Slide 1

Size: px

Start display at page:

Download "Slide 1"

浑逄
5 years ago
Views:

1 英特尔全球企业的数据中心未来发展方向及其高性能计算 Gregg Wyant 英特尔 IT 策略架构和创新部门总裁首席架构师 Shesha Krishnapura 英特尔 IT 工程计算部门首席工程师 IAIS004

2 议程数据中心未来展望高性能计算在英特尔企业全球环境中的应用 2

3 数据中心未来展望 Gregg Wyant 3

4 英特尔数据中心概览英特尔数据有四个部门负责满足来自不同领域 (DOME) 的数据中心需求 : D O M E 芯片设计工程计算日常办公通用目标工厂制造晶圆厂 / 封装厂企业级应用支持芯片设计在英特尔占最多的服务器资源支持典型的 IT 运行和客户服务支持工厂封装和制造所需计算服务支持电子商务程序和 ERP 等企业级别应用程序运行在英特尔,70% 的数据中心服务器为 D( 芯片设计 ) 服务, 其他的 30% 用于 O( 日常办公 ),M( 晶圆工厂 ) 和 E( 企业级应用 ) 4

英特尔数据中心发展回顾 1995-2000 2000-2004 2005-2007 2008-2009 高速增长摸索发展

对数据中心进行评估芯片设计规范化开始进行一些提高数据中心效率的探索开始制定一些策略开始组建专门负责数据中心的部门

5 英特尔数据中心发展回顾高速增长摸索发展英特尔大型数据中心需求增长各个数据中心硬件独立购买芯片设计以地理上的分站为单位进行缺乏统一的统筹安排资源的系统初步整合对数据中心进行评估芯片设计规范化开始进行一些提高数据中心效率的探索开始制定一些策略开始组建专门负责数据中心的部门制定策略规划整合统筹的长远规划更加专注于数据中心整理合并开始执行策略和规划总结经验持续优化经验总结优化策略分析数据中心合并的回报率根据分析结果, 调整专注重点 5

6 为什么要调整数据中心的模型? 旧模型基于层次和部门的由信息部门负责驱动的策略制定专注于如何对应对于海量级的数据中心支持程序运行时有限地运用虚拟化首要工作是如何提高信息部门的效率, 只提供有限服务选项根据空间进行设计缺乏可维护的设计缺乏透明的可统计的数据新模型基于业务需求的业务部门端到端的策略整合专注于如何优化数据中心策略应对根据业务需求的各个方面支持程序运行时最大程度的运用虚拟化首要工作是如何帮助提高整个公司和公司客户的效率, 提供多种适用于业务需求的服务选项根据业务目标进行设计加入更加可维护的设计, 更方便管理透明的数据统计 ( 如开销使用率运行健康状态和计划等 ) 6

7 7

8 新型数据中心模型业务需求应用程序集成, 接入服务数据中心纵向集成控制解决方案 / 应用程序计算部署 ( 服务器存储和网络 ) 附属设备部署核心服务授权, 目录, 服务 / 信息总线, 引用程序安全授权服务器, 操作系统, 虚拟化, 动态池管理, 数据库存储域网络 (SAN), 网络文件系统, 磁盘簇 (JBOD), 虚拟存储, 备份和恢复 (BAR) 路由和交换服务, 连接 /VPN, 防火墙, 运载平衡 / 运载缓存, DNS/DHCP, 代理服务器数据中心容量, 电力, 供热通风与空调工程, 服务器预测 / 架设标准监控, 预备, 软件部署, 安全补丁, 统一管理 D 芯片设计,O 日常办公,M 工厂制造,E 企业级应用 8

9 英特尔高性能计算内部实践和经验共享 Shesha Krishnapura

10 内容简介英特尔微处理器设计对计算能力有着极高的要求在每一代处理器设计最后一步的流片 (Tapeout) 阶段, 对计算能力的需求更是会呈现爆炸性增长英特尔 IT 运用高性能计算 (HPC, High Performance) 来解决大规模的计算和扩展性需求, 并在计算性能, 稳定性和减少开销方面都得到了很大的提高 10

