4-1 Trasmitter Receiver Tx Rx Trasmitter Tx Receiver Rx Transceiver LD LED 2001 Optical Amplifier Modulator
4-2 4-1 4-1-1 ( ) LED LD LED LD VCSEL LED LD PIN APD 1. 2. Linewidth 3. 4. 5. 6. (Laser Diode LD) (Light Emitting Diode LED) LD LED Fabry-Perot(F- P) (DFB ) (VCSEL) DFB CATV
4-3 ( ) Fabry-Perot (F-P) F-P ( ) FTTC 1.3µm ( ) F-P (DFB ) Linewidth ( 100 ) ( Gbps) ( ) (VCSEL) (Vertical C avity Surface Emitting Laser VCSEL) parallel interconnect VCSEL LD(ELD) VCSEL ( ) VCSEL ELD VCSEL ( 20nm) WDM FTTH FTTC 0.98µm 0.85µm VCSEL Fast Ethernet(125Mbps) Gigabit Ethernet(1.25Gbps) 850nm 1.3µm Fast Ethernet 850nm (light emitting diode LED)
4-4 Gigabit Gigabit Ethernet 850nm HP Siemens AMP Honeywell 850nm Gigabit VCSEL LD 4-1-1 OC-3 155Mbps OC-12 622Mbps OC-48 2.5Gbps OC-192 10Gbps OC-768 40Gbps 4-1-1 LD ( nm) LD 1310 FP 1310 FP OC-3 1310 FP 1550 DFB 1310 FP 1310 FP OC-12 1310 DFB 1550 DFB 1310 FP 1310 DFB OC-48 1310 DFB 1550 DFB ILM 1310 DFB 1550 DFB ILM OC-192 1550 DFB ILM 1550 DFB ILM OC-768 DFB Unstrategies Unlimited LED 850nm GaAlAs GaAs 1,300nm InGsAsP InP LED
4-5 (Surface Emitting) (Edge-Emitting) ( 10%) 50 100nm LED WAN LAN FTTH FTTC FDDI LED (1) (2) (3) PIN (Positive-Intrinsic-Negative Photodiode) APD (Avalanche Photodiode) PIN 0.6~0.8 A w APD 80 A w PIN PIN GaAs InGaAs 0.85~1.65µm 10Gbps 20Gbps KTH 40Gbps Monolithic 4-1-2
4-6 4-1-1 ST FC SC SFF 20 16 9 (1 9) 9 (2 9) 10 20 ( X-Y-Z ) IC IC Pre-Amplifier GaAs SiGe Agilent / 3.3V port
4-7 4-1-2 Agilent HFBR-5900 HFBR-5903 125 Mbit s MMF (2 km) Small Form Factor Transceiver for FDDI Fast Ethernet (100Base-FX) 4-1-3 LD LD EMI
4-8 1. 2. Heat Sink TEC T hermal Electric Cooler 3. soldering UV UV or E poxy A dhesive (Laser Welding) 4. LD C oaxial DIL D ual In Line Butterfly 1. C oaxial LD TO-CAN receptacle LD TO-CAN 4 pin 10GHz TO-CAN CD-ROM
4-9 4-1-3 TO-CAN LD submount TO MPD Monitor PhotoDiode LD LD 4-1-3 TO-CAN 4 5 6 3 2 1. (Header) 2. (Submount) (LD) 3. 4. (PD) 5. (Cap) 6. (Window) 1 TO 4-1-4
4-10 4-1-4 TO-CAN Submount LD (Die Bonder) (Oven) LD P D (Wire Bonder) (Cap Seal) (Test) D ie Bonder A g paste E poxy LD Wire Bonder IC Cap Seal TO LD chip Vidicon
4-11 2.DIL 4-1-5 DIL pin TO LD TO-CAN PD Wire Bonder Butterfly 4-1-5 DIL 3.Butterfly 10Gbps B utterfly 4-1-6 pin
4-12 4-1-6 B utterfly 4-1-7 4-1-7 B utterfly Detector Substrate LD PACKAGE TEC TEC Thermal Electric Cooler LD D etector TEC pin pigtail
4-13 pigtail LD Metallic Ferrule pneumatic tweezer 4-1-8 x y z LD 4-1-8 pneumatic tweezer metallic ferrule Newport 4-1-9 R oller electrode
4-14 0.1mm butterfly DIL Min-DIL 4-1-9 SONET SDH ATM FDDI Ethernet 155M 622M 1.25G 2.5G 10G 40G pin single in line dual line pigtail pigtail
4-15 4-1-10 LD LED PD TO-CAN TO-CAN Connector Receptacle P igtail OSA Optical Sub-Assembly OSA ESA Electric Sub-Assembly IC EMI Shield 4-1-10 LD LED TO-CAN OSA OSA ESA OSA TOSA Transmitter OSA ROSA Receiver OSA OSA LED LD PIN APD TO-CAN OSA sleeve ferrule 2.5Gbps Isolator N d Y AG OSA Butterfly
4-16 PWS Post Weld Shift PWS PWS N d YAG B utterfly OSA 100% 50% 33.3% 4-1-11 120 o 45 o ± 2 o PWS 4-1-11 N d:yag OSA 4-1-12 9pin SC PCB
