19-2529; Rev 2; 7/04 2.7Gbps SFP +3.3V 155Mbps 2.7Gbps SFP/SFF SFP MSA SFF-8472 (APC) 10mA 60mA ( 85mA) 1mA 100mA FP/DFB DS1858 SFP IC APC MAX3735A -40 C +85 C SFP/SFF 1G/2G SFP/SFF OC3 OC48-FEC SFP/SFF SFP SFP SFF-8472 MSA 10mA 60mA ( ) 10mA 85mA ( ) 1mA 100mA <51ps 27mA ( ) 155Mbps 2.7Gbps ( ) 24 4mm x 4mm QFN PART TEMP RANGE PIN-PACKAGE MAX3735E/D -40 C to +85 C Dice* MAX3735ETG -40 C to +85 C 24 Thin QFN-EP** MAX3735EGG -40 C to +85 C 24 QFN-EP** MAX3735AETG -40 C to +85 C 24 Thin QFN-EP** MAX3735AETG+ -40 C to +85 C 24 Thin QFN-EP** *Dice are designed to operate from -40 C to +85 C, but are tested and guaranteed only at T A = +25 C. **EP = Exposed pad. +Denotes lead-free package. +3.3V +3.3V OPTIONAL SHUTDOWN CIRCUITRY SERDES 0.1µF 0.1µF IN+ OUT- BIAS MD IN- MODSET TX_FAULT APCSET APCFILT1 VCC MAX3735 MAX3735A APCFILT2 BC_MON SHUTDOWN PC_MON +3.3V 15Ω 10Ω FERRITE BEAD C MD 0.01µF DS1858/DS1859 CONTROLLER IC H0 H1 C APC R BC_MON MON1 M0N2 M0N3 +3.3V R PC_MON REPRESENTS A CONTROLLED-IMPEDANCE TRANSMISSION LINE Maxim Integrated Products 1 Maxim Maxim Maxim Maxim www.maxim-ic.com.cn
ABSOLUTE MAXIMUM RATINGS Supply Voltage,...-0.5V to +6.0V Current into BIAS,, OUT-...-20mA to +150mA Current into MD...-5mA to +5mA Voltage at IN+, IN-,, TX_FAULT, SHUTDOWN...-0.5V to ( + 0.5V) Voltage at BIAS, PC_MON, BC_MON, MODSET, APCSET...-0.5V to ( + 0.5V) Voltage at, OUT-...+0.5V to ( + 1.5V) Voltage at APCFILT1, APCFILT2...-0.5V to +3V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Continuous Power Dissipation (T A = +85 C ) 24-Lead Thin QFN (derate 20.8mW/ C above +85 C)...1354mW 24-Lead QFN (derate 20.8mW/ C above +85 C)...1354mW Operating Ambient Temperature Range (T A )...-40 C to +85 C Storage Ambient Temperature Range...-55 C to +150 C Die Attach Temperature...+400 C Lead Temperature (soldering, 10s)...+300 C ( = +2.97V to +3.63V, T A = -40 C to +85 C. Typical values at = +3.3V, I BIAS = 20mA, I MOD = 30mA, T A = +25 C, unless otherwise noted.) (Note 1) POWER SUPPLY PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS Power-Supply Current I CC Excludes the laser bias and modulation currents (Note 2) I/O SPECIFICATIONS 27 50 ma Differential Input Voltage V ID V ID = (V IN +) - (V IN -), Figure 1 200 2400 mv P-P Common-Mode Input Voltage 0.6 V Differential Input Resistance 85 100 115 Ω Input Pullup Resistance Input Current R PULL 4.7 7.4 10.0 kω V HIGH = 15 V =, = 3.3V, R PULL = 7.4kΩ -450 Input High Voltage V IH 2 V Input Low Voltage V IL 0.8 V TX_FAULT Output High Voltage V OH I OH = 100µA sourcing (Note 3) 2.4 V TX_FAULT Output Low Voltage V OL I OL = 1mA sinking (Note 3) 0.4 V SHUTDOWN Output High Voltage V OH I OH = 100µA sourcing - 0.4 V SHUTDOWN Output Low Voltage V OL I OL = 100µA sinking 0.4 V BIAS GENERATOR Bias On-Current Range I BIAS Current into BIAS pin 1 100 ma Bias Off-Current I BIASOFF Current into BIAS pin during TX_FAULT or Bias Overshoot During SFP module hot plugging (Notes 4, 5, 11) Bias-Current Monitor Gain I BC_MON External resistor to defines the voltage gain, I BIAS = 1mA, R BC_MON = 69.28kΩ 10.0 12 13.5 I BIAS = 100mA, R BC_MON = 693.25Ω 11.5 13 13.5 µa 100 µa 10 % ma/a Bias-Current Monitor Gain Stability 1mA I BIAS 100mA MAX3735-8 +8 (Notes 4, 6) MAX3735A -6 +6 % 2
