FI 325P Type FI 212C245XX FI 212C24551 FI 212C FI 212C35568 FI 212P2453 FI 212P2453/ FI212P8928/ FI212P85912 FI 212P89213/ FI 212P8599 FI 212P39
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- 舒杨驹 唐
- 7 years ago
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1 MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS) REFLOW FEATURES Compact and Low-profile Low loss and high attenuation Stable temperature characteristics APPLICATIONS Bluetooth module, Wireless LAN, Digital TV ORDERING CODE F I B ー T ❶ ❷ ❸ ❹ ❺ ❻ ❼ ❶Device code Filters for FI High Frequency ❷Electrode code With Plating =Blank space ❸Dimensions code [mm] EXTERNAL DIMENSIONS/STANDARD QUANTITY B L C P T D ❹Special Code Band Pass Filter Low Pass Filter Balance Filter Diplexer Balun Dual Filter ❺Frequency MHz example ~ ~77 ❻Spec Code 1~ Individual Spec ❼Packaging ー T Tape & Reel FI 325P Type FI 212B Type FI 212B24525/FI 212B19223 FI 212L Type max. 1.max FI 212C24533/FI 212C24534 FI 168B/L Type FI 212C Type FI 212C249566/FI 212C FI 212P Type FI 212P 396A4 FI 168T Type max FI 212C FI 168D Type FI 168P Type FI 15B/L Type max Max Max chipfilter1_e-1
2 FI 325P Type FI 212C245XX FI 212C24551 FI 212C FI 212C35568 FI 212P2453 FI 212P2453/ FI212P8928/ FI212P85912 FI 212P89213/ FI 212P8599 FI 212P396A4 FI 168T Type FI 168D8718 FI 168P Type (1) GND Balanced Balanced Balanced GND GND GND Low Band Unbalance High Band IN GND (2) Common GND GND GND Common Common Port Common Port GND GND GND High Band (3) GND Balanced Balanced Balanced GND GND GND High Band Balanced Low Band IN Common (4) High Band GND GND GND HIGH Band High Band Low Band GND Balanced Low Band OUT Low Band (5) GND Unbalance Unbalance Unbalance GND GND GND GND GND GND ー (6) Low Band DC NC NC or DC Low Band Low Band High Band Common NC High Band OUT ー (7) ー NC NC NC ー ー ー GND ー ー ー (8) ー GND GND GND ー ー ー GND ー ー ー Type Standard Quantity [pcs] 325P 2 212B 212L 3 212C 212P 168B 168L 168T 4 168D 168P 15B 1 15L PART NUMBERS Multi-layer band pass filters Applications External dimensions Ordering code Notes 2.4GHz W-LAN Bluetooth max. FI 212B24525/FI 212B24526/FI 212B max. FI 168B max. FI 15B24524 WiMAX max. FI 168B2565/FI168B24956D max. FI 212B3961 WiMedia Band group 1 UWB max. FI212B44882 WiMedia Band group 1 TFC 7 PHS max. FI 212B19223 Multi-layer low pass filters Applications External dimensions Ordering code Notes max. FI 212L623 for ISDB-T Digital TV max. FI 168L625 Thickness.45 mm max. WiMAX max. FI 168L Thickness.45 mm max. 2.4GHz W-LAN Bluetooth Multi-layer diplexer max. FI 15L2514 Thickness.4 mm max. Other max. FI 168D8718 Dual band LPF Applications External dimensions Ordering code Notes max. FI 212P2453 W-LAN FI 168P max. FI 168P24523 FI 212P8928 Cellular max. FI 212P89213 FI 212P8599 FI 212P85912 GPS/ 2.4GHz W-LAN max. FI 168P UWB max. FI212P396A4 BS max. FI325P1257 Multi-layer balance filters Applications External dimensions Ordering code Notes max. FI 212C24532 Conjugated match to CSR BC max. FI 212C24533 Conjugated match to CSR BC3 Bluetooth max. FI 212C24534 Conjugated match to CSR BC4-BGA max. FI 212C24536 Conjugated match to CSR BC max. FI 212C24551 Conjugated match to STLC25C-D max. FI 212C24575 Conjugated match to CSR BC5FM, BC6ROM WiMAX max. FI 212C Thickness.5 mm max max. FI 212C35568 Thickness.5 mm max. Multi-layer Balun Applications External dimensions Ordering code Notes 5GHz max. FI 168T Thickness.5 mm max. BS max. FI 168T15521 Thickness.5 mm max. HIGH FREQUENCY PRODUCTS ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 212B24525 Ripple 1. db max. 1.4 db max.