2 ABSOLUTE MAXIMUM RATINGS (Ta=25 C) Parameter Symbol Max Rating Unit Forward Current If 18 ma Reverse Voltage Vr 5 V Operating Temperature Range Top

Size: px

Start display at page:

Download "2 ABSOLUTE MAXIMUM RATINGS (Ta=25 C) Parameter Symbol Max Rating Unit Forward Current If 18 ma Reverse Voltage Vr 5 V Operating Temperature Range Top"

向钝酆
5 years ago
Views:

1 1 specification CSHF573NW2C package outlines Polarity Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.25mm (.1 ) unless otherwised noted. 3. Specifications are subject to change without notice. Part Number Chip Material Color of Emission Lens Type Viewing Angle CSHF573NW2C InGaN White Yellow Diffused Castleton Street, #588 City of Industry, CA T: F:

2 2 ABSOLUTE MAXIMUM RATINGS (Ta=25 C) Parameter Symbol Max Rating Unit Forward Current If 18 ma Reverse Voltage Vr 5 V Operating Temperature Range Top -4~+85 c Storage Temperature Range Tstg -4~+1 c Peak Pulsing Current (1/1 duty f = 1KHz) Ifp 35 ma Soldering Temperature Tsol Max 26 C for 5 sec Max OPTICAL-ELECTRICAL CHARACTERISTICS (Ta=25 C) Parameter Symbol Test Condition Value Min Typ Max Unit Luminous Intensity Iv If = 15mA lm Forward Voltage Vf If = 15mA V Reverse Leakage Current Ir Vr = 5V µa Viewing Angle at 5% Iv 2θ1/2 If = 15mA Deg Color Rendering Index CRI If = 15mA Correlated Color Temperature CCT If = 15mA K *Tolerance of viewing angle: -1 / +5 deg. 177 Castleton Street, #588 City of Industry, CA T: F:

3 明 2L optical characteristic curves Fig.1-Forward Voltage Vs. Forward Current 伏安特性性曲线 Forward Current (ma) Fig.3-Ambient Temperature Vs. Relative Intensity 环境境温度与相对对光强特性曲曲线 Relative Luminous Flux (%) Forward Voltage (v) Ta( ) 8 1 Fig.5-Forward Voltage Vs. Ambient Temperature 电压与环境温温度特性曲线 Fig.2-Forwa rd Current Vs. Relativee Intensity 正向电流与相对对光强特性曲曲线 Relative Intensity(%) Fig.4-Ambient Temperature Vs. Forward Current 环境温度与正正向电流特性性曲 Forward current (ma) Forward Current (ma) Ta( ) Fig.6-Radia ation diagram 辐射射特性曲线 Forward Voltage (v) Ta( ) 8 1 Fig.7-Chromaticity Coordinate Vs. Ambient Temperature 色坐标与环境温度特性曲线 Fig.8- Spectrum Distribution 光谱分布布特性曲线 Y X Relative Emission Intensity (%) Wa avelength [nm PAGE: 6 / 12 65K 4K 3K 177 Castleton Street, #588 City of Industry, CA T: F:

4 4 optical characteristic curves The Chromaticity Diagram Bin Data: BIN X1 CP CK CP CK CP3 CK3 NP NK NP2.367 NK2.373 NP1.381 NK WP WK WP WK WP WK Y X Y X Y X Y Castleton Street, #588 City of Industry, CA T: F:

5 5 PACKAGING SPECIFICATION Carrier Tape Dimensions FEED DIRECTION Polarity Mark Top Tape Reel Dimension 177 Castleton Street, #588 City of Industry, CA T: F:

6 6 照明明 2L soldering conditions S SMT Reflow Sold dering Instruction ns SMT T回流焊说说明平平均升温速度度 Tsmax 至 Tp 最高最 3 C/ 秒最高 3 C/ 秒预预热最低温温度 (Tsmin) 1 C 15 C 预预热最高温温度 (Tsmax)) 15 C 2 C 6-12 秒 6-18 秒限限时维持高温温温度 (TL)) 183 C 217 C 限限时维持高温温时间 (tl) 6-15 秒 6-15 秒 215 C 26 C 1-3 秒 2-4 秒最高最 6 C/ 秒最高 6 C/ 秒最多 6 分钟钟最多 8 分钟钟预预热时间 tsmin 至 tsmax t 峰 / 分类温峰值温度 (Tp) 与与实际峰值温温度 (tp) 相差差 5 C 以内的的保持时间降降温速度 2 C 升至峰 25 峰值温度所需时时间 1 1.Reflow solde ering should no ot be done mo ore than two tim mes. In the ca ase of more tha an 24 hours passed solderin ng after first, LEDs will be damaged. 回流 L 流焊次数不可以以超过两次两两次回流焊的时时间间隔如果超超过24小时 LE ED可能由于吸吸湿而损坏 2 2.When solde ering, do not put stress on the t LEDs during heating当焊焊接时不要在在材料受热时用用力压胶体表面面 Solderin ng Iron 烙铁焊接烙 1.When ha and soldering,, keep the tem mperature of iron i below less 3 less than t 3 second ds 当手工焊焊接时烙铁的温温度必须小于3 3 时间不不可超过3秒 2.The hand solder shou uld be done only one time.手手工焊接只可焊焊接一次 Repairin ng 修补 Repair should not be done e after the LED Ds have been soldered. When repairing iss unavoidable,,a double-head d soldering irron should be used (as belo ow figure). It sh hould be confirmed in advan nce whether th he characteristtics of LEDs will w or will not b damaged by be b repairing. LE ED回流焊后不不应该修复当当必须修复时必须使用双头烙头烙铁而且事先先应确认此种方方式会不会损损坏LED本身的的特性 Caution ns 注意事项项 1.The encap psulated material of the LED Ds is silicone. Therefore the e LEDs have a soft surface on the top of package. The e pressure to the p e top surface will be influen nce to the relia ability of the LEDs. L Precauttions should b be taken to av void the strong g p pressure on th he encapsulate ed part. So wh hen usethe piccking up nozzle, the pressure on the siliccone resin sho ould be properr. L LED封装胶为硅硅胶表面较软软用力按压胶胶体表面会影响响LED可靠性因此应有预防防措施避免在按按压器件当使使用吸嘴时胶胶体体表面的压力应应是恰当的 2. Compon nents should not n be mounted on warped (non ( coplanar) portion of PC CB. After solde ering, do not warp w the c circuit board.led灯珠不要焊焊接在弯曲的PC CB板上焊接接之后也不要要弯折线路板 3. Do not app 3 ply mechaniccal force or excess e vibrattion during th he cooling process to norrmal tempera ature after s soldering. Do o not rapidly cool device after a solderin ng. 回流焊之之后冷却过程中中不要对材材料实加外力也不要有有震动回流流焊后不要采采用激剧冷却却的方式 REFOND::WI-E-45 w.refond.com m 177 Castleton Street, #588 REV:E/ R Te el: City of Industry, CA order best product The most current version DATE:214/ D 11/24to supply the PAGE: 1 possible. / 12 Fax: T: F:

OVLFx3C7_Series_A3_bgry-KB.pub

OVLFx3C7_Series_A3_bgry-KB.pub (5 mm) x High brightness with well-defined spatial radiation patterns x U-resistant epoxy lens x Blue, green, red, yellow Product Photo Here Each device in the OLFx3C7 series is a high-intensity LED mounted