ELECTRICAL CHARACTERISTICS (continued) ( = +2.97V to +3.63V, T A = -40 C to +85 C. Typical values at = +3.3V, I BIAS = 20mA, I MOD = 30mA, T A = +25 C, unless otherwise noted.) (Note 1) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS AUTOMATIC POWER-CONTROL LOOP MD Reverse Bias Voltage 18µA I MD 1500µA 1.6 V MD Average Current Range I MD Average current into MD pin 18 1500 µa Average Power-Setting Stability Average Power Setting Accuracy MD-Current Monitor Gain MD-Current Monitor Gain Stability LASER MODULATOR I PC_MON APC closed loop (Notes 4, 7) APC Closed Loop 1mA I BIAS 100mA (Note 8) I BIAS = 1mA (MAX3735) -880 +880 I BIA S = 1m A ( M AX 3735A) -110 +110 I BIA S = 100m A -650 +650 ppm/ C -16 +16 % External resistor to defines the voltage gain; MAX3735 0.8 1 1.23 I MD = 18µA, R PC_MON = 50kΩ MAX3735A 0.9 1.1 I MD = 1.5mA, R PC_MON = 600Ω 0.95 1 1.05 18µA I MD 1500µA MAX3735-10 +10 (Notes 4, 6) MAX3735A -4 +4 Current into pin; R L 15Ω, V, V OUT- 0.6V (DC-coupled) Modulation On-Current Range I MOD Current into pin; R L 15Ω_, V, V OUT- 2.0V (AC-coupled) Modulation Off-Current I MODOFF Current into pin during TX_FAULT or 10 60 10 85 Modulation-Current Stability I MOD = 10mA -480 +480 (Note 4) I MOD = 60mA -255 +255 Modulation-Current Absolute Accuracy A/A % ma 100 µa ppm/ C 10mA I MOD 60mA (Note 8) -15 +15 % Modulation-Current Rise Time t R 20% to 80%, 10mA I MOD 60mA (Note 4) 42 65 ps Modulation-Current Fall Time t F 20% to 80%, 10mA I MOD 60mA (Note 4) 50 80 ps Deterministic Jitter 10mA I MOD 60mA at 2.67Gbps (Notes 4, 9, 10) At 1.25Gbps (K28.5 pattern) 11.5 At 622Mbps (Note 9) 18 At 155Mbps (Note 9) 40 18 38 Random Jitter RJ 10mA I MOD 60mA (Note 4) 0.7 1.0 ps RMS ps 3
ELECTRICAL CHARACTERISTICS (continued) ( = +2.97V to +3.63V, T A = -40 C to +85 C. Typical values at = +3.3V, I BIAS = 20mA, I MOD = 30mA, T A = +25 C, unless otherwise noted.) (Note 1) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS SAFETY FEATURES Excessive Bias-Current Comparator Threshold Range Excessive MD-Current Comparator Threshold Range SFP TIMING REQUIREMENTS Assert Time Negate Time Negate Time During FAULT Recovery t_off t_on t_onfault TX_FAULT always occurs for V BC_MON 1.38V, TX_FAULT never occurs for V BC_MON 1.22V TX_FAULT always occurs for V PC_MON 1.38V, TX_FAULT never occurs for V PC_MON 1.22V Time from rising edge of to I BIAS = I BIASOFF and I MOD = I MODOFF (Note 4) Time