幻灯片 1

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1 公司简介 & 产品说明 Profile & Products

2 简报目录 Contents 公司概况 Overview 生产流程及设备 Manufacturing Process 过程检验及设备 Quality Control and Assurance 主要原物料供应商 Main Raw Materials 产能及制程能力 Capacity and Capability 企业规划与愿景 Vision 产品特性及比较 Product Properties 产品销售及应用 Sales and Applications

3 1 公司概况 Overview 公司注册 Establishment : June, 2000 注册资本 Capital: US$20 Million 占地面积 Area:120K m 2 公司雇员 Employee:600 董事长 Chairman : 包秀银先生 Mr. Mike Bao 公司地址 Address: 上海市嘉定区南翔镇昌翔路 158 号 NO. 158 CHANGXIANG ROAD NANXIANG SHANGHAI P. R. CHINA 经营产品 Scope: 半固化片和覆铜箔基板 Prepreg and Laminate 产品类型 Products:Normal FR4, High CTI, LDPP, Anti-CAF, Lead Free, Halogen Free, Low Dk

4 2 半固化片生产流程 Prepreg Process 树脂 Resin 硬化剂 Hardner 促进剂 Accelerator 上胶 Treating 调胶 Mixing 玻纤布 Glass 半固化片 Prepreg 裁切 Cutting

5 基板生产流程 Laminate Process 组合 Building Up 层压 Lamination 检验 Inspection 基板 Laminates

6 3 系统认证 QA System 系统认证 Certificate ISO 9001:1994 ISO 9001:2000 时间 Time 2001 年 2003 年 ISO 14001:2004 ISO/TS SONY GP OHSAS 年 2007 年 2009 年 2010 年

7 品质管控过程 QC Flow Chart 退回供应商 RTV 出货 Outgoing Rej 原物料 Raw Material IQC 物性检验 Laminate Test Rej 报废 Scrap 重工 Rework 调整 Adjusting 调胶 Mixing 外观检验 Visual Inspection Rej MRB Rej 胶水测试 Varnish Test 裁切 Trimming V 上胶 Treating V 折卸 Break-down 报废 Scrap 半固化片 Prepreg Test 压合 Pressing V 备注 Remark: V 预叠 Ply-up 外观检验 Visual Inspection 切铜箔 Copper Foil Cutting 组合 Build-up up V 品保控制点 Control by QA V

8 主要检验仪器 Test Instrument

9 4 设备及能力 Capacity and Capability 制程 Process 月产能 Capacity 主设备 Equipments 设备供应商 Suppliers 设备能力 Capability 上胶 Treating Km 上胶机 (16 台 ) Treater (16 sets) 田熊 ( 日本 ) TAKUMA (Japan) 101 glass (min.) 亚泰金属 ( 台湾 ) Asian Metal (Taiwan) 压合 Lamination 1500KSH 热压机 (10 台 ) Hot Presser (10 sets) 北川 ( 日本 ) KITAGAWA (Japan) Thickness CPK>1.67 组合拆卸 Assembly 1500KSH 回流线 (5 套 ) Circulating System (5 sets) 爱机 ( 日本 ) AIKI (Japan) 0.03mm (min.) 阳程 ( 台湾 ) USAN (Taiwan)

10 出货产品规格 Specification 高阶产品类型 Advanced Materials Lead Free Halogen Free Anti-CAF Low CTE LDPP Low Dk / Df 基板厚度 Thickness 0.03 ~ 3.20mm ( ~ ) 供应尺寸 Dimensions 37 x49 41 x49 43 x49 74 x49 82 x49 86 x49 铜箔 Copper Foil (HTE, RTF, Heavy Copper, Ultra-thin) 1/4oz, 1/3oz, 1/2oz, 1oz, 2oz, 3oz, 4oz, up to 6oz 半固化片 Prepreg Anti-CAF (106, 1067, 1078, 1080, 1086, 2113, 2313, 3313, 2116, 1506, 7628) Laser Drillable (1078, 1086, 1067, 1037, 106)

