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Apr/May 2011 4/5 1 619 56 Ad Index Editor's Note 6 There are still a Lot to be Done Market Watch 8 PCB EAGLE PCB Design Tool EAGLE Enters the China Market 10 NEPCON China 2011 SMT NEPCON China 2011 will See SMT Industry s Fast Development 12 ELEXCON ELEXCON Saw New Market Hot Pots 14 SMT China The 5 th Vision Awards will Witness New Achievements of the Industry My Viewpoints 14 Mastering The Key Of SMT Technology Cover Story 16 Trends In SMT Dispensing Applications Dan Ashley Steve Adamson Nordson ASYMTEK Tech Features 20 RoHS RoHS Recast Just Around The Corner: Are You Ready? Jean-Cyril Walker 23 EU Lawmakers' Science-based Decision Won't Stop Cal For Removal Of Halogens Stephanie Castorina 25 ( ) Copper Tin Intermetallic Crystals Role In Formation Of Microbridges Between Leads, Part II Jeff Kukelhan BAE 32 OSP Creep Corrosion Of OSP And ImAg PWB Finishes C. Xu, W. Reents, J. Franey, J. Yaemsiri and J. Devaney, Alcatel-Lucent

2 / China / Hong Kong SAR 478 13 B Adonis Mak adonism@actintl.com.hk Mark Mak markm@actintl.com.hk Simon Lian simonl@actintl.com.hk Shirley Qiao shirleyq@actintl.com.hk Katie Huang katieh@actintl.com.hk Sunnie Zhao sunniez@actintl.com.hk Yoyo Deng KC Chan Mandy Choy Jade Cheng Publishing House ACT International Unit B, 13/F, Por Yen Building, No.478 Castle Peak Road, Cheung Sha Wan, Kowloon, Hong Kong. 852 2838 6298 852 2838 2766 Beijing 86 10 58607751 86 10 58607751 Shanghai 86 21 62511200 86 21 52410030 Shenzhen 86 755 25988571 86 755 25988567 Tech Solutions 41 Job Sequence Optimizer Helps Release Your Potentials Mattias Jonsson Mydata SMT SMT Step by Step 43 Step 3: Dispensing Measurement Of Pressure Distribution During Encapsulation Of Flip Chips Thomas Schreier Jeffrey G. Stark 46 Step 4: Printing A New Future-proof Technology for Stencil Printing Mark Whitmore Rick Goldsmith DEK 51 Step 5: Pick & Pl acing Pick & Placing Process Must Be Under Full Control Sjef van Gastel Assembléon Products 53 Nepcon Selected Exhibits at Nepcon SH 2011 USA SMT Magazine Publisher/ Group Editorial Director Ray Rasmussen ray@iconnect007.com Sales Manager Barb Hockaday barb@iconnect007.com SMTSMT BRBR BR "This publication contains articles reprinted from SMT magazine. SMT magazine is exclusively owned and published by BR Publishing Corporation. BR Publishing Corporation is not responsible in any way for the editorial policy and expressly disclaims responsibility for, and makes no warranties, express or implied, with respect to the content of this publication or the performance or reliability of products described herein that are produced by independent vendors." 2011 ACT 1998 ACT ACT / / LED ACT ACT www.actintl.com.hk About ACT International Media Group ACT International, established 1998, serves a wide range of high technology sectors in the high-growth China market. Through its range of products -- including magazines and online publishing, conferences and events -- ACT delivers proven access to the China market for international marketing companies and local enterprises. ACT s portfolio includes eight technical magazine titles and related websites plus a range of conferences serving more than 80,000 professional readers in fields of semiconductor manufacturing, PV/solar energy, electronic design, electronic manufacturing, contamination control, laser/photonics, optical communications and LED technology. ACT International is also an exclusive advertising sales representative for a number of world leading technical publishers. ACT is headquartered in Hong Kong and operates liaison offices in Beijing, Shanghai and Shenzhen. www.actintl.com.hk SMT China EOEM EMS SMT SMT SMT SMT / About SMT China SMT China is a technical magazine tailored for EOEM and EMS providers in China, helping them to design, assemble and test surface mounted PCBs. It provides the latest information on solutions and technological developments in materials and tools for surface mount assembly and reports on SMT industry trends. Its readers are technical professionals, including technical executives/managers, process engineers and scientists engaged in SMT manufacturing in China. All rights reserved.

