PCB 生產流程 PCB Process Flow Chart 製表 :2015/08/01
PCB Process Flow Chart 工程製前 Pre- Engineering 發料 Material releasing 內層線路 Inner Layer Trace 自動光學檢測 A O I 壓合 Lamination 鑽孔 Drilling 一次銅 PTH 乾膜線路 Dry Film Image Transfer 二次銅 Pattern Plating 中檢 &AOI Inspection 防焊印刷 Solder Mask 表面處理 Surface metalized 文字 Silk Legend 成型 Router 測試 Test O/S 成品檢驗 Final Inspection 包裝 Packing 出貨 Shipping Circuitech Precision Electronics, Inc.
工程製前生產流程 Pre-Engineering Process Flow Chart OP : 將客戶之原始資料, 依廠內各製程能力, 成本 效率 良率 之考量轉換成工單作為製造之標準. CAM: : 將客戶的資料轉換成工廠可生產的資料 ; 同時製作生產所需之工具 OP :Checking Gerber of customer under PCB processes capability and create suitable processes flow chart with spec for production line following. CAM: Uses Gerber file of customer to edit working panel tools for PCB processes, including artwork film and NC program. OP CAM 客戶原稿 Original Gerber checking 鑽孔檢查 NC drilling checking 客戶原稿 Original Gerber OP 設計 Create OP 測試程式製作 Net list program CAM 製作 CAM edition 阻抗設計與排版 檢修程式製作 VRS program 出鑽孔程式 Create NC drilling program CAM 製作 CAM edition CNC 程式製作 Create CNC routing program 工單問題詢問 Release DFM 成型圖製作 Create outline drawing V-CUT 圖製作 Create V-cut drawing 底片繪製與壓膜 底片檢查與原稿校對 底片 scan 檢修 Artwork scanning 底片量測 Artwork inspection CAM 工作站 CAM workstation 壓膜機 Protective film lamination 沖片機 Artwork developer 繪片機 Plotter 底片檢查機 Film inspector 八目檢查機 Artwork inspector
物管課生產流程 Material Management Process Flow Chart 物管 : 依工程設計基板規格及排版圖裁切生產工作尺寸 Material Management: As OP instruction, cut material into suitable working panel size and release to Inner layer or drilling process. 進料 Material incoming 請購 Material application 收料 Material incoming 檢驗 Inspection 入庫 In store 發料 & 領料 Material releasing 發料及領料 Material releasing 裁切 Cutting 裁切機 Diamond saw machine 磨邊清洗機 Grind machine 圓角機 Round corner machine
內層課生產流程 Inner Layer Process Flow Chart 內層 : 在基板表面塗布感光油墨, 利用影像轉移的方式將線路圖形轉移到基板表面油墨上, 再通過顯影 蝕刻和去膜的製成製作內層板 Inner Layer:Coating the film of photosensitive ink by roller on the CCL surface, transfer the pattern on CCL with UV light through artwork film, like photo; then have the development, etching and striping stage to finish whole process. 油墨塗布 Film coating 前處理 Pre-treatment 油墨塗布 Coating ink 烘烤 Curing 曝光 / 蝕刻 Exposure/Etching 曝光 Exposure 顯影 Developing 蝕 刻 Acid etching 去膜 Striping AOI CCD 鑽孔 Drill tooling holes 自動光學檢測 AOI 檢修 VRS 內層前處理 Pre-treatment 水平塗布 Roller Coating 曝光 Exposure 內層蝕刻 Etching CCD 鑽孔 Drill Tooling Holes 自動光學檢測 AOI
壓合課生產流程 Lamination Process Flow Chart 壓合 : 利用熱壓合的方式將經表面處理過的內層板 銅箔和與之相對應的半固化膠片進行熱壓 固化成一個整體 ( 亦即後續生產中的覆銅板 ) Lamination Press:Put inner layer, prepreg and copper foil together as stack up construction, then press them through high temperature and pressure to becoming CCL. 棕 化 Brown Oxidation 酸洗 Acid cleaning 鹼洗 Cleaner 預浸 Pre-dip 棕 化 Brown oxidation 烘乾 Baking 疊 合 Stack up PP 裁切 PP Cutting PP 沖孔 PP drilling 熱熔機熔合 Auto Alignment Welding 疊板 Stack up 壓 合 Lamination press 熱壓 Hot press 冷壓 Cool press 下料 Unloading X-RAY 鑽靶 X-ray drill CNC 撈邊 CNC Routing 棕 化 Brown Oxidation 熱熔機熔合 Auto Alignment Welding 疊合 Stack Up 壓合 Press X-RAY 鑽靶 X-RAY drill CNC 撈邊 CNC Routing
