th International ... ; 2

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1 th International Conference on Electronic Packaging Technology (ICEPT 2014) Chengdu, China August 2014 Pages IEEE Catalog Number: CFP14553-POD ISBN: /2

2 Advanced Table of Contents Session A Packaging A-009 ENEG and ENEPIG Surface Finish for Long Term Solderability 1 Kelvin Pun, M.N. Islam, Tin Wing Ng A-032 Parallel Gap Resistance Thick Wire Bonding for Vertical Interconnection in 3D Assembly 6 Xuguang Guo, Yanhong Tian, Shang Wang, Chunqing Wang A-040 Drop-on-demand jetting of piezoelectric diaphragm-piston for fabricating precision solder bumps 10 Long He, Xingfang Wei, Honghai Zhang, Peng Chen, Hao Lno, Ming Ma, Sheng Liu.Xiayun Shu A-055 Preparation and Performances of Nanoporous Copper for Low Temperature Bonding 14 Kecheng Li, Xiaogang Liu, Mingxiang Chen, Sheng Liu A-056 Research on nano-thermocompression bonding process using nanoporous copper as bonding layer 19 Kecheng Li, Xiaogang Liu, Mingxiang Chen, Sheng Liu A-073 Impact of the packaging structural geometry on the Conformal Coating LED performance by Optical Simulation 24 Gong Yu-bing, Liao Zhi-ping A-074 Impact of the LED chips placement and heat sink design on the multi-chip LED bump performance by the thermal and Optical Simulation 28 Gong Yu-bing, Zhu Zheng A-118 Low Cost Fabrication of TSV-based Silicon Interposer Using Wet ChemicalEtching and Its Application in 3D Packaging 32 Jiaotuo Ye, Xiao Chen, Chunsheng Zhu, Gaowei Xu, Le Luo A-130 Fabrication and Measurement of BPF using IPD Technology 36 Bian Xinhai, Guo Hongyan, Zhang Li, KH Tan, CM Lai A-182 Passive Equalizer Design on High Density Interconnects for 25Gbps High Speed IO and Beyond 39 Boping Wu, Tingling Mo

3 A-190 Influence of Warpage on the State Estimation of a MEMS-Based Gyro-Free Inertial Measurement Unit 43 Shuai Yu, Chaojun Liu, Shengzhi Zhang, Xuebing Yuan, Qiang Dan, Sheng Liu A-225 Effect of melting temperature and amount of the phase change material (PCM) on thermal performance of hybrid heat sinks 48 Jinyan Hit, Tinghui Gao, Yongming Zhu, Run Hu, Xiaobing Luo, Ting Cheng A-269 Analysis on Electromagnetic Isolation Issues Among Multi-chips in System in Package 53 Peng Wu, Fengman Liu, Yi He, Huimin He, Jim Li, Liqiang Cao, Dongkai Shangguan, Lixi Wan A-287 Embedded Band Pass Filter designed using Embedded Capacitor Material 58 Wenhu Yang, Xinjiang Zhao, Shahui Yu, Rong Sun, Wei-Hsin Liao A-289 Study on the POP ceramic package multilayer board design 62 Zhang Jie, Wang Ke A-292 Multilayer Chip Embedded based on the Organic Substrate 66 Xueping Guo, Zhongyao Yu, Liqiang Cao, Yang Song, Yu Sun, Zhidan Fang, Hu Hao, Guowei Ding A-309 New Process of Copper Pillar Bumps on Substrate 70 Yang Song, Ding Wenlong Liu, Zhongyao Yu, Xueping Guo, Zhidan Fang, Guowei A-310 Foldable Substrates for Wearable Electronics 74 Kelvin Pun, M.N. Islam, Tin WingNg A-342 Characterization of Stencil Printing Parameters for Fine Pitch Wafer Bumping 80 Xi He, Ziyu Liu, Jian Cai, Yu Chen, Lin Tan, Qian Wang A-347 Investigation of temporary bonding and release processes for TSV with copper pillar bumps 86 Xiangmeng Jing, Feng Jiang, Li, Wenqi Zhang Cheng Xu, Kai Xue, Fengwei Dai, Zhaoqiang A-381 Bonding 1200 V, 150 A IGBT Chips (13.5 mm x 13.5 mm) with DBC Substrate by Pressureless Sintering Nanosilver Paste for Power Electronic Packaging 90

4 Shcmcan Fu, Yunhiii Mei, Xin Li.Guo-Quan Lu A-418 Full-color LED display research based on chip on board(cob) package97 Mingyu Hu, Yiping Wu A-419 Effect of annealing after copper plating on the pumping behavior of through silicon vias 101 Liang Ji, Xiangmeng Jing, Kai Xue, Cheng Xu, Hongwen he, Wenqi Zhang A-430 The Process Development and Reliability Study of Low Cost Area Array QFN Packaging Technology 105 Hu Wang, Taotao Li, Xiaobo Ma, Xiaolong Wang, Shiguang Chen, Jianyou Xie, Daquan Yu A-451 Study of 3D SiP (System-in-Package) Module for Package-on-Package Application Using Multi-layer PCB Manufacturing Process 109 Liulin Hu, Zhu Jin, Xuejie Liao, Yaoguo Ouyang, Jinsheng Dong A-453 Development of Advanced AuSn Alloy Plating Technology for Semiconductor Application 113 Zhang Ling, Ng Seow Ching, Li Zheng, Fang Shu Nong.Tennyson Nguty, Emiel de Bruin, An Xiao, Henk Thoonen Session B System Integration Bill A Test Method of SIP Module 117 Tianrui Zhu, Yun Liang, Yimao Cai, Lidong Lan, Xin Li B-157 Influence of Cu Orientation on the Growth of Cu-Sn Intermetallics and Interfacial Reaction of Cu/Sn Diffusion Couple 121 Shan Yang, Li Peng, Yishi Tao, Anmin Hu, Ming Li B-251 The Coupling Effect of Size Effect and Krikendall Voids on the Fracture Features of Ni/Sn3.0Ag0.5Cu/Cu Joint 125 LiXunping, Zhou Bin, Yang Shaohua, En Yunfei B-252 Optimization Design and Simulation for a Band-Pass-Filter with IPD Technology for RF Front-end Application 129 Huijuan Wang, Jie Pan, Xiaoli Ren, Anmou Liao, Yuan Lu, Daquan Yu, DongkaiShangguan B-436 Fast Time Domain Crosstalk Analysis of Through Silicon Vias Based On

5 Packaging Equivalent Circuit Model 134 Zhilong ZHANG, Rimiu FANG, Guanjiang WANG, Xin SUN, Yufeng JIN,Min MlAO B-450 A LTCC-BGA multi-chip packaging technology for MMICs up to Ku-band 138 Shuwei He, Zhi Huang, Dong Wang, Yijun Chen Session C - Materials & Processes C-004 Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process 141 Y. Tang, B. Zhou, J. H. Huang, Z. Z. Wu, G. Y. Li C-011 Increasing Bonding Strength of Chips and Substrates Assembly by Argon Plasma 145 Cheng-Li Chuang, Jong-Ning Aoh, Bo-Zhi Yang C-012 Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 151 Jamtsz Sitek, Marek Koscielski, Yan Zhang, Jing-yu Fan, Shiwei Ma C-015 A novel Method to Fabricate A1N-A1203 Multiphase Ceramic Layer on WCu Alloy 155 Jiandong Zhu, RongAn, Chunqing Wang, Yanhong Tian, Guangwu Wen C-020 Reactive wetting and dewetting of liquid SnPb solder on the butterfly pattern 159 W. Liu, P. Jin, S.D. Zhang C-021 Twin-induced ultra-high thermal conductivity of intering Ag nanoparticles for high power density electronic packaging 163 Shuai Wang, Mingyu Li, Jongmyung Kim C-029 Study of silver-copper-palladium solder properties for vacuum electronic devices 167 Xiaowei Wang, Yutian Shu, Limin Ma, Fu Guo C-035 Fabrication and thermophysical properties of short graphite fiber/cu composites with Mo2C coating by vacuum pressure infiltration 172 ChenZhang, XinboHe, QianLiu