编辑手记 Editor s Note 同志仍须努力 连绥仁 英国 金融时报 引述美国经济咨询机构 HIS 环球透视 (HIS Global Insight) 于三月十四日发表的研究报告说, 在二零一零年, 中国制造业的产值占全球制造业总产值的 19.8%, 比美国的 19.4% 高出零点四个百分点 根据新的数据, 去年全球制造业总产值达到 10.078 万亿美元, 经过通胀调整后, 比二零零九年实际增长 9.7 %, 表明全球制造业已经从经济衰退中复苏 不过, 应当指出, 中国制造业的产值有一大部分来自西方企业在中国的子公司, 在电子等领域尤其如此 另一方面,HIS 环球透视研究报告的产值是以美元计算, 而人民币兑美元的汇率升值约 3%, 这是中国制造业产值上升的部份因素 一百六十年前, 中国曾是全球最大的商品生产国 后来, 英国在工业革命的推动下, 成为工业品生产的龙头 英国保持这个龙头地位五十年, 之后, 美国取而代之, 保持世界第一长达一百一十年之久 经济史学家普遍认为, 在一八三零年, 中国制造业产值占全球产值近三成, 一九零零年下降到大约 6%, 一九九零年下降到大约 3% 此后, 中国靠低廉劳动力吸引西方制造业转移到中国, 大量外来投资和外来技术, 加上中国转到以发展生产力为国策, 经济开始迅速发展 在一百六十年后的今天, 中国再度成为全球制造业产值最高的国家 人们说, 中国是制造业大国, 指的就是中国制造业产值在世界市场占的比例很高, 如今位居第一 人们又说中国还没有成为制造业强国 中国制造业的不足在哪里呢? 笔者在旧作 论人类生产力 ( 表面组装技术 二零一零年十二月期) 中说 : 人类社会存在 两种类型的生产活动 : 一是创造技术或技术知识的活动 ; 一是单纯的生产活动 后者是前者的创造性果实在数量上的延伸和重复 中国的制造业产值超过美国, 这个产值是指 单纯的生产活动 方面的产值, 在技术创造和创新方面, 落后很多 笔者在旧作 论人类生产力 中又说, 单纯生产活动的生产力有五个要素 : 一是技术知识, 二是劳动者, 三是生产资料, 四是原材料, 五是一定方式的生产和经营组织 这里, 技术知识是指制造的产品和制造产品的知识 目前, 中国制造业的主体基本上是属于 单纯的生产活动, 尤其是我们的电子制造业, 不过是使用西方的制造技术 按照西方的制造方法生产着西方创造的产品 有几样产品不是这样呢? 有那些不是按照李鸿章一百几十年提出的 师其法 的方针做的? 走进任何一个国际性电子工业展览会, 就可以看到这点 在生产组织和经营方面, 和西方也存在距离 然而, 在一百六十年前, 中国的商品制造, 以及生产的组织和经营管理, 是依靠自己的知识 中国制造业缺乏创造力, 也就是在 创造技术或技术知识 方面的能力极为不足 一百几十年前, 李鸿章大规模引进西方先进技术, 建立了中国的现代

Editor s Note 编辑手记 工业, 基本是单纯进行生产 但是自那以后的一百几十年, 中国的现代制造业没有形成创造和创新的力量 然而, 在这一百几十年间, 在西方世界, 在制造领域, 出现了许多新的产业, 却没有一个新产业是在我们的国家创造 诞生的 不妨想一下, 在制造方法方面, 除了候德榜的制碱法, 有多少制造方法是在我们这片国土上创造诞生的呢? 还有一点是, 中国制造业的效率低, 即 单纯的生产活动 的效率低 HIS 世界工业服务部主管 Mark Killion 说, 美国的生产值略低于中国, 但美国制造业只有 1150 万工人, 但中国则雇用了近一亿人 也就是说, 按人头计算, 中国制造业工人的产值只有美国工人的九分之一至十分之一 我们的祖先有四大发明的辉煌, 在科学技术领域, 我们的祖先曾在世界领先 这是祖先给我们留下的光荣 我们无不引以自豪 我们有光荣的祖先 但是, 从另一个角度看, 在科学技术方面, 我们这一代人或几代人曾做了些甚么可以光宗耀祖, 可以为祖宗们增光呢? 所以, 虽然我们的制造业产值已经位居全球第一, 同志仍须努力 笔者窃以为, 最需要努力的地方是把蕴藏在我们身上的创造力发挥出来 影响制造业在全球竞争力的众多因素中, 技术人才是最主要的 为了提高创造力, 首先, 需要破除束缚创造力的牢笼, 需要有一群对科学 技术有热情 有梦想的人, 还需要稳定的经费支持 我们的传统文化是 学而优则仕 孔子办教育和后来的教育是为帝王培养臣子 过去读书人的追求是 入仕, 对科学和技术没有兴趣, 没有热情, 没有梦想 现在读书人的追求似乎是 入仕 或赚钱, 做更大的官 赚更多的钱 这种文化正在改变, 但是变得还不够 我们在科学技术知识创造上的投资, 主要靠政府 也是不够的, 需要全社会形成投资到科学技术的热情和行动 美国竞争力协会 (Council on Competitiveness) 主席 Deborah Wince-Smith 说, 未来美国的竞争力不在于商品制造, 而在创新和新的服务 在激励创造力, 在 有热情 有梦想的人, 在全社会提供 经费支持 等方面, 美国等国家值得我们 师其法, 对于中国将来在创造力和创造方面走到世界最前列, 有着深远的意义

