uP6003-DS-C0100

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1 Order Number PDC8 PDYA Package Typ e DFN6x58L DFN5x610L Top Marking P P 3.3A Charger Interface, Wide Input Sensorless CC/C Synchronousectified Buck Converter for QC2.0/QC3.0/PE+1.1/PE+2.0 And FCP General Description The is a highefficiency synchronousrectified buck converter with an internal power switch. With internal low DS(ON) switches, the highefficiency buck converter is capable of delivering up to 3.3A output current for charger interface and a wide input voltage range from 8 to 32. It operates in either C (Constant Output oltage) mode or CC (Constant Output Current) mode and provides a current limitation function. The has a constant output voltage 5.2/9/12 for Qualcomm Quick Charge TM 3.0/ 2.0(QC2.0/QC3.0) that is detected from D+ and line and automatically detects whether a connected Powered Device (PD) is Quick Charge (QC2.0/QC3.0) capable before enabling output voltage adjustment. If a PD not compliant to Quick Charge (QC2.0/QC3.0) is detected, the disables output voltage adjustment to ensure safe operation with legacy 5.2 only USB PDs. is a USB secondary side fastcharging converter, supporting Qualcomm Quick Charge TM 3.0 (QC 3.0) High oltage Dedicated Charging Port (HDCP) Class A specification. allows for selection of the output voltage of an AC/ DC USB adapter based on commands from the Portable Device (PD) being powered. Selecting a higher charging voltage will reduce the charging current for a given power level resulting in reduced I drops and increased system efficiency. Another advantage of QC3.0 is a decreased battery charging time and a reduced PD system cost thanks to the ability to select an optimum charging voltage. This eliminates the need for costly DC/DC converters within the PD. The USBbus voltage can be controlled in discreet steps from 3.6 up to The output current is limited not to exceed maximum allowable power level. Other features for the buck converter include internal softstart, adjustable external CC (Constant Output Current) limit setting, builtin fixed linecompensation, short circuit protection, IN/ over voltage protection, and over temperature protection. It is available in space saving DFN6x58L and DFN5x610L packages. Ordering Information Note: (1) Please check the sample/production availability with upi representatives. (2) upi products are compatible with the current IPC/JEDEC JST020 requirement. They are halogenfree, ohs compliant and 100% matte tin (Sn) plating that are suitable for use in SnPb or Pbfree soldering processes. Features Certification: is certified by Qualcomm and UL. Please refer to the information below for verification: Qualcomm Quick Charge is a product of Qualcomm Technologies, Inc. UL Certificate No for Series Wide Input oltage ange : 8 to 32 Input oltage Absolute Maximum ating: 36 Up to 3.3A Output Current C/CC Mode Control (Constant oltage and Constant Current) Automatic Selection of D+/ Mode for an Attached Device D+/ Divider Mode 2.7 and 2.7 D+/ 1.2 Mode D+/ Shorted Mode (BC 1.2) Internal QC2.0/QC3.0/PE+1.1/PE+2.0/FCP Protocol and USB Type C Wide Output oltage ange: 3.6 to 12.1 Output oltage Accuracy: +1.5% Fixed 125kHz Frequency Operation Up to 95% Conversion Efficiency Fixed Cable Compensation oltage Adjustable External CC (Constant Output Current) Limit Setting: Default = 3.3A CC (Constant Output Current) Limit Accurarcy:+3% Short Circuit Protection IN/ Over oltage Protection and Over Temperature Protections DFN6x58L and DFN5x610L Packages ohs Compliant and Halogen Free PDA Like Device Car Chargers Portable Charging Devices Applications DSC3201, Nov

2 IN=8~32 IN=8~32 C1 100uF/50 C1 IN IN D+ 100uF/ USB/FCP USB/FCP/QC 2.0 and 3.0 USB Type C Detect C2 1uF/50 C2 1uF/50 IN D+ LX BOOT SENSE+ 4 5 SENSE DFN6x58L IN D+ BOOT LX SENSE+ BOOT LX SENSE+ CC1 CC2 SENSE SENSE C3 0.1uF ohm C6 3.3nF C3 0.1uF ohm C6 3.3nF SENSE 10 1 SENSE+ 9 2 D+ L1 22uH C4 22uFx4/16/X7/MLCC 220uF/16/ES=90m ohm/ec 220uF/16/ES=25m ohm/oscon L1 22uH CC2 3 8 BOOT CC1 4 7 LX DFN5x610L C4 22uFx4/16/X7/MLCC 220uF/16/ES=90m ohm/ec 220uF/16/ES=25m ohm/oscon IN 5 6 LX SENSE 39m ohm = 3.6~12.1 C5 0.1uF/16 Typical Application Circuit SENSE 39m ohm Pin Configuration = 3.6~12.1 C5 0.1uF/16 2 DSC3201, Nov. 2016