(25 deg-c) 1.7 db max.(-3~+85 deg-c) 3 db min.( MHz) 3 db min.(85 MHz) 3 db min.(9 MHz) 3 db min.(18 MHz) 3 db min.(19 MHz) 27 db min.( MHz) 2 db min.(48-5 MHz) 2 db min.(5 MHz) FI 212B24526 Pass band frequency MHz 2.6 db max.(25 deg-c) 2.9 db max.(-4~+85 deg-c) Ripple at 1. db max. at 4 db min.(8-96 MHz) 3 db min.( MHz) 25 db min.( MHz) 3 db min.(48-5 MHz) 3 db min.(72-75 MHz) FI 212B24527 Ripple 1. db max. 1.4 db max.(25 deg-c) 1.7 db max.(-4~+85 deg-c) 3 db min.(8-96 MHz) 3 db min.( MHz) 6 db min.( MHz) 2 db min.(48-5 MHz) chipfilter1_e-1 177
3 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168B2451 Pass band frequency 24 25MHz Ripple 1. db max. 2.1 max. 2.2 db (25deg-C) 2.5 db (-3~+85deg-C) 25 db min. (88 96MHz) 25 db min. ( MHz) 2 db min. (48 5MHz) 2 db min. (72 75MHz) 5 ohm FI 212B19223 Pass band frequency MHz Insertion Loss at 1.7 db max. (25deg-C) MHz 2. db max. (-3-+85deg-C) Insertion Loss at 1.7 db max. (25deg-C) MHz 2. db max. (-3-+85deg-C) Ripple at Pass band 1. db max. at Pass band 3 db min. (142MHz) 18 db min. ( MHz) FI 15B24524 Ripple 1. db max. 2.2 max. FI 168B2565 FI 168B24956D 3. db max.(25 deg-c) 3.3 db max.(-4~+85 deg-c) 25 db min.(88-96 MHz) 22 db min.( MHz) 2 db min.(48-5 MHz) 2 db min.(72-75 MHz) Pass band frequency MHz 2.4 db max.(25 deg-c) MHz 2.6 db max.(-3~+85 deg-c) 2.3 db max. (25 deg-c) MHz 2.5 db max. (-3~+85 deg-c) Ripple at 1.4 db max MHz Ripple at 1.3 db max MHz at 2.4 max MHz at 1.3 max MHz 15 db min.(15-2 MHz) 1 db min.(46-8 MHz) Pass band frequency MHz Ripple at pass band at pass band FI 212B db (25deg-C) 2.6 db (-3~+85deg-C).8 db max. 2.1 max. 15 db min. (DC-162MHz) 23 db min. (349-4MHz) 25 db min. (449-8MHz) 5 ohm Pass band frequency MHz Ripple 2. db max. 2.5 max. FI 212B db max. (25 deg-c) 3. db max. (-3~+85 deg-c) 33 db min. (9MHz) 25 db min. (15MHz) 22 db min. (19MHz) 13 db min. (25MHz) 1dB min. (515MHz) 5 ohm Pass band frequency MHz 2.4 db max. (25 deg-c) MHz 2.7 db max. (-3~+85 deg-c) 2.5 db max. (25 deg-c) MHz 2.8 db max. (-3~+85 deg-c) Ripple 1.5 db max. 2.2 max. 4 db min. (24-25MHz) 25 db min. (33-36MHz) 1 db min. ( MHz) FI 212L623 Pass band frequency MHz.7 db max. (25 deg-c) 47 6MHz.9 db max. (-3~+85 deg-c) 1.5 db max. (25 deg-c) 6 71MHz 1.7 db max. (-3~+85 deg-c) 3.3 db max. (25 deg-c) 71 77MHz 3.7 db max. (-3~+85 deg-c) Ripple at MHz 1.2 db max. at MHz 2.5 max. 15 db min. (83 84 MHz) (25 deg-c) 11 db min. (83 84 MHz) (-3~+85 deg-c) 15 db min. ( MHz) 15 db min. (94 96 MHz) 7 db min. ( MHz) 8 db min. ( MHz) 8 db min. (24 25 MHz) FI 168L625 Pass band frequency MHz 1.2 db max. (25 deg-c) 47-6MHz 1.3 db max. (-3~+85 deg-c) 2.2 db max. (25 deg-c) 6-71MHz 2.4 db max. (-3~+85 deg-c) 4. db max. (25 deg-c) 71-77MHz 4.4 db max. (-3~+85 deg-c) Ripple at MHz 1.4 db max. (47 71 MHz) 2.5 max. (71 77 MHz) 25 db min. ( MHz) (25 deg-c) 21 db min. ( MHz) (-3~+85 deg-c) 25 db min. (94 96 MHz) 27 db min. ( MHz) 26 db min. ( MHz) 26 db min. (24 25 MHz) FI 168L Pass band frequency MHz MHz.5 db max. (25 deg-c) 47-77MHz.6 db max. (-3~+85 deg-c).5 db max. (25 deg-c) 23-27MHz.6 db max. (-3~+85 deg-c) Ripple at MHz.3 db max. Ripple at MHz.3 db max. at 47 77MHz at 23 27MHz 2 db min. (46 54 MHz) 2 db min. (69 81 MHz) FI 15L db max.(25 deg-c) MHz.55 db max.(-4~+85 deg-c) at 1.7 max MHz 21 db min.(48-5 MHz) 21 db min.(72-75 MHz) 178 chipfilter1_e-1
