Meeting Date: November 14, 2016 Meeting Location: Taipei, Taiwan IBIS Open Forum Minutes VOTING MEMBERS AND 2016 PARTICIPANTS ANSYS Curtis Clark, Toru Watanabe Broadcom (Avago Technologies) Bob Miller Cadence Design Systems Ken Willis, Brad Brim, Aileen Chen, Lanbing Chen Zhiyu Guo, Mohan Jiang, Rachel Li, Ping Liu Haisan Wang, Yitong Wen, Clark Wu, Dingru Xiao Benny Yan, Haidong Zhang, Wenjian Zhang Zhangmin Zhong, Hui Wang, Jinsong Hu, Wei Dai Rong Zhang, Kent Ho*, Skipper Liang*, Jack Lin* Candy Yu* Cisco Systems Giuseppi Selli, Brian Baek, Hannah Bian, Tonghao Ding Amanda Liao, Cassie Yan CST Stefan Paret Ericsson Anders Ekholm*, David Zhang, Zilwan Mahmod Guohua Wang GLOBALFOUNDRIES Steve Parker Huawei Technologies Yuanbin Cai, Haiping Cao, Zhenxing Hu, Peng Huang Xusheng Liu, Longfang Lv, Guanjiang Wang Chen Yu, Cheng Zhang, Gezi Zhang, Zhengyi Zhu Fangxu Yang, Huajun Chen, Xiao Peng Zhengrong Xu, Xianbiao Wang, Lin Shi Hongcheng Yin IBM Adge Hawes, Luis Armenta, Trevor Timpane Infineon Technologies AG (Christian Sporrer) Intel Corporation Hsinho Wu, Mohammad Bapi, Michael Mirmak, Masahi Shimanouchi, Todd Bermensolo, Zao Liu, Gong Ouyang, Udy Shrivastava, Gianni Signorini, Richard Mellitz, Youqing Chen, Jennifer Liu Luping Liu, Bruce Qin, Yuyang Wang, Denis Chen* Jimmy Hsu*, Thonas Su*, Morgan Tseng* IO Methodology Lance Wang* Keysight Technologies Radek Biernacki, Heidi Barnes, Jian Yang, Fangyi Rao, Stephen Slater, Pegah Alavi, Edwin Young Maxim Integrated Yan Liang, Don Greer, Thinh Nguyen, Joe Engert, Hock Seon, Ahmed Gendy Mentor Graphics Arpad Muranyi, Vladimir Dmitriev-Zdorov, John Angulo, Mikael Stahlberg Micron Technology Randy Wolff, Justin Butterfield 2016 IBIS Open Forum 1
Signal Integrity Software Synopsys Teraspeed Labs Xilinx ZTE Corporation Zuken Mike LaBonte*, Walter Katz, Todd Westerhoff, Richard Allred Ted Mido, Kevin Li, Massimo Prando, Xuefeng Chen Andy Tai, Jinghua Huang Bob Ross (Raymond Anderson) Shunlin Zhu, Fengling Gao, Lili Wei, Zhongmin Wei Bi Yi, Changgang Yin, Yang Yang, Xiaoli Yu Michael Schaeder, Amir Wallrabenstein OTHER PARTICIPANTS IN 2016 AAT Alcatel-Lucent ASUSTek Computer Aurora System Avant Technology BasiCAE Software Technology Celestica easic Edadoc FiberHome Technologies Foxconn Electronics Fujitsu Advanced Technologies Ghent University Gigabyte Technology Gowin Semiconductor H3C Hamburg University of Technology Hanghou Hikvision Digital Technology Hewlett Packard Enterprise Hisilicon Independent Info TM Microelectronics Institut Supérieur des Sciences Appliquées et de Technologie de Sousse Inventec JEITA John Baprawski, Inc. KEI Systems Lattice Semiconductor Leading Edge Lenovo Lite-On Technology Sam Liu* Yishan Li, Yiqing Mao Nick Huang* Dian Yang Jyam Huang*, Chloe Yang* Darcy Liu Allen Wang, Vincent Wen David Banas Deheng Chen, Hong Zhang Yejing Jia Gino Chen*, Ryan Hou*, Mandy HY Su* Shogo Fujimori Paolo Manfredi Chris Tsai*, CJ Wang* Xiaozhi Lin, Qi Zhou Bin Chen, Mao Jun, Xing Hu Jan Preibisch, David Dahl Wenquan Hu Passor Ho*, Corey Huang*, Hellen Lo* Wei Zhen, Carl Gabrielson Aofeng Qian Wael Dghais Zhong Peng Yosuke Kanamaru John Baprawski Shinichi Maeda Dinh Tran, Maryam Shahbazi Pietro Vergine John Lin*, Alan Sun* Steven Chen*, Steven CH Chen*, Sam Lyu* 2016 IBIS Open Forum 2
Marvell Jie Pan, Weizhe Li, Liang Wu, BL Qian, Fang Lv MathWorks Mike Mulligan, Corey Mathis Monsoon Solutions Nathan Hirsch Mostec Ninghua Li, Kaihe Zhang Nanya Technology Corp. Chiwei Chen*, Andy Chih*, Taco Hsieh*, Jordan Hsu* Andre Huang*, Raphael Huang*, George Lee*, Allen Zuo* Northrup Grumman Alex Golian Novatek Vincent Lin*, Willy Lin* Nvidia Corp. Norman Chang*, David Chen*, Chihwei Tsai*, Ann Yen* NXP Jon Burnett Peace Giant Corp. Walter Huang*, Jimmy Liu* Pegatron Corp. Aje Chang*, Stanley Chu* Politecnico di Torino Claudio Siviero, Stefano Grivet-Talocia, Igor Simone Stievano Qualcomm Technologies Guobing Han, Irwin Xue* Quanta Computer Eriksson Chuang*, Scott CH Lee* Rambus John Yan Raytheon Joseph Aday SAE International (Logen Johnson) SAIC Motor Corp Weng Yang Shanghai Zhaoxin Semiconductor Jude Ji Shenzhen Zhongzeling Electronics Nick Huang SILABTECH Biman Chattopadhyary Silicon Motion Technology Matt Lin* Signal Metrics Ron Olisar SiGuys Donald Telian SMICS Sheral Qi