6 C-041 Preparation of MnCVGraphene Nanocomposite for the Application of Supercapacitor 177 Chunliang Liu, Dayong Gui, Jianhong Liu C-047 Chip cooling with carbon nanotube heat sink 183 Zhenlong Huang, Taisong Pan, Min Gao, Yuan Lin C-054 Palladium Coated Cu Wire: A Robust Material for Die to Die Cu WB Interconnect 186 Allen M. Descartin,Zhang XiaoLong,Li Jun C-066 Improving the Thermal and Mechanical properties of Epoxy Resins for Electronic Packaging 191 Shuang Liang, Dayong Gui, Wenchuan Zhang, Weijian Xiong, Jianhong Liu C-068 Study of Gold Wire Bonding on 0.1 urn Soft Gold Film Substrate 196 Ruonan Zhang, Rui Guo, Ming Li.Kaiyou Qian, Hope Chiu C-077 Evaluation of Ag sintering die attach for high temperature power module applications 200 Yimin Zhao, Yibo Wu, Kim Evans, John Swingler, Steve Jones, Xiaoping Dai C-081 Effects of Cu orientation and stand-off-height on the microstructure of Cu/SnAgCu interface 205 Han Xiao, Li Peng, Jiaxing Liang, Anmin Hu, Ming Li C-083 Effect of Ni-coated graphene on the performance of SAC305 solder 209 Guang Chen, Fengshun Wu, WeishengXia, Hui Liu.Changqing Liu C-101 The Finite Element Analysis of Solder Joints under Temperature Cycling. 214 Fangyi Liu, Wenzhong Lou, Fufu Wang, Xuran Ding, Dakui Wang C-105 Analysis of Stress and Strain Distribution on Pad During Bump Bonding Process 219 Tang Wenliang, Huang Chunyue.Li Tianming,Liang Ying, Xiong Guoji, Wu song, Li Chunquan, Ning Zhongping C-119 Dealloyed nanoporous Cu films on ceramic substrate for low temperature bonding 223 Xiaogang Liu, Kecheng Li, Mingxiang Chen, Sheng Liu C-122 Research on conformal EMI shielding Cu/Ni layers on package 227

7 Fankan Jiang, Ming Li, Liming Gao C-124 The Improvement of Soldering Process of New Power Module Packaging Material with Large Soldering Area 231 Jun Zhang, Bin-bin Zhang, Yun-yan Liu, Jing-ming Fei, Cheng-an Wan C Plasma Treatment in Polymer Insulation Process for Through Silicon Vias 235 Lulu Zhuang, Kim Jiang, Guoping Zhang.Jiaoning Tang, Rong Sun.S. W. Ricky Lee C-136 Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling 239 Donghua Yang, Guoshuai Yang, Jian Cai, Qian Wang, Yang Hu, Jingwei Li, Liang!iang Li C-144 Preparation, microstructure and properties of Sn-Ag-Cu solder reinforced with A1203 nanoparticles 243 Bomin Huang, Guang Chen, Fengshun Wu, WeishengXia, Liping Mo, HuiLiu C-145 Investigation of ultrasonic bonding interface based on Ni micro-nano cones array 247 Haozhe Wang, Li Peng, Anmin Hu, Ming Li C-150 Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints 251 Lang Zhang, Min-Bo Zhou, Xin-Ping Zhang C-163 A Novel Temporary Adhesive for Thin Wafer Handling 256 Xingtian Shuai, Rong Sun, Guoping Zhang and Libo Deng C-170 Preparation of raspberry-like Si02 nanoparticles and thermo-mechanical properties of its epoxy composites 262 Liang Huang, Gang Li, Pengli Zhu, Rong Sun, Daoqiang (Daniel) Lu.Chingping Wong C-178 Study of Electrical and Physical Properties of PrxAI2.x03 as Metal-oxide-semiconductor Gate Dielectric 266 Ziming Zhang, Huiqin Ling, Ming Li C-181 A Novel Nickel Nanocone Array Current Collector for High Performance supercapacitor 270 Binghe Xie, Cheng Yang, Zijin Sit, Zhexu Zhang, Xiaoya Cui, Jingping Liu

8 C-189 Modeling of Laminar Fluid Flow in Jet Dispensing Process 276 Xiuyang Shan, Yun Chen, Xianan Peng, Hcmxiong Li C-191 Isotropically Conductive Adhesives filled with copper nanoparticles and micron-sized flakes 280 Wenjan Chen, Dunying Deng, Fei Xiao C-195 Thermal Property analysis of boron nitride-filled glass-fiber reinforced polymer composites 284 ZHANG Jingyu, ZENG Xiaoliang, SUN Rong.XU Jian-bin C-198 Preparation and characterization of a high Tg cyanate ester/epoxy composite resin 288 Zhidong Ren, Yuanrong Cheng, Lingqiang Kong, Fei Xiao C-199 Preparation of direct plated copper ceramic spreader using electroless copper as seed layer 292 Ziliang Hao, Xuebin Zhang, Chen Chen, Mingxiang Chen C-201 Study on the bridge effect of Graphene oxide on thermal conductivity of A1203 filled glass fibers reinforced polymer composites 296 Yimin Yao, Xiaoliang Zeng, Rong Sun, Jianbin Xu C-204 Curing Mechanism and Thermal Properties of A Certain Liquid Crystalline Epoxy Resin Cured with Different Curing Agents 301 Guo Kun, ZengXiaoliang, Yu Shuhui, Sun Rong, Xu Jianbin C-205 High performance electrical conductive composites with ultralow percolation threshold 306 Xinfeng Zhang, Matthew Ming-Fai Yuen C-206 Effect of SiC Whiskers Addition on Microstructure, Microhardness and Wettability of Sn-Ag-Cu Solder 310 Kaisheng Xu, Guang Chen, Fengshun Wu, Weisheng Xia, Hui Liu C-212 Stress Control of Plasma Enhanced Chemical Vapor Deposited Si02 Film in Through Silicon Via Process 313 Wenguo Ning, Qiang Zhao, Kai Zheng, Dong Chen, Hongyan Guo, Li Zhang, Zhengxun Hu, K.H. Tan, CM. Lai C-214 Preparation of Silver Nanosheets Used for Low Temperature Bonding 317 Yunwen Wu, Fengtian Hu, Anming Hu, Ming Li

9 C-218 Preparation and properties of electroless deposited NiB as barrier layer Junhong Zhang, Huiqin Ling, Yifeng Yan, Ming Li C-219 Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method 324 Run Hit, Chao Yuan, Xiaobing Luo.Ting Cheng, ShengLiu C-224 Enhancing the Thermal Conductivity of Silicone Composites by Increasing Crosslink Degree 329 Jie Li, Xinfeng Zhang, Matthew Ming-Fai Yuen,Kai Zhang C-227 Dry Etching of Fused Silica Glass in C4F8/Ar Inductively Coupled Plasmas for Through Glass Via (TGV) Applications 334 Laicun Lin, Mingchuan Zhang, Delong Qiu, Xiangmeng Jing, Feng Jiang, Daquan Yu C-235 Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics 340 Yarong Chen, Zongpeng He, Zhenming Zhang, Meng Yang, RongAn C-245 Assembly process research of TO package power transistor in Aerospace electronic products 343 Ningning Wang, Qiong fvu, Zongpeng He, Zhenming Zhang, Wei Zhang C-248 Hermetic Packaging of Kovar Alloy and Low-carbon Steel Structure in Hybrid Integrated Circuit (HIC) System Using Parallel Seam Welding Process 347 Junde Wang, Xiaoqi He, Xunping Li, Yunfei En.Xinping Zhang C-253 The study of novel Metal/Composite thermal interface materials for chip testing 352 Wang Shen, Cai Xionghui, Chen Guang, Wu Fengshun, Xia Weishen, Zhu Wenbo, Liu Ruhua, Zhang Yi C-261 Study on local recrystallization and damage mode of Lead-free BGA solder joint 356 XingXu, Gaiqing Chen, Mingsheng Cheng C-267 Plasma Cleaning and Its application in Microwave Module Wire Bonding Technology 360 Han Zongjie.Hu Yongfangjan Wei.Li Xiaoxuan

