COGCOH HGLGPHRHSHTHUJSL COGCOH HGLGPHRHSHTH UJSL X7RX5R Y5V Z5U X7R Y5V SUMMARY Types of Dielectric Material and Capacitor HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as Classcapacitor, including high frequency COGCOH capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH, TH, UJ, SL. The electrical properties of COGCOH capacitor are the most stable one and change invariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required, HGLGPHRHSHTHUJSL capacitor s capacitance changes with temperature.they are suited for applications where low-losses and temperature compensating circuits. X7RX5RX7RX5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class capacitor whose capacitance is higher than that of class. These capacitors are classified as having a semi-stable temperature charac teristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc. FH2009-001 1 29
Y5VThe capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc. Z5UThe capacitor made of this kind of material is considered as Classcapacitor, whose temperature characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature. STRUCTURE AND DIMENSIONS DIMENSIONS L L W T WB WB British expression Type Dimensions (mm) Metric expression L W T WB 0402 1005 1.000.05 0.500.05 0.500.05 0.250.10 0603 1608 1.600.10 0.800.10 0.800.10 0.300.10 0805 2012 2.000.20 1.250.20 1206 3216 3.200.30 1.600.30 0.55 0.800.20 1.000.20 1.250.20 0.800.20 1.000.20 1.250.20 1.600.30 0.500.20 0.600.30 1210 3225 3.200.30 2.500.30 2.80 0.800.30 1808 4520 4.500.40 2.000.20 2.20 0.800.30 1812 4532 4.500.40 3.200.30 3.50 0.800.30 2220 5750 5.700.40 5.000.40 3.50 1.000.40 2225 5763 5.700.50 6.300.50 6.20 1.000.40 3035 7690 7.600.50 9.000.50 8.10 1.000.40 NoteWe can design according to customer special requirements FH2009-001 2 29
STRUCTURE T W L NO Name Ceramic dielectric Inner electrode Substrate electrode Nickel Layer Tin Layer HOW TO ORDER 0805 CG 101 J 500 N T NOTES DIMENSIONS unitinch/ mm Size Code 0402 0603 0805 1206 1210 1808 1812 2220 2225 3035 (LW) 0.04 inch 0.02 0.06 0.03 0.080.05 0.12 0.06 0.12 0.10 0.18 0.08 0.180.12 0.220.20 0.220.25 0.300.35 (LW) 1.00 mm 0.50 1.60 0.80 2.001.25 3.20 1.60 3.20 2.50 4.50 2.00 4.503.20 5.705.00 5.706.30 7.609.00 DIELECTRIC STYLE CG CH HG LG PH RH SH TH UJ SL X B E F (Dielectric Code) COG COH HG LG PH RH SH TH UJ SL X5R X7R Z5U Y5V (Dielectric) FH2009-002 3 29
NOMINAL CAPACITANCE (unit)pf (Express Method) (Actual Value) 0R5 0.5 1R0 1.0 102 1010 2 0 R Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point. 224 2210 4 CAPACITANCE TOLERANCE (Code) B C D F G J K M S Z (Tolerance) 0.10pF 0.25pF 0.5pF 1.0% 2.0% 5.0% 10% 20% BCD 10pF. NoteThese capacitance tolerance B, C, D are just applicable the capacitance that equals to or less than 10pF. +50% -20% +80% -20% RATED VOLTAGE (unit)v (Express Method) (Actual Value) 6R3 6.3 500 5010 0 201 2010 1 0 R Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point. 102 1010 2 TERMINAL MATERIAL STYLES Termination Styles (Express Method) Silver Solderable Termination Copper Solderable Termination Nickel Barrier Termination S C N FH2009-001 4 29
