略扩张新市场产品需求增长投资组合互补填补技术产品空缺中国政策提高自给能力 18

19 China Semiconductor Industry Significant growth Since 2000 China Semiconductor Industry Revenue(B$) 70 IC Packaging&Test 60 IC Manufacture IC Design Source: CSIA, SEMI China, April

20 Revenue Target of 2014 Guideline 纲要 2014 年目标 $ Billion 中国集成电路产业营收和目标 China IC Industry Revenue and Projection 标注 : 1. 营收值为中国所有集成电路企业销售所得, 包含 IC Fabless 代工厂 IDM 和委外封装等企业年营运目标是超过 3500 亿人民币 ; 年均增速超过 20% 数据来源 : SEMI 2016 年 8 月 Source: CSIA, SEMI 20

21 Growth in Supply Chain Segments 21

22 China Fabless China Top 10 Fabless(Unit:RMB 100M) Global Top 10 Fabless(Unit: US$M) Rank Company 2016 Rank Company 海思 HiSilicon Qualcomm 15,436 2 清华紫光展瑞 Ziguang Broadcom 13,848 3 中兴微电子 ZTE IC MediaTek 8,800 4 华大半导体 HDSC* Apple 6,493 5 智芯微电子 Nari Nvdia 6,340 6 汇顶科技 Goodix AMD 4,238 7 士兰微电子 Silan Hisilicon 3,762 8 大唐半导体 Datang Marvell 2,403 9 敦泰科技 FocalTech Xilinx 2, 中星微电子 Vimicro Spreadtrum 1,510 Total 总计 65,135 *HDSC Revenue includes Montage, Centec Phytium CSMT Empyrean Data Source:CSIA

23 China Fabless: Increasing market share China wafer demand at TSMC, SMIC, UMC, and Hua Hong has increased at 28% CAGR in Increasing share at TSMC including at advanced nodes 23

China Fabless Design- Still Lacking in Key Technologies % by local fabless System Device IC Made in China Processor/MCU FPGA/DSP Communication System Storage Devices Display and Video Server MPU 0%

24 China Fabless Design- Still Lacking in Key Technologies % by local fabless System Device IC Made in China Processor/MCU FPGA/DSP Communication System Storage Devices Display and Video Server MPU 0% PC MPU 0% Industrial MCU 2% Programable Logical FPGA/EPLD 0% Digital Process DSP 0% Application Processor 18% Mobile Communication Communication Processor 22% Embeded MPU 0% Embeded DSP 0% Core Network NPU 15% DRAM 0% Semicon Storage NAND Flash 0% Nor Flash 5% HD TV/Smart TV Image Processor 5% Display Driver 0% 24

25 Global IC Mfg Capacity Distribution WPM China IC Mfg Capacity: -relatively low among global regions -and mostly at mature nodes Source: SEMI World Fab Forecast, November

Distribution of China 's Semiconductor Fabs Major New Fabs: - SMIC Beijing B2 in operation, B3 under construction, Shanghai: two 12-inch lines; Shenzhen: a 12-inch line; Ningbo one 8- inch line -

26 Distribution of China 's Semiconductor Fabs Major New Fabs: - SMIC Beijing B2 in operation, B3 under construction, Shanghai: two 12-inch lines; Shenzhen: a 12-inch line; Ningbo one 8- inch line - Wuhan Changjiang Memory(YMTC) initiated in March 2016, 3 NAND & NOR production lines; - Hua Li new 12-inch line in Zhoupu; - Intel Dalian fab converted into NAND production - UMC Xiamen 12-inch fab,production in Jinghe Hefei 12 inch fab under construction, production in 2017; - TSMC Nanjing 12-inch fab foundation, production in 2018; - Jinhua new 12-inch memory fab 27

27 The Race: Foundry Technology Nodes Courtesy, Prof Wei Tsinghua U 28

28 Global Top 10 Pkg/Test Companies 全球前 10 大封测厂 Amount in $US M 数据来源 : IC Insight, 2017 年 4 月 29

29 China Top 10 Pkg/Test Companies 中国十大封测厂 2016 Amount in RMB 亿 2016 公司名称总部 2016 年销售额 2015 年销售额 2016/2015 增长率 1 江苏新潮集团 JCET 中国 193* 南通华达微电子 NFME 威讯联合半导体 ( 北京 ) 有限公司中国 135.7** 美国华天科技 HuaTian 中国恩智浦半导体公司美国英特尔 Intel 美国海太半导体 HiTech 中国上海凯虹中国安靠 Amkor 美国盛碟半导体 Sandisk 中国 * 包括星科金朋销售数据 ** 包括 AMD 苏州, 马来西亚工厂销售数据数据来源 : CIA, SEMi 整理 2016 年 8 月 30