10 C-268 Research on Factors Influencing the Board Level Product Quality 363 Wang Yuming, Zhao Zhenyu, Chuan Chen, Zou Guisheng, Cai Jian, Wang Qian, Wu Liang, Dong Chun, Bai Han C-270 Characterization of Thermal and Curing Behaviors of Epoxy Molding Compounds 369 SHEN Huiqiang, QINFei, XIA Gitofeng, BIE Xiaorui C-283 Influence of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives 373 NanaXiong, ZhilingLi, Jingze Li.Hui Xie, Yuehui Wang C-293 An Advanced Constitutive Model for SnPb and SnAg Solder Materials378 XuHe, YaoYao C-304 Large-scale production of oxidation-resistant core-shell nanoparticles for dielectric applications 384 Gang Li, Shuhui Yu, Rong Sun C-307 Preparation and evaluation of embedded capacitors with high permittivity BT/ER composites by graft modified method 388 Maobai Lai, Shuhui Yu, Wenhu Yang, Rong Sun C-313 Investigating the rheological and thermomechanical properties of SiCVepoxy nanocomposites: probing the role of silane coupling agent.391 Gang Li, Pengli Zhu, liang.huang, Tao Zhao, Rong Sun, Daoqiang (Daniel) Lu. C-319 Solder Joint Reliability with Various Silver Finish on PCB 396 Liu Hai, Jin Li, Gu Liqun, Li Juanjuan, Li Ying, Chen Qiang, Du Maouha, Zhou Jianwei, Chang TaeSub C-335 Research on Reliability of Sn-l.0Ag-0.5Cu Low-Ag Lead-free Solder Alloy 401 YatingHu, BingAn, Rong Chen, Weiwen Lv, Yiping Wu C-351 Surface treatments of hexagonal boron nitride for thermal conductive epoxy composites 405 Tianke Qi, Yan Li, Yuanrong Cheng, Fei Xiao C-377 Magnetic Deposition of Ni/Au Coated Polymer Core Particles for Flip-chip Interconnection 409

11 Jimlei Tao, David Whalley, Changqing Liu C-383 Sulfur-containing compound in epoxy molding compound 414 Xingming Cheng, Hongjie Liu, Wei Tan, Chi Qiu, Lanxia Li, Jianglong Han C-396 Study of Metal Mask Assisted TSV Bottom the Dielectric Layer Etching Process 418 Fengwei Dai, Zhongcai Niu, Wenqi Zhang C-397 Packaging of Graphite/Epoxy Composite Film as Electric Heating Devices 422 Chang Li, Xingsong Su, Yitao Xu, Shiguo Chen, Xianzhu Fa, Rong Sun.Chingping Wong C-401 The reversible transformation between Cu2(In,Sn) and Cu(In,Sn)2 compounds during solid-state aging 425 Zhi-Quan Liu, Fei-Fei Tian C-404 Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects.429 Mingliang Huang, Fan Yang, Ning Zhao, Xiaohua Liu, Jingyun Wang C-405 Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 433 Mingliang Huang, Zhijie Zhang, Ning Zhao, Xiaofei Feng C-413 Spray Coating Process with Polymer Material for Insulation in CIS-TSV Wafer-Level-Packaging 437 Yuechen Zhuang, Daquan Yu, Fengwei Dai, Guoping Zhang, Jun Fan C-414 Influences of Material and Structural Factors on the Stress Conditions in Cu/low-k Chips during Cu Wire Bonding 441 Xiaoyi Bai, Baohua Chang, Dong Du C-421 The effect of low-melting point alloy re-melting process on the quality of mixed BGA joint and its reliability 447 Hongqin Wang, Zhonghua Wan, Daojun Luo, Zilian Liu. C-435 Applications of Low Temperature Sintering Technology as Die Attach for High Temperature Power Modules 452 Yibo Wu, Yimin Zhao, Yangang Wang, Steve Jones, Xiaoping Dai, Guoyou Liu C-437 Development of Aluminum Compatible Photoresist Stripper for High Density Pillar Bump Technology 458 Libhert Peng, Bing Liu, Jianghua Liu, Justan Sun

12 C-443 High dielectric performance of polymer composites based on BaTi03-supporting Ag hybrid fillers 462 Fang Fang, Sitibin Luo, Shuhui Yu, Rong Sun C-449 Study of the return loss performance of an improved TSVs structure Zuo Guoyi, Miao Min, Li Zhensong C-452 A Kind of Novel Silicon-, Phosphorus-Containing Hybrid Material and Its Use as the Modifier of DGEBA Epoxy Resins 470 Hu Chaohui.Zhou Lina C-454 Research on tensile property and creep resistance of electroplating nickel reinforced by AI2O3 nanoparticles 476 Chunjin Hang, Yanhong Tian, Chunqing Wang, Hong Wang C-468 Development and characterization of graphene-enhanced thermal conductive adhesives 480 Marcello Casa.Shirong Huang.Paolo Ciambelli.Nan Wang.Lilei Yejohan Liu C-471 Effect of CuO on laser absorption in glass to glass laser bonding 484 Kui Fu, Yi Li, Luqiao Yin, Jianhua Zhang C-486 Rapid Formation of Cu-Sn Intermetallic Compounds by Strong Electric Current 489 Baolei Liu, Yanhong Tian, Shang Wang, Rui Zhang, Dong, Chunqing Wang Xin Zhao, Chenglong C-492 Study on the Preparation of Aluminum Nitride with High Thermal Conductivity 493 Zhao Dongliang, Gao ling Session D Packaging Design & Modeling D-002 Solder Joint Fatigue Life Prediction in Large Sizeand Low Cost Wafer- Level 496 ChipScale Packages Ming-Che Hsieh, Su-LanTzeng D-003 Design and Stress Analysis for Fine Pitch Flip ChipPackages with Copper Column Interconnects 502 Ming-Che Hsieh, Su-LanTzeng D-005 Simulation on heat transfer of microchannels andthermal vias for high

13 power electronic packages 508 Lan-Ying Zhang, Yang-Fei Zhang D-007 Vibration analysis of nanomechanical mass sensor based on circular graphene sheets 511 Xionghui Gong, Shengwei Jiang, Xuefang Wang, Sheng Liu,Shuo Wang D-008 Finite element analysis of graphene resonator tuned by pressure difference 516 Xionghui Gong, Shengwei Jiang, Xuefang Wang, Sheng Liu, Shuo Wang D O 16 Impact Influence of BGA Chip's Layout on Solder BallsFatigue Life Tian Wenchao, Guan Rongcheng D-017 Impact Anti-vibration Structure Analysis and Optimizing onbga Packaging Module 524 Tian Wenchao, Guan Rongcheng D-018 Low Effect and Experiment of Screw Locations on BGAViscoplastic Fatigue Life 529 Tian Wenchao, Guan Rongcheng D-030 Fatigue LifePrediction for CBGA under Random Vibration Loading by Finite Element Method 535 Shang Wang, YanhongTian, XuguangGuo D-031 Analysis of the Influence of SOP Lead Shape on Solder Joint Reliability Ren Chao, Zeng Chenhui, Shao Jiang, XueHeping, Xu Wenzheng D-033 Modeling and Analysis of Wearable Low-Cost MEMS Inertial Measurement Units 542 Xuebing Yuan, Shuai Yu, Shengzhi Zhang, Chaojun Liu D-039 Electrical Performance Analysis and StructureOptimization for QFP-48 Sockets 547 Sun Ling, Wang Xuemin, Sun Haiyan, Wang shenglong, Yang Lingling D-048 Modeling and Comparison of Different Edge Radiation Suppression Methods in Printed Circuit Boards 551 Hua-YunXu, Mu-Shui Zhang, Hong-Zhou Tan D-049 Electrical Simulation of Thin Film Inductors on Silicon and Glass Substrates 555