from falling edge of to I BIAS and I MOD at 95% of steady state when TX_FAULT = 0 before reset C APC = 2.7nF, MAX3735 (Note 4) MAX3735A (Note 11) Time from falling edge of to I BIAS and I MOD at 95% of steady state when TX_FAULT = 1 before reset (Note 4) 1.22 1.30 1.39 V 1.22 1.30 1.39 V 0.14 5 µs 1 ms 600 µs 60 200 ms TX_FAULT Reset Time or Power- On Time TX_FAULT Assert Time to Reset t_init t_fault From power-on or negation of TX_FAULT using (Note 4) Time from fault to TX_FAULT on, C FAULT 20pF, R FAULT = 4.7kΩ (Note 4) Time must be held high to reset TX_FAULT (Note 4) 60 200 ms 3.3 50 µs 5 µs Note 1: Specifications at -40 C are guaranteed by design and characterization. Dice are tested at T A = +25 C only. Note 2: Maximum value is specified at I MOD = 60mA, I BIAS = 100mA. Note 3: TX_FAULT is an open-collector output and must be pulled up with a 4.7kΩ to 10kΩ resistor. Note 4: Guaranteed by design and characterization. Note 5: turn-on time must be 0.8s, DC-coupled interface. Note 6: Gain stability is defined by the digital diagnostic document (SFF-8472, rev. 9.0) over temperature and supply variation. Note 7: Assuming that the laser diode to photodiode transfer function does not change with temperature. Note 8: Accuracy refers to part-to-part variation. Note 9: Deterministic jitter is measured using a 223-1 PRBS or equivalent pattern. Note 10: Broadband noise is filtered through the network as shown in Figure 3. One capacitor, C < 0.47µF, and one 0603 ferrite bead or inductor can be added (optional). This supply voltage filtering reduces the hotplugging inrush current. The supply noise must be < 100mV P-P up to 2MHz. Note 11: C APC values chosen as shown in Table 4 (MAX3735A). 4
VOLTAGE V IN + V IN - (V IN +) - (V IN -) CURRENT I OUT + TIME 1. (100mV min, 1200mV max) (200mV P-P min, 2400mV P-P max) I MOD MAX3735 MAX3735A OUT- 2. 30Ω 30Ω 0.5pF I 30Ω 75Ω OSCILLOSCOPE 50Ω SOURCE NOISE HOST BOARD FILTER DEFINED BY SFP MSA L1 1µH OPTIONAL MODULE TO LASER DRIVER VOLTAGE SUPPLY C1 0.1µF C2 10µF C3 0.1µF OPTIONAL 3. 5
( = +3.3V, C APC = 0.01µF, I BIAS = 20mA, and I MOD = 30mA, T A = +25 C, unless otherwise noted.) OPTICAL EYE E R = 8.2dB, 2.7Gbps, 2.3GHz FILTER 2 7-1 PRBS, 1310nm FP LASER 54ps/div MAX3735 toc01 OPTICAL EYE E R = 8.2dB, 1.25Gbps, 900MHz FILTER K28.5 PATTERN, 1310nm FP LASER 115ps/div MAX3735 toc02 OPTICAL EYE E R = 12dB, 155Mbps, 117MHz FILTER 2 7-1 PRBS, 1310nm FP LASER MAX3735 toc03 2.7Gbps, 2 7-1 PRBS, 30mA MODULATION ELECTRICAL EYE MAX3735 toc04 85mV/div 919ps/div 58ps/div 70 SUPPLY CURRENT vs. TEMPERATURE EXCLUDES I BIAS AND I MOD MAX3735 toc05 20 18 BIAS-CURRENT MONITOR GAIN vs. TEMPERATURE MAX3735 toc06 SUPPLY CURRENT (ma) 55 40 GAIN (ma/a) 16 14 25 12 10-40 -15 10 35 60 85 TEMPERATURE ( C) 10-40 -15 10 35 60 85 TEMPERATURE ( C) 6