Market Watch PCB EAGLE e Premier Farnell CadSoft Computer EAGLE EAGLE PCB EAGLE EAGLE Windows Linux Mac EAGLE CAD EAGLE C ULP CAD EAGLE DesignLink 40 EAGLE 5.11 DesignLink e e e PCB EAGLE EAGLE DesignLink EAGLE 5.11 U EAGLE (ULP) EAGLE EAGLE www.element14.com/eaglediscussion EAGLE EAGLE@element-14.com EAGLE Cadsoft Thomas Liratsch CadSoft e element14 Premier Farnell e 3500 400 000 40,000 2-3 5 e Premier Farnell 3500 29 element14 www.element14.com 7.953 5480 8 2011 4/5 SMT China

Market Watch 2011 4/5 SMT China 9

Market Watch NEPCON China 2011 SMT 2011 NEPCON China 2011 NEPCON China 2011 2011 NEPCON China 2011 2009 2010 SMT SMT NEPCON China DEK Europlacer JUKI Mydata Speedline KIC OK Cookson BTU Heller Rehm Thermal Nagoya Vi Technology Koh Young TRI 2011 5 11 13 NEPCON China 2011 2011 NEPCON China Mentor Mentor Mentor NEPCON 2011 2015 2011 15% SMT NEPCON China 2011 2011 SMT NPM-W SIPLACE SIPLACE DX Nutek Private Limited Nutek Fuji NXT AIMEX Cookson ALPHA EF-6850HF Henkel Macromelt NEPCON China 2011 2010 16.9% 11.6 1.2 63395 25.5% 2011 15% 15% 2011 NEPCON China 2011 www. nepconchina.com 10 2011 4/5 SMT China

Market Watch 2011 4/5 SMT China 11

Market Watch ELEXCON ELEXCON2010 ( ) 2011 LED ELEXCON2011 ROHM TDK OMRON KEMET LED 2011 2010 LED 1000 2015 LED 5000 4 10 3000 TDK ROHM LED LED 2010 7718 1732.3 1211 1 ELEXCON2011 2010 2010 63645 24.1% TDK ELECON2011 70%

My Viewpoints SMT SMT BGA BGA SMT China SMT SMT China SMT China SMT China NEPCON SMT China SMT EMS OEM SMT China SMT China SMT China SMT China VA SMT China SMT China VA SMT China SMT China SMT 18 14 2011 4/5 SMT China

My Viewpoints 2011 4/5 SMT China 15

Cover Story Dan Ashley Steve Adamson Nordson ASYMTEK 0603 1608 01005 040201005 SMT 4 90 1 1 <75μm 5.5 16 2011 4/5 SMT China

Cover Story 2 2 Z Z Z Z 11.97 29 2.11 50%

Cover Story Z 25μm 200Hz PCB Z 3 3 SMT 01005 250 PWB PWB 14 SMT 54 103 A B BGA BGA SMT QFP BGA 18 2011 4/5 SMT China

Booth 1C05

Tech Feature RoHS Jean-Cyril Walker 2010 11 24 640 3 12 RoHS 2002/95/EC [1] RoHS EEE 37 REACH ROHS RoHS LSIT RoHS RoHS PBBPBDE [2] WEEE 2002/95/EC 1 2 3 IT 4 5 6 7 8 RoHS I RoHS WEE I WEE 8 9 RoHS 2006 1 1 2006 1 1 RoHS 2016 1 1 2016 1 1 RoHS RoHS LSIT [3] LSIT / RoHS 5(1)(b) 6 6 / / [4] EC 1907/2006 20 2011 4/5 SMT China