11 芯片设计阶段逻辑设计逻辑建模逻辑仿真物理设计综合转换电路时间分析通道布局电路时间校验物理校验流入流出掩膜准备 11

12 流片计算面临的挑战 10 倍的计算需求 45 纳米处理器芯片技术在计算方面的需求是 65 纳米的 10 倍多减少流片时间从 25 天到 10 天参考 : 基于 65 纳米技术的第一代 CPU 产品的流片时间是 25 天挑战 : 基于 45 纳米技术的第一代 CPU 产品的需要把流片时间控制在 10 天之内服务器内存需求增长至 128GB 以上大规模内存需求控制在 200GB 以内对计算环境稳定性有更高的要求在过去的一年内出现了大约 80 个计算相关的问题减少 2000 万美元的开销所有任务须在 11 个月内完成 12

最大化利用的开放标准化模块, 以建立一个敏捷的运行环境把能否更加有效的部署作为解决方案的质量标准之一定期地做性能横向测评,

13 流片高性能计算的策略制定任务目的为流片 (Tapeout) 准备更稳定的优化的高性能计算环境策略充分发挥业界和公司内部专家资源, 设计为流片 (Tapeout) 服务的高性能计算架构结合新一代过程技术 (Process Technology ), 优化解决方案最大化利用的开放标准化模块, 以建立一个敏捷的运行环境把能否更加有效的部署作为解决方案的质量标准之一定期地做性能横向测评, 定期查看是否有最新的技术和最好的可方法可以采用高性能计算 (HPC) 和过程技术 (Process Technology) 的更新换代保持一致 13

14 14 高性能计算解决方案

15 高性能计算实现了规模性和高稳定性 (13.20X) (7.39X) (3.95X) (1.00X) 15

16 高性能计算的存储解决方案

17 2005 年性能瓶颈主服务器负责分发 800 个 OPC 任务主服务器负责分发 1600 个 OPC 任务一个由 800 个处理器内核组成的从机集群一个由 1600 个处理器内核组成的从机集群 1 台 NAS 存储服务器 1 台 NAS 存储服务器输入数据文件 100+ GB 输入数据文件 100+ GB 在一个吞吐周期内不能改变 17 OPC 光学邻近效应修正

18 2005 年非高性能计算解决方案主服务器负责分发 8000 个 OPC 任务 10 个从机集群 8000 个处理器内核 10 台 NAS 存储服务器输入数据文件 100+ GB 18

19 19 通过并行存储获得突破

20 高性能计算的大规模内存解决方案

21 第一代 HPC 中的 16 核 256GB 内存服务器左边 : 基于四个单核处理器的一个节点, 有 64GB 内存右边 : 通过四个节点相互连接得到一个 256GB 系统 21

22 第一代 HPC 中的 32 核 256GB 内存服务器左边 : 基于单个双核处理器的一个节点, 有 64GB 内存右边 : 通过四个节点相互连接得到一个 256GB 系统 22

23 第一代 HPC 中的 64 核 512GB 服务器通过第一代高性能计算环境 (HPC-1) 组建的大规模内存服务器, 由 8 个节点组成的, 拥有 512GB 内存每个节点拥有 64GB 内存四个双核处理器 23

24 第二代 HPC 中的 96 核 1TB 服务器左边 : 一个节点, 基于四个 6 核处理器, 拥有 256GB 内存右边 : 四个节点相互连接组成 1-TB 系统 24

第一代和第二代 HPC 大规模内存服务器比较 HPC-1 HPC-2 处理器总数 32 或者 64 96

25 第一代和第二代 HPC 大规模内存服务器比较 HPC-1 HPC-2 处理器总数 32 或者内存容量 512 GB 1 TB 数据中心机架所需空间 24U 16U 电量消耗 7.3 KW 3.6KW 25

