33 5 Vol.33,No.5 2012 10 JournalofHebeiUniversityofScienceandTechnology Oct.2012 :1008-1542(2012)05-0453-06 /,, ( 河北科技大学机械工程学院, 河北石家庄 050018) : 利用计算流体力学软件 FLUENT 的凝固 / 熔化模型, 对双层壁圆筒内填充的铝硅合金相变材料的熔化 / 凝固过程进行了数值模拟, 得到了在第 3 类边界条件下圆筒内相变材料在凝固 / 熔化过程中的动态温度场分布 相界面移动规律及凝固 / 熔化时间等, 对蓄热装置的设计及实验研究 提供了重要的参考价值 : 相变材料 ; 熔化 ; 凝固 ;FLUENT :TK02;TK124 :A Numericalsimulationonmeltingandsolidification processofaluminum-siliconaloy CUIHai-ting,ZHANG Gai,JIANGJing-zhi (ColegeofMechanicalEngineering,HebeiUniversityofScienceandTechnology,ShijiazhuangHebei050018,China) Abstract: Byusingthesolidification /meltingmodeloffluentsoftware,themeltingandsolidificationprocessofthealumi- num-siliconaloyinacylinderheatstoragewithdoublewalweresimulatednumericaly.consideringthethirdkindofboundary condition,thedynamictemperaturefielddistributionandthepositionofthephaseinterfacechangemovingwithtimeareob- tained.andthemeltingandsolidificationdurationtimeisalsocalculated.theresultshaveimportantreferencevalueforthe numericalsimulationofthephasechangeproblemandthedesignofphasechangeenergystoragedevice. Keywords: phasechangematerial ;melting;solidification;fluent [1],,, ;, 45%~55%;,, [2-4] FLUENT, /, 1 1.1 1, H=600mm, Φ=180mm, :2012-06-29; :2012-08-23; : : (50876004); (ZH2012079); (12124423A) : (1964-),,,,
Δ Δ Δ 454 2012, 20, 10mm;, 4mm, 1,, :1), ;2) ; 3) 2 [5-6] 1.2 3 : 20 图 1 储热装置示意图 Fig.1 Schematicofheatstoragedevice 20 3 PCM( ), 1 表 1 铝硅合金相变材料物性参数 Tab.1 PhysicalpropertiesofAl-Sialoy PCM /(kg m -3 ) /(kj kg -1 K -1 ) /(W m -1 K -1 ) / /(kj kg -1 ) 2250 1970 180 570 450 2000 1740 70 - - 2 [7] FLUENT / β= ( ρ H) t + ( ρ 珗 vh)= (κ H =h+δh, T h =h ref+ c p dt, T ref ΔH =βl, β=0ift < T, β=1ift > T, T -T T -T T)+S, ift < T < T : ρ ;t ;H ;h ref ( );h ;ΔH ;L ; β ;c p ;κ ;T 3 FLUENT 3.1 FLUENT GAMBIT,FLUENT GAMBIT Quad, 2 3.2 GAMBIT FLUENT, 2D ( ), Solidification & Melting [8] 3 80 W/ (m 2 K) SIMPLE
5 / 455, PCM PCM patch, 298 K, 923K 10~ 30s 4 4.1 图 2 Fig.2 蓄热装置网格划分 Meshofheatstoragedevice 3 PCM, 4 PCM PCM 17000s PCM, PCM ;, PCM 1.0, PCM ;, 图 3 熔化过程 PCM 区平均温度曲线 图 4 熔化过程 PCM 区液相率曲线 Fig.3 TemperaturechangeonPCMareainmeltingprocess Fig.4 LiquidfractionchangeonPCMareainmeltingprocess 5 6 35000s 5,,,, 6,, 35000s,PCM, 7 8 421000s, PCM 8, PCM 1.0, 275000s 421000s, 243min 7, PCM,,PCM,PCM
456 2012 图 5 35000s 时温度分布图 Fig.5 Temperaturedistributionat35000s 图 6 35000s 时液相率分布图 Fig.6 Liquidfractiondistributionat35000s 图 7 421000s 时温度分布图 Fig.7 Temperaturedistributionat421000s 图 8 421000s 时液相率分布图 Fig.8 Liquidfractiondistributionat421000s 4.2, 923K (673K), patch PCM 923K 673K 9 PCM, 10 PCM 9 10,PCM, PCM PCM 0,,, 11 12 5000s PCM, 12, 5000s,PCM
5 / 457 图 9 凝固过程 PCM 区平均温度曲线图 Fig.9 TemperaturechangeonPCMareainsolidificationprocess 图 10 凝固过程 PCM 区液相率曲线图 Fig.10 LiquidfractionchangeonPCMarea insolidificationprocess 图 11 5000s 时温度分布图 Fig.11 Temperaturedistributionat5000s 图 12 5000s 时液相率分布图 Fig.12 Liquidfractiondistributionat5000s 13 14 10000s, PCM 14 图 13 10000s 时温度分布图 Fig.13 Temperaturedistributionat10000s 图 14 10000s 时液相率分布图 Fig.14 Liquidfractiondistributionat10000s
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