CHANGE RECORD Ed./Rev. Date Verified and approved by Description Writer 1 01/26/2016 FS / PW / MCV / LLR Initial Document WY TABLE OF CONTENTS 1. GENERAL 引言... 3 1.1. Purpose and scope 目的和范围... 3 1.2. Applicable documents 适用资料... 3 1.3. Documents inreference 参考资料... 3 1.4. Definition 定义... 3 2. PROPOSED SOLUTIONS FOR MECHANICAL REINFORCEMENT 加固的解决方案... 4 2.1. Recommended solution (1): Reinforcement with 4 spots of adhesive 推荐的解决方案 (1) : 胶粘剂的 4 点加固... 4 2.2. Alternative solution (2): Partial-Underfilling through holes in board 代替解决方案 (2) : 通过板上的洞 局部填充... 4 2.3. Alternative solution (3) :Clamping 替代解决方案 (3) : 压接... 4 2.4. Important remarks before processing- 操作之前的重要说明... 5 2.4.1. First remark : No glue on active tracks 功能区的电路上不能用胶... 5 2.4.2. Second remark : No Kapton tape on the module 模块上不能用胶带... 5 2.4.3. Third remark : No glue on balls of the module 模块的焊球上不能涂胶... 6 3. MODUS OPERANDI FOR REINFORCEMENTWITH SPOTS OF ADHESIVE (SOLUTION 1) 用斑点胶加固的操作方法 ( 解决方案 1)... 7 3.1. Objective 目的... 7 3.2. Materials and toolings 材料和工具... 7 3.3. Choice of adhesive 胶粘剂的选择... 8 3.4. Mixture preparation 混合制剂... 9 3.5. Definition of areas with glue 涂胶区域定义... 9 3.6. Modus operandi with micro-spatula 用着微铲的操作手法... 10 3.7. Modus operandi with dispenser 用着分配器的操作方法... 11 3.8. Just a few information about solutions (2) and (3) 解决方案 (2) 和 (3) 的一些信息 :... 11 Doc. N :3641-0842-1 Page 2/11
1. GENERAL 引言 1.1. PURPOSE AND SCOPE 目的和范围 This document aims to describe the process for stakingof a BGA module mounted on a board. This process is used at 3D PLUS for assembly verifications according to ECSS-ST-70-38 standard. 此文件的目的在于描述 BGA 模块在电路板上的装配流程 根据 ECSS-ST-70-38 标准,3D PLUS 把这个流程用于装配验证. In the following chapters, the 3D PLUS module3d2d4g72ub3652 4Gb DDR2 SDRAM 64Mx72 is chosen as example. 在接下来的章节中,3D PLUS 模块 3D2D4G72UB3652 4Gb DDR2 SDRAM 64Mx72 将作为范例. 1.2. APPLICABLE DOCUMENTS 适用资料 AD1 : Assembly Recommendations - Automatic Reflow - SOP and BGA packages - ref: 3300-1301 自动焊装配建议 -SOP 和 BGA 封装 - ref: 3300-1301 AD2 : Automatic assembly recommendations for BGA module with Sn10Pb90 solder balls (SnPb soldering process) ref : 3300-8283 自动装配建议 BGA 模块 Sn10Pb90 焊球 ( 锡铅焊接工艺 ) ref : 3300-8283 1.3. DOCUMENTS INREFERENCE 参考资料 RD1 : Datasheet of Hysol Eccobond 285 with Catalyst 11 Hysol Eccobond285 与 Catalyst11 数据表 1.4. DEFINITION 定义 Underfill of a BGA module : resin reinforcement filling the space between the bottom of the component and the board, encompassing every solder ball BGA 模块的底部填充胶 : 树脂增强填充模块底部和板之间的空间, 囊括每一个焊球. Note :the underfill of a BGA module has never been performed up to now. 注意 : 这种 BGA 模块的底部填充胶到目前为止还没有被试用过. Partial-underfilling of a BGA module:resin reinforcement dispensed between the bottom of the component and the board, that filling a small area under the module, without touching any solder ball only possible with holes through the PCB. BGA 模块的局部填充胶 : 树脂填充器件底部和板之间的空间, 即填充模块下边的一小块区域并且不触碰任何一个焊球, 只可能通过印刷电路板上穿孔进行. Note :in the following chapters, underfill will mean partial-underfill as a shortcut 注意 : 在接下来的章节中, 底部填充胶意味着局部底部填充胶的简写. Doc. N :3641-0842-1 Page 3/11