( ) ( = +3.3V, C APC = 0.01µF, I BIAS = 20mA, and I MOD = 30mA, T A = +25 C, unless otherwise noted.) GAIN (A/A) 3.0 2.5 2.0 1.5 1.0 0.5 PHOTOCURRENT MONITOR GAIN vs. TEMPERATURE 0-40 -15 10 35 60 85 TEMPERATURE ( C) MAX3735 toc07 IMOD (ma) 100 90 80 70 60 50 40 30 20 10 MODULATION CURRENT vs. R MODSET 0 1 10 100 R MODSET (kω) MAX3735 toc08 IMD (ma) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 MONITOR DIODE CURRENT vs. R APCSET 0 0 1 10 100 R APCSET (kω) MAX3735 toc09 80 70 EDGE TRANSITION TIME vs. MODULATION CURRENT MAX3735 toc10 60 50 DETERMINISTIC JITTER vs. MODULATION CURRENT MAX3735 toc11 3.0 2.5 RANDOM JITTER vs. MODULATION CURRENT MAX3735 toc12 EDGE TRANSITION TIME (ps) 60 50 40 RISE TIME FALL TIME DJ (psp-p) 40 30 20 DJ (INCLUDING PWD) RANDOM JITTER (psrms) 2.0 1.5 1.0 30 10 0.5 20 10 20 30 40 50 60 I MOD (ma) PWD 0 10 20 30 40 50 60 I MOD (ma) 0 10 20 30 40 50 60 I MOD (ma) HOT PLUG WITH MAX3735 toc13 STARTUP WITH S RAMPING SUPPLY MAX3735 toc14 TRANSMITTER ENABLE MAX3735 toc15 3.3V 3.3V 3.3V 0V 0V FAULT FAULT FAULT HIGH t_on = 44µs LASER OUTPUT t_init = 60ms LASER OUTPUT LASER OUTPUT 20ms/div 20ms/div 12µs/div 7
( ) ( = +3.3V, C APC = 0.01µF, I BIAS = 20mA, and I MOD = 30mA, T A = +25 C, unless otherwise noted.) FAULT LASER OUTPUT 3.3V TRANSMITTER DISABLE MAX3735 toc16 40ns/div t_off = 134ns HIGH V PC_MON FAULT LASER OUTPUT RESPONSE TO FAULT EXTERNALLY FORCED FAULT 1µs/div MAX3735 toc17 t_fault = 0.9µs HIGH FAULT RECOVERY TIME MAX3735 toc18 FREQUENT ASSERTION OF MAX3735 toc19 V PC_MON FAULT EXTERNAL FAULT REMOVED HIGH V PC_MON FAULT EXTERNALLY FORCED FAULT HIGH LASER OUTPUT t_init = 60ms LASER OUTPUT 100ms/div 4µs/div 8
PIN NAME FUNCTION 1, 4, 8, 14, 18 +3.3V Supply Voltage 2 IN+ Noninverted Data Input 3 IN- Inverted Data Input 5 PC_MON Photodiode Current Monitor Output. Current out of this pin develops a ground-referenced voltage across an external resistor that is proportional to the monitor diode current. 6 BC_MON Bias Current Monitor Output. Current out of this pin develops a ground-referenced voltage across an external resistor that is proportional to the bias current. 7, 12, 22 Ground 9 SHUTDOWN Shutdown Driver Output. Voltage output to control an external transistor for optional shutdown circuitry. 10 TX_FAULT Open-Collector Transmit Fault Indicator ( 1) (Table 1). 11 MODSET A resistor connected from this pad to ground sets the desired modulation current. 13 BIAS Laser Bias Current Output 15, 16 Noninverted 15 16 I Modulation Current Output. Connect pins and 16 externally to minimize parasitic MOD inductance of the package. I MOD flows into this pin when input data is high. 17 OUT- Inverted I Modulation Current Output. I MOD MOD flows into this pin when input data is low. 19 MD Monitor Diode Input. Connect this pin to the anode of a monitor photodiode. A capacitor to ground is required to filter the high-speed AC monitor photocurrent. 