14 Zheng Qin, Cheng Pang, Xiaoli Ren, Wenya Shang, DongkaiShangguan, Daqnan Yu D-050 A Comparative Investigation on Power Noise Suppression Methods between Two Blocks in Printed Circuit Boards 560 Yu Zou, MuShui Zhang, HongZhou Tan D-052 Modeling, Simulation and Analysis of Coplanar Waveguide on Glass Substrate for 2.5D Integration 564 Zheng Qin, Cheng Pang, Xiaoli Ren, Wenya Shang, Dongkai Shangguan, Daquan Yu D-060 High Bandwidth Application on 2.5D IC Silicon Interposer 568 Chen-Chao Wang, Hung-Hsiang Cheng, Ming-Feng Chung, Po-Chih Pan, Cheng-Yu Ho, Chi-Tsung Chiu,Chih-Pin Hung D-061 Utilizing Plating Bar Structure to Enhance Passive Equalizer Compensation Technique 573 Chen-Chao Wang, Hung-Chun Kuo, Fu-Chen Chu, You-Le Lin, Tsai-Yun Hsieh, Chi-Tsung Chiu, Chih-Pin Hung, Sheng-Hua Huang, Chih-Wen Kuo D-084 Influence of Compliant Layer Thickness on Stress and Strain of Solder Joints in Wafer Level Chip Scale Package under Thermal Cycle 577 Liang Ying, Li Tianming D-086 A Novel Method for IR-Drop Reduction in High-Performance Printed Circuit Boards 583 Xiangmeng Jing, Yue-Hui Huang, Mu-shuizhang, Hong-zhou Tan D-102 Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects 587 Hong-Bo Qin, Wu Yue, Chang-Bo Ke, Min-Bo Zhou, Xin-Ping Zhang, Bin Li D-115 Effect of Defects on Thermal Conductivity ofgraphene 592 Kai Tang, Fulong Zhu, Ying Li,KeDuan, Sheng Liu, Yanming Chen D-120 Studies on Thermally Strain Relieving Behaviorof Ring Configurationsfor a Packaged SAW Device Chip 596 DeyangYan, WeiXu, Lei Chen, Cheng Zhao, Yao Liang, Liwang Jiang D-121 A New Interconnection/Transition MethodUsing Bumping-bridge Structurefor 1-level Package of RF MEMS Devices 599 Lei Chen, Wei Xu, Deyang Yan, Cheng Zhao, Yi Wang, Yue Sun D-127 A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten

15 Sn-based Solder 602 Anil Kimwar, Haitao Majunhao Sun, Lin Qu, Shuang Li, Jiahui Liu D-139 A new designed trench structure to reduce the wafer warpage in wafer level packaging process 606 Chunsheng Zhu, Heng Lee, Jiaotuo Ye, Gaowei Xu, Le Luo, Chunsheng Zhu, Heng Lee, Jiaotuo Ye D-146 Determination of Solder/Culnterfacial Cohesive Zone Model Parameters by Inverse Analysis 610 Guohui Jin, Pengwei Wu, Yangjian Xu, Lihua Liang, Xiaogui Wang D-147 Electrical Characterization and Analysis on the Via-Solder Ball Structure 615 Yi He, Jun Li, Fengman Liu, Peng Wu, Liqiang Cao D-153 Modeling the Bottom-Up Filling of Through Silicon Vias with Different Additives 618 Zuyang Wang, Wei Luo, Liming Gao, Ming Li D-164 Thermal Performance Investigation of Three-dimensional Structure Unit in Double-sided Cooling IGBT Module 622 Chunlei Wang, Libing Zheng, Li Han, Huachao Fang, Ju Xu D-165 Packaging and process optimization for Three-dimensional structure unit of Double-sided cooling IGBT module 626 Chunlei Wang, Libing Zheng, Li Han, Huachao Fang, Ju Xu D-169 Electromigration Reliability Evaluation in FCBGA Package Based on Orthogonal Experimental Design 630 Yuanxiang Zhang.Lihua Liang.Richard Rao D-173 Thermal Effect on Performance of Micromachined Hemispherical Gyroscope 637 Weihui Wang, Zhang Luo, Ming Wen, Qiang Dan.Sheng Liu D-174 Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects 641 Shui-Bao Liang, Chang-Bo Ke, Wen-Jing Ma, Min-Bo Zhou, Xin-Ping Zhang D-175 Effects of Bubbles in Coating Gel on ThePerformance of MEMS Pressure Sensor 646 Qiang Dan, Fanliang Li,Sheng Liu

16 D-188 Study of Response Time ofa Micro Flow Sensor 651 Xing Guo, ChunlinXu, Qiang Dan, Shengzhi Zhang.Sheng Liu D-194 Modeling and Simulation of Self-heating Effect with Temperature Difference Air Flow Sensor 655 Chunlin Xu, Xing Guo, Hao Jiang, Zhefeng Zhang.Sheng Liu D-197 Simulation of Effects of Package Parasitics on Modulation Characteristics of Semiconductor Lasers 660 Yongyong Lu, Sheng Hu, Yonglin Yu D-203 Effects of Residual Stress in the Membrane on the Performance of Surface Micromachining Silicon Nitride Pressure Sensor 664 Hao Jiang, Gang Cao, Chunlin Xu, Zefeng Zhang.Sheng Liu D-216 Study on the effect of the phosphor distribution on the phosphor layer temperature in light emitting diodes by lattice Boltzmann method 671 Lan Li, Chao Yuan, Run Hu, Huai Zheng, Xiaobing Luo D-228 A new fast moisture sensitivity analysis method usingequal moisture distribution simulation 676 Xiaosong Ma D-229 Simulation Analysis of Jet Dispenser Based onpiezoelectric Actuators..680 Yajie Wen, Guiling Deng, Can Zhou D-230 Study on Temperature Field of Fluid Jet-dispenser Based on Two Piezoelectric Stacks 684 ZhichaoGu, GuilingDeng, Can Zhou D-271 Interfacial stress analysis in TSVs by considering the sidewall scallop..688 WU Wei, QINFei, LI Wei,SHI Ge D-275 Numerical simulation of the intermetallic compound cracking in solder joint 693 ANTong, QINFei D-282 Homogenization Schemes for TSV Interposer Packages BIEXiaorui, QINFei, SHENYing, CHEN Si D-284 Numerical Analysis on MUF Process for Flip Chip Packaging 703 Xiyun Cheng, Qian Wang, Lin Tan, Guanhua Li, Yu Chen, Jian Cai D-297 Thermal Analysis of 2.5-D Package Designs With Joule heating Effect