Tech Feature 2011 4/5 SMT China 21

Tech Feature REACH 7 5 [5] V RoHS 5 18 WEEE [6] RoHS 5 CE RoHS RoHS RoHS EC 765/2008 [7] (EC) 765/2008 II RoHS RoHS CE RoHS RoHS RoHS [8] RoHS RoHS CE [9] RoHS EEE HBCDED2- DEHP BBP DBP 6 6 REACH [10] RoHS 2011 20 18 Jean-Cyril (JC) Walker Keller and Heckman 1-202/434-4181; walker@khlaw.com 1. See http://www.europarl.europa.eu/sides/ getdoc.do?type=ta&language=en&ref erence= P7-TA-2010-0431. 2. Concentrations limits: 0.1% for lead, mercury, hexavalent chromium, PBBs and PBDEs; and 0.01% for cadmium. 3. See Proposed Recast Directive, art. 3(c). 4. Directive 2002/95/EC, art. 5, para. 1(c). 5. See Proposed Recast Directive, art. 5, para. 2. 6. See Proposed Recast Directive, art. 5, para. 1(b). 7. See Proposed Recast Directive, art. 7(b). 8. See Proposed Recast Directive, art. 7(e). 9. See Proposed Recast Directive, art. 10(e). 10. See Proposed Recast Directive, art. 6, para. 2. 22 2011 4/5 SMT China

Tech Feature Stephanie Castorina RoHS NGO RoHS IPC RoHS 2008 Oko RoHS Oko PCB BFRIPC Oko Oko IPC RoHS IPC RoHS RoHS RoHS HBCDD2- DEHP BBP DBP HBCDD 2011 4/5 SMT China 23

Tech Feature MEP J Jill Evans RoHS Evans IPC RoHS IPC Evans RoHS OEM OEM OEM OEM Environmentally Preferable Electronic Assessment Tool ( EPEAT RoHS RoHS 2011 5 IPC IPC REACH RoHS Stephanie Castorina IPC IPC Castorina 24 2011 4/5 SMT China

Tech Feature Cu6Sn5 Jeff Kukelhan BAE Sn63Pb36Ag2 Cu6Sn5 15 16 17 1 20 40 17 PWB 18 25 15 Sn62Pb36Ag2 0.5 0.2 16 15 17 15 Sn62Pb36Ag2 18 EDS 1.7% 19 PWB 18 20 EDS 20% 21 6.8 5 22 Cu 6 Sn 5 18 23 EDS 2011 4/5 SMT China 25

Tech Feature 26 2011 4/5 SMT China

Tech Feature 18 16 17 19 EDS 19 18 EDS Sn62Pb36Ag2 1.7% 20 17 18 Cu 6 Sn 5 A B Cu 6 Sn 5 21 22 A B EDS 6.8 5 22 Cu 6 Sn 5 SEM 23 EDS 25 6.8 5 Cu 6 Sn 5 Sn63Pb37 26 15 26 14 PWB Cu 6 Sn 5 Cu 6 Sn 5 Cu 6 Sn 5 415 BAE Fort Wayne 21 20 A EDS Cu 6 Sn 5 Sn62Pb36Ag2 22 20 B EDS 6.8 5 Cu 6 Sn 5 PWB 23 17 18 Cu 6 Sn 5 24 A EDS 25 EDS 2011 4/5 SMT China 27

Tech Feature 28 2011 4/5 SMT China

Tech Feature 24 23 A EDS 6.8 5 Cu 6 Sn 5 PWB 25 23 EDS EDS 6.6 5 Cu 6 Sn 5 PWB 26 Sn63Pb37 0.5 0.2 Cu 6 Sn 5 Cu 6 Sn 5 Cu 6 Sn 5 Cu 6 Sn 5 PWB PWB PWB Cu 6 Sn 5 Cu 6 Sn 5 27A 27B Cu 6 Sn 5 27c 27d 28 Cu 6 Sn 5 Cu 6 Sn 5 PWB 2011 4/5 SMT China 29