Sony Corporation Hiroaki Ammo Sony LSI Design Takashi Hasegawa SPISim Wei-hsing Huang* Spreadtrum Communications Junyong Deng, Steven Guo, Baoping Bian Yanbiao Chu, Nikki Xie, Zhi Wang STMicroelectronics Fabio Brina, Olivier Bayet Technoprobe Alberto Berizzi, Lorenzo Bernasconi, Simona Cucchi Teledyne LeCroy Denny Li, Yifeng Wu Université de Bretagne Occidentale Mihai Telescu Vendorchain Jun Zhao, Jing Luo, Dong Lei VIA Labs Sheng-yuan Lee* VIA Technologies Terence Hsieh*, Jerry Hsu*, Justin Hsu* Winbond Electronics Albert Li* Xpeedic Technology Max Cang*, Mingcan Zhao, Zhouxiang Su, Rui Wang Qionhui Gui, Wenliang Dai, Yuqing Shen Haitao Zhang, Rick Chang*, Zachary Su* Zhejiang Uniview Technologies Weiqi Chen, Jiayun Dai 2016 IBIS Open Forum 3
In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password November 18, 2016 Asian IBIS Summit Tokyo no teleconference December 2, 2016 628 078 024 IBISfriday11 For teleconference dial-in information, use the password at the following website: https://sae.webex.com/sae/j.php?mtid=m0a07ee0ddc25e28af96b4bbad3c17f4b All teleconference meetings are 8:00 a.m. to 9:55 a.m. US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. NOTE: "AR" = Action Required. ------------------------------------------------------------------------------------------------------------------------------- OFFICIAL OPENING The Asian IBIS Summit took place on Monday, November 14, 2016 at the Sherwood Hotel in Taipei. About 59 people representing 26 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.ibis.org/summits/nov16b/ Mike LaBonte welcomed participants on behalf of the IBIS Open Forum and convened the meeting, noting that only technical presentations would be on the agenda, and there would be no voting. Mike continued by thanking all the co-sponsors including Cadence Design Systems, IO Methodology, Peace Giant Corporation, Synopsys and Xpeedic Technology. IBIS CHAIR S REPORT Mike LaBonte (Signal Integrity Software (SiSoft), USA) Mike LaBonte presented updates on work in progress in the ATM, Interconnect and Quality task groups. This includes an IBIS 6.2 release, backchannel support, C_comp model enhancements, redriver flow enhancements, and an interconnect modeling BIRD. Several BIRDs have been approved for IBIS 6.2 while some are still in progress. The IBIS Open Forum 2016 IBIS Open Forum 4
has 22 members and regular teleconference and Summit meetings. The China regional forum is a new group affiliated with IBIS. CASE STUDY: MODELING IBIS FOR OPEN_DRAIN TRUE DIFFERENTIAL PAIR BUFFER Lance Wang*, Yan Liang** (*IO Methodology and **Maxim Integrated, USA) Lance Wang presented. An Open_drain differential pair presents a special case for IBIS modeling. The Open_drain model type does not use Pullup I-V data, but this data is useful for modeling this type of buffer. Using an Output or I/O model type to model this type of buffer allows inclusion of Pullup I-V data and is a better solution. Improvements to the C_comp model to capture voltage and frequency dependencies would improve the model further. DIFFERENTIAL MODELING FLOW WITH SERIES MODEL IN VERILOG-A Wei-hsing Huang* and Sanjeev Gupta** (*SPISim, USA and **Sigintegrity Solutions, India) Wei-hsing Huang presented. Half/true differential buffers are modeled including a series model for the effects of differential current and differential capacitance. The rigid syntax of the series model can lead to many inaccuracies. Replacing the series model with a Verilog-A model using [External Model] syntax streamlines the modeling flow, improves V-T extraction accuracies, and removes the rigid series model syntax. A modeling flow for creating the Verilog-A model was presented. IBIS-AMI MODEL GENERATION WITH QUALITY Skipper Liang (Cadence Design Systems, ROC) Skipper Liang presented starting with an overview of channel simulation equations and IBIS- AMI models. IBIS-AMI model generation flow involves many steps, and validation is the key. Validation includes comparisons to Spice transistor-level model simulations. An example was shown of USB 3.0 RX and TX IBIS-AMI models in simulation including real channel characteristics. A comment was made that the IBIS-AMI model validation should check the modified impulse/step response, not waveforms and eye