17 along TSVs 711 H. Y. Zhang D-299 Investigation of warpage induced reliability of a system in package in assembly process 718 Qiuxiao Qian, Yong Liu D-314 Study on the board-level drop test of the stacked memory device by FEA Junwen Pang, Jim Wang.Liyou Zhao D-318 The investigation of board-level vibration for the stacked memory device. 728 Xiao Li, Jun Wang.Liyou Zhao D-325 The Optimization of Thermal Performance in Power Electronics Modules 734 Paul Evans, Alberto Castellazzi, C Mark Johnson,Hua Lu, Chris Bailey D-334 Stress modeling for the impacts of flip chip process on the ultralow-k chips 740 Lin Lin, Jun Wang,Chen Yang D-337 Modeling and Characterization of Joule Heating in Metal Core of TSV 745 Yong-Sheng Li,Xing-Chang Wei, Er-Ping Li D-338 The Use of Buried Technologyln Microsystem Packaging AchievesThe New Type of Electronic Band Gap 749 Wang liuping, ShangGuanDong kai, Cao liqiang, Liu Yuan D-341 Electromagnetic Noise Coupling Analysis of TSV Array by using Cylindrical Mode Expansion Method 753 Jim Li.Hui-Chun Yu, Xing-Yun Luo,Xing-Chang Wei, Er-Ping Li D-343 A flexible module design with LED chips based on the PET-copper foils Yim Chao Chen, Miao Cai, Hong Liang Jia, D.G. Yang D-346 Low silver lead-free solder joint reliability of VFBGA packages under board level drop test at-45 C 762 XiaoyanNiu, Zhanhiao Zhang, Guixiang Wang, Xuefeng Shu

18 D-352 Heat transfer of gas-water two-phase flow in microgap 766 Zhihui Wen, Zhipeng Zhou, Jiancheng Shen, Jinsong Zhang D-358 Light Extraction Analysis of High-power LED based on Flip Chip Technology 771 He Liynn, Ye Lezhi D-363 Thermal analysis for COB based on glass substrate 775 Xin Chen, Yiping Wit D-415 Harmonic Vibration Analysis and S-N Curve Estimate of PBGA Mixed Solder Joints 778 Lu Tao, Zhou Bin, Pan Kailin, En Yunfei, Gong Yubin D-420 Modeling and analysis of TSV noise coupling and suppression methods for 20nm node and beyond 783 Runiu FANG, Xin SUN, Yufeng JIN,Min MlAO D-446 Study of Ground-Signal-Ground TSV in terms of Transmission Performance 788 Li Qinghai, Miao Min, Li Zhensong D-447 Study on Encapsulation Reliability 792 Peng DING, RenhuiLIU, Yu CHEN, Guanqiang SONG, Guanhua LI D-461 Fine Pitch BGA Device Solder Bridging Mechanismlnvestigation Through Solder Shape Modeling 796 Xiaoqing Li, Yuchuan Wang, Jianwei Zhou, Tae Sub Chang D-462 Experimental and Numerical Study of MoistureEffect onwarpage of Plastic 801 Package Yinglei Chen, Maohua Du, Jianwei Zhou, Tae Sub Chang D-469 Study on the influencing factors of thermal spreading resistance of HP-LED package 806 Jinlong Zhang, Luqiao Yin, Peng Song, Yang Bai, Jianhua Zhang D-489 Microwave Multichip Module TridimensionalAssembly Technology Based on LTCC 811 T. Zhang D-491 A Novel High Performance 40GHz Hermetic SMTCeramic Package for Microwave Applications 815 QiaoZhizhuang, Gao Ling, Liu Linjie

19 Session E Inter-connection technologies E-072 Electroless Ni-P-Zr02 metallization for lead-free solder interconnection Xiao HU, Y.C.CHAN E-315 Back Drilling in High-Speed Interconnect System 825 Xu Wang, Weidong Ding E-385 Simulation Study of a Novel TSV Structure 829 Zhensong Li, Min Miao, Qinghai Li, Dacheng Yang E-460 Signal Integrity Analysis of a High-Performance Processor Package with Silicon Interposer 833 Kecheng Li, Xiaogang Liu, Mingxiang Chen, Sheng Liu E-495 Power QFN Tiger Device Down Bond Bond-ability Study 838 Hanmin Zhang, M. Hu, B.G Yin, Q.CHe, D.H Ye, Sonder Wang Session F - Advanced Manufacturing & Packaging Equipment F-013 Experimental Estimation of Adhesive Fracture Energy of Compliant Adhesive Tape 842 Zunxu Liu, Pengpeng Tang, YongAn Huang, Zhouping Yin F-076 The Reliability of High-lead Solder Joints in Flip-Chip Devices 847 Lingjuan Tian, Yuanfu Zhao, Quanbin Yao, Yusheng Cao, Binhao Lian F-078 The influence of the solder joint void on the CCGA package reliability 850 Yingzhuo Huang.Binhao Lian, Quanbin Yao, Xiaorui Lv, Pengrong Lin F-187 Reliability Study of the Solder Joints in CCGA Package during Thermal Test 854 Xiaorui Lv, Yingzhuo Huang, Pengrong Lin, Xueming Jiang, Binhao Lian, Quanbin Yao F-220 Defect Inspection of Copper Bonding Using Ultrasound 858

20 Lei Su, Tielin Shi, Li Du, Pengfei Chen, Guanglan Liao, Xiangning Lu F-236 Reactive ion etching characteristics of partially-cured benzocyclobutene Yang Yang, Zhen Song, Ynxin Du, Zheyao Wang F-279 Residual stress measurement of the ground wafer by Raman Spectroscopy 867 SUNJinglong, QIN Fei, REN Chao, WANG Zhongkang, TANG Liang F-281 Subsurface Damage Distribution of Ground Silicon Wafers 871 YANDebao, QIN Fei, SUNJinglong, WANG Zhongkang, TANG Liang F-349 Modeling and simulation of silicon wafer backside grinding process 874 Zhaoqiang Li, Xiangmeng Jing, Feng Jiang, Wenqi Zhang F-384 Strain field simulation of transferring process on large wafers 878 Tang Liang, Ye Lezhi F-407 A Novel Modeling of TSV MOS Capacitance by Finite Difference Method 881 Shuai Yu, Chaojun Liu, Shengzhi Zhang, Xuebing Yuan, Qiang Dan, Sheng Liu F-488 Diamond sawing process of 12 inch low-k silicon wafer applied in smart card 885 Xiangfei Kong, Xiulei Wang, Caifeng Wu Session G Quality & Reliability G-014 Mechanical Properties and Microstructure of Sn-Based Solder Joints at Cryogenic Temperature 888 Xue Du, Yanhong Tian, Xin Zhao G-022 Tensile testing and microstructure analysis on Sn-Pb-Cd and Sn-Pb eutectic solder 893 Y. Ding, G. D. Wu, X. L. Wang, G. S. Yan, C.J. Hang G-026 Effects of Electromigration on the Creep of SnO.3AgO.7Cu Solder Joint 898

21 Yong Zuo, Limin Ma, Fu Guo, Lei Qiao, Yutian Shu, Jing Han G-027 Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing 902 Lei Qiao, Yong Zuo, Limin Ma, Yutian Shu, Fu Guo G-034 Study of microstructure evolution and temperature distribution in eutectic SnBi solder joints under high current density 907 Qian Liu, Yutian Shu, Limin Ma, Fu Guo G-038 Reliability analysis of power MOSFET 912 Peisheng Liu, Jinxin Huang, Ying Lu, Longlong Yang G-045 Optimization of Lead-free Wave Soldering Process for Inverter Air-conditioner Motherboard by DOE 917 Xiaojian Liu, Ling Wang G-046 Study of Key Failure Modes of PTH in High Density Printed Board and Case Study Yao Bin, Chen Hui, Lu Yudong, Luo Daojun G-051 Reliability evaluation on high power light emitting diodes 928 Lu Guoguang, Hao Mingming, Huang Yun, Zhang Hongqi 923 G-063 The Simulation Analysis for the Correlation between Failure of BGA Solder Joints and the Loading Modes 933 Wang Lifeng, He Bing, Yu Yangyang G-064 The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 937 Shuang Li, Yao Du, Lin Qu, Anil Kunwar, Junhao Sun, Jiahui Liu, Ning Zhao, Mingliang Huang, Haitao Ma G-065 Investigate influence of solder thickness on the fatigue failure behavior of solder joint under high temperature 940 Yongxin Zhu, Xiaoyan Li, Ruiting Gao, Chao Wang G-067 Effect of Ar Reflow Atmosphere on the SAC305 Solder Joint Reliability Ting Li, Dongyan Ding, Yeqing Tao, Jason Guo, Ting He, Yunhong Yu G-069 The study of interficial reaction during rapidly solidified lead-free solder Sn3.5AgO.7Cu/Cu laser soldering 949 Jiahui Liu, Haitao Ma, Shuang Li, Junhao Sun, Anil Kunwar, Wang Miao,