11 5 原物料供应商 Materials Suppliers 玻璃纤维布 : - 日东纺 Nittobo (Nitto Boseki Co., Ltd. / JAPAN) - 橡树 AST (Asahi Glass Co., Ltd. / JAPAN) - 台玻 TGF (Taiwan Glass Industry Corp. / TAIWAN) - 宏和 Grace (Grace / China) 铜箔 : - 日进 ILJIN (ILJIN Copper Foil Co., Ltd / S. KOREA) - 长春 CCP (Chang Chun Group / TAIWAN) - 福田 Fukuda (Fukuda Metal Foil & Powder / JAPAN) 树脂 : - 陶氏化学 Dow (The Dow Chemical Company / USA) - 长春 CCP (Chang Chun Group / TAIWAN) - 宏昌 Grace (Grace / China)

12 1037 附页 : 常用玻纤布 Glass fiber Type

13 6 企业愿景 Vision 力争 2012 年底实现年销售总额 20 亿, 打造成为中国一流的 CCL 生产企业 Striving to achieve annual sales of 2 billion at the end of 2012, to build Chinese first-class CCL manufacturers 以国际化视野行业市场战略并以上海南亚发展速度, 打造成为国际一流的具有品牌影响力 CCL 生产企业 Base on an international outlook, industry market strategies, and fast developing speed, we would build a world-class brands that have influence on CCL manufacturers.

14 7 电子行业需求 Customer Requirements End products High Frequency Application Computers Workstations Servers, Switches Amplifier, Antenna Digital Electronic Equipments Digital TV Cellular GPS PCB or PCBA products Low loss Multi/High Layer Lead Free/Halogen Free High Ratio of Hole Height/Diameter BGA/CSP/IC packaging CCL-Solutions Low Dk/Df High Thermal Resistance Low Z-CTE Low Moisture Absorption

15 行业核心技术 CCL Core Technologies Server Backplane Middle Tg & High Tg. Lead Free High-Freq. Wireless > Base Station Low Loss Halogen Free 4C Electronics Substrate Anti-CAF Automotives Military

16 上海南亚产品及应用 Product Line Performance Power Supply, Server, Base Station, Automotive, IC Test, Substrate Play station, NB, Camera, MP, etc. Green Low Level 4C Electronics Base station, Server, Automotive, Military, etc. Server, NB, LCD, GPS, Mobile Phone, DDR, Automotive, Power supply, etc. NY1600 NY1140 NY1150 NY1170 NY2150 NY2170 NY3140 Tg140, FR-4 Multifunctional Tg140 High CTI Laminate NY3170 NY3150 Tg170 FR-4 Multifunctional Tg150 FR-4 Multifunctional Low Dk Tg150 PN curing, Filler, Low CTE, Lead free Tg150 PN curing, Filler, Halogen free Laminate Tg145 DICY curing, Filler, Halogen free Laminate Tg170 PN curing, Filler, Low CTE, Lead free Tg170 Low Dk, Low Df, Tg150 Low Dk, Low Df, Tg170 PN curing, Filler, Halogen free Laminate for 2-4 Layer Rigid Board for Lead Free 2-14 L Low CTE PCB for Lead Free 2-8 Layer & Rigid Board for 2-6 Layer Rigid Board for High CTI material Medium Layer Count. for Halogen Free Higher Layer Count. (>14L) for Halogen-Free & Lead Free PCB 2-14 L for Halogen-Free & Lead-Free PCB 2-4 L for Lead Free Product High Layer Count. (>14L) Base station Telecom Eq, High Freq. Appl. Regular Low Level 4C Electronics Regular Low Level 4C Electronics Washing Machine Plasma TV Regular Low Level 4C Electronics Products