Tech Feature 29 PWB PWB Cu 6 Sn 5 Cu 6 Sn 5 Cu 6 Sn 5 27 a b Cu 6 Sn 5 28 27 29 28 Cu6Sn5 29 30 PWB PWB PWB Cu 6 Sn 5 Sn63Pb37 Sn62Pb36Ag2 Cu 6 Sn 5 Cu 6 Sn 5 Cu 6 Sn 5 Cu 6 Sn 5 1. Manko, H.J., Solders and Soldering, 3rd Ed. McGraw-Hill, New York, 1992, pp. 94-96. 2. Boettinger, W.J., Handwerker, C.A., Kattner, U.R., Reactive Wetting and Intermetallic Formation, in The Mechanics of Solder Alloy Wetting and Spreading, Yost, F.J., Hosking, F.M. and Frear, D.R., Ed., Van Nostrand Reinhold, NY, 1993, pp. 130-131. 3. Klein-Wassink, R.J., Soldering in Electronics, 2nd Ed., Electrochemical Publications, Isle of Man, British Isles, 1989, pp. 160-161. 4. Manko, H.J., Solders and Soldering, 3rd Ed. McGraw-Hill, New York 1992, page 99. 30 2011 4/5 SMT China

Tech Feature OSP C. Xu W. Reents J. Franey J. Yaemsiri J. Devaney, Alcatel-Lucent G2 ImAg APEX2009 [1] OSP MFG OSP ImAg Egan Mendizza Au Ag 2 S Au 1 [2] 1 - Ag-Rh - Ag-Pd Ag 2 S Ag 2 S IC 2 1 [2] P. Zhao, University of Maryland 2 DIP [3] 3 [3] Telecordia Telecordia MFG 5 Telecordia MFG Battelle III Telecordia MFG 30 [4-7] [1] FR4 OSP 1. 3 32 2011 4/5 SMT China

Tech Feature 1 MFG H 2 S SO 2 NO 2 Cl 2 NEBS Outdoor 100 ppb 200 ppb 200 ppb 20 ppb ALU Intemational 1500-200 ppb 200 ppb 200 ppb 20 ppb ECM ECM ECM Ag 2 S [2] Cu 2 S FR4 ECM ECM / 4 2. MFG [9-16] MFG Battelle Telcordia Telcordia NEBS 1 275-360 / 1 ISA G1 Copper Sulfide Growth Silver Sulfide Whiskeer Growth 4 MFG 5 MFG 5 5 MFG <360nm/ [11] Alcatel-Lucent ALU H2S H2S 1 2 H2S H2S 1 NEBS MFG ALU ALU ALU MFG 40oC 70% 500-600 / [15-16] 1 MFG 1 SPS IPC ORM0 ID Trieber Aqua SMD Junior 130oF Alpha 500M 1 / IPC 10 / 3. 5 5 MFG 2011 4/5 SMT China 33

Tech Feature 34 2011 4/5 SMT China

Tech Feature 2011 4/5 SMT China 35

Tech Feature Flux + 5n Exposed OSP / Cu 6 OSP ESD 7 OSP 6 6 SED ESD 6 EDS 5 ESD 6 OSP MFG /OSP 5 1 2 3 5 MFG 7 5 MFG Alpha 500M 1 / IPC 10 / PWB ECM ECM MFG 8 7 MFG EDS 9 9 SED 9 FR-4 Creep Corrosion 8 9 36 2011 4/5 SMT China

Tech Feature 4. (1) OSP (2) IPC (3) 4.1 OSP [1 6 7] [1] OSP MFG OSP OSP OSP OSP H2S OSP 4.2 / PWB / IPC 4.3 IC MFG OSP MFG FR-4 MFG 4.4 PWB OSP OSP ENIG /OSP/ENIG 1 HASL [21] PWB ImAg > OSP > ENIG >> ImSn~HASL HASL ENIG PWB PWB OSP PWB 2011 4/5 SMT China 37