22 Jianjie Hao, Yanpeng Bao G-082 A Framework to Test Reliability and Security of Wi-Fi Device 953 Dong Wang, Ming Zhou G-087 Comparative Study on the Reliability of QFN and AAQFN Packages Jia Xi, Fei Xiao, Hu Wang G-088 Temperature Cycling and Drop Reliability of a 3D System-in-Package Device 963 Jia Xi, Kim Lin, Fei Xiao, Xiaofeng Sun G-090 Numerical simulation and analysis on thermal coupling effect of MCM packaging 967 WANG Kaikim, GAO Qi, GE Zhipeng G-091 Study of the Thermal Field and Thermal Stress Field of Typical BGA Packaging by Numerical Simulation 971 GAOQi, WANG Kaikim G-095 In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 976 Junhao Sun, Yao Du, Anil Kunwar, Lin Qu, Shuang Li, Jiahui Liu, Binfeng Guo, H.T. Ma G-109 Formation of single phase Cu-Sn IMCs via layer-by-layer electroplating ofcu and Sn metals 980 Rong An, Huiwen Ma, Hailong Li, Zhen Zheng, Chunqing Wang G-113 Parallel-gap resistance welding between gold-plated silver interconnects and silver electrodes in germanium solar cells 985 Rong An, DiXu, Chunqing Wang G-117 Effect of Temperature Cycling on Reliability of Flip Chip Solder Joint 989 Xueming Jiang, Pengrong Lin, Yuezhong Song, Yingzhuo Huang, Binhao Lian, Quanbin Yao G-132 Analysis of laser typing spots at gold-plated kovar alloy cavity 992 Yuwei Zheng, Shengxiang Bao, Zhenzhen Rao, Chengshi Zhang, Yao Yan G-133 Effect of magnetism of specimen on energy spectrum analysis 996 Yan Yao, Shengxiang Bao, Zheng Yuwei

23 G-134 Failure analysis of the Winding inductor caused by hot dip coating tin 1001 Yuwei Zheng, Shengxiang Bao, Zhenzhen Rao, Chengshi Zhang, Yao Yan G-135 Effect of Interfacial Reaction on Tin Whisker Formation of Sn/Ni Films Deposited on Copper Lead-frame 1005 Ting Liu, Dongyan Ding, Yu Hu, Yihua Gong G-137 Failure Analysis of Sm2Col7 Type Permanent Magnet for High 1010 Temperature Yan Yao, Shengxiang Bao, Zhang Xiaowen, Wang Zuwen, Shen Anguo, Zhang Ming G-141 A Simulation of Intelligent Power Module Under Power Cycling Condition 1015 Yong Wang, Wen Zhao, Ming Li, Ming Chen G-142 Effect of Al-0.5%Cu thin fdm on reliability of IGBT module 1021 Wen Zhao, Yong Wang, Ming Li, Liming Gao G-143 Reliability of 1206 capacitor/sac305 solder joint reflowed in protective atmosphere 1026 Yeqing Tao, Dongyan Ding, Ting Li, Jason Guo, Ted He, Yunhong Yu G-152 The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints 1030 Wangyun Li, Hongbo Qin, Minbo Zhou, Xinping Zhang G-154 Effect of Cu/Al Substrate Thickness on the Deformation and Fatigue Life of Bumps Array 1035 Shijie Chen, Fengshun Wu, Weisheng Xia, Hui Liu, Ming Xiao, Lin Huang G-158 Effect of Micro-Channel on Warpage and Residual Stress Due to Reflow Process in IGBT Modules 1040 Yang Zhou, LingXu, Zefeng Zhang, Sheng Liu G-162 Modeling of the coelescence of micro-voids under the influence of elastic stresses and electromigration 1047 Peng Zhou, Jie Wang G-167 The study of different transmission lines in high speed optical module 1052 Huimin He, Baoxia Li, Yu Sun

24 induced G-176 Morphology, Kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface 1056 Zhihao Zhang, Huijun Cao, YongXiao, Mingyu Li G-183 Digital Image Distortion and Proofreading Technology in Micro Focal Spot X-ray Inspection 1060 Weiwen Lv, BingAn, Yiping Wu G-193 Effect of Heat Sink on Electromigration Lifetime of Ni Thin Film 1063 Lin Huang, Shijie Chen, Fengshun Wu, Weisheng Xia, Hid Liu, Yanjun Xu G-221 Is thermal management outside the package enough for higher LED reliability? 1068 Qi Chen, Quan Chen, Run Hu, Xiaobing Luo G-234 Electromigration - failure mechanism and lifetime prediction in NiCuThin Film 1071 Yanjun Xu, Lin Huang, Guang Chen, Fengshun Wu, Weisheng Xia, Hid Liu G-237 Warpage and Stress Optimization of Wafer-level Package of MEMS with Glass Frit Bonding 1075 Gaowei Xu, Chunsheng Zhu, Jiaotuo Ye, Heng Li, Wei Gai, Le Luo G-242 Reliability of Au-Si eutectic bonding 1080 Tianxiang Ye, Zhen Song, Yuxin Du, Zheyao Wang G-249 Reliability of BGA Assembled with Lead-Free Low Melting and Medium Melting Mixed Solder Alloys 1083 Yan Liu, Joanna Keck, Erin Page, Ning-Cheng Lee G-256 Acceleration of the growth of tin whisker by thermal aging and external tension 1096 Z.X.Yao, L.M.Yin, Y.H.Lu, W.gang, Z.GChen, Z.X.Yao G-260 The effect of coating thickness and external force on the growth of tin whisker 1100 Z.X. Yao, L.M.Yin, L.P. Zhang, J. Zhou, Z.X. Yao G-262 Mechanistic study of Failed SnPb/Cu-Fe-P Solder Joints in Power MOSFET 1104 Lihua Cao, Zhi-Quan Liu, Yongliang Zhang, Cui Zhang, Renzhe Zhao G-263 Research of parallel scheduling strategy for hierarchical SiP test using IEEE 1500 standard 1108

25 Xiongbo Zhao, Penglong Jiang, Liangliang Liu G-265 Data analysis method of the small samples and zero-failure data for space TWT accelerated life test 1112 Fangfang Song, Zhenwei Zhou, Shajin Li, Yunfei En, Bin Li G-272 EFFECT of N-WELL for SINGLE EVENT UPSET in 65 NM CMOS TRIPLE-WELL TECHNOLOGY in 6T SRAM CELLS 1116 Jian Wang, Lei Li G-274 Study of Tin Whisker Growth Accelerated by Rare Earth Phase and the Mechanism of Tin Whisker Growth 1120 Yan Yao, Shengxiang Bao, Zheng Yuwei G-316 Measurement and analysis of low-frequency noise in large capacity high voltage aluminum electrolytic capacitors 1127 Wu Yong, Ma Zhongfa, Du Lei, He Liang G-320 Experimental and Finite Elemental Investigations on Residual Stress of TSV 1133 Fei Su, Tianbao Lan, Yunhui Zhu, Jing Chen G-327 Thermo-mechanical Reliability of 3D package under different thermal cycling 1138 Tianbao Lan, Fei Su G-330 Effect of Package Thermal Warpage for POP Assembling Technique 1142 Yabing Zou, Yabing Zou G-332 Contact Resistance Investigation of Electrical Connector with Different Shrink Range 1146 Ke Duan, Fulong Zhu, Ying Li, Kai Tang, Sheng Liu, Yanming Chen G-354 Molecular modeling of the conductivity of carbon nanotubes under different temperature and humidity 1150 Ning Yang, Xianping Chen, Miao Cai, Daoguo Yang, Guoqi Zhang G-357 The Morphology Change of SnAgCu Solder Under Current Stressing 1155 Zheng Zhang, Yuan Wang, Fei Su G-360 De-embedding Research in Cold Test of Output Window of Gyro-TWT (Gyro Traveling Wave Tube) 1159 Qian Liu, Li Wang, Ran Yan

