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PDF PDF RoHS RoHS RoHS 2002/95/EC Murata's Approach for EU RoHS (http://www.murata.com/info/rohs.html)
1. 1 2. IC 4 2.1 4 2.2 5 2.3 7 2.4 8 2.5 9 2.6 10 3. 12 3.1 12 3.2 13 3.3 14 3.4 17 3.5 18 4. 23 4.1 ESL 23 4.2 ESL 25 4.3 3 26 4.4 3 30 5. LC 31 5.1 31 5.2 31 5.3 33 5.4 35 5.5 LC 37 5.6 40 5.7 41 5.8 LC 43
6. 44 6.1 44 6.2 45 6.3 47 6.4 ESL 48 6.5 49 7. 51 7.1 IC 51 7.2 IC 52 7.3 IC 53 7.4 l max 54 8. PDN 58 8.1 58 8.2 PDN 59 8.3 60 8.4 PCB 63 8.5 63 8.6 63 8.7 65 8.8 PDN 70 9. 71 72
IC 3 IC 2 IC 1 IC 3 IC 2 IC 1 1
IC 2 IC 1 IC 3 1kHz 1MHz 1GHz IC 3 IC 2 IC 1 2
3
IC C-MOS IC 2-1 C-MOS C-MOS C-MOS ICVDDGND 10 6 C-MOS 0110 2-1 7 8 IC IC IC 1-3 2-1 4
IC 2-1 1 2 IC 3 IC 2-2 IC 3 1-3 123 IC IC 2-3 IC PDN A IC IC B 5
9 2.3 23 1-3 IC 2-4 IC B C 2-4 B C 6
6 2-5 I.L. 50Ω db 50Ω S S 21 S 21 7
2-1 IC 2-6a 2-6bIC 2-6 IC PDN 50Ω 2-5 50Ω 2-7 50Ω db 2-5 10 20dB 8
µ 100pF 20dB/dec. 1000pF 10000pF 100000pF 20dB 2-8 10MHz µ µ µ µ µ IC IC IC 2-9bc IC IC -2-9 9
2-9bc a 2-10 µ µ µ µ IC 2-9 - 2-9 c IC 2-9 2-9bc 2-9a IC IC 2-9 b 10
L C 2-2 2 Z T C FL HZ T IC Ω Z T IC ΔI A ΔV V 10 Z T ΔV ΔI = 2-3 L =1µH 600Ω@100MHz IC ΔI=0.1A ΔV=200mV 2-3 Z T =2Ω 2-2 C 0.25µFIC 0.25µF 2-2 2-2 11
10MHz MLCC 3-1 1 3-1 ESR ESL V 3-2 log Z Z = 1 2 π f Cap Z = 2 π f ESL Z ESR 1 f 0 = 2 π Cap ESL log f 3-2 ESR ESL ESR ESL 3-2 V MLCC 3-3 2.0x1.25mm-GRM21 25Ω 3dB 12
2-5 50Ω 3-3 MLCC 4 MLCC 25 0.001µF 0.01µF 0.1µF 1µF 10µF 3dB 10µF 1µF 0.1µF 0.01µF 0.001µF 3-4 ESLPCB 3-5 ESLPCB ESLPCB 7 13
Insertion Loss (db) µ Frequency (MHz) ESLPCB 3-6a ESLPCB 3-6b ESLPCB 10mm MSL 3-7 10MHz 20dB 14
µ 3-8 3-7 20MHz IC 6mm 1608-1µF MLCC 15mm 图 3-8 ab cb c 15
6mm 2mm0.4mm 6mm 100mV 50ns/div 15mm 15mm level (V) 0.30 0.20 0.10 0.00-0.10-0.20 level (V) 0.30 0.20 0.10 0.00-0.10-0.20 level (V) 0.30 0.20 0.10 0.00-0.10-0.20-0.30-0.30-0.30-200 -100 0 100 200-200 -100 0 100 200-200 -100 0 100 200 time (ns) time (ns) time (ns) 3-9 3-8 3m H V 3-8ab c 3-9 c b 10dB 10dB 6mm 3-8 ab 1/5 3-9 ab 8dB 1/2.5 ESLPCB 16
6mm 6mm 70 70 70 60 60 60 50 40 30 20 H V 50 40 30 20 H V 50 40 30 20 H V 10 10 10 50Ω 3.1 3-10 3-10 5 17
0.5 2 10 50 ESL ESR 3-11 3-12 11 3-11b 18
10 impedance (Ω) 1 0.1 0.01 µ frequencymh 10 impedance (Ω) 1 0.1 0.01 frequencymh 3-14 1 2 3 10:1 1 2.6 23 3-14d ESL ESR 4 19