Tech Feature 38 2011 4/5 SMT China

Tech Feature 2011 4/5 SMT China 39

Tech Feature FR-4 / OSP IPC Sherwin Kahn Marc Benowitz Serwin Kahn 1. C. Xu, J. Smetana, J. Franey, G. Guerra, D. Fleming, W. Reents, D. Willie, A. Garcia I., G. Encinas and X. Jiang, APEX, 2009. 2. T. F. Egan and A. Mendizza, "Creeping Silver Sulfide," Journal Of The Electrochemical Society, Vol 107 (4), 353, (1960). 3. P. Zhao " Creep Corrosion Over Plastic Encapsulated Microcircuit Packages With Noble Metal Pre-Plated Leadframes," Ph.D. Dissertation, 2005, University of Maryland. 4. R. Veale, "Reliability of PCB Alternate Surface Finishes In A Harsh Industrial Environment," SMTA, 2005. 5. P. Mazurkiewicz, "Accelerated Corrosion of Printed Circuit Boards due to High Levels of Reduced Sulfur Gasses in Industrial Environments," Proceedings of the 32nd International Symposium for Testing and Failure Analysis, November 12-16, 2006, Renaissance Austin Hotel, Austin, Texas. 6. C. Xu, D. Flemming, K. Demerkin, G. Derkits, J. Franey, W. Reents, "Corrosion Resistance of PWB Surface Finishes," Alcatel-Lucent, APEX, 2007. 7. R. Schueller, "Creep Corrosion On Lead- Free Printed Circuit Boards In High Sulfur Environments," SMTA, 2007. 8. B.H. Chudnovsky, 48th IEEE Holm Conference on Electrical Contacts, 2002. 9. W. Abbott, "The Development and Performance Characteristics of Mixed Flowing Gas Environment," IEEE Trans. Components, Hybrids, Manufacturing Technology, Vol. CHMT-11:1 (1988), 22-35. 10. ASTM International, "Standard Guide for Mixed Flowing Gas (MFG) Tests for Electrical Contacts," ASTM B 845-97, June 10, 2003. 11. ISA-S71.04-1985, "Environmental Conditions for Process Measurement and Control Systems: Airborne Contaminants," Instrument Society of America, 1985. 12. D. Williams, "The Effect of Test Environment on the Creep of Base Metal Surface Films over Precious Metal Inlays," IEEE Trans. Components, Hybrids, Manufacturing, Vol. CHMT-11:1 (1988), 36-42. 13. Telcordia GR-63-CORE Issue 2, Section 5.5, "Airborne Contaminants Test Methods," November, 2000. 14. Corrosion, Vol. 55, No. 1, page 66, 1999. 15. Lucent Technologies corrosion taskforce: Coupons deployed at beginning of 1999. 16. G.E. Derkits, J.P. Franey and W.D. Reents, "Biased Mixed Flowing Gas Testing for World Class reliability," Bell Labs Technical Journal, 11(3), 105-120, 2006. 17. Conrad, L.R., Pike-Biegunski, M.J., Freed, R.L, "Creep Corrosion over Gold, Palladium, and Tin-lead Electroplate," The Fifteenth Annual Connectors and Interconnection Technology Symposium Proceedings, pp.401-14, Fort Washington, Pennsylvania, 1982. 18. IPC, "Specification for Immersion Silver Plating for Printed Circuit Boards," IPC-4553, September 29, 2005. 19. IPC, "Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards," IPC-4552, October, 2002. 20. IPC, "Time, Temperature and Humidity Stress of Final Board Finish Solderability," IPC-TR-585, May, 2006. 21. B. Wright, K. Demirkan, R. L. Opila, K. Hannigan, M. Reid, J. Punsch, C. Xu, W.D. Reents Jr., J.P. Franey, D.A. Fleming, G.E. Derkits Jr., P. Ahern, IEEE Transactions on electronics packaging manufacturing, submitted for publication. 40 2011 4/5 SMT China

Tech Solution Mattias Jonsson Micronic Mydata AB SMT SMT MYDATA MYPlan 4.1 MYPlan MYPlan MYPlan MYPlan MYPlan MYPlan MYPlan MYPlan MYPlan 8 MYPlan MYLabel SMD MYPlan MYDATA 2011 4/5 SMT China 41

SMT Step-by-Step SMT MEMS PressurexR [1] MEMS EMC Thomas Schreier-Alt Jeffrey G. Stark IC MEMS [1] [2 3] [4] Fraunhofer IZM 1 PCB ( 1) 1 PCB 2 Kistler 2 3 Kistler [4] 2011 4/5 SMT China 43

SMT SMT Step-by-Step 3 PCB 4 PCB Kistler 2,000 /200 MAP 130 /13 2 (4) 10 140 50 1 5 100 500 PCB PET 80 180 120 140 4 100 PCB 4 PCB PCB PCB PCB 5 PCB PCB 300 150 200 EMC 4 PressurexR 1. Pressurex Sensor Film, www.sensorprod.com, Sensor Products Inc. (USA). 2. R. Muller-Fiedler, V. Knobloch, Reliability aspects of microsensors and micro-mechatronic actuators for automotive applications, Microelectronics Reliability 2003; 43: 1085-1091. 3. K. Niehoff, T. Schreier-Alt, F. Schindler-Saefkow, F. Ansorge, H. Kittel, Thermo-Mechanical Stress Analysis, IEEE European Microelectronics and Packaging Congress EMPC, 2009. 4. T. Schreier-Alt, F. Schindler-Saefkow, O. Wittler, H. Kittel, Encapsulation of system in package - process characterization and optimization, Proceedings of 2nd ESTC, 2008. 5. T. Schreier-Alt, F. Ansorge, H. Reichl, Fiber Optic Strain and Structural Health Monitoring in Polymer Electronic Packaging, Proceedings of Electronic Components and Technology Conference, 2007. 6. Topaq Analysis System, www.sensorprod. com/topaq, Sensor Products Inc. (USA). 44 2011 4/5 SMT China

