(Microsoft Word - \245\372\350b\254\354\247\336 K1 Emitter \265\265\245~\245\372 _3W 400nm \266\302\264\337_\262\243\253~\263W\256\346\256\

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棉暇骆
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紫外光 3W emitter 黑殼封裝封裝產品規格書 Ultraviolet (UV UV) 3W emitter black LF package product data sheet 一類 (UV UV) 產品 / 兩種品名 PE-U2C3AA-T0 / PE-U2C3AA-R0 Contents 產品特性 Features 產品編碼 Product Nomenclature 封裝外觀尺寸

1 紫外光 3W emitter 黑殼封裝封裝產品規格書 Ultraviolet (UV UV) 3W emitter black LF package product data sheet 一類 (UV UV) 產品 / 兩種品名 PE-U2C3AA-T0 / PE-U2C3AA-R0 Contents 產品特性 Features 產品編碼 Product Nomenclature 封裝外觀尺寸 Package Dimensions 光電特性 Electro-optical Characteristics 絕對最大額定值 Absolute Maximum Ratings 分類碼規格 Bin Code Specification 光譜分佈圖 Spectrum Distribution 特性曲線 Characteristic Curves 典型發光圖形 Typical Radiation Pattern 典型迴焊曲線 Typical Re-flow Profile 包裝方式 Packing 使用注意事項 Notice

2 產品特性與應用 Features and Applications: Feature 特性 Applications 應用 3W High Power Emitter LED Special Lighting (3W 仿流明大功率 LED) ( 特殊照明 ) Silicone compression molding lens Industrial Lighting ( 矽膠壓模成型透镜 ) ( 工業照明 ) Half Angle (2θ1/2) : 140 Medical Lighting ( 视角 :140 ) ( 醫療照明 ) Lens Color : Silicone Water Clear ( 透镜颜色 : 矽膠無色透明 ) 產品編碼 Product Nomenclature 下表將描述產品品名 (Product Type) 之命名原則, 有關光電特性規格之定義, 請參考分類碼規格 (Bin Code Specification) 章節之規範 P E - U 2 C 3 A A - T 0 X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X1&X2 - Module ( 模組 ) X3 - Color 顏色 X4 - Lens 透鏡 Code Code(X3) Type Code(X4) Type Type (X1&X2) U 400nm 0 Flat PE Emitter C 650nm 1 Lambertian-I D 850nm 2 Lambertian-II X5 - Substrate 基板 X6 - Power 功率 X7 - Chip 芯片 Code(X5) Type Code(X6) Type Code(X7) Type A White LF Au-plating 1 1W A Chip-A B White LF Ag-plating 2 2W B Chip-B C Black LF Au-plating 3 3W C Chip-C D Black LF Ag-plating X8 - Version 版本 X9 - Packing 包裝 X10 - CRI 演色性 Code(X8) Type Code(X9) Type Code(X10) Type A Ver.A T Tube 0 no limit B Ver.B R Reel 7 70 (min) C Ver.C 8 80 (min)

3 封裝外觀尺寸 Package Dimensions: Notes : 1. All dimensions are in millimeters ( 所有尺寸以 mm 毫米为單位 ) 2. Tolerance is ±0.25mm ( 公差 )

4 光電特性 Electrical/Optical Characteristics (Ta=25 C) Parameter ( 参数 ) Radiant Flux ( 幅射通量 ) Peak Wavelength ( 主波長 ) Forward Voltage ( 順向電壓 ) Thermal Resistance Junction To Board ( 熱阻 ) Temperature Coefficient of Forward Voltage ( 順向電壓之温度係数 ) Reverse Current ( 反向漏电流 ) Viewing Angle[1] ( 發光角度 ) Symbol ( 符号 ) Conditions ( 测试条件 ) Min. ( 最小值 ) Avg. ( 平均值 ) Max. ( 最大值 ) Units ( 单位 ) Φe IF=350mA mw WLP IF=350mA nm VF IF=350mA V RthJ-B IF=350mA 13 /W VF/ T IF=350mA 2 mv/ IR VR=5V 10 μa 2θ1/2 IF=350mA Deg 絕對最大額定值 Absolute Maximum Rating (Ta=25 C) Parameter ( 参数 ) Power Dissipation ( 消耗功率 ) Continuous Forward Current ( 持續順向输入电流 ) Peak Forward Current [2] ( 顺向脈衝電流 ) LED Junction Temperature ( 接面温度 ) Reverse Voltage ( 反向电压 ) Operating Temperature Range ( 工作温度 ) Storage Temperature Range ( 儲存温度 ) Manual Solding Temperature ( 手工焊接温度 ) ESD Sensitivity ( 抗静电能力 ) Notes: Symbol ( 符号 ) Ratings ( 數值 ) Units ( 單位 ) PD 3 W IF 700 ma IF(Peak) 1000 ma TJ 120 VR 5 V TOPR -30 To +80 TSTG -40 To +100 TSOL ESD [1]. Tolerance Θ:10,(Θ 公差为 10 ) [2]. 1/10 Duty Cycle 0.1ms Pulse Width. ( 脈衝宽度 0.1ms, 占空比 1/10) 260 ±20 For 3-5 Seconds 2000V HBM

