YF-PCB Presentation.pptx

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1 Shenzhen YiFang Electronics Co., Ltd. 公司地址 : 深圳市南山区南油学府路中润大厦 B 座 12 楼工厂地址 : 深圳市宝安区西乡钟屋新工业区 65 栋 TEL: Fax: 电话 : 传真 : yfmarket@163.com lylpcb@163.com

2 主营 : 大功率 LED 铝基板铜基板插件式铝基板 ( 路灯板射灯板日光灯板 ) 长条形铝基板等单双面铝基板等. 拥有全套电路板生产和检测设备, 全面执行 ISO9001 体系, 现不仅可生产 20 层以下各种 FR-4 电路板, 还可生产金属基电路板, 产品广泛适用于 : 路灯照明草坪灯日光灯电子机械通讯等有散热要求行业客户, 公司已取得 UL 认证, 认证号码 :E 拥有一支从事线路板生产的专业化队伍及全套国内领先的电路板生产检测设备, 公司各层管理全面严格推行 ISO9001:2000 国际质量体系认证的标准, 从而保证了产品的质量我公司专业从事各类金属基板和 20 层以下各种 FR-4 电路板生产和研发的高科技企业, 所生产的各种铝基板铜基板铁基板等金属基板以及各种 FR-4 电路板等产品, 可与国外先进产品相媲美主要产品有单面单层单面多层双面单层双面多层等大功率 led 贴片金属基板插件式金属基板等产品广泛应用于照明 ( 如路灯照明草坪灯日光灯舞台灯光等 ) 电子机械通讯汽车等有散热需求的行业领域公司自 2005 年成立以来, 秉承高质价优高效准时的经营理念, 始终把客户的需要做为我们追求的目标, 竭诚为国内外客户提供满意的产品, 坚持以最优质的产品, 最完善的售后服务回馈新老客户, 赢得了广大客户的支持和信赖!

3 At YiFang we have, collectively, more than 5 years experience in every PCB manufacture and such as we have produced a unique suite of services tailored with our customers in mind through quality product, on-time delivery,quick-turn manufacturing capability, competitive price. Professionally we are making Metal backed PCB including Aluminum backed PCB, copper backed PCB which specifies for LED Technology with wide range thicknesses to achieve better heat dissipation, and Multilayer up to 20 layer FR-4 PCBs.

5 企业宗旨 : 不懈追求完美竭诚服务客户价值观念 : 一切价值来源于优良的品质企业精神 : 精通专业实现卓越勇于超越管理理念 : 企业提升员工价值员工提升客户价值客户提升企业价值共同提升社会价值发扬团队精神提升个人价值创造企业辉煌质量方针 : 实施科学管理控制生产过程保证产品质量满足客户要求环境方针 : 实施清洁生产使用环保物料减少物料耗费创建绿色企业保护地球环境业

6 Aluminum Backed PCB/ 铝基线路板 Copper Backed PCB/ 铜基线路板 Ferrous/ Iron Backed PCB/ 铁基线路板 FR-4 PCB/ 玻纤板

7 Products 产品分布其他 10% FR-4 多层板 24% 单面铝基板 43% FR-4 双面板 10% 双面铝基板 13%

8 45,000, ,000, % 35,000, % 30,000, ,000, % 20,000, ,000, % 10,000, ,000, Expected Turnover/ 产值 Growth Rate/ 增长率

9 UL 认证 /ULcertificate: E Aluminum Backed PCB UL 认证 /ULcertificate: E FR-4 PCB

10 通过 ISO 质量管理体系认证

11 Getting SGS compliance for our green products keeps YiFang to pursue the road of green sustainable development and continuous innovation to achieve environmental protection and benefits of a win-win.