30 Equipment and Material 半导体设备材料产业 Material 原材料及配套 434 亿美元, US$43.4B 设备 Equipment 367 亿美元 US$36.7B 31

31 2015 年全球十大半导体设备厂商 2015 排名公司公司 2015 营收主要产品领域 ( 英文名 ) ( 中文名 ) ( 单位 : 亿美元 ) 沉积刻蚀离子注入 1 Applied Materials 应用材料化学机械研磨等 2015 市场份额 (%) 2 Lam Research 泛林刻蚀沉积清洗等 ASML 阿斯麦光刻设备 Tokyo Electron 东电电子沉积刻蚀匀胶显影设备等 KLA-Tencor 科天硅片检测测量设备 Screen Semiconductor Solutions Hitachi High- Technologies 迪恩士刻蚀清洗设备日立高新沉积刻蚀检测设备封装贴片设备等 Nikon 尼康光刻设备 Hitachi Kokusai 日立国际电气热处理设备 ASM International 先域沉积封装键合设备等其它 China Local Supplier: <1-2% Market Share 数据来源 : Gartner,

32 Overview of Global IC Materials Suppliers Wafer Photoresist Gas Sputter Materials CMP Slurries China Market Share 5% 8% 10% 6% 9% Global Shin-Etsu(JPN) Sumco(JPN) Siltronic(GER) Sunedison(US) SAS(TW) TOK(JPN) Shipley(US) JSR(JPN) DOW(US) Shin-Etsu(JPN) Air Liquid(FRA) Praxair(US) Linde(GER) Air Product(US) Matheson(GER) JME(US) LMC(GER) Tosoh SMD(JPN) Japan Energy (JPN) DOW(US) 3M(US) Cabot(US) Toray(JPN) China Mainland GRINM JRH Wafer Works Simgui GuoSheng ZingSemi Kempur RuiHong 718th research institute of CSIC Huate Gas Nata Optoelectronic Material KFMI GRIKIN Anji Xinanna China Local Supplier: <1% Market Share 33

33 With Limited Competitiveness, China IC Industry Faces Challenges and Opportunities 34

34 35

35 What s Ahead? China Semiconductor Industry Fast Growing Application Market Opportunities Mobile computing + 5G (Huawei) AI, AR/VR, IoT, Cloud Computing, Big Data (BAT)(WeChat) Industrial 4.0 Smart Mfg 2025 IIot New Energy, Smart (electic)automotive Smart Medical, Smart City, Smart Grid China s Transition from Low-cost manufacturing to solution provider, then to innovation. 36

36 China HSR High Speed Rail Europe: 6100KM Japan: 2800Km China: 19000Km 30000KM Europe Japan 37

37 China Smart Grid ±500kV transimission line: 16, ±800kV and higherultra High-V transimission line:7, Total Capacity: 100GW,Distance: 300,000KM Completed Construction Planned,

38 Smart (Electric) Vehicles 39

39 Summary Why? Concerns of National Security and Trade Deficit Market Driven China National IC Development Guideline and Big Fund Necessary, Just Timely, or Maybe too late? Opportunities and Challenges Design/Fabless: Mostly Low-Margin Consumer Segments Mfg: 2-3 Generations Behind. Over capacity? Sustainability? Assembly/Test: Improving competitiveness thru R&D and M&A Equipment/Material: Dominated by US/JP/EU Plan and Beyond, Not a Threat yet. China as a Global Ecosystem Partner Opportunities for US and global players. Low-Cost Mfg -> Solution -> Innovation 40

40 SEMICON China 2018 March 14-16, 2018

PowerPoint Presentation

PowerPoint Presentation The Rise of China IC Industry - Innovation and Investment Forum Lung Chu 居龙 President, SEMI China July 11,2017 China Strategic Innovation and Investment Forum: The Rise of China IC Industry Date: Tuesday,