3 Pin No. Pin Name PDC8 PDYA Pin Function Power Supply Input. Input voltage that supplies current to the output voltage and 1,2 5 IN powers the internal control circuit. Bypass the input voltage with a minimum 1uFx1 X5 or X7 ceramic capacitor. 4 C C1 USB Type C Port CC1 Input Connection. Functional Pin Description CC1 oltage On Source Side. 3 C C2 USB Type C Port CC2 Input Connection. CC2 oltage On Source Side. 3 2 D + USB Port D+ Input Connection. U SB D+ data line input. 4 1 D U SB Port Input Connection. USB data line input S ENSE The Current Sense Input () Pin. Adjustable line and cable compensation voltage. 6 9 S ENSE+ The Current Sense Input (+) Pin. Adjustable line and cable compensation voltage. 7 8 BOOT Bootstrap Supply for the Floating Upper Gate Driver. Connect the bootstrap capacitor C BOOT between BOOT pin and the LX pin to form a bootstrap circuit. The bootstrap capacitor provides the charge to turn on the upper MOSFET. Typical value for C BOOT is 0.1uF or greater. Ensure that C BOOT is placed near the IC. 8 6, 7 L X I nternal Switches Output. Connect this pin to the output inductor. Exposed Pad () G round. Ground of the buck converter. The exposed pad is the main path for heat convection and should be wellsoldered to the PCB for best thermal performance. DSC3201, Nov

4 SENSE SENSE+ X1 FB Diff Amplifier PE+1.1/PE+2.0 EF_C EF_UP EF_OP EF_CC OTP Current Sense/CC (Constant Output Current) Limit Amplifier COMP_C COMP_CC BC1.2/QC2.0/ QC3.0/FCP D+ UP OP OTP Set Current Limit PO Control & Protection Logic Line/Cable Compensation Functional Block Diagram PO EN CC Current Sense UG Driver CC LG Driver EN Logic Internal egulator EF USB TYPE C A IN A BOOT LX CC1 CC2 4 DSC3201, Nov. 2016

5 C/CC Mode Control The provides C/CC function. It operates in either C (Constant Output oltage) mode or CC (Constant Output Current) mode. The function provides a current limitation function and adjusts external current limit setting (Default=3.3A). In the C mode, the output voltage is controlled within +1.5%. In the CC mode, the output current variation is less than +3% of the nominal value which can be set up to 3.3A by the current sensing resistor. When Output current increase until it reaches the CC limit set by the SENSE resistor. At this point, the device will transition from regulating output voltage to regulating output current, and the output voltage will drop with increasing load. The CC (Constant Output Current) limit is set at 3.3A by default with an external resistance SENSE = 39mΩ, When the (SENSE1+) (SENSE1) voltage gets higher than 130m and reaches the current limit, the driver is turned off. The CC (Constant Output Current) limit is set according to the following equation: CC (Constant Output Current) Limit = 130m SENSE Output Cable esistance Compensation In charger applications, the large load will cause voltage drop in the output cable. The has a builtin cable compensation function. When the load increases, the cable compensator will increase an adjustable regulation of the error amplifier that can make the output voltage constant. Use the curve and table to adjust internal the reference voltage values for fixed USB cable compensation by outside resistance SENSE = 39mΩ (default), as shown in Figure 1 and Table 1.The fixed cable compensation is calculated as follows: COMP = ILOAD x COMP COMP ( mω) 60 I (ma) L OAD Fixed USB Cable Compensation oltage (m) Table 1 USB Cable Compensation Application Table COMP (m) COMP = 60m/A (Fixed) Functional Description I LOAD (ma) Figure 1 USB Cable Compensation at a Fixed esistor Divider alue Current Limit Protection The continuously monitors the inductor current, when the inductor current is higher than current limit threshold, the current limit function activates and forces the upper switch turning off to limit inductor current cycle by cycle. Output Short Circuit Protection The provides output short circuit protection function. Once the output loader shortcircuits, the SCP will be triggered then always hiccup, the hiccup cycle time is set by an internal counter. When the SCP condition is removed or disappears, the converter will resume normal operation and the hiccup status will terminate. Output Over oltage Protection The provides output over voltage protection. Once the output voltage (measured the at SENSE pin) gets higher than OP threshold, the OP will be triggered to shut down the converter. When the OP condition disappears, the converter will resume normal operation and resume the normal state automatically. Over Temperature Protection The OTP is triggered and shuts down the if the junction temperature is higher than 150 o C The OTP is a nonlatch type protection. The automatically initiates another soft start cycle if the junction temperature drops below 130 o C. DSC3201, Nov

