Automotive MCU in a Fast-Changing Environment 快速变化市场中的汽车微控制器 Jason Yang Automotive MCU Marketing Manager 杨金晶 汽车微控制器市场经理 March.2015 TM External Use
A Global Leader in Automotive MCU 汽车微控制器供应商的领导者 Five Core Product Groups Four Primary Markets >50 Year Legacy >5,500 Engineers >6,000 Patent Families Microcontrollers Digital Networking Automotive MCU Analog & Sensors RF Automotive Networking Industrial Consumer Freescale shipped over 370M automotive MCUs (>4 per car) in 2012 Freescale is in approximately 50 million new vehicles / year 飞思卡尔为市场提供超过 3.7 亿片汽车微控制器 ( 平均每辆车超过 4 片 ), External Use 2 每年超过五千万辆新车使用了飞思卡尔的汽车微控制器
Agenda Automotive Market Trends 车身电子市场趋势 Automotive MCU Trends and Challenges 汽车微控制器的趋势和挑战 FSL Automotive MCU Accelerate Your Business 飞思卡尔汽车 MCU 产品和方案助力您的事业 Conclusion 总结 External Use 3
Automotive market trends 车身电子市场趋势 External Use 4
Body Market Trends and Challenges 车身电子市场趋势 Connected More complex Gateways with higher performance and multi-core usage (Expanding memory ) Ethernet and wireless communication Personalization options driving LIN nodes Software Integration: Safe and Secure Green Cost Efficient Functional Safety - ISO26262 Several body-apps need ASIL A/B (some C/D) Reduced ASIL-assessment effort Security/Cryptography for Gateway and BCM modules Power management in stop and run modes Autosar SW management of partial/pretended networking EC-motors, LED-lighting Cost reduction via ECU integration Electrification of the car replacing mech. components Scalability of hardware and software Auto generated code to decrease dev costs Autosar: Multicore-support OS MCAL Safety: SW-routines supporting self-test (Core/Memory) Security: Cryptography algorithmic support Application-support Motor Control-library Reference designs External Use 5
2000 2002 2004 2006 2008 2010 TM 2012 2014 2016 2018 2020 2022 2024 2026 Vehicle Production s Shifting Global Footprint 全球机动车产量预测 120 100 80 60 Light Vehicle Production (Million) World Total BRIC, ROW World Light Vehicle production is forecasted to double in the 25- year period (2000-2025) All of the Growth is in Emerging Markets 40 N. Amer, Japan, Europe, S. Korea Region 2000-2025 CAGR 20 N. Amer., Japan, Europe, S. Korea 0% 0 BRIC, ROW 8% Worldwide 3% Source: IHS Automotive (Feb 14) External Use 6
Automotive Processors Per Vehicle Trends 每一辆汽车上的汽车微控制器增长趋势 45 Auto Processors per Vehicle $120 Auto Processor Content per Vehicle ($) 40 35 N. America $100 N. America 30 Japan $80 Japan 25 20 Europe S. Korea $60 Europe S. Korea 15 China $40 China 10 India India 5 World Avg. $20 World Avg. 0 2007 2013 2020 $0 2007 2013 2020 Source: Strategy Analytics (Jan 14) External Use 7
Market Trends and Challenges for Automotive MCUs 汽车微控制器的趋势和挑战 External Use 8
Automotive Electronics Architectural Trends 汽车电子网络结构的进化 Diagnostics/ Programming Today/Near Future Future (2018+) Gateway ECU Infotainment Gateway/ Centerstack Dynamics Sensors Brakes Torque Management Dampers ADAS Airbags Tensioners Steering (Radar,Camera) Ped. Protection Vehicle Dynamics & Safety Multimedia/ Telematics Entertainment Navigation Driver Instruments Controls Driver Interface (HMI) Ethernet Cameras Engine Transmission Electric Motor Generator Body, Security Lighting Seats Mirrors Doors Lighting Distributed Electronic Control Units One ECU per mechanical function - connected by multiple CAN and LIN interfaces External Use 9 Distributed Computing Major computing nodes on a high-performance network organized by domains that control distributed nodes. Auto MCU: More performance, more embedded memory, more safety for less cost, less power and less development effort 市场对汽车微控制器的要求 : 更高性能, 更大内存, 更多安全, 更低价格, 更低功耗, 更低开发成本