3-17 3-15 4MHz IC 3-15 MLCC MLCC 3-11 1µF 1000 pf MLCC level (mv) µ level (mv) level (mv) time (ns) µ level (mv) time (ns) time (ns) time (ns) level (mv) µ level (mv) time (ns) time (ns) 20
3-16 MLCC 3-15 3-14b 2 3-14 c 4 level (mv) µ level (mv) time (ns) time (ns) level (mv) µµ level (mv) level (mv) time (ns) µµ µ level (mv) time (ns) time (ns) time (ns) 3-17 3-14d ESL 3 MLCC ESL ESL 3 3 4 21
level (mv) µ level (mv) time (ns) time (ns) level (mv) µ level (mv) time (ns) time (ns) level (mv) µ level (mv) time (ns) time (ns) 22
3 IC 4 MLCC 4-1 4-2 4-2a LW 4-3a MLCC 4-2bc 4-3bc 4-4 23
L part 2L 2M = 2 4-5 MLCC 1.6x0.8mm 1µF 100MHz LW 1/5 1/2 MLCC 1/10 4-5 S MSL ESL PCB 4-6 ESL PCB MLCC 4-5 24
ESL LW LLL 0.5 x 1.0mm 0.1µF - 0.22µF 0.8 x 1.6mm 0.0022µF - 2.2µF 1.25 x 2.0mm 0.01µF - 2.2µF 1.6 x 3.2mm 0.01µF - 10µF 8 LLA 1.6 x 0.8 mm 0.1µF - 2.2µF 2.0 x 1.25 mm 0.01µF - 4.7µF 3.2 x 1.6 mm 0.1µF - 2.2µF 10 LLM 2.0 x 1.25 mm 0.01µF - 2.2µF 3.2 x 1.6 mm 0.1µF - 2.2µF 25
3 4-7 3 MLCC 4-8 3 T 3 / MLCC 4-7 3 10pH 20 ph 3 MLCC 1/30 1GHz 4-9 MLCC 3 1.6x0.8mm 1µF 100MHz 3 MLCC 35dB 26
µ µ 3 T ESL PCB / 4-10 ESL PCB 2 via via via via ESL ESR via via IC MLCC 3 MLCC ESL PCB 27
4-11 1µF 0.5Ω5Ω50Ω3 1GHz 30dB 3 T 4-8 1GHz 4-12 a60ω b3ω 100MHz 40mmx30mm 4-12 MLCC a60ω b3ω 3 a60ω b3ω MLCC 3 3 3 28
1 MSL 0.8 mm 10 MSL 0.2 mm 29
3 1608 NFM18PS 0.47-1.0µF 0.8±0.1 (1) (2) 0.15 +0.2 0.1 0.2 min. 0.15 +0.2 0.1 (3) (2) 1.6±0.1 +0.2 0.8 0.1 0.6±0.1 0.4±0.1 : Electrode (in mm) 2.2µFNFM18PC 0.1-4.7µF 0.2 min. 0.2 min. (2) (1) (3) 0.25±0.1 (2) 0.25±0.1 0.8±0.1 0.4±0.1 1.6±0.1 0.8±0.1 : Electrode (in mm) 2012 10µFNFM21PC/PS 0.1-10µF 0.3±0.2 0.4±0.2 0.6±0.2 2.0±0.2 0.85±0.1 1.25±0.1 (2) (1) (3) (2) 0.25±0.2 : Electrode (in mm) 3212 50V NFM3DPC 0.022µF 1.1±0.3 0.7±0.2 3.2±0.2 1.25±0.2 (2) (1) (3) 0.25±0.2 (2) 0.3±0.2 : Electrode (in mm) 30
LC LC LC 5-1 5-1a ba π IC a π b 5.6 5-1 IC IC 2-2 5.1 5-2 31
µ µ µ 5-3 Z EPR L EPC ESR log Z EPR Z = 2π f L Z = 1 2 π f EPC 1 f 0 = 2 π L EPC log f 5-3 EPCEPR L f 0 EPR EPR EPC EPC ESR 5-4 50Ω 100Ω 3dB 32
100 100µH 10µH 1µH 3dB 1µH 10µH 100µH 5-5 3.4 5-1 50 10 2 0.5 5.2 5-6 5-6 12 5-7 5-8 33
EPC () () Z R X 5-8 Z R X 10MHz 10MHz 5-8 300MHz 5-4 EPC Q 5-9 5-8 -20 db/dec 34
20dB/dec. 5-7 EPC 100MHz EPC MHz 5-10 EPC LC LC 5-11 L C 20dB/dec. 9 35
L C IC 5.1 L π L C 5-12 µ µ µ µ µ µ µ µµ µ µµ LC 5-12 L C MLCC L 5-13 LC 5-11 36
