PDP : /PDP :
CRT ( ) HDTV ( ) PC monitorvga XGA UXGA monitor TV Note-PC ( ) 19 20 21 I T :
Stadium, Theater, etc SNG Satellite Mobil Stock, Exchange Contents Provider Weather : NHK Service Provider Video Server Terrestrial CATV Broadcast Services Multi-channel HDTV Multimedia Home Home server
Menu Screen HDTV main channel Weather TV newspaper headlines Favorite channels Programs in home server Audio services Program table E-mail
: NHK Data Broadcasting ~ from watch TV to using TV~
PDP
PDP NEC Pioneer
Pioneer
127 57 FHP 130 50 183 180 PDP : 12th FPD manufacturing Technology Expo & Conference 2002 July ( ) 360 350 166 194 200 150 800 530 212 318 300 500 1195 515 680 500 1500 2100 2155 675 1480 750 2750 3500 3545 5000 845 2700 1000 4000
PDP 1996 ~ 2000 2001 ~ 2005 2006 ~ TV 30~55 25~60 150 ~ 300 cd/m 2 300 ~ 500 cd/m 2 300 ~ 400W(42) 200 ~ 300W(42) 1.5 ~ 3 / 1 ~ 1.5 / 20~80 500 ~ 700 cd/m 2 200 W(42) 0.5 ~ 1 / Batch/In-line line
PDP Pioneer Fujitsu Hitachi Sony NEC Panasonic F H P Philips Photonics Thomson Plasmaco Toray SDI LG Orion UPD
Optical Filter Power supply PDP PDP Vedio IC Driver IC Logic IC FPC DSP ACF ( +FHP)~ ( ) 90% 85% 95% Optical filter 100%
UV
: PDP? Plasma Display Panelalso called Gas Discharge Display : : ( 21~60) ( <10 ) ( >160 o )
PDP 特點 PDP PDP CRT 大畫面/平面化 畫面均勻 不受磁場影響 重量輕 視角廣 體積小 厚度薄 應用範圍廣
PDP DC Hybrid AC Fresh Memory : 1. AC- 2. NHK 42DCHDTVPDP
42DCPDP cell cell Priming Rib
ACPDP Front glass substrate Black stripe Dielectric layer ITO electrode MgO layer Phos. Red Phos. Green Phos. Blue Address electrode Bus electrode Barrier Rib Rear glass substrate
MgO : 90 0 data
Hybrid DC/AC Hybrid AC/DC Hybrid
AC PDP 1964 ACPDP 1990 ACPDPADS ACPDP ACPDP 1966 1992 21VGAACPDP(26 ) 1967 AC PDP 1994 PDP 1968 Owens-Illinois ACPDP 1996 42 852x480 1677 PDP General 1972 Owens-Illinois 1997 25SXGA PDP ACPDP Pioneer 50 1280x768 1677 PDP ACPDP : [ALIS] 1972 PDP 1998 42ACHDTV PDP LG 6016 : 9 XGA type ACPDP 1976 ACPDP 1999 Digital 41 ACVGA PDP 60AC PDP( ) 1979 1984 1988 1989 LG LTCC-M PDP ACPDP 2000 25PDP ACPDP 2002/1 Pioneer T Waffle Rib 3000:142 AC-PDP NEC CCFBS ACPDP 2001 FHP TERES 20 ACPDP Pioneer 1.8lm/W PDP 2002 Fine Plasma Tube Array AC-PDP 20 ACPDP
PDP ( ) ( ) PDP
PDP address Black strip / /
PDP Expansion (x10-7 / 0 C) Strain point ( 0 C) Soda-lime glass 87(50~350 0 C) 85(50~300 0 C) Asahi PD200 83 Central CP600 Corning Cs25 85 84 NEG PP-8 83 506 570 603 610 582 Annealing point ( 0 C) Softening point ( 0 C) Density ( gm/cc) 545 620 633 654 626 726 830 835 848 836 2.49 2.77 2.74 2.88 2.82 Resisitivity (log 10 Ω cm) 6.65 (250 0 C) 8.5 (150 0 C) 12 9.9 10.5 12
ITO SnO 2 @ ITO SnO 2 @
() : - ITO or SnO 2 (thin film process) - ( ) (>90%) Bus : - Cr/Cu/Cr or Cr/Al/Cr (thin film process) or Ag (thick film process) - : 50~ 100µm Black strip & color filter (optional) - inorganic material (thick film process)