PACKAGE STYLES B Bulk Bag T Taping Package / Temperature Coefficient /Characteristics Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range COG 20 C 0±30 ppm/ -55125 COH 20 C 0±60 ppm/ -55125 HG 20 C -33±30 ppm/ -2585 LG 20 C -75±30 ppm/ -2585 PH 20 C -150± 60 ppm/ -2585 RH 20 C -220± 60 ppm/ -2585 SH 20 C -330± 60 ppm/ -2585 TH 20 C -470± 60 ppm/ -2585 UJ 20 C -750± 120 ppm/ -2585 SL 20 C -1000+140 ppm/ -2585 X7R 20 C ±15% -55125 X5R 20 C ±15% -5585 Z5U 20 C -56%+22% 1085 Y5V 20 C -80%+30% -2585 20 C 85 C 20 C NoteNominal temperature coefficient and allowed tolerance of class are decided by the changing of the capacitance between 20 C and 85 C. Nominal temperature coefficient of class are decided by the temperature of 20 C. FH2009-001 5 29
Capacitance Range and Operating Voltage /unit: pf Capacitance Size Code Rated Voltage COGNPO X7R X5R Y5V (Z5U) 6.3V 0.1470 10039,000 39,0004,700,000 1,0001,000,000 10V 0.1470 10039,000 39,0001,000,000 1,0001,000,000 0402 16V 0.1470 10039,000 39,00047,000 1,000220,000 25V 0.1470 10022,000 1,000100,000 50V 0.1470 10010,000 1,000100,000 6.3V 0.14,700 100220,000 220,0004,700,000 1,0004,700,000 10V 0.14,700 100220,000 220,0001,000,000 1,0002,200,000 0603 16V 0.14,700 100220,000 220,0001,000,000 1,0001,000,000 25V 0.14,700 100150,000 1,0001,000,000 50V 0.14,700 100100,000 1,000220,000 6.3V 0.310,000 1001,000,000 1,000,00010,000,000 1,00010,000,000 10V 0.310,000 1001,000,000 1,000,0004,700,000 1,00010,000,000 0805 16V 0.310,000 1001,000,000 1,0002,200,000 25V 0.310,000 1001,000,000 1,0002,200,000 50V 0.310,000 100100,000 1,0001,000,000 6.3V 0.533,000 1001,200,000 1,200,00010,000,000 1,00047,000,000 10V 0.533,000 1001,200,000 1,200,00010,000,000 1,00022,000,000 1206 16V 0.533,000 1001,200,000 1,200,00010,000,000 1,00010,000,000 25V 0.533,000 1004,700,000 1,0002,200,000 50V 0.512,000 100470,000 1,0001,000,000 FH2009-001 6 29
Capacitance Size Code Rated Voltage COGNPO X7R X5R Y5V (Z5U) 6.3V 1010,000 2203,300,000 3.3uF22uF 4,70047,000,000 10V 1010,000 2203,300,000 3.3uF22uF 4,70047,000,000 1210 16V 1010,000 2203,300,000 3.3uF10uF 4,70010,000,000 25V 1010,000 2202,200,000 4,70010,000,000 50V 108,200 2201,000,000 4,7001,500,000 6.3V 1010,000 2204,700,000 4.7uF22uF 4,70033,000,000 10V 1010,000 2204,700,000 4.7uF22uF 4,70022,000,000 1808 16V 1010,000 2202,200,000 4,70022,000,000 25V 1010,000 2202,200,000 4,70010,000,000 50V 106,800 2201,000,000 4,7002,200,000 6.3V 1015,000 47010,000,000 10uF22uF 10,00033,000,000 10V 1015,000 47010,000,000 10uF22uF 10,00022,000,000 1812 16V 1015,000 47010,000,000 10uF22uF 10,00022,000,000 25V 1015,000 47010,000,000 10,00010,000,000 50V 1012,000 4702,200,000 10,00010,00,000 6.3V 1047,000 47010,000,000 10uF33uF 10,00047,000,000 2220 2225 10V 1047,000 47010,000,000 10uF22uF 10,00033,000,000 16V 1047,000 47010,000,000 10,00022,000,000 25V 1047,000 4704,700,000 10,00010,000,000 50V 1033,000 4703,300,000 10,00010,000,000 6.3V 10100,000 47010,000,000 10uF100uF 10,00047,000,000 10V 10100,000 47010,000,000 10uF47uF 10,00033,000,000 3035 16V 10100,000 47010,000,000 10uF33uF 10,00022,000,000 25V 10100,000 47010,000,000 10uF22uF 10,00010,000,000 50V 1047,000 47010,000,000 10,00010,000,000 NoteWe can design according to customer special requirements FH2009-002 7 29