26 G-365 Different diffusion behavior of Cu> Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during Liquid-Solid electro migration 1164 Q. Zhou, Y. Zhou, X. Qin, X.J. Wang, M.L. Huang G-372 Investigation on Reliability and Failure Analysis of Plastic Encapsulated Microelectronics 1169 Huiwei Wu, Shengzong He, Liyuan Liu, Xianjun Kuang, Dengyun Lei, Haijun Li G-376 Effect of Pb content on shear performance of SnAgCu-xSnPb/Cu Mixed solder joint 1173 Wangxin, Li Xunping, Pan Kailin, Zhou bin, Jiang Tingbiao G-398 Characterization of After-Reflow Misalignment on Head-in-Pillow Defect in BGA Assembly 1177 Chuan Chen, Jian Cai, Qian Wang, Yuming Wang, Guisheng Zou, Zhengyu Zhao, Chang Yong Park G-399 Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces 1181 Ming Yang, Mingyu Li, Jianxin Wu, JinhuaXu G-400 Research on Mobility Variance Caused by TSVInduced Mechanical Stress in 3D-IC 1186 Yangyang Zhao, Hailong You, Ran Cui, Yu Zhang, Xinzhang Jia G-406 Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects 1190 Mingliang Huang, Fei Zhang, Fan Yang, Ning Zhao G-428 Typical Failure Mechanism of LED Package 1194 Guangning Xu, Zeya Peng, Huanxiang Xu, Xianjun, Lei Zhang G-432 Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module 1198 Hongyu Tang, Yong Yu, Min Jia, Stanley Y. Y. Leung, Cheng Qian, Cadmus C. A. Yuan, Xiang Zhou, G. Q. Zhang G-433 A novel design of heatsink-less LED base fluorescent lamp retrofit 1202 Jia Zhao, Yan Liu, Hongyu Tang, Stanley Y Y Leung, Cadmus C A Yuan, Zhang G Q G-445 Research of surface wettability of plating on the ceramic shell 1208 Dongmei Li, Xiaocheng Feng, Jinchun He, Binhao Lian, Yong Wang

27 G-456 Study on Fracture Mechanism of the Aged Sn2.5Ag0.7Cu0.1RE/Cu Soldering Joint with External Energy 1212 Xingdong Guo, Keke Zhang G-458 Physics-of-failure-based prognostics and health management for electronic products 1215 Decai Yang G-470 Electrothermal-coupled simulation of electrodes with flip-chip LEDs.1219 Peng Song, Luqiao Yin, Wen Git, Jinlong Zhang, Jianhna Zhang G-475 Failure Analysis For IC Plastic And Substrate/Leadframe Package Gongchang Zhang, Jianqiang Li, Yanning Chen, Renqing Wang, Miaomiao Yang G-479 Effects of Resin Thickness on the Stress Intensity Factors of Edge-cracked Adhesive Joints 1229 Xin Lan, Nao-Aki NODA G-480 Microstructure and Properties of Sn2.5Ag0.7Cu0.1RE Lead- Free Soldering Joints with ultrasonic Assisted 1233 Yu-jie Liu, Ke-ke Zhang, Xiao-jiao Zhang, Kai Zhao, Ran-feng Qiu, Hong-xin Shi Session H Microwave and Power electronics Packaging H-058 A Band-Notched UWB Slot Antenna with High Skirt Selectivity and Controllable Bandwidth 1237 Chao Wang, Xubo Wei, Bo Ding, Mingxia Zhang,Dan Wang, Zetao He, Yu Shi H-070 Miniaturized CQ Bandpass Filter with Mixed Coupling 1241 Zetao He, Yu Shi, Xubo Wei H-097 Compact CPW-fed tri-band stepped monopole antenna with inverted-l strip for WLANAViMAX applications 1244 Yuanfu Liu, Peng Wang, Hao Qin H-099 Compact Dual-Band Bandpass Filter Using Combined CRLH Resonator And Right-Handed Open Stubs Loaded Resonator 1248 Long Chen, Yonglun Luo, Xiaolei Ma H-l 14 A Compact Printed Filtering Antenna With Flat Gain Using Annular Slot

28 And UIR 1252 Bo Ding, Xubo Wei, Chao Wang, Mingxia Zhang, Zetao He, Yu Shi H-166 A compact tri-band monopole antenna with asymmetric CPW grounds for WLAN/WiMAX applications 1256 Hao Qin, Peng Wang, Yuanfu Liu H-172 Circuit Modeling and Structure Optimization of Integrated Passive Inductors 1260 Jie Pan, Huijuan Wang, Delong Qiu, Xiaoli Ren, Yuan Lu, Daquan Yu, Dongkai Shangguan H-285 Design of wide stopband bandpass filter using composite right/left handed transimission line 1265 Pu-chao wu H-286 A novel Absorption Band-pass Filter with Compact Structure and Wide Relative Bandwidth 1270 Wei-wei Qin, An-gang Shu H-295 Compact UWB Signal Interference Filter Using Interdigital Coupled Lines 1275 Y Zhang, YL Luo, Z YXin H-303 A Highly Linear Short-wave Broadband Doublebalanced Mixer 1278 Hongjun Ying, Yu Shi, Qingfu Yang H-308 Development of Circularly Polarized Antennas Based on Dual-mode Hexagonal SIW Cavity 1283 Gen Zhang, Ziqiang Xu H-317 A Highly Linear Short-wave UltrawidebandBalanced Amplifier 1287 Gaogan Yu, Yu Shi, Huayi Zheng H-322 Microstructures and Properties of Alumina/Copper Joints Fabricated by Ultrasonic-Assisted Brazing for Replacing DBC in Power Electronics Packaging 1291 Hongjun Ji, Hao Chen, Mingyu Li H-326 A band-notched UWB antenna with good shape factor 1295 Nie Fan, Jin Long H-328 Compact Dual-band Bandpass Filter Using Stepped Impedance Resonators 1299

29 Xubo Wei, Bo Ding, Gnotao Yue.Chao Wang, Zetao He, Yu Shi H-350 A simple Ultra-Wideband filter with Notch band using SIR and Three parallel lines 1302 Sit Song Yang, Ran Liu, Zhi li Li, Peng Zhou H-356 MICROSTRUCTURE AND MAGNETIC PROPERTIES OF COSN-DOPED MTYPE BARIUM FERRITE WITH LOW TEMPERATURE SINTERING FOR LTCC APPLICATION 1305 Wang Yu, Zhang Huaiwit, Wang Yue, Yang Kai, Yingli Liu H-359 Novel Design of A Compact Band-pass Filter With Two Finite Transmission Zeros Using LTCC Technology 1308 Zhiyu Zhao, Yingli Liu, Kai Yang, Lei Shi, Liyun Gan H-364 A HIGH-EFFICIENCY CLASS-F POWER AMPLIFIER USING DOUBLE CRLH-TL FOR LTE APPLICATION 1312 Xian-ping Xiong, Chen Yong-Lun Luo, Yun Zhang, Xiao-Lei Ma, Pu-chao Wu, Long H-373 DESIGN OF COMPACT BANDPASS FILTER WITH ENHANCED STOPBAND CHARACTERISTICS 1316 MingxiaZhang, ShuanglinYuan, XuboWei, DanWang H-374 A PIN Diode Controlled Variable Attenuator On Rectangular Waveguide In Millimeter Wave Band 1320 Liu Chen, Cheng Chen, Xin Wang H-375 A Novel Waveguide Directional Coupler With High Directivity and Broad Bandwidth 1322 Cheng Chen, Liu Chen, Tingling Yang H-378 Study on the Magnetic Properties of Low-Fired NiCuZn Ferrite Prepared by a Combined Method 1324 Kai Yang, Yingli Liu, Zhiyu Zhao, Lei Shi H-380 Rectangular Waveguide Band-pass Filter with High Power Harmonic Suppression 1327 Peng Zhao.Xin Wang, Cheng Chen H-382 A THZ Cross-guide Waveguide Directional Coupler With High Directivity 1329 Xin Wang, Peng Zhao, Tingting Yang H-386 A LTE Doherty Power Amplifier using Envelope Tracking Technique

