4 November 2013 FOR IMMEDIATE RELEASE CONTACT: Peggy Chen Executive Administrator of SMTA China Tel: +86-21-5609-3010 Fax: +86-21-5609-3020 Email: peggychen@smta.org.cn Greetings to our Valued SMTA Speakers and Industry Colleagues In conjunction with Call for Papers 2014 for the Technology Conference The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2014. This event, held in conjunction with NEPCON China 2014, will as usual address the industry s most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability. You are invited to submit a paper to the electronic industry s premier forum on the manufacture of electronic products utilizing surface mount and related technologies. Papers are sought in the following key technology tracks: Advanced Packaging/ Components 3D Packaging and Integration BGA/CSP Biomedical Packaging Bumping Chip on Board Copper Wire Bonding Direct Chip Attach Embedded and Miniature Passives Failure Analysis Fine Lead Pitch Flip Chip
Hermetic Packaging for High Rel High Temperature Packaging Lead Finishes Leadless Pkgs (LGA/QFN/BTC) MEMS and Sensors Package on Package (PoP) Photonics Photovoltaics and Solar Reliability Through Silicon Vias (TSVs) Tin Whiskers Wafer Level Packaging (WLP) Assembly Adhesives Alternate Alloys BGA/CSP Assembly Cleaning Conformal Coating and Potting Connector Technology Copper Erosion DFX/Design for Six Sigma Dispensing Equipment Selection Facility Layout Flux and Solder Halogen and Halogen- Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Land Pattern Design Lead- Free Soldering/Reliability Lean Manufacturing Low Temperature Soldering Low Volume/Prototype Medical Electronics Placement Printing
Reflow Soldering Rework and Repair of QFNs RFID Assembly Selective Soldering Set Up Reduction Solder Paste Solder Voids Supplier Engineering Underfill and Corner Glue Vapor Phase Reflow Wave Soldering Yield Improvement Business/Supply Chain Capacity Modeling Conflict Minerals Contract Manufacturing Doing Business in Asia Environmental Issues Lean Manufacturing Operations Management Remaining Competitive RoHS/REACH Compliance Supplier Management Technology Roadmaps Emerging Technologies 0201/01005 Components/Assembly Advanced Packaging Consumer Applications Electronic Printing Technology Embedded Technology Flexible Electronics MEMS/RF MEMS/MOEMS Microsystems Packaging / Modular Microsystems Nanoelectronics Reliability of Nanodevices
New Materials and Processes Optoelectronics Printed Electronics Power or Thermal Management Sensors and Manufacturing Solar Technology Solid State Lighting System in a Package Thermal Interface Materials Wireless Applications Harsh Environment Applications Alternate Energy Components and Reliability Corrosion Lead- free Issues Substrates and Finishes Thermal Management Tin Whiskers PCB Technology Black Pad and Surface Finish Defects Creep Corrosion Embedded Passive/Active Components Halogen Free HDI Microvias (including filled/unfilled) Moisture Sensitivity High Power PCBs Soldermask Substrate Reliability Substrate Solderability Surface Finish Process Control Acoustic Imaging (C- SAM) AOI CIM