Q COG Hi-Q COG MLCC : RF Hi-QESR CQCG Q Q 1MHz~2.4GHz CQ CG, Application: Hi-Q COG capacitors are ideally suited for RF and microwave application requiring high Q, low ESR, and high resonant frequency Note for CQ and CG: The following Q value is just confirmed by general customer. If there is a higher requirement for Q value requirements, we can design and produce according to the special requirements For the customer whose requirements for frequency is between 1MHz and 2.4GHz or higher frequency, we can design it according to their requirements The frequency of CQ is a little higher than that of CG. Please choose them according to your requirements CQ Q CQ Capacitance value and Q value Capacitance pf 300MHz Q Q value at 300MHz 0805 0603 Capacitance pf 300MHz Q Q value at 300MHz 0805 0603 Capacitance pf 300MHz Q Q value at 300MHz 0805 0603 4.7 1000 800 11 450 360 24 200 160 5.2 900 720 12 400 320 27 175 140 5.6 850 680 13 375 300 30 150 120 6.2 800 640 14 350 280 33 140 112 6.8 700 560 15 325 260 36 130 104 7.5 650 520 16 300 240 39 120 96 8.2 575 460 18 250 200 43 110 88 9.1 525 420 20 225 180 47 100 80 10 500 400 22 215 172 ---- ---- ---- FH2009-001 8 29
HIGH VOLTAGE MLCC / Middle & high voltage MLCC is a kind of special design special technology MLCC that bases on the technology of general MLCC. This kind of MLCC has stable high voltage reliability and suitable to SMT. Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the performance of the circuit. APPLICATIONS Analog & Digital Modems LAN/WAN Interface Lighting Ballast Circuits Voltage Multipliers DC-DC Converters Back-lighting Inverters FH2009-001 9 29
/unit: pf Capacitance Size Code Rated Voltage NPO X7R Y5V 100V 0.5820 15010,000 2,20068,000 0603 200V 0.5470 1506,800 ---------- 250V 0.5470 1506,800 ---------- 100V 0.51,500 15033,000 10,000100,000 200V 0.11,500 15022,000 10,00056,000 0805 250V 0.11,500 15022,000 10,00056,000 500V 0.1560 15010,000 --------- 1000V 0.1100 --------- --------- 100V 0.53,300 150100,000 15,000330,000 200V 0.12,700 15047,000 10,000150,000 1206 250V 0.12,700 15033,000 10,000150,000 500V 0.11,500 15022,000 ---------- 1000V 0.11,000 1505,600 ---------- 2000V 0.1270 1501,500 ----------- 100V 1.04,700 150220,000 10,000820,000 200V 1.03,300 150100,000 10,000390,000 1210 250V 1.03,300 15082,000 10,000390,000 500V 1.02,000 15033,000 ---------- 1000V 1.0820 15010,000 ----------- 2000V 1.0470 1506,800 ----------- 100V 2.04,700 150220,000 150,0001,000,000 200V 2.03,300 150100,000 10,000390,000 250V 2.03,300 15082,000 10,000390,000 500V 2.01,800 15039,000 -------- 1808 1000V 2.0820 15010,000 --------- 2000V 2.0470 1506,800 --------- 3000V 2.0470 1502,200 --------- 4000V 2.056 1501,000 ---------- 5000V 2.027 ----------- ---------- FH2009-001 10 29