5 分類碼規格 Bin Code Specification P F E A B Q 7 B 0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y1 - Item ( 類型 ) Y2 - Condition 測試條件 Code(Y1) Type Code(Y2) IF(mA) Unit P STANDARD F 350 mw Y3/Y4 - Peak Wavelength Group 峰波長類別 UV (400nm) Code(Y3/Y4) WLP (nm) Code(Y3/Y4) WLP (nm) VI EA VJ EB VK EC VL ED VM EE VN EF VO EG VP EH VQ EI VR EJ VS EK VT EL Y5&Y6 - Radiant Flux 幅射通量 Y7 - Forward Voltage 順向電壓 Code(Y5) Code(Y6) Min. (mw) Max. (mw) Code(Y7) Min. (V) Max. (V) A A A B A C A D A E A F A G A H A I A J A K A A L B B O C B P D B Q E B R F B S B T Y8 - Others 其它 B U Code(Y8) Ir (µa) WLP step B V B nm B W C nm B X B Y B Z Code(Y9) C A C B Y9 - TBD. 保留碼 Type Default

6 光譜分佈圖 Spectrum Distri istribution 100% Ultraviolet (UV 400nm) Spectrum Distribution Relative intensity (%) 90% 80% 70% 60% 50% 40% 30% 20% 10% 400nm 0% Wavelength(nm) 特性曲線 Characteristic Curves Radiant flux (Φe) vs Current(IF) Current(IF) vs Voltage(VF) 300% Relative intensity (%) 250% 200% 150% 100% 400nm Current (ma) nm 50% % Current(mA) Voltage (V)

7 典型發光圖形 Typical Radiatio adiation Pattern Spatial radiation pattern 100% 90% 80% Relative Intensity 70% 60% 50% 40% 30% 20% 10% 0% View angle (degrees) Spatial radiation pattern Relative intensity

8 典型迴焊曲線 Typical Reflow Soldering Profile Reflow soldering temperature profile Profile Feature Average Ramp-Up Rate (Ts max to Tp) Typical parameters 3 C/second max. Preheat Temperature Min (Ts min ) 150 C Preheat Temperature Max (Ts max ) 200 C Time (ts min to ts max ) seconds Time maintained above Temperature (TL) 217 C Time maintained above Time (tl) seconds Peak/Classification Temperature (Tp) 260 C Time within 5 C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 C to Peak Temperature 5 seconds 6 C/second max. 8 minutes max.

9 包裝方式 Packing 料管包裝 (Tube packing) Cork Tube Label (IDENTIFIES DEVICE CONTENTS) Emitter Cork ( + )Anode Side Unit nit:mm W1 W2 H1 H2 L ±0.2 ±0.2 ±0.2 ±0.2 ±2.0

10 料帶包裝 (Tape-and and-reel packing) Reel dimensions ARBOR HOLE(FOR MOUNING REEL ON PICK-AND-PLACE MACHINE) REEL (CARRIES TAPE DURING SHIPPING AND COMPONEMT FEEDING) COVER TAPE (SECURES DEVICE IN CARRIER) COVER TAPE (SECURES DEVICE IN CARRIER) LABEL (IDENTIFIES DEVICE CONTENTS) USER FEED DIRECTION Unit nit:mm M N W W1 H K S Φ330.0 ±1.0 Φ99.5 ± ± ± Φ13.5 ± ± ±0.5 Carrier tape dimensions ( + )Anode Side (360mm Min. or 32 Empty pockets) (Orientation in pockets) (360mm Min. or 32 Empty pockets) Unit nit:mm FEEDING DIRECTION W P E F P2 D D1 P0 A0 B0 K0 T ± ±0.25 ±

11 使用注意事項 Notice 使用注意事項一為避免吸潮建議將產品貯存在放有乾燥劑的乾燥櫃中, 貯存溫度為 :5 ~30, 濕度 : 60%HR 二貯存在濕度較高環境的產品使用前, 建議乾燥, 乾燥條件為 :100 ±5 /12 個小時三產品在焊錫後冷卻過程中避免機械壓力和過大震動四回焊後不允許快速冷卻五禁止焊接在變形 PCB 板上六產品不得接觸水油有機溶液七產品使用最大溫度值應考慮工作電流大小八打開防潮包裝後 7 天內產品使用完畢九重新包裝未使用的產品置防潮袋密封好之後貯存在乾燥的地方十產品外觀尺寸可更改而不另行通知十一防靜電要求 : 使用產品時, 必須戴防靜電環或防靜電手套, 所有設備裝置機台必須有效接地十二該產品必須配置恒流源驅動 Notice 1. In order to avoid absorption of moisture, it is recommended that the products are stored in the dry box (or desiccators ) with a desiccants. Alternatively the following environment is recommended: Storage temperature : 5 C~30 C Humidity:60% HR max. 2. If the storage conditions are of high humidity the product should be dried before use. Recommended drying conditions: 12 hours at 100 C±5 C 3. Any mechanical force or any excess vibration should be avoid during the cooling process after soldering. 4. Reflow rapidly cooling should be avoided. 5. Components should not be mounted on distorted Printed Circuit Boards. 6. Devices should not contact with any types of fluid, such as water, oil, organic solvents. etc. 7. The maximum ambient temperature should be taken into consideration when determining the operating current. 8. Devices should be soldered within 7 days after opening the moisture-proof packing. 9. Repack unused product in anti-moisture packing, fold to close any opening and store in a dry place. 10. The appearance and specifications of devices may be modified for improvement without notice. 11. ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands or anti-electrostatic gloves be used when handing the LEDs. All devices, equipment and machinery should be properly grounded. 12. This product must be driven by constant power supplier.

OVLFx3C7_Series_A3_bgry-KB.pub

OVLFx3C7_Series_A3_bgry-KB.pub (5 mm) x High brightness with well-defined spatial radiation patterns x U-resistant epoxy lens x Blue, green, red, yellow Product Photo Here Each device in the OLFx3C7 series is a high-intensity LED mounted