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1 CD DC-DC 13 ( ) EMC

2 / A B 2

3 [email protected] A B C

4 WD26C CD TL DC-DC..18 DC/DC NCP SoC C8051F EDA MULTISIM

5 U2402B.48 EMC.52 NOKIA

6 WD26C EL LCD EL WD26C EL EMI WD26C 2V 6V 5V 2uA L D EL 1 WD26C 2 TG [ 1.2V 3V ] EL TG EL L L mH 10mH L V EL EL EL 6

7 C1 R1 VD C1 VT1 J 1 2 VT1 SA VT1 R VD C1 SA C1 C1 10 = RC =10ti R2 R2 U/Ic U Ic SA 7

8 CD4069 CD4069 a CD CMOS I II III-VI C2 C3 VD1 VD2 VDD 250R Vo -VDD b CD VDD 5V -3V 430R -2V 200R -1.5V l00r -1V VDD VD1 VD2 1N60 8

9 TL431 TL431 TL431 K1 K2 170V 190V TL431 K1 K2 T l90v 210V K1 K2 k2 210V 230V K1 K1 K2 230V 250V K1 K2 K1 K2 210V 230V RP1 K1 RP2 K2 VD1 VD4 VD7 VD8 1N4001 VD5 VD6 1N4007 RP1 RP2 WSW K1 K2 12V T 9

10 T U 10

11 SR5553 PIR 40s 30uA 5V 12V 40s PIR SR5553 LED VT1 LED 2, PZ288 11

12 12

13 9V V 9V V 9V l.2ma 60 VT1 VT2 C2 L VD2 C3 VT3 VD1 VD3 R2 VD3 13

14 1.2V/500mA 9V T 15mm S T E3 L2 L1 70mA DC/DC 1.2V 9V VT2 T R1 100kHz VT2 14

15 VD C1 VT1 9V VT1 VT2 l00 T 10m 0.21mm C1 C2 9V 9V R2 T 1.2V 15V R1 S 15

16 7 4 LED LED

17 7 7 1 IC1 4 CD4O192 CPu 4 BCD CD4511 IC1 4 DP2 DP4 0 DP IC1 1 4 Q4 Q F F4 10 LED LT LED LT IC1 7 R-S 1 7 Q4 Q Q4 0 Q4 RS 0 F1 0 0 F2 F1 IC1 PE 8 IC Q4 Q4 RS 0 F3 RS 1 F2 6 1 F1 IC1 PE

18 DC-DC DC-DC LT1073 LT1073 Linear DC-DC ua 1V 3 DC-DC DIP8 SO-8 LT LT1073 A1 212mV A1 FB 212mV A1 18

19 19kHz NPN A2 LT1073 a LT k 150mV mv a 470uH b - 10mV c - 100mV LT

20 DC/DC NCP1550 DC/DC DC DC NCP1550 NCP1550 PDA P MOSFET DC/DC NCP1550 2A NCP1550 PWM 600kHz 50mV PFM PWM PFM NCP1550 NCP1550 PCB NCP V 5.5V 1.8V 3.3V 92 50uA PFM 0.3uA V V 2 50mV PWM+PFM PWM 600kHz 5 TSOP 20

21 NCP1550 NCP TSOP NCP1550 SN18T1 SN19T1 SN25T1 SN27T1 SN33T1 l.5v l.9v 2.5V 2.7V 3.3V 1 CE 2 GND 3 Vout 4 EXT P-MOSFET 5 Vin NCP1550 NCP550 1 L PCB 0.5A IL L T Vin-R DS Iout-Vout / IL-0.4 Iout R DS P-MOSFET P-MOSFET M P-MOSFET V GS R DS 1.0A 2.0A NTGS3441T1 NTGS3443T1 3 SD P 21