Size Code 1812 2220 2225 Capacitance Rated Voltage NPO X7R Y5V 100V 3.0180 22010,000 150330,000 150,0001,500,000 200V 3.05,600 150150,000 100,000470,000 250V 3.05,600 150120,000 100,000470,000 500V 3.03,900 150100,000 ---------- 1000V 3.01,200 15027,000 ---------- 2000V 3.0680 15010,000 ---------- 3000V 3.0470 1502,200 ---------- 4000V 3.0220 1501,500 --------- 5000V 3.056 ---------- ---------- 100V 5.027,000 1501,000,000 250,0003,300,000 200V 5.012,000 150470,000 22,000680,000 250V 5.012,000 150470,000 22,000680,000 500V 5.06,800 150330,000 ---------- 1000V 5.02,200 15056,000 ---------- 2000V 5.01,000 15027,000 ---------- 3000V 5.0680 1503,900 ---------- 4000V 5.0560 1503,300 ---------- 5000V 5.0100 ----------- ---------- NoteWe can design according to customer special requirements. Measurement method of dielectric withstanding voltage for high voltage MLCC Rated voltage range 100VVr500V 500VVr1000V 1000VVr2000V 2000VVr5000V Measuring Method 200%, 5, 50mA Force 200%Rated voltage for 5 second. Max..current should not exceed 50 ma. 150%, 5, 50mA Force 150%Rated voltage for 5 second. Max..current should not exceed 50 ma. 120%, 5, 50mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 50 ma. 120%, 5, 10mA Force 120%Rated voltage for 5 seconds. Max..current should not exceed 10 ma. FH2009-002 11 29
Reliability Test Item Technical Specification Test Method and Remarks Measuring Measuring Capacitance Should be within the Frequency Voltage Class specified tolerance. 1000pF 1MHZ10% 1.00.2Vrms 1000 pf 1KHZ10% 25 3 Test Temprature: 25 3 C10µF : 1KHZ10% : 1.00.2Vrms Capacitance Class Should be within the specified tolerance. Test Frequency: 1KHZ10% Test Voltage: 1.00.2Vrms C10µF X7RY5V : 12024 HZ :0.50.1Vrms Test Frequency: 12024 HZ Test Voltage: 0.50.1Vrms Z5U :10.1KHZ :0.50.05Vrms Test Frequency: 10.1KHZ Test Voltage: 0.50.05Vrms (DF, tan) Dissipation Class Factor DF Capacitance Measuring Measuring Frequency Voltage 0.56% Cr5 pf 1MHZ10% 1.5[(150/Cr)+7]10-4 5pFCr50 pf 1MHZ10% 1.00.2Vrms 0.15% 50pFCr1000 pf 1MHZ10% 0.15% 1000 pf 1KHZ10% FH2009-001 12 29
Item Technical Specification Test Method and Remarks 50V 25V 16V 10V 6.3V C10µF X7R 2.5% 3.5% 5.0% 5.0% 7.5% C3.3µF : 1.00.2Vrms 10.0% : 1KHZ10% Test Frequency: 1KHZ10% C3.3µF Test Voltage: 1.00.2Vrms (DF, tan) Dissipation Class Factor Y5V Z5U 25V 16V 10V 6.3V 7.0% C1.0µF 12.5% 12.5% 12.5% 9.0% C1.0µF C10µF X7RY5V : 12024 HZ :0.50.1Vrms Test Frequency: 12024 HZ Test Voltage: 0.5 0.1Vrms Z5U: :10.1KHZ :0.50.05Vrms Test Frequency: 10.1KHZ Test Voltage: 0.50.05Vrms C10 nf, Ri50000M Class C10 nf, RiC R 500S : 605 75% (IR) X7R Insulation Resistance Class Y5V Z5U C25 nf, Ri10000M C25 nf, RiC R 100S C25 nf, Ri4000M C25 nf, RiC R 100S 25 3 50mA Measuring Voltage: Rated Voltage Duration: 605s Test Humidity: 75% Test Temprature: 25 Test Current: 50mA FH2009-001 13 29