µ 5-14 4MHz IC 1µF L 10µF π 100 µ µ µ µ µ µ µ µ level (mv) level (mv) level (mv) 50 0-50 -100 time (ns) 100 50 0-50 -100 time (ns) 100 50 0-50 -100 time (ns) 2 10MHz 37
LC 11 5-15 LC 5-16 µ µ µ µ 5-15 6A 5-16a 5-16b LC 1GHz LC 5-17 LC 5-14 4MHz IC 1µF MLCC 2200pF 6mm 2200pF LC 2200pF MLCC 10µF MLCC LC 38
4MHzIC 3V MLCC 1µF+MLCC2200pF 1µF 2200pF level (mv) 100 50 0-50 -100 time (ns) MLCC 1µF+LC 2200pF NFE31PT222Z 6A MLCC 1µF+LC 10µF NFE31PT222Z 6A 1µF 1µF NFE31P222 (2200pF) NFE31P222 (2200pF) 10µF level (mv) level (mv) 100 50 0-50 -100 time (ns) 100 50 0-50 -100 time (ns) 5-16 50Ω 5-18 5-16 5-18 a 5-17b LC LC µ µ 39
EPC IC 2-2 ΔV ripple = R dc ΔI ripple 5-1 V ripple, R dc I ripple 1A 100 mωr dc 100mV 40
Murata 0603 BLM03P 1005 BLM15P 0.6-±0.03 0.3±0.03 0.25±0.1 0.3±0.03 0.5±0.05 0.15±0.05 1.0±0.05 0.5±0.05 : Electrode (in mm) : Electrode (in mm) 1005 BLM15E 1005 BLM15G 0.25±0.1 0.25±0.1 0.5±0.05 0.5±0.05 1.0±0.05 0.5±0.05 1.0±0.05 0.5±0.05 : Electrode : Electrode (in mm) (in mm) 1608 BLM18P 6A 600Ω 1608 BLM18K 0.4±0.2 1.6±0.15 0.8±0.15 0.8±0.15 T 1.6±0.15 0.8±0.15 0.4±0.2 : Electrode (in mm) : Electrode (in mm) 1608 6A BLM18S 1608 BLM18E 1.6±0.15 0.8±0.15 1.6±0.15 0.8±0.15 0.5±0.15 T 0.4±0.2 0.4±0.2 : Electrode (in mm) : Electrode (in mm) 1608 BLM18G 2012 BLM21P 0.35±0.15 0.5±0.2 0.8±0.1 0.85±0.2 1.6±0.1 0.8±0.1 2.0±0.2 1.25±0.2 : Electrode (in mm) EIA CODE : 0805 : Electrode (in mm) 41
3216 BLM31P 4516 BLM41P 0.7±0.3 0.7±0.3 3.2±0.2 1.6±0.2 1.1±0.2 4.5±0.2 1.6±0.2 1.6±0.2 : Electrode (in mm) : Electrode (in mm) 3216 LQH31C 3225 LQ32C 2.3±0.2 1.6±0.2 2.5±0.2 2.5±0.2 1.8±0.2 2.0±0.2 3.2±0.3 1.6±0.2 3.2±0.3 2.5±0.2 0.7min. 0.7min. 0.7min. (in mm) 0.9±0.3 1.3±0.2 0.9±0.3 (in mm) 3225 LQH32C_3353 2.5±0.2 2.5±0.2 A 1.55±0.15 A 3.2±0.3 2.5±0.2 A : 2.8 max. 0.9±0.3 1.3±0.2 0.9±0.3 (in mm) 4532 LQH43C 3.6±0.2 3.2±0.2 5750 LQH55D 5.0±0.3 5.0±0.3 2.6±0.2 4.7±0.3 4.5±0.3 3.2±0.2 5.7±0.3 1.0min. 1.0min. 1.0min. (in mm) 1.3 1.7 1.3 min. min. min. (in mm) 42
6363 LQH66S 6.3±0.3 6.3±0.3 4.7±0.3 6.3±0.3 1.3 min. 1.7 min. 1.3 min. (in mm) NFE BNX BNX 3216 NFE31P 6816 NFE61P 0.7±0.2 1.0±0.2 0.7±0.2 0.7±0.2 2.6±0.3 0.7±0.2 (1) (2) (3) (1) (2) (3) 1.6±0.15 6.8±0.5 1.6±0.3 1.6±0.3 3.2±0.35 1.6±0.15 : Electrode (in mm) : Electrode (in mm) BNX 9.1±0.2 12.1±0.2 (1) (2) (3) BNX022 (4) 4.2±0.3 (2.45) 3.1±0.2 0.3±0.1 0.3±0.1 1.05±0.2 1.3±0.2 1.6±0.3 (1) (3) (4) (4) (2) 7.0±0.2 1.55±0.2 (3) (4) (1) (2) : Electrode 1.0±0.3 1.55±0.2 2.5±0.2 (4) (in mm) L1 L3 C2 (1) B CB (2) L2 C1 (3) PSG CG (4) (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B 43