4 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168D8718 FI 212C S S S S Pass band frequency MHz MHz.6 db max.( -2 to +85 Deg.C) at MHz 1.5 max. 25 db min. ( MHz) 25 db min. ( MHz) Pass band frequency MHz MHz.6 db max.( -2 to +85 Deg.C) at MHz 1.5 max. 25 db min. ( MHz) 25 db min. ( MHz) Isolation In to In/Out to Out 27 db min. ( MHz) 3 db min. ( MHz) In to Out 3 db min. ( MHz) 3 db min. ( MHz) FI 212C24532 Ripple 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. Balanced port 2. db max. 18 +/- 1 deg 35 db min. (88-96MHz) 2 db min. ( MHz) 2 db min. ( MHz) 2 db min. (48-5MHz) Unbalanced Port 5 ohm Conjugated match to CSR BC4 Ripple Amp. balance at Passband Phase Balance at Passband 2.7 db max.(25 deg-c) 3. db max.(-3~+85 deg-c) 1. db max. 2. db Max. 18 +/- 1 deg Unbalanced Port V.S.W.R at Passband V.S.W.R at Passband 25 db min.(88-96 MHz) 15 db min.( MHz) 12 db min.( MHz) 15 db min.(48-5 MHz) Unbalanced Port 5 ohm FI 212C24536 Conjugated to CSR BC4-BGA, BC5-BGA Ripple 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. Balanced port 2. db max. 18 +/- 1 deg 35 db min. (88-96MHz) 2 db min. ( MHz) 15 db min. ( MHz) 2 db min. (48-5MHz) Unbalanced Port Conjugated match to CSR BC5 HIGH FREQUENCY PRODUCTS FI 212C24533 pass band 2.7 db (25deg-C) 3. db (-3~+85deg-C) Ripple 1. db max. Balanced port 2. db max. 18 +/- 1 deg 25 db min. (88-96MHz) 15 db min. ( MHz) 15 db min. ( MHz) 15 db min. (48-5MHz) Unbalanced Port Conjugated match to CSR BC3 chipfilter1_e-1 179
5 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 212C24551 Ripple FI 212C db (25deg-C) 4. db (-3~+85deg-C) 1. db max. Balanced port 2. db max. 18 +/- 1 deg 4 db min. (824 96MHz) 12 db min. ( MHz) 27 db min. ( MHz) 25 db min. ( MHz) 23 db min. ( MHz) 2 db min. (48-5MHz) Unbalanced Port 5 ohm Conjugated match to STLC25C-D Ripple 3.7 db (25deg-C) 4. db (-3~+85deg-C) 1. db max. 2.2 max. Balanced port 2.2 max. 2. db max. 18 +/- 1 deg 4 db min. (88-96MHz) 18 db min. ( MHz) 12 db min. ( MHz) 3 db min. (48-5MHz) Unbalanced Port 5 ohm FI 212C Conjugated match to CSR BC5FM.BC6ROM Pass band frequency MHz 2.9 db max. (25 deg-c) at MHz 3.2 db max. (-3~+85 deg-c) Ripple at MHz 1.2 db max. at MHz Balanced port at MHz 2. db max. at MHz 18 +/- 12 deg at MHz 2.3 db max. (25 deg-c) at MHz 2.6 db max. (-3~+85 deg-c) Ripple at MHz 1. db max. at MHz Balanced port at MHz 2. db max. at MHz 18 +/- 12 deg at MHz 4 db Min. (824-96MHz) 15 db Min. ( MHz) 2 db Min. (49-585MHz) 5 : FI 212C35568 Pass band frequency 33-38MHz Ripple at pass band FI 212P db max. (25 deg-c) at 24-25MHz.7 db max. (-3~+85 deg-c) 14 db min. (49-515MHz) 2 db min. ( MHz) 14 db min. ( MHz) Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz FI 168P db (25 deg-c) 2.8 db (-3~+85 deg-c) 1. db max. Balanced port Amplitude imbalance at pass 2. db max. band Phase imbalance 18 +/- 12 deg 4 db min. ( MHz) 4 db min. ( MHz) 35 db min. (24-25MHz) 15 db min. (49-585MHz) 5:1.7 db max. (25 deg-c).9 db max. (-3~+85 deg-c).6 db max. (25 deg-c).8 db max. (-3~+85 deg-c).9 db max. (25 deg-c) 1. db max. (-3~+85 deg-c) (band-1.-2) 2.5 max. (band-2) 2 db min. (24-25MHz).4 db max. (25 deg-c) at 24-25MHz.5 db max. (-3~+85 deg-c) at MHz 2 db min. (49-558MHz) 15 db min. (585-85MHz) Pass band frequency MHz.6 db max. (25 deg-c) at MHz.7 db max. (-4~+85 deg-c) at MHz 2 min. (24-25MHz) 18 chipfilter1_e-1