20 APCFILT1 Connect a capacitor (C APC ) between pin 20 (APCFILT1) and pin 21 (APCFILT2) to set the dominant 20 (APCFILT1) 21 (APCFILT2) C pole of the APC feedback loop. APC APC 21 APCFILT2 See APCFIL1 APCFILT1 23 APCSET A resistor connected from this pin to ground sets the desired average optical power. 24 EP Exposed Pad Transmitter TTL Disable, TTL. Laser output is disabled when is asserted high or left unconnected. The laser output is enabled when this pin is asserted low. Ground. Must be soldered to the circuit board ground for proper thermal and electrical performance ( ) (see the Exposed Pad Package section). (APC) ( 4) (+3.3V) MAX3735/ MAX3735A 15Ω 0.6V 60mA 85mA (R D ) 15Ω RC Maxim HFAN-02.0 Interfacing Maxim's Laser Drivers to Laser Diodes (Maxim ) 2.7Gbps BIAS BIAS 9
100Ω INPUT BUFFER I MD 1 I BIAS 76 V BG X270 I MOD ENABLE SAFETY LOGIC AND POWER DETECTOR MAX3735 MAX3735A DATA PATH I BIAS ENABLE x38 IN+ IN- PC_MON R PC_MON BC_MON SHUTDOWN 15Ω OUT- I MOD BIAS V BG APCSET R D I BIAS I APCSET R APCSET MD I MD x1 C MD R BC_MON (4.7kΩ TO 10kΩ) MODSET APCFILT1 APCFILT2 R MODSET TX_FAULT SHUTDOWN C APC 4. APC APC APC R APCSET APC C APC C APC () (TX_FAULT) ( 5) ( 1) 2 ( ) SFP MSA TX_FAULT 4.7kΩ 10kΩ (BC_MON PC_MON) (I BIAS ) (I MD ) PC_MON BC_MON 1.38V 100Ω V BC_MON = (I BIAS / 76) x 100Ω V PC_MON = I MD x 100Ω 10
PC_MON R PC_MON BC_MON R BC_MON POR AND COUNTER FOR t_init COUNTER FOR t_onfault I MD 1 I BIAS 76 V BG V BG MODSET SHORT- CIRCUIT DETECTOR COMP COMP R S RS LATCH MAX3735 MAX3735A 100ns DELAY Q I MOD ENABLE I BIAS ENABLE CMOS TTL OPEN COLLECTOR SHUTDOWN TX_FAULT 5. 1. 1. 2. 3. 4. If any of the I/O pins is shorted to or (singlepoint failure, see Table 2), and the bias current or the photocurrent exceed the programmed threshold. End-of-life (EOL) condition of the laser diode. The bias current and/or the photocurrent exceed the programmed threshold. Laser cathode is grounded and the photocurrent exceeds the programmed thresholds. N o feed b ack for the AP C l oop ( b r oken i nter connecti on, d efecti ve m oni tor p hotod i od e), and the b i as cur r ent exceed s the p r og r am m ed thr eshol d. 3 50% (P AVG ) (η) (r e ) 3 R MODSET +25 C R MODSET APC R APCSET R APCSET R APCSET (R D ) ( 4) 15Ω R D R L 15Ω R L R D 8Ω 13Ω ( 0.01µF) RC RC R COMP = 50Ω C COMP = 8pF Maxim HFAN-02.0 Interfacing Maxim's Laser Drivers to Laser Diodes (Maxim ) 11