Challenges for Body Electronics 车身电子面临的挑战 Central Gateway need high performance and high scalability. 中央网关需要高性能和高扩展性. Limited R&D Cost - different applications need share common platform to reuse software/hardware/toolchain. 控制开发成本 - 不同应用需要共享软硬件平台以使得软件 / 硬件 / 工具链能够最大程度的重复使用 Smart distributed CAN/LIN nodes require smaller size and lower cost. 智能分布式 CAN/LIN 节点需要更小体积更低成本 External Use 10
Freescale Automotive MCU Overview 飞思卡尔汽车微控制器 External Use 11
Challenges for Body Electronics 车身电子面临的挑战 Central Gateway need high performance and high scalability. 中央网关需要高性能和高扩展性. Limited R&D Cost - different applications need share common platform to reuse software/hardware/toolchain. 控制开发成本 - 不同应用需要共享软硬件平台以使得软件 / 硬件 / 工具链能够最大程度的重复使用 Smart distributed CAN/LIN nodes require smaller size and lower cost. 智能分布式 CAN/LIN 节点需要更小体积更低成本 External Use 12
Ethernet Ethernet MLB SDHC FlexRay 2x USB 2.0 32ch edma MPC5748C/G - High End Gateway/BCM Solution 高端网关 /BCM 解决方案 System VReg 8-40MHz Osc FMPLL 32KHz Osc 16MHz IRC 128KHz IRC RTC/API SIUL 16xPIT+RTI 3xSWT 3xSTM SSCM FCCU BAF/BAR STCU (MBIST/LBIST) 16xSemaphore DMA MUX CTU emios 96ch Debug JTAG 3x Nexus Class 3+ Flash controller 6M Flash incl EE emulation (with ECC) 1 CRC e200z4 Core CROSSBAR SWITCH Memory Protection Unit (MPU) 32ch* ATD 12bit Crossbar Masters e200z4 Core 256k 256k 256k SRAM SRAM SRAM (with ECC) (with ECC) (with ECC) 48ch* ATD 10bit e200z2 Core Communications I/O System 3 Analog Comparators 4 DSPI 6 SPIs X Peripheral Bridge 4 I2C, 3 SAI *Mixture of internal and external channels Features available depend on package and device version 8 CAN HSM Low Power Unit Interface 18 LIN Flex Applications: High end Gateway and Body Modules Key Characteristics: 2x e200z4 + 1x z2 cores, FPU on z4 cores 160 MHz max for z4s and 80 MHz on z2 HSM Security Module option supports both SHE and EVITA low/medium standard Media Local Bus supports MOST communication 2 x USB 2.0 (1 OTG and 1 Host module) support interfacing to 3G modem and infotainment domain 2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB Ethernet switch CAN module optionally supports CAN FD SDHC provides standard SDIO interface Low Power Unit provides reduced CAN, LIN, SPI, ADC functionality in low power mode Designed to ISO26262 process for use in ASIL B -40 to +125C (ambient) 3.0V to 5.5V Packages: 176 LQFP, 256 BGA, 324 BGA 5747C 5748C 5747G 5748G Cores 2 2 3 3 Flash 4M 6M 4M 6M RAM 512k 768k 768k 768k MLB N N Y Y USB N N Y Y External Use 13
Challenges for Body Electronics 车身电子面临的挑战 Central Gateway need high performance and high scalability. 中央网关需要高性能和高扩展性. Limited R&D Cost - different applications need share common platform to reuse software/hardware/toolchain. 控制开发成本 - 不同应用需要共享软硬件平台以使得软件 / 硬件 / 工具链能够最大程度的重复使用 Smart distributed CAN/LIN nodes require smaller size and lower cost. 智能分布式 CAN/LIN 节点需要更小体积更低成本 External Use 14