Item Technical Specification Test Method and Remarks :300%:250% (DWV) Dielectric Withstanding Voltage Measuring Voltage: No breakdown or damage. 15 / 50mA ( MLCC) Class:300% Rated voltage Class:250% Rated voltage Duration: 15s Charge/ Discharge Current: 50mA max. (This method excludes high-voltage MLCC) 80~120 10~30. 95%. At least 95% of the terminal electrode is Solderability covered by new solder. Visual Appearance: No visible damage. Preheating conditions:80 to 120; 10~30s. Sn/Pb63/37 : 2355 : 20.5s : 2455 : 20.5s Solder Temperature: 2355 Solder Temperature: 2455 Duration: 20.5s Duration: 20.5s FH2009-001 14 29
Item Technical Specification Test Method and Remarks Item Resistance to Soldering Heat C/C DF IR NPOSL NPO to SL 0.5%0.5PF X7R Y5VZ5U -5~+10% -10~+20% 0.5% or 0.5PF whichever is larger Same to initial value. Same to initial value. 95% AppearanceNo visible damage.at least 95% of the terminal electrode is covered by new solder. 100~200 102. : 2655 : 101s 10. 242 Preheating conditions: 100 to 200 ; 102min. Solder Temperature: 2655 Duration: 101s Clean the capacitor with solvent and examine it with a 10X(min.) microscope. Recovery Time: 242h Recovery condition: Room temperature Al 2 O 3 PCB 1mm 0.5mm/sec. mm. Resistance to Appearance: No visible damage. Flexure of 20 T=10 Substrate (Bending Strength) 452 Test Board: Al 2 O 3 or PCB Warp: 1mm Speed: 0.5mm/sec. 452 C/C 10% Unit: mm The measurement should be made with the board in the bending position. FH2009-001 15 29
Item Technical Specification Test Method and Remarks 5N Termination No visible damage. Applied Force: 5N Adhesion 101S Duration: 101S 2 1 241h 5 4 1 ( NPO/X7R: Y5V: -25 Z5U:+10) -55 30 C/C: 2 (+20) 23 1%1pF, 3 ( NPO/X7R:+125 Y5V/Z5U: +85) 30 4 (+20) 23 B: 10% 242h E,F: 20% Temperature Preheating conditions: up-category temperature, 1h Cycle Class: 1% or 1pF, Class: E,F: 20% whichever is larger. B: 10% Initial Measurement Recovery time: 241h Cycling Times: 5 times, 1 cycle, 4 steps: Step Temperature Time (min.) NPO/X7R: -55 1 Low- category temp. ( Y5V: -25 Z5U:+10) 30 2 Normal temp. (+20) 23 NPO/X7R: +125 3 Up- category temp. ( Y5V/Z5U: +85) 30 4 Normal temp. (+20) 23 Recovery time after test: 242h FH2009-001 16 29
Item C/C DF Moisture Resistance Technical Specification : 2%1pF, : B: 10% E,F: 30% Class: 2% or 1pF, whichever is larger. Class: B: 10% E,F: 30% 2 Not more than twice of initial value. 402 Test Method and Remarks 90~95%RH 500 24 ()48 () Ri2500MRiC R 25S Temperature402. Humidity90~95%RH Class: Ri2500MRiC R 25S whichever is smaller. Duration500h IR Ri1000MRiC R 25S Recovery conditionsroom temperature. Recovery Time24h (Class1) or 48h (Class2) Class: Ri1000MRiC R 25S whichever is smaller. Appearance: No visible damage. 2%1pF B: 20% E,F: 30% C/C Class: 2% or 1pF, whichever is larger. Class: B: 20% E,F: 30% 2 Not more than twice of initial value. Ri4000MRiC R 40S 100V 1.5 1000 50mA DF 24 48 Low-Voltage 100V Life Test. Applied Voltage: 1.5 Rated Voltage Class: Ri4000M RiC R Duration: 1000h 40S whichever is smaller. Charge/ Discharge Current: 50mA max. IR Ri2000MRiC R 50S Recovery Conditions: Room Temperature. Recovery Time: 24h (Class 1), or 48h Class: Ri2000M RiC R (Class2) 50S whichever is smaller. Visual Appearance: No visible damage. FH2009-001 17 29