2. PIN NAME CIRCUIT RESPONSE TO OVERVOLTAGE OR SHORT TO CIRCUIT RESPONSE TO UNDERVOLTAGE OR SHORT TO GROUND TX_FAULT Does not affect laser power. Does not affect laser power. Modulation and bias currents are disabled. Normal condition for circuit operation. IN+ IN- MD SHUTDOWN BIAS The optical average power increases and a fault occurs if V PC_MON exceeds the threshold. The APC loop responds by decreasing the bias current. The optical average power decreases and the APC loop responds by increasing the bias current. A fault state occurs if V BC_MON exceeds the threshold voltage. Disables bias current. A fault state occurs. Does not affect laser power. If the shutdown circuitry is used, laser current is disabled and a fault state* occurs. In this condition, laser forward voltage is 0V and no light is emitted. The optical average power decreases and the APC loop responds by increasing the bias current. A fault state occurs if V BC_MON exceeds the threshold voltage. The optical average power increases and a fault occurs if V PC_MON exceeds the threshold. The APC loop responds by decreasing the bias current. The APC circuit responds by increasing bias current until a fault is detected, then a fault state* occurs. Does not affect laser power. Fault state* occurs. If the shutdown circuitry is used, the laser current is disabled. The APC circuit responds by increasing the bias current until a fault is detected, then a fault state* occurs. Fault state* occurs. If the shutdown circuitry is used, laser current is disabled. OUT- Does not affect laser power. Does not affect laser power. PC_MON Fault state* occurs. Does not affect laser power. BC_MON Fault state* occurs. Does not affect laser power. APCFILT1 APCFILT2 IBIAS increases until V BC_MON exceeds the threshold voltage. IBIAS increases until V BC_MON exceeds the threshold voltage. IBIAS increases until V BC_MON exceeds the threshold voltage. IBIAS increases until V BC_MON exceeds the threshold voltage. MODSET Does not affect laser power. Fault state* occurs. APCSET Does not affect laser power. Fault state* occurs. *A fault state asserts the TX_FAULT pin, disables the modulation and bias currents, and asserts the SHUTDOWN pin. 3. PARAMETER SYMBOL RELATION Average Power P AVG P AVG = (P 0 + P 1 ) / 2 Extinction Ratio r e r e = P 1 / P 0 Optical Power High P 1 P 1 = 2P AVG x r e / (r e + 1) Optical Power Low P 0 P 0 = 2P AVG / (r e + 1) Optical Amplitude P P-P P P-P = P 1 - P 0 Laser Slope Efficiency η η = P P-P / I MOD Modulation Current I MOD I MOD = P P-P / η APC APCFILT1 APCFILT2 (C APC ) (C MD ) ( C APC C MD ) MAX3735 C APC C MD 20 MAX3735A C APC C MD 4 20 12
SFP MSA 100Ω ( 6) SHUTDOWN ( 4) SHUTDOWN 2.488Gbps P AVG = 0dBm -40 C +85 C 6.6 (8.2dB) λ = 1.3µm I TH = 22mA +25 C β TH = 1.3%/ C ρ MON = 0.2A/W η = 0.05mW/mA (+25 C ) R APCSET I MD = P AVG x ρ MON = 200µA R APCSET R APCSET 3kΩ I MD = 1.23 / (2 x R APCSET ) R MODSET 6.6 (r e +25 C 25 C r e 20 3 P P-P = 1.81mW 1.81mW/(0.05mW/mA) = 36.2mA R MODSET R MOD- SET 9.5kΩ I MOD = 1.23 / (0.0037 x R MODSET ) C APC SFP C APC MAX3735 MAX3735A C APC C APC Maxim HFDN-23.0: Choosing the APC Loop Capacitors Used with SFP Module MAX3735 MAX3735A PACKAGE 16kΩ MAX3735 MAX3735A 0.81nH PACKAGE OUT- IN+ 0.97nH 0.11pF 0.11pF 50Ω 0.99nH 0.11pF 50Ω IN- 0.97nH 0.11pF 24kΩ 0.99nH 0.11pF K = 0.3 6. 7. 13