2. PROPOSED SOLUTIONS FOR MECHANICAL REINFORCEMENT 加固的解决方案 2.1. RECOMMENDED SOLUTION (1): REINFORCEMENT WITH 4 SPOTS OF ADHESIVE 推荐的解决方案 (1) : 胶粘剂的 4 点加固 PROS 优点 : - This solution is the easiest solution to perform 这个方法执行起来最简单 - This solution is the process validated by 3D PLUS, for its verification procedure. 这个方法已被 3D PLUS 用于核查程序验证过了 CONS 缺点 : - A few space around the module is required for the modus operandi. 执行这个方案时要求模块周围要有一点空间 - Avoiding any overlapping of adhesive onto the laser tracks on the active sides is required. 要求避免功能区的电路上胶的重叠 4 spots 2.2. ALTERNATIVE SOLUTION (2): PARTIAL-UNDERFILLING THROUGH HOLES IN BOARD 代替解决方案 (2) : 通过板上的洞局部填充 PROS 优点 :Every active side remains untouched 对每一条功能区的电路没有影响 CONS 缺点 : - Some holes on the board are required for underfilling, making the routing more complex. 板上的一些洞是局部填充所要求的, 这让路由更加复杂. - Blind process no visual access during the underfilling 无目视的过程 - 在局部填充过程中没有视觉的访问 - Defining the parameters of dispense (such as dip, pressure, time, rest time, pot life) is more difficult. 定义分配参数 ( 例如度 压力 时间 休息时间 贮放时间 ) 会更困难 partial-underfilling = 3 spots under the body 2.3. ALTERNATIVE SOLUTION (3) :CLAMPING 替代解决方案 (3) : 压接 PROS 优点 : this solution may be the most reworkable configuration (less damage on board after rework) 这个方案也许是让返工最简单的返工后板的损害较少 ) CONS 缺点 : - A few space around the module is required (note : the clamp may cover several modules in array) 模块周围需要有一点空间 ( 注意 : 压板也许会覆盖阵列中的几个模块 ) Doc. N :3641-0842-1 Page 4/11
- The marking is partially hidden 模块的激光打标是局部隐藏的 Note : only the recommended solution (1) will be described in the following chapters. 注意 : 只有推荐的方案 (1) 将会在接下来的章节中进行描述 2.4. IMPORTANT REMARKS BEFORE PROCESSING- 操作之前的重要说明 2.4.1. FIRST REMARK : NO GLUE ON ACTIVE TRACKS 功能区的电路上不能用胶 IMPORTANT NOTE : The glue must not overlap the tracks on active sides of the module 重要注意事项 : 胶不能涂在模块功能区的电路上 OK NOK 2.4.2. SECOND REMARK : NO KAPTON TAPE ON THE MODULE 模块上不能用胶带 IMPORTANT NOTE : The usage of Kapton tape or any other adhesive tape is absolutely forbidden on the module. It might damage the module after removal. (see AD1) 重要注意事项 : 在模块上, 禁止使用聚酰亚胺高温胶带或者任何其他胶带 在胶带移开之后, 可能会对模块产生伤害 Doc. N :3641-0842-1 Page 5/11
2.4.3. THIRD REMARK : NO GLUE ON BALLS OF THE MODULE 模块的焊球上不能涂胶 IMPORTANT NOTE : At visual inspection, the glue must not touch any solder ball. - For solution 1 : no contact with balls from the outer ring - For solution 2 : no contact with balls from the inner ring 重要注意事项 : 目测来看, 胶不能触碰任何焊球 解决方案 1: 从外环不能接触焊球解决方案 2: 从内环不能接触焊球 OK NOK NOK OK Solution 1 : 4 spots Solution 2 : partial underfill Doc. N :3641-0842-1 Page 6/11
