Call for papers Shanghai World Expo Exhibition & Convention Center April 26-27 Shanghai, China FOR IMMEDIATE RELEASE CONTACT: Peggy Chen Executive Administrator of SMTA China Tel: +86-21-5609-3010 Fax: +86-21-5609-3020 Email: peggychen@smta.org.cn Greetings to our Valued SMTA Speakers and Industry Colleagues In conjunction with Call for Papers 2016 for the Technology Conference The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2016. This event, held in conjunction with NEPCON China 2016, will as usual address the industry s most pressing issues in Advanced Packaging/Components, Assembly, Business/Supply Chain, Emerging Technologies, Harsh Environment Applications (Military, Aerospace, Automotive, Industrial, Oil & Gas), PCB Technology and Process Control.
You are invited to submit a paper to the electronic industry s premier forum on the manufacture of electronic products utilizing surface mount and related technologies. Papers are sought in the following key technology tracks: Advanced Packaging/Components 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental Testing Failure Analysis Techniques Flip Chip High Temperature Packaging Lead Finishes Magnetic Soldering MEMS and Sensors Moisture Sensitive Devices (MSD) Package on Package (PoP) Photonics Photovoltaics and Solar Reliability Silver Wire-bonding Stacked Die System in Package (SiP) Through Silicon Vias (TSVs) Tin Whiskers Wafer Level Packaging (WLP) Assembly 01005/03015 Components/Assembly 3D Board Assembly Additive Manufacturing SMT Adhesives Alternate Solder Alloys BGA/CSP Assembly Bottom Terminated Components Cavity Board Assembly Cleaning, Conformal Coating and Potting Connector Assembly to PCB DFX/Design for Six Sigma Direct Chip Attach to PCB (DCA) Dispensing & Underfill Epoxy Fluxes Facility Layout Halogen and Halogen-Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Laser Soldering Leadless Area Array Packages Lead-Free Soldering/Reliability Low Temperature Processing Low Volume/Prototype Non-Wet Open (NWO) Defects Package-on-Package Assembly Part Obsolescence Placement Printing Reflow Soldering/ Wave Soldering Rework and Repair of QFNs (01005, Leadless Components, PoP, Rework Reliability Robotic Soldering Selective Soldering Solder Jetting Solder Paste/Solder Voids in Joints Solderless Interconnections Supplier Engineering Thermo Compression Bonding Underfill/ Corner Glue/ Other Polymeric Reinforcements Vapor Phase Reflow Yield Improvement Business/Supply Chain Capacity Modeling Conflict Minerals Contract Manufacturing Counterfeit Parts
Doing Business in Overseas Environmental Issues Lean Manufacturing Onshoring Operations Management Part Obsolescence RoHS/REACH Compliance Supplier Management Technology Roadmaps Emerging Technologies <= 0.3mm Pitch Area Array Technologies 3D Circuits 3D Printing & Design Rules Advanced Packaging Assembly to Flex Substrates Assembly to Glass Substrates Cavity Assembly Consumer Applications Embedded Active Technology Embedded Passive Technology Flexible Electronics Jetting of Solder Pastes LED Technology/Assembly/Reliability MEMS/RF/MOEMS Microsystems Packaging / Modular Microsystems Nanomaterials Nanotechnology, Materials, & Electronics New Materials and Processes Optoelectronics Plastic 3D PCB to PCB Technology Power or Thermal Management Power Electronics Printed Electronics Technology Reliability of Nanodevices Resin Reinforcement Solder Pastes Sensors and Manufacturing Smart Manufacturing Systems Small Die Size Singulation Solid State Lighting Solar Technology System in a Package Thermal Interface Materials Touch Screen Technologies Virtual Prototyping Wearable Electronics Wireless Applications Harsh Environment Applications (Military, Aerospace, Automotive, Industrial, Oil & Gas) Alternate Energy Battery Prognostics Components and Reliability Copper Corrosion COTS High Lead Solder Replacement High Temperature Electronics Lead-free Issues Non-Destructive Inspection Micro-Computed Tomography Multiphysics Modeling Substrates and Finishes Thermal Management Tin Whiskers PCB Technology Bio-Compatible Substrates Black Pad and Surface Finish Defects Conductive Anodic Filament (CAF) Creep Corrosion Embedded Passive/Active Components Halogen Free HDI High Power PCBs Micro-vias (including filled/unfilled) Moisture Sensitivity New Laminate Materials New Surface Finishes & Solderability Pad Cratering Soldermask Substrate Reliability
Process Control Acoustic Imaging (C-SAM) Benefits of AOI & SPI CIM In-Circuit Test Process Modeling Software Test Strategies 2D/3D X-Ray SMTA China solicits technical papers for presentation in the Technology Conference. Inclusion in the Technology Conference requires strictly technical papers (complimentary presentation slot for speakers) subject to final acceptance by the Technical Advisory Committee of SMTA China. All papers including abstract and biography for inclusion in the Conference Proceedings requested in both Chinese and English. All papers (powerpoint) must be in Chinese and shall be presented in Chinese or English with translator. SMTA China East (NEPCON China) Technology Conference 30 minutes pure technical papers presented 5 minutes for answering the question 26-27 April 2016 If you or your company wishes to share pertinent information with the highly qualified audience of SMTA China please submit your abstract to Peggy Chen by email to peggychen@smta.org.cn Please include your name, job title, company affiliation, and all pertinent contact information as well as your choice of Technology Conference for your paper. Deadlines of Materials Submission for the SMTA China East Conference: Abstract and Speaker Bio (Chinese and English version) 18 December 2015 Chinese & English version of Paper and Chinese version of PPT 29 February 2016 In order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the Annual Award Presentation which will be held at the venue of vendor conference in the afternnon of 26 April in Shanghai Thank you for your support of SMTA China and we look forward to hearing from you. Contact and Enquiry: Ms. Peggy Chen, Executive Administrator of SMTA China, Tel:+86-21-5609-3010, Fax:+86-21-5609-3020, E-mail:peggychen@smta.org.cn
4 2627 : SMTA : +86-21-5609-3010 : +86-21-5609-3020 : peggychen@smta.org.cn : 2016 SMTA2016 SMTA ( )
2.5/3D BGA/CSP (PoP) 01005/03015 3D SMT BGA/CSP DFX
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SMTA SMTA () 30 5 2016 4 2627 SMTA SMTA peggychen@smta.org.cn. ( ) 2015 12 18 2016 2 29, SMTA4 26. SMTA SMTA+86-21-5609-3010+86-21- 5609-3020peggychen@smta.org.cn