Item Technical Specification 2%1pF Test Method and Remarks C/C B: 20% E,F: 30% Class: 2% or 1pF, whichever is larger. Class: B: 20% 100V 500V2 500V 1000V1.5 1000V1.2 100 50mA E,F: 30% 125NPO X7R85Y5V Middle &high voltage Life Test DF IR 2 Not more than twice of initial value. Ri4000MRiC R 40S. 100VRated Voltage500V2 Multiple Class: Ri4000MRiC R 500VRated Voltage1000V1.5 Multiple 40S whichever is smaller. Ri2000MRiC R 50S. Charge/ Discharge Current: 50mA max. Class: Ri2000MRiC R Temperature125NPO X7R85Y5V 50S whichever is smaller. Visual Appearance: No visible damage. 2 24 48 Applied Voltage: 1000V Rated Voltage1.2 Multiple Duration: 100h Recovery Conditions: Room Temperature Recovery Time: 24h (Class 1), or 48h (Class2) 1h 241h NotePretreatment (only for class2 capacitor) Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement. First, place the capacitor in the up-category temperature or other specified higher temperature environment for 1hour. Then recovery the capacitor at standard pressure conditions for 241hours FH2009-001 18 29
PACKAGE PAPER TAPING Top cover tape Carrier tape(paper) Chip hole(pocket) Polystyrene reel Bottom tape 0402 Dimensions of paper taping for 0402 type FH2009-001 19 29
*W1 *L1 *D C B P1 P2 P0 d t Code 0402 0.65± 0.10 1.15± 0.10 8.00± 0.10 3.50± 0.05 1.75± 0.10 2.00± 0.05 2.00± 0.05 4.00± 0.10 1.50-0/+0.10 0.80 Below 060308051206 Dimensions of paper taping for 060308051206 types. Feeding hole J Chip pocket A E D C T Chip cap Tape running direction Code paper size Unitmm A B C D E F G H J T 0603 1.10 1.90 8.00 3.50 ± 0.05 1.75 4.00 2.00 4.00 1.50-0/+0.10 1.10 Max 0805 1.45 ± 0.15 2.30 ± 0.15 8.0 ± 0.15 3.50 ± 0.05 1.75 4.00 2.00 4.00 1.50-0/+0.10 1.10 Max 1206 1.80 ± 0.20 3.40 ± 0.20 8.00 ± 0.20 3.50 ± 0.05 1.75 4.00 2.00 4.00 1.50-0/+0.10 1.10 Max Note: The place with * means where needs exactly dimensions. FH2009-001 20 29
EMBOSSED TAPING Top cover tape Carrier tape(paper) Chip hole(pocket) Polystyrene reel (0805~1812 ) Dimensions of embossed taping for 0805~1812 type Feeding hole J Chip pocket A B E D C T Chip cap H G F Tape running direction FH2009-001 21 29
Code Tape size A B C D* E F G* H J T 0805 1.55 ± 0.20 2.35 ± 0.20 8.00 ± 0.20 3.50 ± 0.05 1.75 4.00 2.00 4.00 1.50-0/+0.10 1.50 Max 1206 1.95 ± 0.20 3.60 ± 0.20 8.00 ± 0.20 3.50 ± 0.05 1.75 4.00 2.00 4.00 ± 0.1 1.50-0/+0.10 1.85 Max 1210 2.70 3.42 8.00 3.50 ± 0.05 1.75 4.00 2.00 ± 0.05 4.00 1.55-0/+0.10 3.2 Max 1808 2.20 4.95 12.00 5.50 ± 0.05 1.75 4.00 2.00 ± 0.05 4.00 1.50-0/+0.10 3.0 Max 1812 3.66 4.95 12.00 5.50 ± 0.05 1.75 8.00 2.00 ± 0.05 4.00 1.55-0/+0.10 4.0 Max * NoteThe place with * means where needs exactly dimensions. Structure of leader part and end part of the carrier paper End (Vacant position) Chip carrier Vacant position Leader part(cover) tape) 200 mm 200 mm over 200mm over 200mm 200 mm /Over 200 mm / Moving Direction FH2009-001 22 29