26 高性能计算的服务器解决方案

27 英特尔四核服务器在运行 OPC 上的优势 30 台基于英特尔至强 5150 双核处理器的服务器 15 台基于英特尔至强 X5355 四核处理器的服务器 10 台基于英特尔至强 E5450 四核处理器的服务器 6 台基于英特尔至强 E5570 四核处理器的服务器每台服务器 16GB 内存 (4GB RAM/ 核 ) 每台服务器 32GB 内存 (4GB RAM/ 核 ) 每台服务器 32GB 内存 (4GB RAM/ 核 ) 每台服务器 24GB 内存 (3GB RAM/ 核 ) 总电量消耗 9360 瓦特总电量消耗 6450 瓦特总电量消耗 3200 瓦特总电量消耗 2250 瓦特 120 个分布式 OPC 任务 120 个分布式 OPC 任务 80 个分布式 OPC 任务 78 个分布式 OPC 任务 11 分钟 41 秒 11 分钟 04 秒 11 分钟 36 秒 10 分钟 25 秒以上数据基于 2006 年 5 月 2006 年 9 月 2007 年 9 月和 2009 年 2 月英特尔的内部测量结果 27 Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Intel Performance Benchmark Limitations..

28 运行 OPC 程序时性能表现以上数据基于 2007 年 5 月 2007 年 9 月和 2009 年 2 月英特尔的内部测量结果 28 Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Intel Performance Benchmark Limitations. April 1, 2009

reflect the approximate performance of Intel products as measured by those tests.

29 英特尔架构为 OPC 带来性能提升 (13.20X) (7.39X) (3.95X) (1.00X) 以上数据基于 2007 年 5 月 2007 年 9 月和 2009 年 2 月英特尔的内部测量结果 29 Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Intel Performance Benchmark Limitations.

30 总结高性能计算算给英特尔的流片 (tapeout) 带来了显著的商业价值在满足 13 倍于以往的计算需求同时, 也带来可 11 倍的稳定性和可靠性提升为英特尔贡献了 4472 万美元的净现值高性能计算研究增强了英特尔把最新芯片技术更快带给市场的能力从 65 纳米到 45 纳米, 把流片 (tapeout) 时间从 25 天减少到了 10 天 30

31 可执行的建议高性能计算不意味着高投入基于 Intel 多核架构的平台使高性能计算 (HPC) 成为经济可行的方案让高性能计算 (HPC) 帮助你成功就像我们在英特尔内部所实践的那样 31

32 Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright 2010 Intel Corporation. 32

33 Risk Factors The above statements and any others in this document that refer to plans and expectations for the first quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Many factors could affect Intel s actual results, and variances from Intel s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the corporation s expectations. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; customer acceptance of Intel s and competitors products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Additionally, Intel is in the process of transitioning to its next generation of products on 32nm process technology, and there could be execution issues associated with these changes, including product defects and errata along with lower than anticipated manufacturing yields. Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel s response to such actions; defects or disruptions in the supply of materials or resources; and Intel s ability to respond quickly to technological developments and to incorporate new features into its products. The gross margin percentage could vary significantly from expectations based on changes in revenue levels; product mix and pricing; start-up costs, including costs associated with the new 32nm process technology; variations in inventory valuation, including variations related to the timing of qualifying products for sale; excess or obsolete inventory; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; the timing and execution of the manufacturing ramp and associated costs; and capacity utilization;. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management s plans with respect to our investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other. Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel s results could be affected by the timing of closing of acquisitions and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting us from manufacturing or selling one or more products, precluding particular business practices, impacting our ability to design our products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other risk factors that could affect Intel s results is included in Intel s SEC filings, including the report on Form 10-Q. Rev. 1/14/10

Microsoft Word - Atmel-45136A-Pick-Best-Microcontroller-Strom-Eiland-Flodell_Article_CS

Microsoft Word - Atmel-45136A-Pick-Best-Microcontroller-Strom-Eiland-Flodell_Article_CS 如何为您的下一款设计选出最好的 8 位或 32 位微控制器作者 : Atmel 产品营销高级总监 Oyvind Strom Atmel 产品营销总监 Andreas Eieland Atmel 研发工具部门高级产品营销经理 Henrik Flodell 不久之前, 嵌入式系统还是既昂贵