SMT SMT Step-by-Step Mark Whitmore Rick Goldsmith DEK USB 0.3 150 0.4 CSP 01005 0.4 CSP 01005 0.3 CSP 80 8000 1997 CSP QFP SMT SMT 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1 90 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 01005 s 0201 s 0.3CSP 0.4CSP SMT 0% 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 2 46 2011 4/5 SMT China

SMT Step-by-Step SMT 2011 4/5 SMT China 47

SMT SMT Step-by-Step ICP 7525 0.66 1 90 2 SMT 0.3 CSP 0.4 0.3 CSP 01005 3 100 m 160μm 0.4 0.3 CSP

SMT Step-by-Step SMT oactiv Pro ProActiv (0.3CSP) 160um, 100um, 0.4 3 100μm 160μm 0.4 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 01005 s 0201 s 0.3CSP 0.4CSP ProActiv 4 SMT 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 SIEDLE DEK SIEDLE SIEDLE SIEDLE SIEDLE SIEDLE 3 5 8 10 Hansatech Hansatech Hansatech ZZS ZZS ZZS 0.3 CSP 0.4 4 Mark Whitmore Rick Goldsmith 2011 4/5 SMT China 49

SMT Step-by-Step SMT Sjef van Gastel Assembléon SMT PCB PCB PCB 30 100,000 / NPI PCB PCB PCB SMT 1 PCB 1 PCB PCB 2 3 1 4 2 2 2011 4/5 SMT China 51

SMT SMT Step-by-Step 3 5 PCB 100,000 PCB Package-on-Package 3 / 1 2 4 PCB IC 4 4 / Assembléon IC / 01005 BGA 20 30 dpm 01005 100 dpm Assembléon A-Series 5 dpm 20% $1000 IC / Sjef van Gastel Assembléon 52 2011 4/5 SMT China

Selected Exhibits at NEPCON SH 2011 NEPCON Cookson 2G20 ALPHA EF-6850HF ALPHA EF-6850HF / SAC305 ALPHA SACX Plus Henkel 2C12 Henkel Macromelt Macromelt Macromel 20 500psi Macromel PVA PVA650MD SMT 1C10 PVA650MD SMT SMT PVA650MD FCM200 PVA650MD PVA PathView TM PVA 24 Fuji AIMEX 1C01 Fuji AIMEX NXT All in One SIPLACE SIPLACE DX 1E02 ASMPT SIPLACE SIPLACE DX SIPLACE DX SIPLACE DX 20 20 01005 Panasonic 1D10 NPM-W NPM-D NPM-W LED AV NPM-W KIC 2H02 SMT SPI AOI X-Ray ICT KIC RPI PCB KIC RPI 100% KIC PRI PCB PCB RPI PCB X-Ray AOI BGA X-Ray 100% BGA KIC RPI X-Ray X 4C01 XD7600NT X X XD7600NT X 100 0.1 10 CMOS 300 2011 4/5 SMT China 53

NEPCON China 2011 2011 5 11~13 www.nepconchina.com 86 21 5153 5100 mike.deng@reedexpo.com.cn 86 10 5763 1818 linda.gao@reedexpo.com.cn

Aqueous Trident 2G32 Trident SPC Trident Focus-Wash Trident Trident 16" SPC SPC SPC ZESTRON ATRON AC 207 2C01 ATRON AC 207 FAST 3-10 ATRON AC 207 FAST ZESTRON ZESTRON 2007 FAST Kyzen 2B21 Kyzen Kyzen Kyzen VJ Electronix SRT Micra 1C10 SRT Micra SRT GPS / POP QFN 01005 0.3 CSP SRT Micra Micra SierraMate TM V9 SRT AutoRun TM V9 Finetech FINEPLACER pico rs SMD IPM 5μm FINEPLACER