12 Single Sided Aluminum Backed PCB Process: Item Treatment 1. Laminate Cutting 2. CNC-Drilling 3. Scrubbing 4. Circuit mask 5. Pre-cure 6. Exposure, Development 7. Circuit checking 8. Etching 9. Etching checking 10. CNC drilling 11. Solder mask 12. Pre-cure 13. Exposure,Development 14. Solder mask checking 15. Cure 16. Legend screen 17. Cure 18. Surface treatment 19. Final Shaping,V-cut 20. E-test 21. Visual Inspection 22. O.Q.C 23. Packing 24. Shipping 序号工序名称 1 开料 2 钻孔 3 磨板 4 丝印感光线路油墨 5 预焗 6 曝光显影 7 线路图形检查 8 蚀刻线路 9 蚀刻检查 10 数控打孔 11 丝印感光防焊油墨 12 预焗 13 曝光显影 14 防焊图形检查 15 高温固化 16 丝印文字 17 高温固化 18 表面处理 19 成型 V-CUT 20 E-TEST 21 外观检查 22 性能测试 23 包装 24 入库

13 产品类型 Product Type AL - back 1 layer 基板类型 Laminate / substrate Material Aluminum base( 1100, 5052, 6061 ) with coper circuit layer Copper base with coper circuit layer Ferrous/ Iron base with coper circuit layer Stainless Steel with coper circuit layer 最大板尺寸 Maximum Panel size 20 " x 24 " ( 1170mm x 600 mm) 铜箔厚度 Copper Thickness 0.5oz, 1oz, 2oz, 3oz and 4oz 介质层 Dielectric Thickness (to Substrate) 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm 基板厚度 Substrate Core Thickness 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm 成品厚度 Finished board thickness 0.4mm to 4.0mm 厚度误差 Thickness tolerance +/-10% 外型加工 Aluminum machining Drilling, Tapping, Milling, Routing, Die-Punched, stamping available 最小孔尺寸 Minimum finish hole size 0.25mm 耐压性 Maximum working voltage 2.5kVDC (0.075mm Dielectric), 3.75kVDC (0.15mm Dielectric) 最小线宽 Minimum Track Width 0.20mm (8 Mil) 最小线距 Minimum Track gap 0.20mm (8 Mil) 最小 Pad 间距 Minimum SMD pad pitch 0.2mm (8Mil) 表面处理 Finishes HAL, Flash Gold plate, Tin, Nickel, OSP 阻焊颜色 Solder mask colour White, Black, Others Available 文字颜色 Legend colour Black, White, Others Available 电气测试 E-Test Yes ROHS ROHS Yes 制作标准 Reference Standards IPC-A-600G Class 2 特殊孔 Special Holes Spot facing, Cup holes 资料输入 Data Input Gerber, CorelDraw, Autocad, Protel

14 Aluminum Backed PCB

15 Aluminum Backed PCB

16 Aluminum Backed PCB

17 Aluminum Backed PCB

品质标准 : 1. 钻孔公差 1.1 孔径公差要求 ±0.025mm; 1.2 孔径精确度要求 ±0.070mm 范围内 ; 1.3 钻孔最小孔径为 0.25mm, 最大一次成孔 6.5mm; 1.4 冲孔最小孔径为 0.7mm, 公差 ±0.05mm; 1.5 板面无擦花披锋漏钻孔和错钻 ; 1.6 沉铜和镀铜孔壁镀铜厚度按 IPC 标准或客户要求 2. 图形转移 2.

18 品质标准 : 1. 钻孔公差 1.1 孔径公差要求 ±0.025mm; 1.2 孔径精确度要求 ±0.070mm 范围内 ; 1.3 钻孔最小孔径为 0.25mm, 最大一次成孔 6.5mm; 1.4 冲孔最小孔径为 0.7mm, 公差 ±0.05mm; 1.5 板面无擦花披锋漏钻孔和错钻 ; 1.6 沉铜和镀铜孔壁镀铜厚度按 IPC 标准或客户要求 2. 图形转移 2.1 线路按客户要求 ±10%~20%; 2.2 最小线路 0.075mm, 线隙 0.15mm, 最小焊环 0.07mm 3. 图形电镀 3.1 镀镍 5μm 镀金安客户要求 ; 3.2 镀层结合牢固, 无变色, 无粗粒 4. 绿油 / 字符 4.1 绿油厚度 12~15μm; 4.2 绿油 / 字符无脱落, 无软化, 标志清晰 ; 4.3 绿油耐焊性 260±10 C, 熔锡表面 10 秒 ; 4.4 热固绿油硬度热度 6H,UV 油度 4H 以上 4.5 碳油碳油 ( 长度 20mmX 宽 3mm) 最大阻值按客户要求 5. 喷锡 5.1 喷锡厚度 3~5μm, 允许两面厚度不等 ; 5.2 喷锡无孔塞无锡灰无发黑表面平滑均匀 6. 翘曲度弓曲和扭曲度 0.75% 7. 外形加工 ( 啤板 / 铣板 ) 7.1 铣板公差 ±0.15mm; 7.2 啤板公差 ±0.12mm 8. FQC/ 电脑测试 8.1 开路短路电脑测试合格率 99.9% 以上 ; 8.2 目检合格率 98% 以上 9. 修理 9.1 每面修理不超过 2 点, 整板不超过 3 点 ; 9.2 表面无擦花露铜等缺陷 5.0 本公司在制程中对品质严格控制, 外观 100% 目检 : 对一般问题按 AQL2.5 抽查, 并按 IPC 标准允收 6.0 本公司对出货之产品都作常规范性能测试, 以检查产品是否符合品质标准常规范性能测试包括 : 可焊性耐焊性耐热冲击性孔径及外形尺寸等