In- Circuit Test Process Modeling Software Solder Paste Inspection Test Strategies 2D/3D X- Ray SMTA China solicits technical papers for presentation in the Technology Conference. Inclusion in the Technology Conference requires strictly technical papers (complimentary presentation slot for speakers) subject to final acceptance by the Technical Advisory Committee of SMTA China. All papers including abstract and biography for inclusion in the Conference Proceedings requested in both Chinese and English. All papers (powerpoint) must be in Chinese and shall be presented in Chinese or English with translator. SMTA China East (NEPCON China) Technology Conference 35 minutes pure technical papers presented 10 minutes for answering the question 23 April 2014 If you or your company wishes to share pertinent information with the highly qualified audience of SMTA China please submit your abstract to Peggy Chen by email to peggychen@smta.org.cn Please include your name, job title, company affiliation, and all pertinent contact information as well as your choice of Technology Conference for your paper. Deadlines of Materials submission for the SMTA China East Conference: Abstract and Speaker Bio(Chinese and English) 20 January 2014 Billingual Paper and Chinese version of PPT 28 February 2014 In order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the Annual Award Presentation which will be held at the venue of vendor conference in the afternnon of 23 April in Shanghai Thank you for your support of SMTA China and we look forward to hearing from you. Contact and Enquiry: Ms. Peggy Chen, Executive Administrator of SMTA China, Tel:+86-21-5609-3010, Fax:+86-21-5609-3020, E-mail:peggychen@smta.org.cn
2013 年 11 月 4 日 尊敬的表面装贴技术协会演讲者和业内同行 同期举行于 : 为高科技技术研讨会 2014 征集论文 中国 SMTA 诚意的邀请您参加 2014 年在上海举办的 SMTA 华东高科技会议 此次会议将与第二十四届中国国际电子生产设备暨微电子工业展联合举办, 此次会议将涉及行业中最热门的话题, 包括电子组装 / 制造, 工业 / 技术路标, 商业焦点, 新兴技术, 实践技能发展, 和无铅及其可靠性 征集电子制造表面装贴技术及科技方面的论文, 论文题材涵盖以下关键技术 : 先进元件及封装 3D 封装和集成 BGA/CSP 生物封装晶圆凸块封装 COB 板上芯片封装铜线打线直接芯片附着嵌入及微型被动元件故障分析细间距引脚倒装芯片高可靠性密闭封装耐高温封装引脚表面处理无引脚封装 (LGA/QFN/BTC) 微型机电系统及传感器元件堆叠装配 (PoP) 光子学光伏及太阳能
可靠性穿透硅通孔 (TSVs) 锡须晶圆级封装 (WLP) 装配 粘胶替代合金 CSP 装配清洗敷型涂覆及注胶连接器技术铜腐蚀 DFX 和零缺陷设计点胶设备选择设施布置助焊剂与焊锡卤素与无卤头枕缺陷与翘曲感应焊点缺陷高熔点焊锡焊盘设计无铅焊接与可靠性精益制造低温焊接小批量与原型机医疗电子元件贴装锡膏印刷回流焊接 QFN 返工与维修 RFID 射频识别装配选择性焊接转换时间缩减焊锡膏焊点空洞供应商工程
底部填充及边角固定汽相焊接波峰焊接良率改善 商业及供应链 产能模型冲突矿产合同制造商亚洲商业营运环境问题精益制造营运管理保持竞争力 RoHS/REACH 符合性供应商管理技术路线图 新兴技术 0201/01005 元件及装配先进封装消费类产品应用电子印刷技术嵌入式技术柔性电子技术微型机电系统与射频微型机电系统与微型光机电系统微型系统封装与模块化微型系统封装纳米电子技术纳米装置的可靠性新材料和工艺流程光电技术印刷电子技术功率或散热管理传感器和制造太阳能技术固态照明系统级封装
热介质材料 无线应用 恶劣环境产品应用 替代能源元件与可靠性腐蚀无铅问题基材与表面处理散热管理锡须 印刷线路板技术 黑焊盘与表面处理缺陷爬行腐蚀嵌入式被动或有源元件无卤高密度集成微通孔 ( 包括填充与非填充 ) 湿度敏感高功率印刷线路板阻焊膜基材可靠性基材可焊性表面处理声学成像 (C- SAM) AOI 光学自动检查 CIM 计算机集成制造 ICT 在线测试工艺制程模型软件印刷锡膏检查测试策略 2D/3D X 光检查
中国 SMTA 为高科技技术研讨会中的演讲征集技术论文 高科技技术研讨会的技术论文主题及内容必须为纯技术论文, 经由中国 SMTA 技术顾问委员会最终决定后, 将被列入会议题目 ( 高科技技术研讨会的演讲者无需缴付赞助费 ) 所有论文包括文章大纲和演讲者个人简介要求中文和英文刊登在技术论文集中 所有演讲 ( 幻灯片形式的演讲稿 ) 必须为中文并且以中文讲解或英文 讲解配备翻译 华东高科技会议 ( 第二十四届中国国际电子生产设备暨微电子工业展 ) 高科技技术研讨会 35 分钟的论文演讲 10 分钟的现场问题回答 2014 4 23 如果您和您的公司希望与中国 SMTA 的会员及专业观众分享贵公司的有关信息, 请发邮件提交您的文章大纲给 SMTA 行政主任陈蕙至 peggychen@smta.org.cn 并写上您的名字 工作头衔和公司的相关信息以及有关联系信息并且注明您的技术论文是投稿于高科技技术研讨会. 华东高科技技术研讨会提交材料的截至日期 : 文章大纲和演讲者个人简介 ( 中文和英文版本 ) 中文 / 英文的论文和中文的幻灯片形式的演讲稿 2014 年 1 月 20 日 2014 2 28 为了感谢演讲者们优秀信息的分享, 中国 SMTA 将于上海 4 月 23 日下午在设备技术研讨会的演讲现场举办的周年颁奖典礼上颁发最佳论文奖和最佳演讲奖. 感谢您支持中国 SMTA, 期待您的消息 联系及查询 :SMTA 中国行政主任陈蕙小姐, 电话 :+86-21-5609-3010, 传真 :+86-21-5609-3020, 电邮信箱 :peggychen@smta.org.cn