17 附页 : Dicy & PN 分子结构 Dicy NH H H 2 N C N C N Phenol Novolac OH OH OH CH 2 CH 2

18 IPC4101C Lead Free Specification IPC4101C Type Normal Tg Normal Tg Middle Tg Middle Tg High Tg High Tg Tg ( ) Filler ( 5%) NA Yes NA Yes NA Yes Td (, TGA-5%) Z-CTE (%, 50~260 ) Z-CTE (ppm/, a1/a2) 60/300 60/300 60/300 60/300 60/300 60/300 T260 (min) T288 (min) T300 (min) / / / / 2 2 Moisture Abs. (%, 0.5mm)

19 上海南亚无铅材料 Lead Free Materials Items Products NY1140 NY1150 NY1170 NY2150 NY2170 Characteristic Method Normal Tg Middle Tg High Tg Middle Tg High Tg Curing Agent NA Dicy Dicy Dicy PN PN Filler NA No No No Yes Yes Tg ( ) DSC Td ( ) TGA-5% Z-CTE (%, 50~260 ) TMA Z-CTE (ppm/, a1/a2) TMA 65/310 58/305 56/295 50/235 50/240 T260 (min) TMA T288 (min) TMA >20 Peel Strength (N/mm) 1oz,A Moisture Abs. (%) 0.5mm Dk/Df 1MHz 4.6/ / / / /0.015 IPC4101C Slash Standard thickness:1.6mm CCL

20 同业无铅产品 Lead Free Benchmark (Mid-Tg) Items Products NY2150 S1000 IT-158 EM825 TU662 Thickness (mm) Etched Tg ( ) Td ( ) Z-CTE (%, 50~260 ) Z-CTE (ppm/, a1/a2) T260 (min) T288 (min) Peel Strength (N/mm) Moisture Abs. (%) Dk/Df Delamination (min) DSC TGA-5% TMA TMA TMA TMA 1oz,A D-24/23 1MHz Solder, / /0.015 > / / / /0.016 > / /0.016 > / /

21 同业无铅产品 Lead Free Benchmark (Hi-Tg) Items Products NY2170 S IT-180A EM827 TU662 Thickness (mm) Etched Tg ( ) Td ( ) Z-CTE (%, 50~260 ) Z-CTE (ppm/, a1/a2) T260 (min) T288 (min) Peel Strength (N/mm) Moisture Abs. (%) Dk/Df Delamination (min) DSC TGA-5% TMA TMA TMA TMA 1oz,A D-24/23 1MHz Solder, / / / / / / / / / /

22 IPC4101C Halogen Free Specification IPC4101C Type Normal Tg Normal Tg Middle Tg Middle Tg High Tg High Tg Tg ( ) Filler ( 5%) NA Yes NA Yes NA Yes Td (, TGA-5%) Z-CTE (%, 50~260 ) Z-CTE (ppm/, a1/a2) 60/300 60/300 60/300 60/300 60/300 60/300 T260 (min) T288 (min) T300 (min) / / / / 2 2 Moisture Abs. (%, 0.5mm)

23 上海南亚无卤素产品 Halogen Free Materials Items Products NY3140 NY3150 NY3170 Characteristic Method Normal Tg Middle Tg High Tg Curing Agent NA Dicy PN PN Filler NA Yes Yes Yes Tg ( ) DSC Td ( ) TGA-5% Z-CTE (%, 50~260 ) TMA Z-CTE (ppm/, a1/a2) TMA 50/260 40/245 40/230 T260 (min) TMA T288 (min) TMA Peel Strength (N/mm) 1oz,A Moisture Abs. (%) 0.5mm Dk/Df 1MHz 4.6/ / /0.008 IPC4101C Slash Standard thickness:1.6mm CCL

24 同业无卤产品 Halogen Free Benchmark Property Unit Condition NY3140 NY3150 S1155 R1566 IT150G NPG EM285 Tg DSC T260 T288 Z-CTE TD P/S Dk, 1MHz Df, 1MHz Moisture Abs. Flammability Min Min % N/mm / / % / TMA TMA TMA TGA A C-96/ 20/65 C-96/ 20/65 D-24/23 UL V V V V V V V-0