() Dielectric Layer : >85% : 5kV :20~30µm, : ±2µm Protective Layer, MgO, refractive index: 1.65~1.69 2 (111)preferred orientation (~100%), : 0.5~1 µm
ITO (1) (4) ITO (120 o C) (2) (90 o C) (5) (3) (6) * pattern
SnO 2 (1) (4) CVD SnO 2 (2) (5) (3) pattern *
PDP ITO Cr/Cu/Cr, Cr,Al PR NaOH(0.5%) 2~3 min NaOH(0.5%) 2~3 min DFR NaCO 3 ( 0.5~1.5%) 2~3 min NaCO 3 ( 0.5~1.5%) 2~3 min FeCl 3 + HCl + H 2 O 3 NaOH (3~5%) or NaCO 3 (3~5%) 2~3 min Cr Cu AlCl 2 6 H 2 O + ZnCl 2 + H 3 PO 4 FeCl 3 HCl 2~3 min NaOH (3~5%) NaCO 3 (3~5%) 1~2 min 10~20S 2~3 min : pp.171
3-Layer Etching Process ITO Cr Cu Cr (1)Cr/Cu/Cr (2) (6) Cu (3) (7) Cr (4) (5) Cr (8)
Ag( ) Ag
Fodel Ag Ag Tape and Fodel Composite Ag Ag Type Base film (25~75µm) Ag layer (12~16µm) Black color layer ( 5µm) cover layer (25µm) Fodel Ag Tape Fodel Composite Ag Tape
ULVC Size Tact ECH-135 Max. 60 4 500 nm ±10 % 200 o C 2(288hrs) 7 hrs ECH-105 Max. 42
Chugai Ro SUPLaDUO In-Line Type
MgO Sample A (111) (❹) Sample B (220) Sample C (200)
PDP Item Barrier Layer Transparent Electrode Bus Electrode Black Strip Transparent Dielectric Color Filter Protection Film Material Substrate SiO 2 ITO SnO 2 Cr/Cu/Cr Ag Low Tm Glass Pigment Low Tm Glass SiO 2 Glass Type Pigment Type MgO Process Annealing Sputtering Sputtering & Photo-etching CVD & Lift-off Screen Printing Sputtering & Photo-etching Screen Printing Photo-sensitive paste Photo-sensitive paste Screen Printing Screen Printing Sputtering Screen Printing Photo-sensitive paste E-beam Evaporation Sputtering, Ion Plating
Address : - Bus Reflective dielectric layer - white glass paste (thick film process) Barrier rib - : 50~ 100µm : 120~ 150µm - : : Phosphors - : 20~ 30 µm
(1) (5) (G,B,R) (2)
( data electrode) <600 Rib 120 µm (~80 µm)
RGB phosphor <500 (glass sealing) <450
(Screen printing method) (Additive method) (Lift off method) (Sandblast method) (Press method) (Photo-paste method) (Etching method) B-D(Blade-Deforming method) (Photo Casting method)
(Sandblast)
Printing : PDP 20008
Barrier Ribs Strip-structured Barrier Ribs Waffle-structured Barrier Ribs Meander Barrier Ribs Mass products Waffle Ribs
(PDPR) 1. Screen Printing 3. Develop 2. Exposure 4. Sintering
PDP Data
Tube ( )
Tube B-B ( ) Tube
Tube Tube Tube
PDP ( ) pattern Data data MgO cell : : UV sputter : PDP Technology Roadmap 20003
NEC Analog Interface diagram : NEC RGB Analog Interface A/D γ Y/C decoder PDP PLL RGB Logic Vol. 53 No.10/2000 PLE
Driver Data Driver NEC 50PDP Frame memory RGB Memory pulse Driver Logic Module (DC/AC) : NEC Vol. 53 No.10/2000 Driver Data Driver 50 853x480 pulse
60 % 20 % 80 % PDP 4 % 0.4 % ( ) 1.1lm/w : media vol.53, No. 8, pp 1067 (1999) 65 % 98 % 45 % 95% 27 % 76lm/w
PDP Cell, ( ) (NEC:CCF ), Blackstripe, filter Subfield ( subfield, 2 subfield ) (NEC:CCF ), cell
FHP ALIS Data ( ) :
NEC : AC-PDP
TV ---PDP ( ) ( ) ( ) ( ) (TV & PC )