KEA products comparison table Features Device Flash RAM EE PROM Freq MS CAN SCI SPI ATD PWT Flex- Tim ACMP IIC GPIO Packag es KEAZN8 8K 1K emulate 48MHz 0 1 1 12c12b 1 6c+2c 16b 2 1 Up to 22 16 TSSOP/ 24 QFN KEAZN16 16K 2K 256B 40MHz 0 3 2 16c12b NA 6c+2c+ 2c 16b 2 2 Up to 57 32/64 LQFP KEAZN32 32K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+ 2c 16b 2 2 Up to 57 32/64 LQFP KEAZN64 64K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+ 2c 16b 2 2 Up to 57 32/64 LQFP KEAZ64 64K 8K emulate 48MHz 1 3 2 16c12b 1 6c+2c+ 2c 16b 2 2 Up to 71 64/80 LQFP KEAZ128 128K 16K emulate 48MHz 1 3 2 16c12b 1 6c+2c+ 2c 16b 2 2 Up to 71 64/80 LQFP External Use 15
1-CY MUL NVIC KEA128 Block Diagram Applications: Automotive general purpose Operating Characteristics: Voltage range: 2.7 to 5.5 V Temperature range: -40 to 125 C Key Features: ARM Cortex M0+ core 48MHz Up to 128K embedded flash Up to 16K RAM External OSC and internal ICS for clock System functions: LVD, WDG, CRC, LP modes Communication: SPI, SCI, IIC, CAN Timers: FTM, PWM, PIT, PWT, RTC 12bit ADC and ACMP System PMC 2.7-5.5V Ext Osc (1-20M, 32K) Int R/C OSC (~32KHz 2%) Int LP Osc (1KHz) FLL Clk Mult LVD POR 1xWDT 1-Cycle GPIO BME (1) Debug SWD Debugger ARM Cortex M0+ 48MHz Core Freq Peripheral Bus Packages: 16TSSOP, 24QFN, 32/ 64 and 80LQFP Pin compatible within KEA family Peripheral Bridge Flash UP To 128KB RAM Up to 16KB EEPROM 256B Option Communications I/O System Open- Drain IO, KBI, GPIO 1 PWT 1 PIT 6+2+2ch 16bit Flex Timer (2) RTC 1 MSCAN 16ch, 12bit ADC w/8 FIFO 2 Analog Comparators 2 SPI 2 I2C 3 SCI (LIN) 2 KBI (1) Support bit operation in RAM (2) Faster timer running 2 x core clock External Use 16
New pipeline for best energy efficiency 高性能低功耗内核 45.00 40.00 Processor Energy Efficiency in CoreMark/mA 42.14 35.00 30.00 x2.25 x8 25.00 20.00 18.60 15.00 10.00 5.00 10.09 5.29 6.04 0.00 Cortex-M0+ A (16bit) B (16bit) C (8bit) D (16/8bit) Assuming only 1/3 of reported MCU consumption is related to the processor Cortex-M0+ is twice more efficient than closest architecture Cortex-M0+: 1.8V, 25C, std configuration, TSMC180ULL, running CoreMark A, B, C & D: current generation of low-power Flash MCUs, running from Flash in most favourable conditions, ~1.8-2.2V, values from Datasheet/public numbers External Use 17
Kinetis Auto: General Purpose 32 Bit ARM MCU Kinetis 汽车微控制器目标应用 TM Applications: Seats/Sun Roof Windows/Doors Mirror/Wiper Fuel/Water Pump controller Body Control Park Assist DC/BLDC Motor control Ambient lighting Infotainment connection module GPS/Radio companion MCU External Use 18 Reference Solutions: BLDC motor control Vehicle Interior / Exterior LED Lighting Low Power LIN/CAN Node Networking Motorcycle Engine Control
Kinetis Auto MCU Summary Kinetis 汽车微控制器总结 Automotive grade qualified 汽车级产品认证 First 32-bit ARM-based MCU ready to use in general automotive applications Scalable 扩展性 8KB to 2MB embedded flash, pin to pin compatible Save development cost & speed time to market 节省开发成本和时间 Massive options of development tools, SW and HW references TM External Use 21
Challenges for Body Electronics 车身电子面临的挑战 Central Gateway need high performance and high scalability. 中央网关需要高性能和高扩展性. Limited R&D Cost - different applications need share common platform to reuse software/hardware/toolchain. 控制开发成本 - 不同应用需要共享软硬件平台以使得软件 / 硬件 / 工具链能够最大程度的重复使用 Smart distributed CAN/LIN nodes require smaller size and lower cost. 智能分布式 CAN/LIN 节点需要更小体积更低成本 External Use 22