25 同业无卤产品 Halogen Free Benchmark (Hi-Tg) Property Unit Condition NY3170 S1165 TU862 IT170GR NPG-170 EM370 Tg DSC T260 T288 Z-CTE TD P/S Dk, 1MHz Df, 1MHz Moisture Abs. Flammability Min Min % N/mm / / % / TMA TMA TMA TGA A C-96/ 20/65 C-96/ 20/65 D-24/23 UL V V V V V V-0

8 销售情况描述 Sales Description 2004 2005 2006 2007

656 920 Computer Evolution ROHS / Green Partner

Establish To Set up the 1st plant For CEM1, CEM3,

Dicy Tg150 Fr4 For Dicy Tg170 Fr4 2009 To Set up

26 8 销售情况描述 Sales Description RMB (Million) Computer Evolution ROHS / Green Partner lead-free / Halogen-free Milestone 2000 To Establish To Set up the 1st plant For CEM1, CEM3, Dicy Tg140 Fr To Set up the 2st plant For Dicy Tg150 Fr4 For Dicy Tg170 Fr To Set up the 3st plant For Lead Free Materials For Halogen Free Materials

27 销售网络 Sales Network 瑞士 Switzerland 挪威 Norway 丹麦 Danmark 英国 British 德国 Germany 俄罗斯 Russia 加拿大 Canada 法国 France 意大利 Italy 希腊 Greece 西班牙 Spain 土尔其 Turkey 韩国 Korea 中国 China 日本 Japan 美国 USA 埃及 Egypt 印度 India 上海南亚 NOUYA 泰国 Thailand 巴西 Brazil 南非 South Africa 澳大利亚 Australia 新西兰 New Zealand 阿根廷 Argentina

28 产品应用 Applications

29 总结 Summary 1. 上海南亚具备一流设备和技术, 能为客户提供一站式的全方位的材料和服务 ; We have the first-class equipment and technology, can provide customers with a one-stop full range of materials and services. 上海南亚之无铅材料 NY2150,NY2170 等材料能解决客户从双面到高多层线路板之材料需求 ; Our Lead-free materials: NY2150, NY2170 can satisfy customers demand from the double-sided to high multi-layer circuit boards. 上海南亚之无卤材料 NY3140,NY3150,NY3170 材料能解决客户从双面到高多层线路板之材料需求 ; Our halogen-free materials: NY3140, NY3150, NY3170 can satisfy customers demand from the double-sided to high multi-layer circuit boards. 上海南亚能提供各种厚度半固化片和基板, 各种基板尺寸, 能大幅提高客户材料使用率, 降低成本, 提供竞争力 We can provide a variety thickness of PP and laminate, various sizes, can significantly improve customer material utilization, lower costs, and competitiveness. 2. 上海南亚最关注高性价比, 提高客户竞争力, 达成互利 ; We Focus on High Performance / Cost ratio, improve customer competitiveness and achieve mutual benefit; 3. 上海南亚希望成为您最好的高阶电子材料合作伙伴 We wants to be your best Partner for Advanced Electronic Materials.

30 Q & A!

<4D6963726F736F667420506F776572506F696E74202D20C6F3D2B5BCB0B2FAC6B7BCF2BDE92DD6D0D3A2CEC420C1F5B9FAD3B1205BBCE6C8DDC4A3CABD5D>

<4D6963726F736F667420506F776572506F696E74202D20C6F3D2B5BCB0B2FAC6B7BCF2BDE92DD6D0D3A2CEC420C1F5B9FAD3B1205BBCE6C8DDC4A3CABD5D> 企业及产品简介 COMPANY & PRODUCTS INTRODUCTION 山东泗水康得新复合材料有限公司 SHANDONG SISHUI KANGDE XIN COMPOSITE MATERIAL CO., LTD. 集团概况 KDXGROUP OVERVIEW 1 拥有两大产业群 : 预涂膜和光学膜 1. GROUP HAS