22 I D I D =Iout Vin Vout l Vin VF VF 4 Cin Cout 33uF 33uF 100uF 22

23 5 A/D I/O 16 A/D A/D 4 4 R1 R4 R8 S1 S16 S1 11k S2 13.9k S5 25k R9 23

24 5 A/D A/D 6 PWM D/A I/O PWM I/O D/A Vout=VDD*D1/ D1+D2 RC D1 D2 PWM R1 C1 7 2 I/O 24

25 1. GP1 GP1 GP2 2. GP1 GP2 C1 3. GP1 GP2 4. GP2 RC 8 V1 10 A S1 V1 78L05 5V GP0 V2 V1 25

26 GP0 V2 V1 10 A S1 S1 GP1 S1 GP1 S1 SoC C8051F SoC SoC Cygnal Cygnal SoC 51 CIP-51 25MIPS 29 C8051F SoC C805lF SoC MCS NJ C805lF SoC CPU C805lF FLASH MOVC MOVX FLASH C8051F 2.7.6V 3V I/O RST JTAG 5V SoC C8051F 8051 SoC C8051F CPU 8051,C8051F CIP51 CPU MCS51 ASM-51 Keil C 26

27 C8051F C8051F C8051F 12 MCS51 C8051F CIP51 CIP CIP5 MCS C8051F C8051F CIP51 22 CPU 8051 C8051F 7 7 WDT 0 CNVSTR AD RST C8051F C8051F C8051F300 F302 2 C8051F RC C CIP kB RAM 128kB RAM SFR 128kB C8051F 8kB-16kB FLASH 512kB C805lF 8051 I/O P0 P1 P2 P3 8 I/O I/O C8051F I/O C805lFZXX 27

28 P0 P1 P2 I/O AD P0 C8051F00x 01x 02x PCA PCA ECI /8 C8051F ADC C805lF230/1/6 ADC 100kbit/S ADC ADCO C805lF02X 8 ADC 8 ADC ADC1 8 ADC 500k bit S 8 ADC 0.5 l 2 4 ADC1 ADC ADC1 ADCO C8051F 12 DAC CPU SFRS CPU DAC DAC ADC DAC C8051F C8051F JTAG Cygnal Windows IDE EC2 IDE Keil C 28

29 PIC16C56 VD5-VD8 A4 V4 V5 HA 4 MT LC048 29

30 DL/T DL/T V 3.3V SRAM 3.3V TC55V1001A CPU Microchip PIC16LC V 74HC V 30

31 7 2 SMD CPU PLC44 umax 1 7 MAXIM MAX V 125mA umax CPU Microchip PIC16LC MHz 500uA 1uA PWM 38 4kHz SRAM kHz SRAM SRAM PIC kHz CPU CPU CPU PWM PWM 38.4kHz 2 >2S 31

32 MAX V CPU 1 7 CPU 5uA MAX856 25uA SRAM 0.5uA CPU 0.5uA 74HC273 3uA 45uA 1 CPU lms 1000 l 500 u A 0.5uA 2 3.3V 1.5V mAh 32

33 0.3/( )= ( )= 277.8( )= 9.3( ) CPU 500uA MAX856 25uA SRAM 5uA 200uA 74HC273 5uA 45uA 1 SRAM 2 3.3V 1.5V PIC16C74 MAX856 PIC12043S TC55V100A 74HC V MPASM Microchip MPLAB DL/T bit/S 9600bit/S DL/T645 BCD HEX 3 33

34 34

35 EDA Multisim2001 Fourier Analysis f t =A 0 +A 1 COS t+a 2 COS2 t+ +B 1 Sin t+b 2 Sin2 t+ A 0 A 1 COS t+b 1 Sin t A n COSn t+ +B n Sinn t n A i B i i RC Multisim Simulate Analyses Foruier Analysis Foruier Analysis 4 Analysis Parameters 35

36 EDA Analysis Parameters 1 Sampling options Frequency resolutuion Fundamental Frequency Estimate Number of Stoppinp time for sampling TSTOP Estimate 1kHz 9 Estimate Output variables 2 Miscellaneous Options Title for analysis Edit transient analysis 2 Results Display phase DisPlay as bar graph 36

