TPCA ENIG : (1) (2) (3) UV 1. ENIG 200-400 Degradation ENIG S/M Extraneous plating Skip plating Developing 2.1 ENIG
ENIG Overhang 2. 2.2 ENIG IMC Zn Cd Pb Sb Bi S Cr Sn Pb S Cr 2-3ppm 2.3 NPTH ENIG NPTH NPTH NPTH ENIG ENIG
3. NPTH ENIG 2.4 ENIG Chemical Resistance ENIG 82-86 20-30 S/M PSR-4000 Z-100 ENIG 0.2mil ENIG 2.5 ENIG Scum Na2CO3 Complexing Compound Oxides
4. Scum ENIG 5. ENIG 6 ENIG 350 800 ENIG EN 2.5.1 ENIG
7. ENIG Scum Scum 2.5.2 ENIG S/M S/M Solder Mask Defined ENIG S/M ENIG 8. BGA Copper Defined S/M Defined ( 30)
S/M 2.6 ENIG ENIG ENIG ENIG 88 S/M 2.7 2.7.1 ENIG S/M 0.7-1.0cm ENIG 9. 2.7.2 1000
ENIG OSP W-250 OSP 10. ENIG OSP OSP 11. CSP Mini-BGA OSP ENIG OSP 2.7.3 CSP 0.1% Motorola OSP Nokia Drop Test
2.7.4 ENIG QFP QFP 12. QFP 13. S/M QFP ENIG 9-10 Rack 1.
2. 3. 10% 4. 5. 6. 82-86 Autocatalytic 15 7. 5% 8. 82-86 10 12 2-3 9. 10. ENIG 3.1 PVC PVDF PVC PVDF Teflon (Fly-Bar)
2-3cm 14. 2 20-30% 2-3 3.2 Pd++ 12mg/l 12ppm 25-30 Pd++120ppm Cu++ 100ppm 300ppm 1mm
15. -0.7V Electrochemical Science and Technology Feb. 1984 p.255 3.3 3.3.1 82-86 304 316 100L 1250L 4 MTO Metal Turn Over 1000L 50% 31% Passivation CrO3 PCB 3.3.2-0.7V +0.8V -0.8V 1V SO4=
3.3.3 (1) (2) ISO-9000 PCB ph 15ppm ENIG 0.5ppm Fe++"Fe+++ (3) (4) PTH (5) ph 4.5-4.8 82-86 Loading Factor 0.4-0.6dm2/L 0.2 1.0 Na2H2PO2 Dummy plating Loading
(6) Stylus plating ENIG 3.4 3.4.1 0.6-0.8g/L 0.2-0.3g/L 5ppm ENIG KCN+( ) 3.4.2 4.1 80 ENIG ENIG 4.2 ENIG ENIG Skip plating
1. 2. IMC 3. Extraneous Plating 1. 2. 3. Tarnishing 1. 2. ENIG PCB ENIG 20 32 1 4 14 17 2001 10 250 300 ft2 16. FC CPU P4 ENIG ENIG PC ENIG 220 250 ft2 30 40 ft2 ENIG
http://www.eurekacp.com.tw