30 1331 Zihao Zhang, Zhenyn Xin H-387 Compact Microstrip Triple-Mode Filter Based on Stepped-Impedance Resonators 1335 Ran Liu, Li Zhi Li, Wen Shi H-388 A Novel Compacted microstrip Bandpass Filter using Stepped Impedance Resonator(SIR) and defected ground structure(dgs) 1338 Zhili Li, Wen Shi, Ye Yuan H-389 A Compact Ultra-wideband Bandpass Filter Design Based on Open Stub Loaded SIR Structure 1341 Ye Yuan, Su Song Yang, Ran Liu H-390 A Q-Band Very Broad Band On-Chip Antenna for Q-LINKPAN Applications 1344 Peng Gao, Ning Wang, Zhi Ning Chen H-391 A 60-GHz On-Chip Antenna Using Standard 0.18um CMOS technology Ning Wang, Peng Gao, Kai Kang H-392 A planar 60GHz antenna for MIMO/diversity applications 1350 Caipu Zhang, Peng Gao H-393 A Compact Microstrip Ultra-wideband Filtenna 1353 Rongda Wang, Peng Gao H-394 A Modified Broadband Hybrid-Ring Directional Coupler in W-Band 1356 Wen Shi, Ye Yuan, Su Song Yang, Bo Sheng Liang H-423 A Novel X-band Oscillator using Substrate Integrated Waveguide Resonators 1359 Jin Long, Qian Kewei H-424 A Waveguide Phase Shifter With Good Flatness and Broad Bandwidth 1362 TingtingYang,Shitou Liu,Xin Wang H-427 A Microstrip Miniaturized Triple-mode Filter 1364

31 Shitou Liu, Tingling Yang, Peng Zhao H-431 Design of A Novel L-band High Selectivity Miniaturized Planar Filter 1366 Xian-Hu Luo, Ya Gao, Kai Yang, Tian-Liang Zhang, Xiang-yang Ren H-440 Technique of multi-temperature Stepped Welding in Microwave Modules Hongyuan Luo, Chengde Cai, Haihin Li H-457 High Power RF Amplifiers Module Assembly -Issues to Consider, Design, Materials and Process 1375 Tennyson Nguty, An Xiao, Henk Thoonen H-463 A Compact 90 Waveguide Twist at Terahertz Frequency 1381 Tingting Yang, Xin Wang, Cheng Chen H-464 A Full Bandwidth H-plane Power Divider Worked in Millimeter Wave Band 1383 Peng Zhao,Shitou Liu,Liu Chen H-465 A Capacity Loaded Dual-mode Satellite Band-pass Filter 1385 Liu Chen, Cheng Chen, Shitou Liu H-466 A Compact 10 db E-Plane Waveguide Directional Coupler With FullBandwidth 1388 Xin Wang, Tingting Yang, Liu Chen H-467 A Waveguide Diplexer Based On E-Plane T-Junction 1390 Cheng Chen, Liu Chen, Peng Zhao H G to 20 G compact rectangle waveguide to circular waveguide mode convertor 1392 Shitou Liu, Peng Zhao H-484 COMPACT BANDPASS FILTER USING NOVEL STEPPED IMPEDANCE RESONATORS 1394 Dan Wang, Xubo Wei H-487 Design of miniature tri-band monopole antenna for WLAN and WiMAX applications 1397 Junyu Guo, ZiqiangXu H-490 Multilayer Dual-mode Filter Based on Substrate Integrated Hexagonal

32 Solid Cavity (SIHC) 1400 M. J. Xu, K. Chen H-493 Compact Dual-band BPF with Improved Stopband 1404 Zetao He, Yu Shi, Xnbo Wei H-494 Design and Fabrication of Integrated Waveguide Filter based on High-Resistivity Silicon 1407 Lin Du, Shi Pu H-496 Improvement of Manufacturing Process for Multilayer Substrate Integrated Waveguide Cavity 1411 ZiqiangXu, Gen Zhang, Gnangliang Cao, Gesheng Cheng H-497 A Compact Dual-band Planar Antenna for 2.4/5.5 GHZ WLAN Applications 1415 Gen Zhang, ZiqiangXu, Hao Liu, Junyu Guo, Guangliang Cao, Zhao Chen Session I State Lighting Packaging and Integration Whisker Thermal Impedance Measurements of Layered Metal Core PCB used in LED lighting 1419 Shijitan Zhang, Wen Xu, Yongtao Wang, Wenfeng Wang Application of Color Temperature Tunable LEDs in Smart Lighting System 1423 Xiu Ziren, Li Hao Warpage Analysis of DBC Substrate based on Noncontact Shadow Moire" Technology 1427 Ke Duan, Fulong Zhu, Mingxiang Chen, Ying Li, Kai Tang, Sheng Liu, Yanming Chen Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging 1431 Yun Chen, Fuliang Wang, Hanxiong Li, Xiuyang Shan Investigation of Lumen Degradation Mechanisms of Mid-power LED by HAST 1437 Jianlin Huang, Sau Koh, Xiupeng Li, Guoqi Zhang Reactive spreading and dewetting of liquid SnPb solder on Cu thin films..

33 1442 W. Liu, P. Jin, S.D. Zhang Thermal resistance analysis of high power LED module under power cycling test 1446 Hao Huang, Miao Cai, Kunmiao Tian, Yunchao Chen, Hongliang Jia, Daoguo Yang Two-step thermoelectric modeling for junctiontemperature prediction of LED lamps 1450 Kunmiao Tian, Miao Cai, Ping Zhang, Xianping Chen, Daoguo Yang Compact Thermal Model of Double-Layer MicroChannel Heat Sink with High Temperature Uniformity for Multiple LEDs 1456 Yongming Zhu, Run Hu, Jinyan Hu, Xiaobing Luo Investigation of microstructure and optical property of high power LED based on rapid thermal cycling 1464 Jibing Chen, Yanfang Yin, Jianping Ye, Bing An, Yiping Wu Inhibition of phosphor sedimentation for White Light-Emitting Diodes with a facilely realizable and economical method 1468 Xiang Lei, Huai Zhen, Xiaobing Lu, Sheng Liu Secondary optical design of LED lamps with high CRI and adjustable CCT 1472 Kerning Zeng, Yujie Li, Jin Chang, Chunjin Hang,Chunqing Wang, Kerning Zeng, Yujie Li, Jin Chang, Chunqing Wang Development of a Real-time Monitoring System with Uni-photodetector for LED Long Term Reliability Tests 1477 Grace G. ZHANG, Sophie L. Y LU, Nick G. M. YANG, Sam H. Y. ZOU, Steven D. L. ZHONG, Jeffery C C. LO, S. W. Ricky LEE Measurement of LED Junction Temperature Using Thermoreflectance Thermography 1482 J.H.L. Ling.A.A.O. Tay A Sandwich Structure of Multi-Chip COB LED with Double Flat Glass boards coated with Phosphors Film by Screen Printing Technique 1486 Cheng Lin, Baolin Liu, Cheng Lin, Xiaohong Li, Yafeng Shen, Zhenxiang Lin