/ IC 6-1 IC IC IC IC IC PDN IC 6-2 V = ΔI (6-1) Z P ΔVΔI Z P VA PDN ΔV IC Z P 44
Δ Δ 6-3 6-3a 6-3b a (A) ΔI 0 (A) v (V) ΔV v-zpa (V) t a (A) 0 (A) v (V) t PDN 6-4 45
6-5 PDN IC 6-3a 3V 0.5 1A 10ns 1µs PDN 0.5 1A 3V ESL ESR 0A 6-6 2µF5µF10µF 10nH ESL PCB 50 m 6-6 6-6 6-6 46
µ µ µ (s) µ µ µ 6-6 6-7 10µF ESR ESL ESR ESL ESL ESL (s) ESL di/dt 10ns di/dt = 1 x 10 8 A/s 6-8 10µF 1µF MLCC ESL 2nH ESL PCB ESR 10m 47
0.5 10µF 10nH 50m 1µF 2nH 10m P w =1µs T r =10ns µ µ 6-9 0.1µF 1µF 1µF 0.2µs 0.5 10µF 10nH 50m 0.1µF 2nH 10m P w =1µs T r =10ns µ µ ESL 6-10 ESL 10µFESL 0.2nHESR 50m ESL 48
0.5 10µF 0.2nH 50m P w =1µs T r =10ns 6-11 L PowerDelay 6-12 L 0.1µH PDN 0.1 1A 3V ESL ESR 0A µ µ µ µ µ µ 6-12 49
6-12 6-12 2µF 6-11 RLC 13 4L C 6-2 2 R C R ESR ESL C 6-12 6-2 40µF 50µF IC L PowerDelay T PowerDelay s L PowerDelay RL L PowerDelay = RT PowerDelay 6-3 50
6 IC IC ESL IC IC MSL PDN 7-1 10µF2.2µF 0.47µF 7-1 IC IC 7-2 IC AB C PDN 7-1 PDN 7-2 10MHz ESL PDN A PDN PDN A B 7 2 IC 0.1 20 12 15 5 7 10 3 C 5mm 3mm 2mm 1mm 0.8mm 4.5 10µF ESL=1nH ESR=3m 2.2µF ESL=1nH ESR=10m 0.47µF ESL=1nH ESR=15m 51
A B a A b B C c C IC MSL 7-3 Z PowerTerminal Z Powe Terminal Z cap Z line 7-1 Z cap Z line Z cap Z line Z cap Z l 52
Z line 7-3 L line Z cap ESL cap ESL IC Z PowerTerminal Z = Z + Z j2 πf ( ESL L ) 7-2 + MSL L line MSL 14 L line L 0. 6 h 6 = 0. 4l 10 (H) 7-3 w MSLh w l 7-2 ESL cap L line IC ESL cap ESL PCB 7-3 IC Z T f T PCB l max Z T Z PowerTerminal f T 7-2 f L line_max L ZT 7-4 2π ESL ft 7-3 L line-max L line l max l max L 2πf 6 6 = 2 5 line _ max T T @ PCB. 10 0. 4 10 0. 6 0. 6 h w Z f T @ PCB h w ESL m 7-5 7-4 IC l max l max l max 53
Z T PDN IC f T@PCB l max l max Z T 7-5 IC l max Z T IC 7-5 ESL cap l max IC 7-5 IC Z T IC IC IC IC IC IC IC ICl max 2f T ESL cap 7-5 Z T l max ESL Z T ESL ESL cap 7-5 ESL cap l max l max h w l max 7-6 7-7 7-10 ESL 3 LW MLCC IC f T PCB 100MHz f T PCB IC 7-7 7-10 l max ESL ESLl max 54