37 EDA Normalize graphs Normalize 37

38 EDA Display 3 Chart Graph Chart and Graph Vertical Decibel Octave Linear Logarithmic 3 More More Options Degree of polynomial for intemolation Sampling frequency 100kHz Sampling option Estimate 38

39 LG LC 1 L = L1+L2+L3+L4 L = 1/(1/L1+1/L2+1/L3+1/L4+ ) 2 Q Q X 39

40 Q Q Q Q Q Q Q Q Q Q Q Q Q Q L L Q Q Q 40

41 MHz 4 Q Q Q Q 1 2MHz Q MHz 0.3mm 1.5mm 2 41

42 3 20mm-30mm L D L/D=0.7 L/ D t/d t L D 3t 2L D L D Q Ds D Ds D Q 10 5 Q 6 12mm 30mm 6mm 13mm 20mm 25mm /3 l/2 D L t Q

44 5 MC2831 FM MC33XX 1 MC DIP 16 SOP MC MHz 3 8V 4mA Vcc=4V 5 1mV f=1.0khz 30dB 30mV V 3 MC2831 MC V 8 Co

45 16MHz L1 C2 L2 C3 C4 MC3373 MC3373 FM 100MHz MC3373 MC3357/3359/3361/3362/3363/3367 RF 60dB IF 80dB 80dB 45

46 5 1 MC DIP 2 MC V 4V -3.0dB 5 V Vcc=4V 3.2mA 60 db 100MHz 3 MC3372 IF MC3372 IF RF 455kHz IF IF MC3372 MC34119D 45MHz C10 L2 R MHz 45MHz kHz 5 R10 R11 DC 8 R12 CDB kHz LC C R8 C7 RP2 MC34119D uA RSSI R14 3V 46

47 5 AGC 9 11 RC AM AM 0.9V 14 47

48 5 U2402B U2402B IC d 2 V d 2 t LED 1 U2402B IC 18 U2402B U2402B 1 OUTPUT 10 Vbatt 2 GND 11 LED1 3 LED2 12 STM 4 V i 13 OSC 5 OPO 14 Vref 6 OPI 15 Vs 48

49 5 7 Tmax 16 r 8 Tmin NTC 17 c - 9 Tp 18 Vsync 2 U2402B V 160mV 5V 0 4V R 800Hz 3 d 2 V d 2 t -dv U2402B 49

50 5 d 2 V d 2 t U2402B IC IC 10 Io 0.1V - dv dv d 2 V d 2 t 10 d 2 V d 2 t -dv -d 2 V d 2 t V10 +d 2 V d 2 t IC 3/8Io 10 Io/16 U2042B 50

51 5 U2402B VS 10 V10 0 4V RA2 RA3 NTC RT1 RT2 RT3 Rntc max Rntc min Rntc Rntc V8 V7 Rs IC 160mV Rs 160mV 4 Vramp Vramp 1 4 Rs 160mV Rs = 0.16V Io 51

52 EMC EMC PCB PCB EMC PCB RF PCB PCB PCB 0.062in 1.6mm 0V PCB PCB PCB 0.008in 0.2mm 0.008in 0.2mm RF 0.062in 1.6mm 0.008in 0.2mm PCB RF PCB PCB 0V RF 52

53 RF RF EMI PCB 1 PCB PCB RF RF 0V 0V PCB RF 0V 2 PCB RF RF Dual In Package DIP 53

54 RF in 2 3.8cm kHz L C Z 5 54

55 PCB PCB 0.5in 1.27cm 1 20 IC RF X Y PCB PCB PCB RF RF PCB 0V RF 55

56 IC 2 EEPROM EEPROM U205 IMEI U205 EEPROM U205 56

57 EEPROM 5 SDA 6 SCL 7 WC 8 VCC EEPROM U205 3 SIM SM U207 X100 U207 X100 SIM SIM SIM IC U207 4 U203 U201 57

58 IMICP IMICN R216 R217 R219 R220 C226 C229 C258 C259 U203 U203 D2 D1 L202 L203 B201 XMICP XMICN R231 R232 R218 R217 C207 C218 U203 XMICN R231 R212 Q202 HOOKDET U201 HEADDET U203 58