diagrams. ACHIEVING FULL SYSTEM SIGNAL INTEGRITY FOR HIGH SPEED BACKPLANE SYSTEM Wenliang Dai (Xpeedic Technology, PRC) Zachary Su presented. The presentation included an introduction of backplane systems, challenges to backplane system simulation, components of EM simulation, an analysis workflow, and details of full backplane system SI simulation. Zachary concluded that passive channel modeling and simulation is essential to high speed channel design. Optimal channel design requires user friendly EDA tools to do layout extraction, via optimization, trace simulation, S-parameter cascading and S-parameter exploration. Full backplane system SI simulation is achieved by sweeping all the channels with correct models. 2016 IBIS Open Forum 5
ON-DIE DECOUPLING MODEL IMPROVEMENTS FOR IBIS POWER AWARE MODELS Randy Wolff# and Aniello Viscardi## (Micron Technology, #USA, ##Italy) Lance Wang presented. He noted that on-die decoupling models for power aware modeling must be added external to the IBIS model currently. To correlate an IBIS model simulation with a transistor model simulation, the decoupling model may need multiple terminals. A Spice model may include a pre-driver on a separate power supply from the driver, and coupling may exist between the pre-driver supply and the final driver supply. The pre-driver and final driver may also share a common ground. One method for creating a non-proprietary decoupling model involves creating an S-parameter model. The S-parameter model could have multiple port options and may require a node 0 reference. Lance showed results of two simulations including package models with either an ideal or non-ideal connection to the pre-driver supply of the Spice model. A 2-port decoupling model was necessary for good correlation in the case with the ideal connection to the pre-driver supply. A 3-port decoupling model was necessary for good correlation in the case with the non-ideal connection to the pre-driver supply. Lance concluded that a multi-port decoupling model is most versatile. Unused ports not connected to a package model should be connected to node 0, which is also the reference port for the S- parameter model. A question was asked if the decoupling network should be captured in the I-T and ISSO data in the model. Lance answered that the decoupling network is around the power supply and/or between the pre-driver and driver. It is not captured in I-T and ISSO curves. IBISCHK6 V6.1.3 AND EXECUTABLE MODEL FILE CHECKING Bob Ross (Teraspeed Labs, USA) Mike LaBonte presented. New ibischk6 version 6.1.3 executables are available that BUGs 174-180. The executable names include 32 and 64-bit operating system designations. An enhancement is executable model file checking per BUG179 for [Algorithmic Model] executable lines. Executable files are checked for the existence of required functions based on.ami file Reserved_Parameters settings. TOUCHSTONE CONVERSION WRAPPER Anders Ekholm (Ericsson, Sweden) Anders Ekholm presented. The tschk2 Touchstone file parser can be used to convert Touchstone models to Touchstone 2 models using the canonical option. Using this option strips out any comments from the original Touchstone file which may contain useful port information. Anders wrote a Perl script that solves this issue. The script is available on the IBIS Open Forum website. A question was asked about the difference between Touchstone 1 and Touchstone 2. Anders answered that Touchstone 2 contains more enhancements. For example, it can use different reference impedances for each port. 2016 IBIS Open Forum 6
DISCUSSION Mike LaBonte surveyed the attendees and established that most attendees were IBIS users. One attendee suggested that it would be helpful to have a workshop on how to find problems in IBIS models and fix them where possible. Mike mentioned that sometimes the simplest of problems such as having a wrong [File Name] could make a model fail, yet that is very easy to fix. A few other simple IBIS fixes were mentioned. One attendee noted that if a V-T table does not match the I-V tables, the user has no recourse. CLOSING REMARKS Mike LaBonte thanked the co-sponsors, presenters and attendees for their participation and support. The meeting adjourned at 4:30 PM. NEXT MEETING The next IBIS Open Forum