ESL l max PDN 7-7 7-10 0.2@100MHz MLCC 2f T ESL cap Z T 8 ESL cap ESL 4 ESL cap MSL MSL 3 ESL cap =0.05nH LW ESL cap =0.2nH MLCC ESL cap =0.5nH MLCC ESL cap =1nH Z T = 0.1, 0.2, 0.5, 1, 2, 5 f T@PCB =100MHz IC w=0.1 to 10 mm h=0.1, 0.2, 0.4, 0.8 mm l max mm mm mm mm 3 ESL=0.05nH 55
mm mm mm mm LW ESL=0.2nH Z T =0.1 mm mm mm mm MLCC ESL=0.5nH Z T =0.2 56
mm mm mm mm MLCC ESL=1nH Z T =0.5 57
IC PDN 1 PDN IC PDN PDN PI 6 IC IC 8-1 8-1 8-1 8-2 15 PDN -- IC 58
7 IC 8-2 8-2 IC Z T 8-3 PDN PDN IC 8.7 8-2 BGA PCB 59
8-2 PDN 8-4 1 logz Z T logf f T 8-4 8-5 V 8-6 Z T 8-6 f C cap f ESL total ESL total C cap L line ESL total ESL 60
C log Z 1 Z = 2f C cap Z =2f ESL total Z T ESL ESR ESR IC f min 1 = 2π Z C T cap f max ZT = 2π ESL total log f 8-6 Z T Z T ESR total ESR Z T Z T 1 2 8-7 ESL total 8-4 3 61
log Z f min 2 1 = 2π Z C T cap 2 f max 1 = Z T 2π ESLtotal 1 Z T log f IC ESL 8-8 log Z Z T log f log Z log f Z T 62
8-2 IC PCB PCB f T@PCB IC 10MHz 100MHz PCB f T@PCB IC IC PCB 8-6 ESR ESL ESR ESL 8-9 MLCC 2.2µF ESR 10MHz MLCC MLCC ESL MLCC IC PCB MLCC IC IC 8-10 2 63
IC IC 1µF+10000pF+1000pF+100pF 0.1µF x 10 8-10a 3 8-11 1µF10000pF1000pF 100pF 1µF µ µ 8-10b 8-12 64
µ µ µ 8-10 4 ESL 8-13 MLCC ESL ESL 10 MLCC µ µ µ 8-14 IC MSL Z T 8-15 IC 65
Z T ΔV = 8-1 ΔI V I IC 100MHz 16 17 Z T f T@PCB IC Z T f T@PCB 8-16 L Power 2 C bulk C bulk L 8-2 2 ZT 7 L Power L line 0. 6 h 6 = 0. 4l 10 (H) 7-3 w h MSL w l L PowerResponce 8-3 L Power 6 L = Z t 8-3 T t PowerResponce 66
L h = 0. 4l w 0. 6 6 10 C bulk L Power 2 ZT f = Z T /2L f = 1/2Z T C C boad 8-17 L bulk 8-2 L C 8-4 2 Z T L bulk ESL IC 8-17 L bulk h = 0. 4l w 0. 6 6 10 IC C boad L Z bulk 2 T h w 67
IC 7 l max f T@PCB Z T 8-18 l max Z 2πf T T @ PCB cap 6 0. 4 10 0. 6 f T @ PCB h w ESL m 7-5 ESL cap ESL ESL PCB ESL IC l Z 2πf ESL. h ft @PCB w T T @PCB cap 6 max 0 4 0. 6 10 h f T@PCB w 68
l max 8-19 ESL cap l max 4 ESL MLC ESL l C l l ESL l C MLCC 8-20 ΔV Z T = Δ I L line h = 0. 4l w 0. 6 6 10 IC h w L Power L bulk C bulk C 2 boad 2 Z Z T T l max Z 2πf T T @PCB cap 6 0. 4 10 0. 6 f T @PCB h w ESL Z T Z T ft@pcb ft@pcb l max 69
CPU m 4 ESL µ µ µ µ µ 70
IC IC PI 1 IC MLCC 3 ESL IC MLCC ESL PI + EMC PI + EMC EMC+ EMC + PI EMC EMC GHz 71