4-17 OSA pin 90 o PCB PCB EMI Shield EMI 4-1-12 OSA ESA SC ROSA TOSA ESA / 1. port
4-18 PCB Min-DIL SFF 1 Min-DIL 4-1-13 Min-DIL pin 2*4 TEC Heat-Sink PCB Min-DIL Butterfly DIL 4-1-13 M in-dil Min-DIL DIL TEC
4-19 Min-DIL Butterfly 2 SFF (Small-formfactor SFF) patch panel outlet PCB TIA/EIA-568-B.3 optical-fiber cabling components portion of the commercial building cabling standard TIA (Small-form-factor SFF) / FTTD Fiber-To-The-Desk SFF LC MT- RJ VF-45 MU MTP FJ SFF LC L ucent Connect L ucent Tech. Bell L ab. HITACHI IBM Sumitomo MT-RJ AMP Fujikura Siecor U.S. Conec HP Molex VF-45 V olition 3M C orning Siemens Infineon Cisco Lucent s LC 3M s VF-45 AMP s MT-RJ 4-1-2 SFF / Hitachi IBM Microelectronics Kyocera Methode Molex MRV Communications Senko and Sumitomo Electric Lightwave Cisco Davicom Semiconductor Infineon Microcosm Corning Siemens and MicroSwitch HP Fujikura Siecor Molex and U.S. Conec
4-20 4-1-14 LC MT-RJ VF-45 4-1-14 SFF Lucent HP 3M SFF EMI PCB EMI 3.3V EMI PCB Shield ground 4-1-15 LC 4-1-15 LC Lucent
4-21 2. active alignment C ouple IC PCB DIP SMT passive alignment OE-device alignment mark photolithography 4-1-16 LD PLC C hip Si Infrared light A u-sn solder pad PLC chip PLC chip etch V V-groove V -groove
4-22 4-1-16 LC NTT Flip-Chip micro machine accurancy 1 2 µm 3. F lip-chip LD PIN wire bonding parasitic inductance Flip Chip evaporation sputter UBM U nder Ball Metallurgy
4-23 plating printing solder bump reflow IC pin DIP Dual In-line Package SMT Surface Mount Technology BGA Ball Grid Array IC Flip Chip Flip Chip Laser Array Flip Chip Solder Bump surface tension self alignment 4. Multi-Channel parallel optical data link parallel serial back plane board-to-board LAN multi processor chip chip LD LD Array PD PD Array Flip Chip 4-1- 17 LD A rray
4-24 4-1-17 PD Furukawa 5. 4-1-18 Receptacle WDM 4-1-18
4-25 4-1-4 2001 2000 DWDM DWDM D ark Fiber Line Card KMI 2001 10 2001 14% 26% Channel Card 9% OXC Optical Cross-Connect port Transparent O-E-O OXC Telecom Ethernet LAN E thernet ATM T oken Ring FDDI LAN 1Gbps E thernet L2 L3 Switch Ethernet collision T 1 Gigabit Ethernet 70 Ethernet DataComm E thernet LAN 10Gbps E thernet 10 GbE 10Gbps E thernet SONET SDH 1Gbps Ethernet
4-26 Cat5e Cat6 10Gbps 10Gbps E therne 10Gbps 4-1-19 Telcom OC-48 2.5G OC-192 10G 1T 10T B utterfly 4-1-19 b ps 100T DWDM 10T 40G 8 0 10G 1 76 1T TDM 2.5G 1 60 10G 4 0 100G 2.5G 16 80G 160G 10G 40G 10G 1G 2.5G 1990 1995 2000 2005 2010 Fhjitsu
4-27 Access FTTH FTTH B i-directional Fibre Channel SAN Storage Area Network Board-to-Board C hip-to-chip interconnect Gbps Laser Array Detector Array SONET SDH DWDM ( ) DWDM ( ) ( )
4-28 4-1-20 12,000 10,000 8,000 6,000 4,000 2,000 0 2000 2001 2002 2003 2004 6376 4463 5800 7830 10180 10G 4-1-20 2000 64 40% 2001 2000 30% 2002 2002 2002 2001 2002 2004 32% 4-1-21 2001 IXC LEC 44% 41% IXC IXC LEC
4-29 4-1-21 2001 Submarine 10% CATV 5% IXC 44% LEC 41% Strategies Unlimited 4-1-22 2001 2.5G 10G 38% 37% 10G 14% 4-1-22 2001 Strategies Unlimited
4-30 4-1-23 2004 10G 40G 10G 2.5G 4-1-23 2004 10 Gbps 43% 40 Gbps 3% 155 Mbps 3% 622 Mbps 20% 2.5 Gbps 31% Strategies Unlimited 4-1-24 2001 71% Nortel Cisco Lucent C IENA NEC Fujitsu