3. MODUS OPERANDI FOR REINFORCEMENTWITH SPOTS OF ADHESIVE (SOLUTION 1) 用斑点胶加固的操作方法 ( 解决方案 1) In this document, it is important to note that before any staking operation, the module is mounted on the board according to the assembly recommendations for automatic reflow [AD1] or [AD2], available on the website. 在这份文件中, 需要注意的是, 任何加固操作之前, 该模块根据自动回流 [AD1] 或者 [AD2] 的装配建议被安装在板上了, 都可以在网站上看到 3.1. OBJECTIVE 目的 The modus operandi explains how to obtain 4 bracket-shaped spots of glue,.dispensed on the 4 corners. Note that the spot might flow on less than 1mm below the body, thanks to its own weight. 该操作方式解释怎样获得 4 个支架形状的几点胶水, 分配在四角 需要注意的是, 由于胶水自身的重量它在模块底部也许流不过 1mm Bracket-shaped spot of glue 3D PLUS module 3D2D4G72UB3652 with 4 spots of glue 3.2. MATERIALS AND TOOLINGS 材料和工具 Adhesive : Highly filled thermally-conductive Thixotropic epoxy adhesive Hysol Eccobond 285 Catalyst :Hysol Catalyst 11 胶粘剂 :HysolEccobond 285 催化剂 :Hysol Catalyst 11 Toolings 工具 : - Wood stick or small metallic micro-spatula 木棒或金属微铲 - Optional toolings: - Time/Pressure-controlled dispenser with adjustable timer - Low volume syringe : 10cc or 30cc for example - Dispenser dip : flexible dip with a diameter below 1.6mm or conic dip with hole below 1.0mm 可选的工具 : - 具有可调定时的时间 / 压力控制分配器 - 低容量的注射器 :10cc 或 30cc 为例 - 直径低于 1.6mm 的灵活倾角或者直径低于 1.0mm 的锥倾角 Doc. N :3641-0842-1 Page 7/11
3.3. CHOICE OF ADHESIVE 胶粘剂的选择 The glue used for mechanical reinforcement is the bi-component thermal epoxy adhesive : HYSOL ECCOBOND 285 with the recommended HYSOL Catalyst 11. 用于机械加固的胶水是双组环氧胶粘剂 : Eccobond 285 和推荐的催化剂 Catalyst 11 This combination of Eccobond 285 / Catalyst 11 is compatible with space applications in terms of outgassing, and is well adapted for thermo-mechanical behaviors (CTE, temperature range ) and ease of process (pot life, viscosity, thixotropy ). (see RD1) the thixotropy is an important parameter to avoid any overflow on tracks or on solder balls. Eccobond 285 和 Catalyst 11 是经过航天认证, 适用于热机械行为 (CTE, 温度范围 ) 并易于使用 ( 锅寿命, 粘度, 触变性 )( 参见 RD1)- 触变性是避免在电路或在焊球溢出的重要参数 It is important to note that before any staking, the module is assembled on the board according to [AD1]/[AD2] 重要的是要注意在模块根据 [AD1]/[AD2] 组装在板上之后才可以进行粘胶的操作 Doc. N :3641-0842-1 Page 8/11
3.4. MIXTURE PREPARATION 混合制剂 - Respect the recommendation of mix ratio from the manufacturer. 尊重制造商关于配合比的建议 - Outgas the mixture in a vacuum chamber. 在真空室除去混合物 - Let the adhesive mixture stand for 45 min. 让粘合剂混合物保持 45 分钟 (Following steps are optional) 接下来的步骤可供选择 - Put the mix into a syringe, in order to use the dispenser avoid bubbles as much as possible when putting the adhesive mix into the syringe. 为了使用分配器, 将混合物倒进注射器 - 当将胶黏剂混合物倒进注射器时要尽量避免产生气泡 - Let the adhesive mixture stand in the syringe for 15 min at least before any use. 在任何使用之前让胶黏剂混合物在注射器里至少待 15 分钟 3.5. DEFINITION OF AREAS WITH GLUE 涂胶区域定义 - Visualize the four areas on the module where the glue is to be dispensed : o One area at each corner o The wider the non-active area is on the module, the easier the gluing operation will be as this lowers the risk of overlapping on tracks o Height : a good practice is half the height of the module body 设想模块上胶水将被分配的四个区域每一个角落的一个区域模块上非功能区越宽, 胶接操作越容易 - 因为这降低了电路上重叠的风险高度 : 一个好的做法是得到模块体的半高 - Check that the corresponding areas on the board where the glue is to be dispensed : o No components in these areas o The areas surfaces are similar 检查板上胶水要被分配的相应区域在这些领域没有组件区域的表面是相似的 H H Doc. N :3641-0842-1 Page 9/11
