PCB (The Industry Analysis of PCB in Taiwan) / 20031229
PCB PCB PCB PCB
PC Server Unix Server DTV STB DVD FDD HDD ODD CD-ROM Multimedia Card LCD OLED CD-RW PDP VFD DVD-ROM... mainframe super computer IT LNB VSAT DLC LMDS DAML MMDS MUX
IC / IC / / / DATA communication Internet / / LCD/CCD/LED / / / / / / / / PCB
Unit: B USD Source:ITRI 2003/3 PCB is one of the most important electronic components industry in Taiwan. Taiwan PCB ranks NO.3 in Taiwan Electronic component Industry. The production value produced in overseas is included.
PCB PCB PCB 1. Computer Desktop PCNotebook PCServerLCD-Monitor 2. Communication WLANMobile Phone Smart Phone 3. Consumer PDADSCDVDGame Console
PCB PCB (Rigid Board) (Flexible Board)IC (IC Substrate)
PCB PCB(Motherboard) 95%
PCB( )
PCB(FPC) FPC is benefit for assembly & reliability. FPC is easily connecting LCD display & control board. Source & Gate boards connected by FPC COF type package is benefit for connecting density easily then create a multi-unit assembly.
IC IC CPU/GPU/Chipset IC
PCB PCB PCB PCB
PCB Issue Material Inner layer Black oxide MLB Lam. Drilling Desmear Deburr E less Cu (PTH) PNL Plating Dry film Pat. plating Fucion HASL Solder plating Etching Tin plating Re-flow/Fuse Tin strip Solder resist Solder resist Tab Plating Hot air leveling Legend print Routing Trimming V - Cut Clean / / OQC/Bake/Pack
PCB (I) UV Light
PCB (II)
PCB (III) UV Light
PCB (V)
PCB Cutting CNC Drilling Plating Through Hole Dry Film Lamination Exposure Development Pattern Etching Dry Film Stripping Pre Lamination Hot Press Lamination Metal Finish Testing Punching Inspection Assembly Packing
PCB PCB PCB PCB
PCB Unit :100M USD 450 400 350 300 250 200 150 100 50 0 347.8 6.7% Mobile phone and networking business grow fast 381.8 9.8% 425.5 11.4% 332 314.3-5.3% -22.0% Overstock issues Price Competition 317 3.8% 10% 350 1998 1999 2000 2001 2002 2003E 2004E 15.0% 10.0% 5.0% 0.0% -5.0% -10.0% -15.0% -20.0% -25.0% Source:ITRI,TPCA, Prismark, CSFB 2003/11 IT 2001 PCB 2004PCB PC, 10%
Unit :100M USD 450 400 350 300 250 200 150 100 50 0 PCB (By ) Americas Europe Japan Asia Others 1998 1999 2000 2001 2002 Source:ITRI,TPCA 2003/04 PCB
PCB (By Technology) 35,000 US$ M 30,000 25,000 20,000 15,000 10,000 2,950 4,712 6,317 10,271 3,175 4,730 5,210 9,572 Flex Build up & IC substrate 8L& Up 4-6L SSB/DSB % Change 7.62% 0.38% -17.52% -6.81% -7.62% 5,000 8,444 7,800-2001 2002 Source: Prismark, 2002 IC CPU/Chipset
PCB (By ) Unit:M USD 3,500 3,000 2,500 2,000 1,500 1,000 500 0 1998 1999 2000 2001 2002 MLB 2,351 2,450 3,268 2,646 2,764 DS 185 202 275 255 313 SS 171 159 145 130 116 FPC 174 202 260 275 385 IC Substrate 26 110 347 425 506 Source:ITRI,TPCA 2003/3 Multi-layer plays an important role in Taiwan s PCB Industry.
PCB (By ) Unit : 10K M 2 IC Substrate FPC SS DS MLB 30 220 800 280 2400 2002 growth rate 330 2800 Total 3730 4260 4190 Source : ITRI, TPCA 2003/3 PCB. IC Substrates and DS boards had high production rates in 2002. 80 270 780 100 330 700 360 2700 120 360 600 450 2800 4300 20% 9% -14% 25% 4% 3%
2002 PCB (By ) Source: TPCA, IEK(2003/4) PCB, IC
2002 PCB (By ) Source: TPCA, IEK(2003/4) PCB
Unit : MSF/M 30 25 56 : 43 Taiwan China 47 : 53 20 15 10 21 16.4 22.4 25.6 5 0 2002/E 2003/E Source : TPCA, ITRI (2003/3) PCB 2003 7% 56% 2003 56:43 2003 47:53
M SF 800 700 600 500 400 300 200 100 - Source:ITRI,TPCA 2003/11 PCB WW PCB Demand WW PCB Capacity WW Utilization Rate 90% 80% 63% 71% 68% 80% 70% 2000 2001 2002 2003(E) 50% 32% 40% PCB 2003Q3 PCB, 60% 30% 20% 10% 0%
PCB The cost decreased more than 50% in the last 2 years. Some suppliers closed their factories to decrease capacity, e.g. Isola, TCF etc. But they still have lots of losses for the market s over supply. To compensate the big losses, those suppliers tried to up the cost at the beginning of this year.