鑽孔課生產流程 Drilling Process Flow Chart 鑽孔 : 根據製前工程的鑽孔資料, 在覆銅板的既定位置鑽出所需要的孔 Drilling:As NC program in the Gerber file, drill all holes for through holes copper plating purpose to connect each layers as customer s design. 鑽 孔 Drilling 上 PIN Stack pinning 鑽孔 Drilling 下 PIN De-pinning X-RAY X-Ray 孔位 AOI Hole AOI 雷射鑽孔 Laser Drilling 上料 Loading 雷射 Drilling 下料 Unloading 盲孔檢查 AOI 10 萬轉鑽孔機 Low RPM Drilling 16 萬轉鑽孔機 High RPM Drilling 20 萬轉鑽孔機 High RPM Drilling X-RAY 檢查 X-RAY checking 驗孔機 Hole Inspector 孔位 AOI Hole AOI 盲孔檢查機 Laser via AOI
一銅課生產流程 Panel Plating Process Flow Chart 一次銅 : 首先用化學反應的方式將通孔內膠渣去除, 再利用化學沉銅的方法在不導電的通孔壁沉積上可導電的化學銅, 然後還用電鍍方法在化學銅表面鍍上金屬銅 Panel Plating:De-smear first to remove resin residues on holes wall by chemical, following by electricless for copper metal deposition then doing electric copper plating again to get around 0.2 mils of copper conductive thickness; purpose is to let each layer connection. 去膠渣 / 化學鍍銅 De-burr /Immersion Copper 一次銅 Panel plating 自動調壓磨刷機 Automatic grinding machine 膨鬆 Fluffy 預浸 Pre-dip 酸浸 Acid dip 放板 Loading 高錳酸鉀 Permanganate 活化 Activation 化學銅 P T H 磨刷 Brushing 中 和 Counteraction 速化 Rapid 一銅 VCP 水洗 Rinse 整孔 Conditional 化學銅 Electroless copper 電鍍填孔 Hole plating 烘烤 Air-blowing 微 蝕 Micro-etching 去毛頭機 De-burr 除膠渣 De-smear 化學銅 PTH 一次銅 VCP 電鍍填孔 Hole plating 驗孔機 Hole Inspector 自動調壓磨刷機 Automatic grinding
乾膜課生產流程 Dry Film Process Flow Chart 乾膜 : 利用影像轉移的方式將外層線路部份的圖像轉移到貼附於 PC 板上的感光乾膜上, 然後用碳酸鈉溶液將覆蓋在線路上的膜溶解, 使銅面顯影出來, 方便後續二次銅電鍍作業 Dry Film:Press dry film (a sensitive material) on multilayer CCL. Make external layer pattern by UV light through artwork, similar inner layer process; next developed by alkaline solution to remove dry film for copper pattern plating. 前處理 Pre-treatment 酸洗 Acid cleaning 水洗 Rinse 磨刷 Brushing 水洗 Rinse 烘乾 Air-blowing 曝 光 Exposure 顯 影 Developing 壓膜 Press film 顯影 Developing 曝光 Exposure 水洗烘乾 Rinse Air-blowing 外層前處理 Pre-treatment 壓膜 Press film 曝光 LDI 曝光 Exposure 顯影 Developing 自動光學檢測 AOI
二銅課生產流程 Pattern Plating Process Flow Chart 二次銅 : 通過電鍍的方式將乾膜後的半成品 PC 板之導通孔的銅厚度增加到客戶需求的厚度, 再經過去膜蝕刻去除不需要的表面銅, 保留需要的線路 Pattern Plating:Increasing external layer pattern conductive thickness through electric copper plating, up to the spec as customer s design and request. 二次銅電鍍 Pattern Plating 去油脂 De-grease 微 蝕 Micro-etching 預浸 Pre-dip 鍍銅 Electric copper plating 酸浸 Acid-dip 鍍 錫 Pure Tin plating 蝕刻 Etching 去 膜 Dry film strip 蝕 刻 Alkaline etching 剝錫 Tin strip 烘乾 Air-blowing 二次銅電鍍 Pattern Plating 去膜蝕刻剝錫 Etching/Stripping 線寬距量測 Line width measuring 阻抗量測 TDR 中檢 Inspection 光學檢驗 AOI
防焊課生產流程 Solder Mask Process Flow Chart 防焊 : 在半成品 PCB 表面表面塗布感光阻焊油墨, 利用影像轉移方式將各式圖形轉移至 PCB 板上, 再通過顯影及烘烤方式使油墨附著故化, 以達到絕緣阻焊之目的 Solder Mask:Coating solder mask by silkscreen printing on bare PCB; solder mask is one kind of sensitive ink, will form a sensitive film after low temperature pre-curing. Next by photo method with high power UV light to do initial curing, except partial selective pads or holes designed for assembly and solder mask on those selective pads or holes will be removed by alkaline solution under developing, following baking again to do final curing for hardness increasing to protect the pattern. 前處理 Pre-treatment 放板 Loading 磨刷 Brushing 水洗 Rinse 烘烤 Air-blowing 印 刷 Printing 製板 Stencil 印刷 Printing 預烤 Pre-curing 顯 影 Developing 曝光 Exposure 顯影後烤 Developing Post-curing 防焊前處理 Pre-treatment 製網板 Stencil 印刷 Printing 曝光 Exposure 顯影 Developing 後烤 Post-Curing