6 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168P24523 FI 212P at 24-25MHz.6 db max. (25 deg-c).7 db max. (-3~+85 deg-c) at MHz 2.max. 2 db min. (48-6MHz) db min. (72-75MHz) Pass band frequency MHz.8 db max. (25 deg-c) at MHz.95 db max. (-4~+85 deg-c) at MHz 2.max. 2 db min. (18-25MHz) 2 db min. (98-119MHz) *Referece FI 212P8928 Pass band frequency MHz at MHz.27 db max.(+25 Deg.C).32 db max.(-4 to +85 Deg.C) at MHz 13dB min. ( MHz) Pass band frequency MHz MHz.45 db max.( +25 Deg.C).55 db max.(-4 to +85 Deg.C) at MHz 19dB min. (698-96MHz) FI 212P89213 Pass band frequency MHz at MHz.27 db max.(+25 Deg.C).32 db max.(-4 to +85 Deg.C) at MHz 13dB min. ( MHz) Pass band frequency MHz MHz.45 db max.( +25 Deg.C).55 db max.(-4 to +85 Deg.C) at MHz 19dB min. (698-96MHz) Pass band frequency MHz at MHz.7 db max.(+25 deg-.c).75 db max.(-3~+85 deg-.c) at MHz dB min. ( MHz) 2dB min. ( MHz) 19dB min. ( MHz) Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz at MHz.75 db max.(+25 deg-.c).85 db max.(-3~+85 deg-.c) at MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at MHz at MHz at MHz 35dB min. ( MHz) 42dB min. ( MHz) 25dB min. (894 96MHz) FI 212P85912 Pass band frequency MHz at MHz.7 db max.(+25 deg-.c).75 db max.(-3~+85 deg-.c) at MHz dB min. ( MHz) 2dB min. ( MHz) 19dB min. ( MHz) Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz at MHz.75 db max.(+25 deg-.c).85 db max.(-3~+85 deg-.c) at MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at MHz.7 db max.(+25 deg-.c).8 db max.(-3~+85 deg-.c) at MHz at MHz at MHz 35dB min. ( MHz) 42dB min. ( MHz) 25dB min. (894 96MHz) HIGH FREQUENCY PRODUCTS 5 ohm chipfilter1_e-1 181
7 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168P Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz.5 db max.(+25 deg-.c) at MHz.6 db max.(-4~+85 deg-.c).4 db max.(+25 deg-.c) at MHz.5 db max.(-4~+85 deg-.c) at MHz.45 db max.(+25 deg-.c).55 db max.(-4~+85 deg-.c) at MHz at MHz at MHz 13dB min. (24-25MHz) High Band Pass band frequency MHz at MHz.6 db max.(+25 deg-.c).7 db max.(-4~+85 deg-.c) at MHz 12dB min. (824 96MHz) 23dB min. ( MHz) 2dB min. ( MHz) FI 212P396A4 Pass band frequency MHz 1.2 db max.(+25 deg-.c) at MHz 1.5 db max.(-4~+85 deg-.c) at MHz 2.2 max. 18dB min. ( MHz) Pass band frequency MHz at MHz 1.2 db max.(+25 deg-.c) 1.5 db max.(-4~+85 deg-.c) at MHz 2.2 max. 13dB min. ( MHz) FI 168T Pass band frequency MHz FI 168T db max.(25 deg-c) 1.2 db max.(-3~+85 deg-c) Phase balance 18 +/- 1 deg 1. db max. 5 : 1 Pass band frequency 9-22MHz 2. db max.(25 deg-c) 2.3 db max.(-3~+85 deg-c) Phase balance 18 +/- 2 deg +/-2 db max. 5 : FI 325P1257 Pass band frequency at MHz Ripple at MHz at MHz MHz 4. db max.(+25 deg-.c) 4.4 db max.(-4~+85 deg-.c) 3. db max.(+25 deg-.c) 3.4 db max.(-4~+85 deg-.c) 2.2 max. 44dB min. (165 22MHz)(+25 deg-.c) 4dB min. (165 22MHz)(-4~+85 deg-.c) 45dB min. (165MHz)(+25 deg-.c) 41dB min. (165MHz)(-4~+85 deg.-c) High Band Pass band frequency MHz 4. db max.(+25 deg-.c) at MHz 4.4 db max.(-4~+85 deg-.c) Ripple 3. db max.(+25 deg-.c) at MHz 3.2 db max.( -4 to +85 Deg.C) 2.25 max. at MHz 44dB min. (9 145MHz)(+25 deg-.c) 4dB min. (9 145MHz)( -4~+85 deg-.c) 45dB min. (145MHz)(+25 deg-.c) 41dB min. (145MHz)(-4~+85 deg-.c) 182 chipfilter1_e-1
8 HIGH FREQUENCY PRODUCTS chipfilter1_e-1 183