For instance on 3D2D4G72UB3652, the recommended areas on module sides respect following conditions: - Areas : 2 areas joining the corners, ONLY on the small active sides (available areas on larger active sides are too small less than 1.5mm wide) - Width (W): 2 to 2.5mm (available = 3mm wide) - Height (H): around 3 mm (half of the body height) - Length (L) : L H 例如 3D2D4G72UB3652, 模块侧面上推荐的区域遵守下面的条件 : 区域 : 两个区域只在小的侧面上 ( 其他侧面的可用的区太小了, 宽不到 1.5mm) 宽度 (W):2 到 2.5mm ( 可用的区为 3mm 宽 ) 高度 (H): 大约 3mm ( 物体高度的一半 ) 长度 (L):L H H L W 3.6. MODUS OPERANDI WITH MICRO-SPATULA 用微铲的操作手法 - Get a small amount of mixture at the end of the micro-spatula. 在微铲上取小量的混合物. - Verify that the viscosity is high enough to avoid overflow. 验证粘度足够高, 以避免溢出. - Put down this amount on the board area at right angle between board and body take care not to push the glue below the module body to avoid overflow under the module body. 在板与物体之间的角度把这部分混合物放在板上, 小心不要把下面的胶水推到模块的身体下面, 以避免在模块下溢出. - Repeat these steps to make the spot grow, until its shape looks like the bracket. 重复以上步骤, 使点生长, 直到它的形状看起来像支架. Doc. N :3641-0842-1 Page 10/11
3.7. MODUS OPERANDI WITH DISPENSER 用着分配器的操作方法 - Set up the parameters of the dispenser (time, pressure), according to the size of syringe and dip, in order to get a small amount of mixture at the end of the dip. 根据注射器和倾角的大小设置分配器的参数 ( 时间, 压力 ), 为了在倾角的底部得到小量的混合物. - Verify that the viscosity is high enough to avoid overflow. 验证粘度足够高, 以避免溢出. - Inject a small spot of resin on the board at the angle between the board and the body take care not to push the glue below the module body to avoid overflow under the module body. 在板与物体之间的角度向板上注入一小点树脂, 小心不要把下面的胶水推到模块的身体下面, 以避免在模块下溢出. - Repeat these steps to make the spot grow, until its shape looks like the bracket. 重复以上步骤, 使点生长, 直到它的形状看起来像支架. 3.8. JUST A FEW INFORMATION ABOUT SOLUTIONS (2) AND (3) 解决方案 (2) 和 (3) 的一些信息 : For solution (2) 解决方案 (2) : - The usage of a time/pressure controlled dispenser is mandatory. 时间 / 压力控制分配器的使用是强制性的. - The number of holes through the board for injection must be defined by the customer (a number of 3 holes is a good practice for 3D2D4G72UB3652). 客户必须确定注射孔的孔数 ( 对于 3D2D4G72UB3652 来说三个孔是一个很好的做法 ) - The volume/mass of adhesive to inject has to be theorically defined (size of each underfilling spot + volume of the hole for injection). 必须从理论上定义胶粘剂注入的体积 / 重量 ( 每个底部填充点的尺寸 + 注射孔的体积 ) - Use a precision balance to measure the mass/volume dispensed by one injection. 使用一种精密天平来测量一次注入的分配的重量 / 体积. For solution (3) 解决方案 (3) : - The design of the clamp must be defined by the customer, according to its requirements. 夹具的设计必须被客户自定义. Doc. N :3641-0842-1 Page 11/11