Copper Foil CCL 100 90 80 70 60 50 40 30 20 10 0 FR-4 1/2 oz. Copper Foil 1 oz. Copper Foil 100 2003Copper Foil 50% ; CCL 40% 00/4Q 01/1Q 01/2Q 01/3Q 01/4Q 02/1Q 02/2Q 02/3Q 02/4Q 03/1Q 03/2Q 03/3Q 03/4Q Source:TPCA 2003/11 CCL Copper Foil 12 03 5~10%
PCB 0.18 0.16 unit:$/in 2 /layer 2000~2002 2000 0.14 0.12 0.10 0.08 0.06 0.04 0.02 2001 2002 0.00 4 6 8 10 12 14 16 18 20 22 24 26 SourcePrismark, NT Information, 2002 Layer Count 2003,, PCB,, PCB
PCB Break even & start to loss money Source:TPCA 2003/3 PCB
PCB PCB PCB PCB
TPCA : 181 PCB Makers:47* Equipments & Materials:133 Others:1 : 213 PCB Makers:77* Equipments & Materials:136 : 22 PCB Makers:10* Equipments & Materials:12 : 49 PCB Makers:10* Equipments & Materials:36 Others:3 Manufacturer service companies included. : 465 (PCB Makers: 144) (E&M: 317) (Others: 4) Update:2003/3
PCB 2002 2002 2001 1 Ibiden Japan 932 887 2 CMK Japan 931 850 4 3 Nippon Mektron Japan 887 708 4 Hitachi Group Japan 562 750 5 Compeq Taiwan 515 597 Intel 6 Unimicron Taiwan 465 410 7 Samsung Electro-Mech S.Korea 462 368 8 Viasystems USA 430 560 9 Daeduck Group S.Korea 428 410 Daeduck GDS SSB 10 Shinko Electric Japan 420 458 2003 11 Sanmima-SCI USA 395 750 ZBC 12 Multek USA 380 400 13 Nanya PCB Taiwan 354 296 14 Tyco USA 335 550 PCB 15 Fujikura Japan 312 242 16 MACO Japan 304 308 ALIVH 17 Toppan-NEC Japan 298 156 IC Substrate 85 18 Korea Circuit Group S.Korea 280 270 Interflex 19 Photocircuits USA 280 294 20 AT&S Austria 276 278 21 LG Electronics S.Korea 265 226 BGA 22 Sony Chemical Japan 260 307 Neagari Div 23 Fujisu ITC Japan 258 458 24 WUS Taiwan 254 268 25 Mitsubishi Gas Chem Grp Japan 240 264 JCI TCI 26 Elec & Eltek China 238 280 Kingboard Chemical 27 Kyoden Group Japan 236 141 FujikikoNippon Elec 28 Nitto Denko Japan 233 146 29 DDI USA 230 270 30 Goda Taiwan 220 200 SourceNT Information 2003/12
PCB 2002 : Source:TPCA 2003/2
PCB PCB Makers (2313) (2316) (2335) (2355) (2367) (2368) (2418) (2429) (2435) (2467) (3037) (3044) (3099) (4909) (5301) (5307) (5318) (5321) (5349) (5355) (5372) (5376) (5381) (5439) (5464) (5469) (5480) (5492) (5498) (6101) (6108) (6114) (6141) (6153) (6156) (6162) (6191) (6194) (6210) (6269) (R311) (R625) (R626) (R802) (R804) (R807) Source:TPCA 2003/11
PCB vs.nb ( ) NB 50/ HPDell ( ) 100/ 10/ 30/ HP ( ) 30/ 42/ Mitac - - -
PCB vs. 2002 2003(F) 2,970 Total 5,729 3,160 3,110 14,969 5,560 4,200 2,910 3,850 16,520 NokiaSiemens Sony Ericsson MotorolaNokiaAlcatel MotorolaAlcatel Kyocera/QualcommMitsubishi MotorolaSony Ericsson Kyocera/Qualcomm Source 2003/12 4 2003 1.5~1.65, 4~4.5 37%
PCB & : PDADSCDV PCB -Microvia PCB -Flex PCB -Rigid-Felx PCB
2. LCD PCB & - LCD panel -LCD TV PCB -0.4m/m,4 -Flex PCB
PCB & 3. Organic IC substrate CPUGPUASICMemorychip-set PCB FC-BGAPBGACSP
PCB Over Capacity Price Erosion Long-term Losses Eliminate Market Restructure Merge & Alliance Fewer survivors Horizontal Integration Unimicron+ + Compeq & ASE Vertical Intergration & ; & ; &
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