9 PACKAGING 1Minimum Quantity 2Tape Material Type Embossed Tape [pcs] 325P 2 212B 212L 3 212C 212P 168B 168L 168T 4 168D 168P 15B 1 15L Type (EIA) 325P 212B 212L Tape Thickness Chip cavity Insertion Pitch max. A B F K T 2.75± ±.2 4.± (.18±.8) (.14±.8) (.157±.4) (.53) (.12) 1.5± ±.2 4.± (.59±.8)(.91±.8)(.157±.4) (.63) (.12) 1.55±.2 2.3±.2 4.± (.61±.8)(.91±.8)(.157±.4) (.26) (.26) 212C 1.55±.2 2.3±.2 4.± (.61±.8) (.91±.8) (.157±.4) (.63) (.12) 212C ±.2 2.3±.2 4.± C-.7 (.61±.8)(.91±.8)(.157±.4) (.51) (.12) 212P 168B 168L 168T 168D 168P 15B 15L 1.55±.2 2.3±.2 4.± (.61±.8)(.91±.8)(.157±.4) (.63) (.12) 1.±.5 1.8±.5 4.± (.39±.2)(.71±.2)(.157±.4) (.22) (.22) 1.±.5 1.8±.5 4.± (.39±.2)(.71±.2)(.157±.4) (.22) (.22) 1.±.5 1.8±.5 4.± (.39±.2)(.71±.2)(.157±.4) (.22) (.22) 1.±.5 1.8±.5 4.± (.39±.2)(.71±.2)(.157±.4) (.22) (.22).95±.5 1.8±.5 4.± (.37±.2)(.71±.2)(.157±.4) (.31) (.31).62± ±.3 2.± (.24±.1)(.44±.1)(.79±.2) (.18) (.18).62± ±.3 2.± (.24±.1)(.44±.1)(.79±.2) (.18) (.18) (inch) 4Leader and Blank Portion Taped package Type (EIA) Thickness mm (inch) Standard Quantity [pcs] 325P.9 typ.(.35) 2 212B.9 typ.(.35) 212L.45 typ.(.18) 212C.9 typ.(.35) 212P.9 typ.(.35) 3 212C typ.(.18) 212C-.7.6 typ.(.24) 168B.45 typ.(.18) 168L.45 typ.(.18) 168T.45 typ.(.18) 4 168D.45 typ.(.18) 168P.6 typ.(.24) 15B.3 typ.(.118) 15L.3 typ.(.118) 1 5Reel size 16mm or more 1mm or more 3Taping Dimensions Embossed tape.315 inches wide (325P Type, 212B Type, 212C Type, 212C-.7 Type) Paper tape.315 inches wide (212L Type, 212C-.5 Type, 168B Type, 168L Type, 168 Type, 168T Type, 168DType, 15B Type, 15L Type) 6Top Tape Strength (inch) The top tape requires a peel-off force of.1~.7n in the direction of the arrow as illustrated below. (inch) chipfil_reli-prp1 chipfil_reli_e-1
10 RELIABILITY DATA 1. Operating Temperature Range 2. Storage Temperature Range Note : ー 2 to +4 in taped packaging 3. Resistance to Flexure of Substrate Warp : 2mm Testing board : Glass epoxy-resin substrate Thickness :.8mm -3~+85-3~+85 No mechanical damage. 4. Adhesion of Electrode Applied force : 5N Duration : 1 sec. 5. Solderability Solder temperature : 23±5 Preconditioning : Immersion into flux. Duration : 4±1 sec. Immersion and Removal speed : 25mm/sec. 75% or more of immersed surface of terminal electrode shall be covered with fresh solder. 6. Resistance to Solder Heat Preheating : 15 for 2 min. Preconditioning : Immersion into flux. Solder temperature : 26±5 Immersion and Removal speed : 25mm/sec. Duration : 5±.5 sec. Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 7. Thermal Shock According to JIS C 25. Conditions for 1 cycle Step Temperature ( ) Duration (min) 1 ー 4±3 3±3 2 Room Temperature Within ±2 3±3 4 Room Temperature Within 3 Number of cycles : 1 Mounting method : Soldering onto PC board. Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 8. Humidity (steady state) Temperature : +4±2 Duration : 96 hrs Humidity : 9~95%RH Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 9. High temperature life test Temperature : +85±2 Duration : 96 hrs Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 1. Low temperature life test Temperature : ー 4±2 Duration : 96 hrs Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Note on standard condition: "standard condition" referred to herein is defined as follows : 5 to 35 of temperature, 45 to 85% relative humidity and 86 to 16kPa of air pressure. When there are questions concerning measurement result : In order to provide correlation data, the test shall be conducted under condition of 2±2 of temperature, 6 to 7% relative humidity and 86 to 16kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition". chipfil_reli-prp2 chipfil_reli_e-1