Ad Index Advertiser Agilent Technologies Singapore (Holdings) Pte Ltd. www.agilent.com/find/i1000 28 AIM Solder (Shenzhen) Company Ltd. www.aimsolder.com 17 Aleader Vision Technology Co., Ltd. www.aoichina.com 45 Assembleon assembleon.com/smart 19 Beijing Star River Comtes Science & www.bjsrc.com BC Technology Development Co., Ltd. Cookson Electronics Ltd. - Alpha Metals www.cn.alpha.cooksonelectronics.com/products/bar 26 China Hi-Tech Fair ELEXCON www.elexcon.com 50 Dage (SE Asia) Pte. Ltd. www.nordsondage.com 13 DEK International, a business of DTG International GmbH www.dek.com/proactiv_chinese 1 Digi-Key www.digikey.cn FC, IFC DongGuan Anda Automatic Equipment Co., Ltd. www.anda-dg.com 42 Dr. O. K. Wack Chemie GmbH www.zestron.com/smt/we-care 21 First Technology China Ltd. www.1techchina.com 31 Fuji Machine Mfg. Co., Ltd. www.fuji.co.jp 34, 35 GKG Precision Machine Co., Ltd. www.gkg.cn 2 Heller (Shanghai) Co., Ltd. www.hellerindustries.com 3 Henkel (China) Investment Co., Ltd. () www.henkel.com/electronics 9 Mento Photoelectricity Technology Inc. www.mento-mv.com 48 Nepcon China www.nepconchina.com 54 Nordson (China) Co., Ltd. EFD () www.nordsonefd.com/ads/cn-smt-0511 38, 39 Omron Electronics (H.K.) Ltd. () www.omron-aoi.cn 15 Shanghai Samsung Mechatronics & www.samsung-smt.com 5 Trading Co., Ltd. (SSMT) Siemens () www.siemens.com/ident 11 SITECH Technology (Hong Kong) Co., Ltd. () www.pangus-ims.com 47 Sun East Electronic Technology (Shenzhen) Co., Ltd. () www.suneast.com.cn IBC Shenzhen Desen Precision Machine Co., Ltd. www.desen-sz.com 7 Shenzhen KED Optical Electric Technology Co., Ltd. www.kedtech.com.cn 55 Shenzhen Ciexpo Technology Co., Ltd. www.ciexpo-ele.com 23 Yantai Darbond Electronics Materials Co., Ltd. www.darbond.com 12 Zhenhuaxing Technology (Shenzhen) Co., Ltd. www.vcta-aoi.com 6 Administration & Sales Offices Administration HK Head Office () ACT International () Unit B,13/F, Por Yen Buiding, No.478 Castle Peak Road, Cheung Sha Wan, Kowloon, Hong Kong Tel: 852 2838 6298 Fax: 852 2838 2766 Publishing Director () Adonis Mak ( ) adonism@actintl.com.hk Publisher () Mark Mak ( ) markm@actintl.com.hk General Manager-China () Michael Tsui ( ) michaelt@actintl.com.hk Tel: 86 755 2598 8571 Editor-in-Chief ( ) Simon Lian ( ) simonl@actintl.com.hk Editor () Shirley Qiao ( ) shirleyq@actintl.com.hk US Offices I-Connect007 Publication PO Box 50 Seaside, OR 97138 USA Publisher-SMT US Edition Barry Matties barry@iconnect007.com Tel: 1 530 320 4507 Editorial Director-SMT US Edition Ray Rasmussen ray@iconnect007.com Tel: 1 916 294 7147 Sales Offices China () Shenzhen () Sky Chen ( ) skyc@actintl.com.hk Tel: 86 755 2598 8571 Shanghai () Sales Director-China Judy Huang ( ) judyh@actintl.com.hk Hatter Yao ( ) hattery@actintl.com.hk Carol Miao ( ) carolm@actintl.com.hk Tel: 86 21 6251 1200 Beijing () Oasis Guo ( ) oasisg@actintl.com.hk Tel: 86 10 5860 7751 Hong Kong ( ) Mark Mak ( ) markm@actintl.com.hk Tel: 852 2838 6298 Asia () Japan () Kazuyoshi Sugita, sugita@gicho.com Tel: 81 3 5209 1201 Korea () Sindy Kang customer@chomdan.co.kr Tel: 82-2-322-0525 Singapore ( ) Peggy Thay peggy.thay@publicitas.com Tel: 65-6836-2272 North America () Barb Hockaday barb@iconnect007.com Tel: 1 916 608 0660 56 2011 2 2011 4/5 SMT China