59 EI D3 L200 L201 C201 C203 XEARP XEARN U203 D4 U203 IC U207 D8 RFICLK U201 E8 RESETX U201 5 U201 U203 U206 X U203 E6 U201 U201 A10 B10 DI E3 U203 U206 LCDEN 59

60 OEM * * * * * * * *ehr *OEM [email protected] /09/

61 3 C C++ LINUX LINUX 2 EDA (Protel 99 ) FPGA CPLD 2 4 CMOS EDA ASIC CMOS 61

62 3 / SQE 2 / / / PCB 3 SQE SPC CET-6 RF PLC 3 PLC MBA DSP 3 DSP DSP DSP C (TI C54X DSP) VoIP WLAN HDTV DVD IC

63 IC VTT Tester 7. * * * * * * * CET 8. IC FA/ Reliability Engineer-Beijing 2 General Description of Job Scope: Failure Analysis capability on semiconductor package level and die level Reliability capability on semiconductor Assy process, especially on qualification process Requirement -Bachelor Degree or above, with Microelectronics or Semiconductor Material or Condensed Matter Physics preferred -Good knowledge on semiconductor, better in GaAs HBT study, FA instrument (especially on curve tracer, c-sam and SEM). -No less than 4 years, and at least 3 years in semiconductor packaging area -Basic computer knowledge -Semiconductor Industry background a plus -Familiarity with the following equipment an advantage Optical microscope(max:4000x) / Smart scope(x,y,z dimension) / X-Ray / C-SAM / X-section & polishing / Decap / Curve tracer / Probe station & Laser cutter / SEM (scanned electron microscope)+ EDX -CET-6 and above P.S. the position is located in Beijing and we offer relocation support to successful candidates. 63

64 Process Engineer(Assembly)-Beijing 1 -Bachelor degree or above in electronic engineering -Minimum 2 years relevant experience in semiconductor industry -in depth QMS, QC functional experience, exposure to Test manufacturing systems, -Minimum 3 years in mix of assembly, production and product engineering experience -Good command of English; good communication skills P.S. the position is located in Beijing and we offer relocation allowance. TFT ( ) TFT DVD,, DFMEA DVD DVD, C/C++ MCS51 PIC IC EDA 3 IC EDA ( Cadence, HSPICE, IC Layout Editor, ) IC ( P-CELL LVS LPE ) ( ) EDA (CADENCE IC Editor, HSpice, ) P-CELLS LVS LPE IC IC 64

65 QSA Engineer shanghai 2 Job Purpose Maintain and promote customer satisfaction through customer audit good presentation and continuous improvement of the quality management system. Job Responsibility -To coordinate customer audit activities, on site audit and questionnaires -To coordinate and draft customer questionnaires -To coordinate customer pre-audit and rehearsal, initiating schedule -To communicate customer engineers and draft customer audit agenda -To host customer audit meetings and assign key persons for the audit -To coordinate corrective actions and be responsible for customer CAR feedback -To regularly report and submit customer audit result to management -To support external audit and coordination -To support others during customer audit -To do internal audit and subcontractor audit -To support and offer quality system service to the customer -To conduct semi-annual customer satisfaction survey -To issue action request to related unit to enhance customer satisfaction -To follow up and verify the corrective actions -To regularly report and submit customer satisfaction survey result to management 65

66 EDA 1., Winzip txt X DPI TIF JPG

专业主干课程与主要专业课程教学大纲（2009年、2011年）.doc

专业主干课程与主要专业课程教学大纲（2009年、2011年）.doc ... 1... 4... 9... 12... 16... 20... 23... 26... 30... 33... 36 Electric Circuits 00440021 64 0 0 4 1 2 Y- 3 4 ZYT H 5 Analog Electronic Technique 00440041 54 14 0 3.5 1. 2. 1. 2. 3. RC 4. 5. 1. 20 2.