11 PRECAUTIONS 1. PCB Design Land pattern design Land pattern dimension examples FI325P Type FI212B Type FI212B24525/FI212B19223 FI212L Type FI168T/D Type FI168B/L Type FI168P Type FI212C Type Technical considerations FI212P Type FI212 P396A4 FI15B/L Type Soldering Conditions for Reflow soldering (for reference) Reflow Profile Technical considerations Components should be preheated to within 1 to 13 from soldering temperature. Assured to be reflow soldering for 2 times. Note : The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. 3. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : ー 2~+4 Precautions Humidity : Below 7%RH The ambient temperature must be kept below 3. Even under ideal storage conditions, the solderbility of electrodes decreases gradually, so filters should be mounted within 6 months from the time of delivery. The packaging material should be kept where no chlorine or sulfur exists in the air. Technical considerations Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/ packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check the solderability before using the filter. Please contact of our offices for further details of specifications. All of the standard values listed here are subject to change without notice. Therefore,please check the specifications carefully before use. chipfil_reli-prp3 chipfil_reli_e-1
. Land Patterns for Reflow Soldering.Recommended Reflow Soldering Conditions (For Lead Free) TYPE PID0703 PID0704 PID1204 PID1205 PID1207 PID1209 L(mm
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1/15 V ALTIS-3535-3W-W-V Technical Document Features...2 Application...2 Environmental Compliance...2 Absolute Maximum Ratings...3 Flux Characteristics (Tj=50, IF=700mA)...4 Mechanical Dimension...5 Pad
HC80279_2007
Reliability Laboratory Page: 1 of 7 Date: August 31, 2007 TEMWELL CORPORATION 8F-1, NO. 51, SEC. 1, MIN SHENG E. RD., TAIPEI, TAIWAN The following merchandise was submitted and identified by the vendor
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GNR-V7R1
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SMD POWER INDUCTORS BS CDSU SERIES Test Freq. : BS0302CDSU BS0403CDSU BS0502CDSU BS0503CDSU BS0504CDSU BS0703CDSU BS0705CDSU BS1004CDSU BS1005CDSU 1.0
SPECIFICATION OF BS CDSU SERIES FEATURES 1. To be high saturation for surface mounting type inductors. 2. Low cost feature. APPLICATIONS VTR, QA equipment, LCD television set, nootbook PC, portable communication
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UNISONIC TECHNOLOGIES CO., LTD LOW NOISE ma LDO REGULATOR DESCRIPTION The UTC is a typical LDO (linear regulator) with the features of High output voltage accuracy, low supply current, low ON-resistance,
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ofired eramics Series UUNG-G HNOOGY OF RF SOUION Feature 特点 低温共烧陶瓷 ompact Size 体积小 Miniaturized SM packaged in low profile and lightweight. ow oss 低 ow insertion loss, high attenuation. High Soldering
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Pin Configurations Figure2. Pin Configuration of FS2012 (Top View) Table 1 Pin Description Pin Number Pin Name Description 1 GND 2 FB 3 SW Ground Pin.