19 FR-4 PCB

20 FR-4 PCB

21 FR-4 PCB

22 FR-4 PCB

23 Item Process Machine 设备 1 Silk Screen AutoType Printing M/C 自动丝印机 2 Legend Printing Manual Type Printing M/C 手动丝印机 3 Wet Process Developping Line 显影线 4 Wet Process Etching Line 蚀刻线 5 Wet Process Brush Line 磨板线 6 Wet Process Pre-Clean Line 预清洗线 7 Wet Process PP Line 电镀线 8 Wet Process PTH Line 沉铜线 9 Exposure Exposure M/C 曝光机 10 Positioning CCD Hole Punching M/C CCD 打孔机 11 UV UV M/C UV 机 12 Baking Oven 烤炉 13 Final Shaping Routing M/C 锣机 14 Final Shaping V-cutting M/C V-cut 机 15 Final Shaping Punching M/C 冲床 16 Packing Packing M/C 包装机 17 E-Test Dedicated Tester 专用机 18 E-Test Flying Probe Tester 飞针机 18 CNC CNC Drilling M/C 钻机

24 2-Head Routing M/C 双头锣机 4-Head Drilling M/C 四头钻机 Drilling M/C 双头钻机 Routing M/C 单头锣机

25 Develop-Etch-Strip Line 显影蚀刻退膜线预清洗线 Pre-Clean Line

26 Screen Printing Machines 丝印机 ( 自动 / 手动 )

27 Exposure Machine 7Kw/8Kw 曝光机

28 PTH Line 沉铜线 Pattern Plating Line 电镀线

29 Oven 烤箱 V-Cutting M/C V-Cut 机

30 品质目标 : PCB: 客户投诉 1% 双面板成品合格率 98.8% 多层成品合格 97.5% 服务宗旨 : 平我们将尽最大努力最大程度满足客户的需求, 做到同行业中一流水服务准则 : 我们将在最短时间内响应客户提出的问题, 并以最专业的态度最热心的服务积极解决问题

31 YiFang incorporates produce quality control system even from the early stage of tooling preparation, down to each manufacturing process and eventually to the final stage of produce testing, inspection and audit. All employees are trained to be 'customer-focus' and 'quality-oriented' according to the standards set forth in the ISO-9000:2000 and IPC-A-600G systems. YiFang s quality policies and procedures define clearly the internal inspection and testing requirements. An independent quality team tracks and monitors the level of customer s satisfaction on continuous basis to ensure the accuracy and consistency in quality assessment. In summary, YiFang s quality policy is to provide all customers a package of products and services that will fulfill or even exceed their requirements. The management and staff are all committed to zero-defect, based on continuous process improvement and quantitative control analysis.

Microsoft PowerPoint - HDI_process_for customer.ppt

Microsoft PowerPoint - HDI_process_for customer.ppt 0 HDI PCB 生产流程介紹 HDI Manufacturing Process Flow Pre-engineering Pattern imaging 1 HDI PCB 生产流程介紹 Mechanical drilling Cu plating Etching Pattern imaging Laminating Solder Mask Drilling Surface Finished