Designs ( MAX3735 MAX3735A SFP APC ) MAX3735 MAX3735 C APC C APC = 4.04 x 10-9 x t _on x η x ρ MON (29.3 + 20.6 I TH - 0.22 I TH 2 ) x (1947 + 833 I MOD - 7.78 I MOD 2 + 0.103 I MOD 3 ) C APC µf I TH I MOD ma t ON µs MAX3735 C MD C APC 20 MAX3735A MAX3735A 4 C APC C APC ( ) C APC 85 C ( 40 C) 34% 4. MAX3735A C APC LASER GAIN (A/A) C APC (F) 0.005 0.039 0.007 0.047 0.010 0.068 0.020 0.100 0.030 0.120 0.040 0.120 ( ) 10mA 85mA Maxim HFAN-02.0 Interfacing Maxim's Laser Driver to Laser Diodes (Maxim ) 6 7 MAX3735 5µm ( ) Maxim ( 1mil) 94mil (2388µm) 15mil (381µm Maxim HFAN-08.0.1 Understanding Bonding Coordinates and Physical Die Size MAX3735 EMI Gain = I MD /(I BIAS - I TH + 0.5 x I MOD ) MAX3735A C MD C APC 4 20 Dallas DS1858/DS1859 SFP Maxim HFAN-2.3.3 Optimizing the Resolution of Laser Driver Setting Using Linear Digital Potentiometers ( ) 60mA 60mA 24 QFN IC Maxim HFAN-08.1 Thermal Consideration for QFN and Other Exposed-Pad Packages IEC 825 IEC825 Maxim Maxim 14
MAX3735 IN+ OUT- 0.060" (1.524mm) IN- 6 5 4 3 7 8 APCSET 9 0.079" (2.007mm) 10 APCFILT2 11 APCFILT1 12 MD 13 14 15 16 17 18 OUT- 19 PC_MON 2 20 BC_MON 1 21 BIAS INDEX PAD 29 28 27 26 25 24 23 22 SHUTDOWN TX_FAULT MODSET 15
5. MAX3735 PAD NAME COORDINATES X Y 1* BC_MON 47 47 2 PC_MON 47 229 3 47 514 4 IN- 47 696 5 IN+ 47 878 6 47 1063 7 242 1149 8 452 1149 9 APCSET 636 1149 10 819 1149 11 APCFILT2 1008 1149 12 APCFILT1 1193 1149 13 MD 1383 1149 14 1567 1149 15 1758 1032 16** OUT- 1758 888 17** OUT- 1758 742 18** 1758 579 19** 1758 433 20 1758 289 21 BIAS 1758 93 22 1578-64 23 1401-64 24 MODSET 1205-64 25 TX_FAULT 1016-64 26 SHUTDOWN 818-64 27 623-64 28 435-64 29 245-64 TOP VIEW IN+ PC_MON BC_MON 1 2 3 4 5 6 24 23 22 21 20 19 MAX3735 MAX3735A 7 8 9 10 11 12 APCSET Thin QFN* (4mm x 4mm) *THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD GROUND FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE. TRANSISTOR COUNT: 327 SUBSTRATE CONNECTED TO DIE SIZE: 60 mils x 79 mils PROCESS: SiGe Bipolar VCC SHUTDOWN APCFILT2 TX_FAULT APCFILT1 MODSET MD 18 17 16 15 14 13 IN- OUT- BIAS *Index pad. Orient the die with this pad in the lower-left corner. **Bond out both pairs of OUT- and to minimize series inductance. 16
( www.maxim-ic.com.cn/packages ) 12,16,20, 24L QFN.EPS PACKAGE OUTLINE 12,16,20,24L QFN, 4x4x0.90 MM 21-0106 E 1 2 PACKAGE OUTLINE 12,16,20,24L QFN, 4x4x0.90 MM 21-0106 E 2 2 17
( ) ( www.maxim-ic.com.cn/packages ) 24L QFN THIN.EPS PACKAGE OUTLINE 12, 16, 20, 24L THIN QFN, 4x4x0.8mm 21-0139 C 1 2 PACKAGE OUTLINE 12, 16, 20, 24L THIN QFN, 4x4x0.8mm 21-0139 C 2 2 Maxim MaximMaxim 18 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 2004 Maxim Integrated Products Printed USA Maxim Integrated Products, Inc.