Features Wide 3.6V to 32V Input Voltage Range Output Adjustable from 0.8V to 30V Maximum Duty Cycle 100% Minimum Drop Out 0.6V Fixed 300KHz Switching Frequency 12A Constant Output Current Capability Internal
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Page: 1 of 7 Date: April 26, 2010 WINMATE COMMUNICATION INC. 9 F, NO. 111-6, SHING-DE RD., SAN-CHUNG CITY, TAIPEI, TAIWAN, R.O.C. The following merchandise was submitted and identified by the vendor as:
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HC70044_2008
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POWER INDUCTOR 功率電感 LQH SERIES Features High Q values Low resistance Ordering Code 特性 LQH 1210 4R7 高 Q 值. 1 2 3 4 低阻抗. 1.Type 類型 2.Dimension 尺寸 3. Inductance 電感值 4.Tolerance 公差 M=±20% K=±10% J=±5% Dimensions
HC20093A_2008
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HC70245_2008
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HCD0174_2008
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HC50246_2009
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Building Technology Experience Center concept air conditioning concept heat pump special energy-saving techniques in hydraulics Concrete core conditio
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外 型 尺 寸 ETENAL DIMENSIONS Type 长 L 宽 W 厚 T 端 e 1.6 0.2 0.8 0.2 0.8 0.2 0.3 0.2 FBMJ16080603 0.063 0.008 0.031 0.008 0.031 0.008 0.012 0.008 0.2 1.2 0.
大 电 流 矩 形 片 状 磁 珠 FB 系 列 M 型 ( 矩 形 片 状 磁 珠 电 感 器 ) ECTANGULA FEITE CHIP BEADS (HIGH CUENT) FB SEIES M TYPE 使 用 温 度 OPEATING TEMP. 408 特 点 FEATUES 可 用 于 电 源 单 元 耐 大 电 流 6A 耐 高 功 率 高 可 靠 性 FBMJ 型 有 多 种 可
DCR (Max.) CKST uH/M 0.1±20% CKST uH/M 0.22±20% CKST uH/M 0.47±20% CKST uH/M 0
B E FEATURES 特性 1.Shielded construction 屏蔽罩结构 2.High current rating up to DC 65Amp 高电流范围可到 64A 3.High frequency rang up to 5MHz 宽频范围可到 5MHz 4.Very low DC resistance 低值电流 5.Low noise 低损耗 6.ROHS compliant
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HC20131_2010
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NO.: 产 品 规 格 书 PRODUCT SPECIFICATION 顾 客 型 号 Client : 型 号 : 3.96mm Pitch 9 &18 Pressure 产 品 编 码 Part Number: 见 产 品 图 纸 规 格 书 : 制 订 Edit 田 野 212.4.28 审 核 Check 王 富 212.9.24 批 准 Approval 朱 春 燕 212.9.24 浙
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HDMI camera ARTRAY CO,. LTD Introduction Thank you for purchasing the ARTCAM HDMI camera series. This manual shows the direction how to use the viewer software. Please refer other instructions or contact
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Operating and Installation Instructions 5120 004601 (PD 84 09 25) Please read this specification carefully before you use the product. Any failure and losses caused by ignoring the above mentioned items