4-31 4-1-24 2001 9% 20% 71% Fuji Chimera 2002 4-1-5 LD FP LD DWDM DFB LD VCSEL TO CAN OSA (VCSEL) (SFF) 2001 2.5G SFF LC VF-45 SFF 155M
4-32 2.5G 10G TO-CAN Laser Array Flip-Chip 4-1-20 4-1-25 2001 2001 2000 IC IC IC 2002 2002 2003 4-1-25 8,000 6,000 4,000 2,000 0 2000 2001 2002 2003 2004
4-33 150% 200% 400% 4-1-6 4-1-26 2001 JDS-U 17.8% Alcatel NEC A gere System 4-1-26 2001 39.6% JDS-U 17.8% Alcatel 13.0% 9.2% Agere System 9.7% NEC 10.7% Fuji Chimera 2002 JDS-U 2002 1 temperature tunable Laser DML directly modulated lasers DML 2.5G
4-34 CQF413 2.5G 100 GHz ITU 100 180km 2.5mW 10mW 2001 1 IBM 1 2 7 JDS-U IBM IBM Fibre Channel GbE Telecom JDS-U Datacom IBM Se-Ge IC JDS-U JDS-U Laser Detector IC Modulator A lcatel Optronics 2001 8 ECOC monitoring 50GHz 8 2.5 10 40 Gbit s WDM C L 14pin butterfly DFB F-P Fabry-Perrot filter 2 photodiodes 20mW PLC Agere 2001 Agere IC Allentown CEO A gere IC IC
4-35 12 XENPAK IC
4-36 4-2 repeater 1. 2. (Fiber in the loop) 3. 4. 1310nm~1550nm 1550nm 100~120km 1310nm 60~70km 4-2-1 (1) O FA Optical Fiber Amplifier rare earth ( ) Repeater ( ) 1550nm (EDFA Erbium-Doped Fiber
4-37 Amplifier) (PDFA Praseodymium-Doped Fluoride-Fiber Amplifier) 1310nm OFA 1. 1 100m 2. 10 500mW 3. WDM 4. Isolator 5. Coupler EDFA 4-2-1 4-2-1 EDFA 0dBm 16dBm pump laser (EDFA) window
4-38 EDFA PDH SDH EDFA 4-2-2 EDFA 980 1550WDM 1480 1550WDM LD 4-2-2 EDFA IGI 2001 (2) SOA Semiconductor Optical Amplifier FP-LD FP FPA JLA TWA (1310nm 1550nm)
4-39 (3) RA Raman Amplifier Raman Stoke line DWDM Raman Raman (cascaded) 4-2-1 4-2-1 Pump Pump EDFA ~ mw Raman SOA mw~ W mw EDFA ~ m Raman ~km SOA 0.3mm 2001 OFC EDFA
4-40 4-2-3 EDWA W Waveguide 4-2-3 EDWA Teem Photonics 1989 EDFA FRA EDFA FRA 1 EDFA pump 3 0.53 m 0.66 m 0.81 m 0.98 m 1.48 m 0.98 m 1.48 m EDFA 0.98 m EDFA 1.48 m 0.98 m 1992 0.98 m EDFA 0.98 m 30% 40% 1997 65% 300mW
4-41 200mW 0.98 m 200mW 1.48 m 0.98 m 1.48 m : 098 m 60% 1.48 40% 0.98 m 1.48 m 0.98 m 4 50% 60% EDFA 1.48 m 1.48 m EDFA 1.48 m 0.98 m 1.48 m H. Yamazaki MOCVD 1% 1.48 m 504mW 337mW 2 Raman Raman 1550nm 1400-1500nm 4-2-2 EDFA DWDM DWDM
4-42 Spilter PON 4-2-4 2000 22 2001 30% 2002 2002 2001 2004 32% 4-2-4 4,000 3,500 3,000 2,500 2,000 1,500 1,000 500 0 2000 2001 2002 2003 2004 2220 1553 2020 2725 3543 EDFA EDFA EDFA EDFA 1994 DWDM Corning JDS Uniphase 10G bit s 40G bit s 1999 330 2004
4-43 7.5 (1) (2) WDM CIBC World Market SOA 2002 2004 2 4-2-5 2001 WDM 82.4% 4-2-5 2001 WDM 11.6% 6.0% WDM 82.4% Strategies Unlimite 4-2-6 2001 64% 21%
4-44 4-2-6 2001 21% 15% 64% Fuji Chimera 2002 4-2-3 EDFA CATV EDFA DWDM DWDM C L S band AGC Gain Flatness L -band C L-band EDFA SOA Raman 2002 2002 2003
4-45 4-2-7 3,000 2,500 2,000 1,500 1,000 500 0 2000 2001 2002 2003 2004 180 450 900 1800 3000 4-2-4 4-2-8 2001 JDS-U 23.5% Corning Nortel A gere System A lcatel Optical 4-2-8 2001 23.5% JDS-U 23.5% Alcatel Optical 11.8% Corning 17.6% Agere System 11.8% Nortel UK 11.8% Fuji Chimera 2002
4-46 JDS-U OAB EDFA C L C L band SONET SDH DWDM 2001 4 JDS-U EDFA Couple Filter epoxy L ucent Nortel Marconi JDS-U 2001 EDFA Furukawa 2001 12 WDM pump WDM Raman gain spectrum DWDM 2000 Raman Raman
4-47 4-3 IC