teleconference meeting will be held December 2, 2016. The Asian IBIS Summit in Tokyo will be held November 18, 2016. No teleconferences will be available for the Summit meeting. ======================================================================== NOTES IBIS CHAIR: Mike LaBonte mlabonte@sisoft.com IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place, Suite 250 Maynard, MA 01754 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764 rrwolff@micron.com Principal Engineer, Silicon SI Group Lead, Micron Technology, Inc. 8000 S. Federal Way P.O. Box 6, Mail Stop: 01-711 Boise, ID 83707-0006 TREASURER: Bob Ross (503) 246-8048 bob@teraspeedlabs.com Engineer, Teraspeed Labs 10238 SW Lancaster Road 2016 IBIS Open Forum 7
Portland, OR 97219 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@ibis.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Mike LaBonte mlabonte@sisoft.com IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place, Suite 250 Maynard, MA 01754 POSTMASTER: Curtis Clark curtis.clark@ansys.com ANSYS, Inc. 150 Baker Ave Ext Concord, MA 01742 This meeting was conducted in accordance with ANSI guidance. All inquiries may be sent to info@ibis.org. Examples of inquiries are: To obtain general information about IBIS. To ask specific questions for individual response. To subscribe to the official ibis@freelists.org and/or ibis-users@freelists.org email lists (formerly ibis@eda.org and ibis-users@eda.org). To subscribe to one of the task group email lists: ibis-macro@freelists.org, ibisinterconn@freelists.org, or ibis-quality@freelists.org. To inquire about joining the IBIS Open Forum as a voting Member. To purchase a license for the IBIS parser source code. To report bugs or request enhancements to the free software tools: ibischk6, tschk2, icmchk1, s2ibis, s2ibis2 and s2iplt. The BUG Report Form for ibischk resides along with reported BUGs at: http://www.ibis.org/bugs/ibischk/ http://www.ibis.org/ bugs/ibischk/bugform.txt The BUG Report Form for tschk2 resides along with reported BUGs at: http://www.ibis.org/bugs/tschk/ http://www.ibis.org/bugs/tschk/bugform.txt The BUG Report Form for icmchk resides along with reported BUGs at: 2016 IBIS Open Forum 8
http://www.ibis.org/bugs/icmchk/ http://www.ibis.org/bugs/icmchk/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.ibis.org/bugs/s2ibis/bugs2i.txt http://www.ibis.org/bugs/s2ibis2/bugs2i2.txt http://www.ibis.org/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.ibis.org/ Check the IBIS file directory on ibis.org for more information on previous discussions and results: http://www.ibis.org/directory.html Other trademarks, brands and names are the property of their respective owners. 2016 IBIS Open Forum 9
SAE STANDARDS BALLOT VOTING STATUS Organization Interest Category Standards Ballot Voting Status October 14, 2016 November 4, 2016 November 11, 2016 November 14, 2016 ANSYS User Inactive X X - - Broadcom Ltd. Producer Inactive X - - - Cadence Design Systems User Active X X X X Cisco Systems User Inactive - - X - CST User Inactive - - - - Ericsson Producer Active - - X X GLOBALFOUNDRIES Producer Inactive X X - - Huawei Technologies Producer Inactive - - X - Infineon Technologies AG Producer Inactive - - - - IBM Producer Inactive X X - - Intel Corp. Producer Active X X X X IO Methodology User Active X X X X Keysight Technologies User Inactive X X - - Maxim Integrated Producer Inactive - - - - Mentor Graphics User Inactive X X - - Micron Technology Producer Inactive X X - - Signal Integrity Software User Active X X X X Synopsys User Active X X X - Teraspeed Labs General Interest Inactive X X - - Xilinx Producer Inactive - - - - ZTE User Inactive - - X - Zuken User Inactive - - - - Criteria for SAE member in good standing: Must attend two consecutive meetings to establish voting membership Membership dues current Must not miss two consecutive meetings Interest categories associated with SAE standards ballot voting are: Users - members that utilize electronic equipment to provide services to an end user. Producers - members that supply electronic equipment. General Interest - members are neither producers nor users. This category includes, but is not limited to, government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers. 2016 IBIS Open Forum 10