S12ZVM for BLDC Motor Control 用于直流无刷电机控制的高集成度混合信号微控制器 Discrete Solution VREG (8pin) LIN phy (8pin) 3+ 2+ MCU or DSC (48pin) Op-amps 20+ Gate Driver (48pin) 4cm ~1 ½ in. S12ZVM Solution: ~ 50 fewer solder joints - 4 to 6 cm2 PCB space 64pin External Use 23
S12 MagniV: Integration Beyond the MCU MagniV: 高集成度混合信号微控制器家族 TM Our S12 MagniV portfolio simplifies system design with the integration on High- Voltage (HV) analog features onto MCUs for automotive applications MM912/S12VR Window Lift S12ZVM BLDC Motor Control S12ZVC Small CAN nodes S12ZVL LIN Nodes MM912_S812 S12ZVL S12VR S12ZVC Reduced PCB Space Reduced Bill of Material MM912_S812 Improved manufacturing efficiency Simplified development External Use 24
AUTOSAR Global Automotive Software Standard AUTOSAR 汽车软件标准 Benefits for car manufacturer Establish development distribution among suppliers Compete on innovative functions with increased design flexibility Simplify software and system integration Reduce cost of overall software development Benefits for supplier Reduce version proliferation Reuse software modules across car manufacturers Increase efficiency of application development Volume of ECUs with AUTOSAR Members represent about 80% of worldwide car production. In 2016 approx 25% of ECUs will be based on AUTOSAR. Source: AUTOSAR Source: AUTOSAR Development Partnership External Use 25
Freescale Automotive Software 飞思卡尔提供汽车软件产品 Freescale provides software products where in-depth hardware knowledge is crucial including AUTOSAR MCAL and OS, Core Self Test, and application-specific libraries to address unique hardware features. Separate Products Part of the Solution AUTOSAR Operating System AUTOSAR MCAL low-level drivers Self Test Libraries Application-oriented Libraries External Use 26
ISO 26262 : Automotive Norm on Functional Safety ISO26262: 越来越多汽车应用要求功能安全 Functional Safety. Simplified. Simplifies the process of system compliance, with solutions designed to address the requirements of automotive and industrial functional safety standards Reduces the time and complexity required to develop safety systems that comply with ISO 26262 and IEC 61508 standards Supports the most stringent Safety Integrity Levels (SILs),enabling designers to build with confidence Zero defect methodology from design to manufacturing to ensure our products meet the stringent demands of safety applications External Use 28
Session Summary 总结 Vehicle networking is ever growing complicated, which includes more and more CAN/LIN nodes, and Ethernet enters vehicle. 车身网络复杂度不断增加,CAN/LIN 节点数量快速增长, 以太网进入车身网络 MPC5748G family address high end BCM/Gateway with Ethernet. MPC5748G 提供理想的高端 BCM/ 网关解决方案 Kinetis Auto MCU with ARM core offering the scalability to cover various body applications. Kinetis 汽车 MCU 覆盖车身电子大部分应用, 整个系列具有高兼容性, 便于客户建立通用软硬件平台 MagniV family offering high-integrationintegration solutions for smart distributed nodes in vehicle network. MagniV 混合信号 MCU 为车身网络上的智能节点提供高集成度解决方案 Freescale provide AutoSAR and Functional Safety support on most MCU products. 飞思卡尔汽车微控制器具备完善的 AutoSAR 和功能安全支持 TM External Use 30
Making the World a Smarter Place. External Use 31