JOURNALOF WUHAN UNIVERSITYOFTECHNOLOGY Vol.33 No.12 Dec.2011 DOI: /j.issn ,,,, (, ) : Ni-P (SEM) X (XRD

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1 JOURNALOF WUHAN UNIVERSITYOFTECHNOLOGY Vol.33 No.12 Dec.2011 DOI: /j.issn ,,,, (, ) : Ni-P (SEM) X (XRD) (EDS) 200~250 : ; ; ; ; : TQ153.5 : A : (2011) StudyofCoatingPerformanceandChemicalNickel-plating onfluoropolymerplastic ZHANG Min,LIAO Hui-wei,ZHOU Yuan,PAN Ya-mei,JIA Jin-deng,JIANG Shan (ColegeofMaterialsScienceandEngineering,SouthwestUniversityofScienceandTechnology,Mianyang621010,China) Abstract: Ni -Pplating wassuccessfulyproducedusingelectrolessplatingtechnologyonfluoropolymerplastic.the morphology,growthpatern,component,structure,corrosionresistanceandelectrochemicalimpedanceofni-pdepositson PTFE membranewasstudiedbyscanningelectronmicroscopy (SEM),X-raydifraction (XRD),energydispersivespec- troscopy(eds)andelectrochemicalworkstations.thecoatingisuniform,denseandhasgoodperformance.coatingcan improvesignificantlyelectroconductibilityoffluorineplastic.heattreatmentatbetween200 and250 ishelpfultoin- creasethecoatingcrystalizationdegreeandimprovecoatingconductivity.ithasbeencheckedthatthecorrosionresistance ofcoatingisfinethroughthestaticweightlessnesscorrosiontestandelectrochemicaltest. Keywords: electrolessplating ; fluorineplastic; electrochemicalimpedance; electroconductibility; corrosionre- sistance [1] Ni-P [2] [3-4] [5],X Ni-P [6-7] [8] : : ( ). : (1987-),,. zgmn12@163.com

2 ( 40mm 40mm 0.1mm) : [9] 1) : ) :10g/L,10mL/L 15~30, 10 min 3) :0.5g/L,10mL/L, 15~30, 10 min :28g/L,30g/L,15g/L,27g/L,0.1~1.5mg/L,pH 4.4, , 2,, 2(d) Ni-P 20μm, 250 1h Ni-P 3 5min, 10min,, 20 min,

,, : 15 3(d), 3(e), 50min, 2.3 Ni-P EDS 4 C H O 3 Ni-P Ni 74.62 %,P 7.05 % 5 Ni-P X 5, 2θ= 31.8,37.2,41.6 Ni-P 2θ= 44.6,, 2.

3 ,, : 15 3(d), 3(e), 50min, 2.3 Ni-P EDS 4 C H O 3 Ni-P Ni %,P 7.05 % 5 Ni-P X 5, 2θ= 31.8,37.2,41.6 Ni-P 2θ= 44.6,, 2.4 C F ( a) Ni-P ( b) 1) 1 a b 10 %H 2SO 4, /h ,15h a a /g a b b /g

4 Ni-P 2)Tafel a b 10% H 2SO V/s, Tafel, 6, 2 2 a mV, b mV 141.2mV; b 31.62μA/cm 2, a 574.4μA/cm μA/cm 2 a 68.8 Ω cm -2 b Ω cm -2, Ω cm -2 Ni-P 2 Tafel Ecorr/mV icorr/( μ A cm -2 ) R p /(Ω cm -2 ) a b ) 7 a Nyquist 10% H 2SO 4 10d b min 2),,Ni-P 8 100~200, 200~ ~ ,,, (260 ) 200~250 3 a.,, Ni-P

5 ,, : 17 b. XRD EDS c. Ni-P d. 200~250 [1] MohamedN A.Structure-propertyRelationshipsforNovelWholyAromaticPolyamideHydrazidesContainingVarious ProportionsofPara-phenyleneand Meta-phenyleneUnits-V:EvaluationoftheElectricalSurfaceConductivityofSeveral MetalizedPlasticFilms[J].MaterialProperties,2007,26: [2] Liu W L,Chien W T,Jiang M H,etal.StudyofNd:YAGLaserAnnealingofElectrolessNi-PFilmonSpiegel-ironPlate bytaguchimethodandgreysystem Theory[J].JournalofAloysandCompounds,2010,495: [3],,. [J].,2010,23(1): [4],,,. SnO2 [J].,2011,33(7):1-4. [5],,,. ZnSe [J].,2008,30(9): [6] LuoL M,YuJ,LuoJ,etal.PreparationandCharacterizationofNi-coatedCr3C2PowderbyRoom TemperatureUltrason- ic-assistedelectrolessplating[j].ceramicsinternational,2010,36: [7],,. [J].,2011,33(7):5-9. [8] Stremsdoerfer G,Omidvar H,Roux P,etal.Depositionof Thin Filmsof Ni-P and Ni-B-P by Dynamic Chemical Plating[J].JournalofAloysandCompounds,2008,466: [9],,,. [J].,2009,18(9):47-51.

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