Reel Dimensions (unit: mm) CODE A B C D E F G 7 REEL 1782.0 3.0 130.5 210.8 50 10.01.5 50 or more 12max 13REEL 3302.0 3.0 130.5 210.8 50 10.01.5 50 or more 12max FH2009-001 23 29
Taping specification Top tape peeling strength (a)paper Taping Cover tape peeling direction Cover tape 0~15 Carrier tape (b) Embossed Taping Cover tape peeling direction Cover tape 015 Carrier tape 0.1N< <0.7N Standard: 0.1N < peeling strength < 0.7N, No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. Bulk Case Package unit:mm Symbol A B T C D E Dimension 6.800.10 8.801.00 12.000.10 15.00+0.10/-0 2.00+0/-0.10 4.700.10 Symbol F W G H L I Dimension 31.50+0.20/-0 36.00+0/-0.20 19.000.35 7.000.35 110.000.70 5.000.35 FH2009-001 24 29
Packing Quantity * (SIZE) ( PACKAGE STYLE & QUANTITY) unit: pcs * PT * ET BC BP 0402 10000 ------ 20000 5000 0603 4000 ------ 15000 5000 0805 4000 3000 10000 5000 1206 4000 1210 ------- T1.35mm 3000 T1.35mm 2000 T1.80mm 2000 T1.80mm 1000 5000 5000 ------- 2000 1410 ------- 2000 ------- ------- 1808 ------- 2000 ------- 2000 1812 -------- 18252220 T1.85mm 1000 T1.85mm 500 ------- 2000 20252225 -------- 500 ------- 500 3035 NoteWe can choose packing style and quantity can be according to the customer s requirement. FH2009-002 25 29
Outer packing The first package Quantity: 5 reels (Max 25000pcs) 5 25000pcs The second package Quantity: 12 cases (Max 300000pcs) 12 300000pcs 65mm 185mm 200mm 197mm label 385mm 425mm Label PART No QUANTITY : DATE Production name Quantity Weight Storage Methods 6 ( ) The guaranteed period for solderability is 6 months (Under deliver package condition). /Storage conditions /Temperature 5~40 /Relative Humidity 20~70% FH2009-001 26 29
Precautions For Use (MLCC),,,,,. The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory. 1. Soldering Profile,.( ) To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). 2. Manual Soldering,,,.,,. Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator s careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. FH2009-001 27 29
3. Too much solder Cracks tend to occur due to large stress. Not enough solder, Weak holding force may cause bad connection between the capacitor and PCB. The temperature profile for soldering Re-flow soldering 1210 Temperature Peak Temperature () 300 250 Preheating 230 200 150 100 50 10S Over 1 minute Over 1 minute Gradual cooling Pb-Sn 230250 240260 FH2009-001 28 29
Wave soldering Temperature () 300 250 200 150 100 50 Preheating Peak Temperature 230 ~260 Pb-Sn 230260 240270 T150 Hand soldering Temperature () 300 250 200 150 100 50 Over 1 minute 3s max. Gradual cooling Preheating Peak Temperature Over 1 minute 3s max. Gradual cooling 130 300 20W 1mm 5s 1/2 FH2009-001 29 29
1. ROHS NPO ROHS 2. ROHS (PF) 0402 COG 0.1~470 0603 COG 0.1~2200 0805 COG 0.1~6800 1206 COG 0.1~12000 1210 COG 12~10000 1808 COG FH2009-001 1 1.