加工課生產流程 Hot Air Solder Leveling Process Flow Chart 表面處理 : 噴錫 / 無鉛噴錫 / 化金 / 鍍金 Surface metalized :HASL / Lead Free HASL / Chemical Gold / ImmersionGold 表面處理 Surface metalized 進料 Loading 表面處理 Surface metalized 外觀檢驗 Visual inspection 噴錫 HASL 無鉛噴錫 Lead Free HASL 化 金 Chemical Gold 鍍 金 Immersion Gold
文字課生產流程 Legend Printing Process Flow Chart 文字 : 利用網板之文字, 標示圖案, 以客戶指定之油墨, 準確印製於 PCB 板板面, 以利客戶裝配零件合維修之辨識 Legend Printing:Print component marks including certain serial numbers on PCB by screen, as customer s design. 文 字 Legend Printing 製網板 Stencil 印刷 Printing 烘烤 Baking 製網板 Stencil 文字印刷 Legend Printing 文字噴塗 Legend Printing 熱烘 Baking UV 烘乾 UV Curing
成型課生產流程 Routing Process Flow Chart 成型 : 成型是針對 PCB 進行切削作業, 依製作規範要求切削成客戶需要的尺寸形狀 V-CUT :V-CUT 是針對 PCB 折斷邊進行切割作業, 依製作規範要求切割成符合客戶要求深度的溝槽 CNC Routing:Cut out the outline dimension of PCB by NC router machine with router bit or punch machine with punch die, as per customer s design or request. V-CUT :Pre-cut a line on both sides of PCB, between piece to piece or piece to breakaway tab, for separation from panel after customer implement assembly. The spec is usually given by customer or PCB vendors propose for customer confirming. 成 型 Routing 放板 Loading 上定位梢 Pin alignment CNC 切割 CNC routing 下板 Unloading 溝槽切割 V-Cut 放板 Loading 切割 V-Cut 收板 Unloading 成型 CNC Routing 溝槽切割 V-CUT 金手指斜邊 Gold Finger beveling
測試課生產流程 O/S Process Flow Chart 測試 :OPEN/SHORT 測試是指用電性原理來測試 PCB 的線路導通品質 O/S Test:Create a net list program from Gerber file to do trace open/short checking, is a electricity function testing implement for customer; usually 100% implement request by both customer and PCB vendors. 測 試 O/S Test 清洗 Cleaning 測試 Testing 檢修 VRS 複測 Re-testing 清洗 Cleaning 酸洗 Acid Cleaning 萬用型測試機 Universal Tester 專用型測試機 Dedicated Tester ATG- 飛針 Fly-probe EMMA- 飛針 Fly-probe 檢修 VRS
成檢課生產流程 FQC Process Flow Chart 外觀檢驗 : 對 PCB 產品外觀依客戶需求進行 100% 的目視檢驗 OSP : 以無公害的有機物覆蓋於 PCB 裸露的銅表面, 防止銅表面氧化 FQC:Last implement 100% of PCB appearance inspection by QC visual to make sure good PCB to customers as request. OSP :One kind of copper surface treatment by organic chemical film coating to prevent oxidation and helpful soldering during assembly. 外觀檢驗 Visual inspection 外觀檢驗 Visual inspection 驗 孔 Hole inspector 表面處理 Surface metalized 外觀檢驗 Visual inspection OQC OQC 外觀檢驗 Visual Inspection 驗 孔 Hole Inspector 有機保焊 OSP 化 銀 Immersion Silver 化 錫 Immersion Tin 壓烤 Oven
包裝課生產流程 Packing Process Flow Chart 包裝 : 將 PCB 產品外觀依客戶需求目視檢驗合格之 PCB 板進行整板分類包裝 Packing: As customer s request or internal spec to pack PCB and put in carton for shipment, and must prevent damage during transportation to customer 包 裝 Packing 摺板彎翹 Bow& Twist checking 挑週期 Date code checking 算數量 Counting 真空包裝 Vacuum package 秤 重 Weight checking 裝箱入庫 Put in carton In store 摺板彎翹 Bow & Twist checking 真空包裝 Vacuum package 秤 重 Weight checking 裝箱 Put in carton 入庫 In store