1) Hidetoshi Yamamoto, Pawainteguritei no tame no kondensa no tekiyou (Application of Decoupling Capacitors for Power Integrity Improvement), Journal of Japan Institute of Electronics Packaging, vol. 12 No.3, May 2009 2) Hidetoshi Yamamoto, Mobairukiki no dengen noizutaisaku (zenpen) (Power Supply Noise Countermeasure for Mobile Equipment Part 1/2) pp. 117-129, Electro Magnetic Compatibility (EMC), September 2007, No. 233 3) Mark I. Montrose, EMC and the Printed Circuit Board - Design, Theory and Layout Made Simple, Wiley-IEEE Press, 1998 4) Brian Young, Digital Signal Integrity Modeling and Simulation with Interconnects and Packages, Prentice Hall PTR, 2001 5) Clayton R. Paul, Introduction to Electromagnetic Compatibility, Wiley-Interscience, 1992 6) Tadashi Kubodera, Kousoku dejitarukairo jissou nouhau (High-Speed Digital Circuit Mounting Know-How), CQ Publishing Co., Ltd., 2002 7) Dejitarukairo ni okeru DCdengenrain no noizutaisaku (Noise Countermeasure for DC Power Supply Line in Digital Circuits), Murata Manufacturing Technical Material, TE13JT, 1996 8) Yukio Sakamoto, Yokuwakaru dengenrain no EMC/noizutaisaku sekkei (Power Supply Line EMC/Noise Countermeasure Design Made Simple), Nikkan Kogyo Shimbun Ltd., 2006 9) Noise Suppression by EMIFIL Basics of EMI Filters, Murata Manufacturing Technical Material, 1986 10) Larry D. Smith, Frequency Domain Target Impedance Method for Bypass Capacitor Selection for Power Distribution Systems, pp.119-136, Power Distribution Network Design Methodologies, IEC, 2008 11) Yukio Sakamoto, Zukai Noizutaisakubuhin to EMC sekkei (EMI Suppression Components and EMC Design Illustrated), Kogyo Chosakai Publishing Co., Ltd., 2005 12) Seiji Sakai, Chip Ferrite Beads, pp. 52-57, Electro Magnetic Compatibility (EMC), November 2007, No. 235 13) Tetsuo Ikeda, Denki riron dai 2 han (Theory of Electricity 2 nd Edition), Morikita Publishing Co., Ltd., 2006 14) Stephan H. Hall, Garret W. Hall, James A. McCall, High-speed Digital System Design; A Handbook of Interconnect Theory and Design Practices, Wiley-Inter Science 2000 15) Mikhail Popovich, Andrey V. Mezhiba, Eby G. Friedman, Power Distribution Networks with On-chip Decoupling Capacitors, Springer, 2008 16) Madhavan Swaminathan, A. Ege Engin, Power Integrity Modeling and Design for Semiconductor and Systems, Prentice Hall PTR, 2008 17) Takahiro Yaguchi, Purintohaisenban no pawainteguritei sekkei (Power Integrity Design of PCB), Journal of Japan Institute of Electronics Packaging, vol. 12 No. 3, May 2009 72
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