6 High oltage Dedicated Charging Port (HDCP) Mode After powerup pins D+ and of are shorted with impedance DCP_DAT and internal reference voltage EF is set to BUS voltage 5.2. The device is in a BC1.2 compatible mode. If a portable device compatible with the Qualcomm Quick Charge specification is connected, a negotiation between HDCP and PD is executed. Once the negotiation is successful the opens D+ and short connection and is pulled down with a DM_DWN. The enters HDCP mode. It monitors D+ and inputs. Based on the specified control patterns, the internal voltage reference value EF is adjusted in order to increase or decrease output voltage to the required value. The is available in Class A version. Class A allows to change the output voltage up to BUS = 12. If the unplug event is detected the decoder circuitry turnson an internal current sink, which discharges the output capacitors to a safe voltage level. If the is set to a Continuous mode it responds to the PD requests in a Single request mode. It does not support Group request mode. HDCP Continuous Mode The continuous mode of operation leverages the previously unused state in QC2.0. If the portable devices try and utilize this mode, it applies voltages on D+ and per Table 2. Assuming the HDCP supports this mode of operation, it will glitch filter the request as it currently does, using TGLITCH CHANGE(40ms). Before the portable device can begin to increment or decrement the voltage, it must wait T_NEW_EQUEST_CONT before pulling D+ and high or low. Once this time has finished, the portable device now attempts to increment or decrement the voltage. To increment, the portable device sends a pulse of width TACTIE by pulling D+ to DP_UP and then must return D+ to DP_SC for TINACTIE. Portable Device D+ 0.6 Functional Description HDCP Class A Output oltage Continuous Mode Previous oltage Table2. HDCP detection voltage coding and status Note: is not forced by the portable device. The portable device shall go HighZ and the HDCP pulls low through dm_dwn. This is to prevent misdetection when current flowing through causes the in the portable device to be at a higher voltage relative to HDCP. Care should be taken in the portable device as this can result in a negative relative voltage on as seen by the portable device. 6 DSC3201, Nov. 2016

7 (Note 1) Supply Input oltage, IN 0.3 to +36 LX oltage to 0.3 to + (IN + 0.3) D+//CC1/CC2 Pin oltage 0.3 to +6.0 SENSE+/SENSE Pin oltage 0.3 to +14 Storage Temperature ange 65 o C to +150 o C Junction Temperature 150 o C Lead Temperature (Soldering, 10 sec) 260 o C ESD ating (Note 2) D+//Sense Pin HBM (Human Body Mode) 4k MM (Machine Mode) 400 Other Pins HBM (Human Body Mode) 2k MM (Machine Mode) 200 Package Thermal esistance (Note 3) (Note 4) Absolute Maximum ating Thermal Information DFN6x5 8L θ JA 45 o C/W DFN6x5 8L θ JC 4 o C/W DFN5x6 10L θ JA 45 o C/W DFN5x6 10L θ JC 4 o C/W Power Dissipation, P T A = 25 o C DFN6x5 8L 2.2W DFN5x6 10L 2.2W ecommended Operation Conditions Operating Junction Temperature ange 40 o C to +125 o C Operating Ambient Temperature ange 40 o C to +85 o C Supply Input oltage, IN +8 to 32 Note 1. Stresses listed as the above Absolute Maximum atings may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. θ JA is measured in the natural convection at T A = 25 o C on a low effective thermal conductivity test board of JEDEC 513 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions. DSC3201, Nov

8 ( IN = 12, T A =25 o C, unless otherwise specified) Parameter Supply Input oltage Input oltage ange IN PO Threshold Symbol N Input OP Threshold IN_O P Supply Input Current Input Quiescent Current I Q1 Input Standby Current I Q2 Power Switches HiSide Switch On esistance S(ON) LowSide Switch On esistance S(ON) Oscillation Frequency f SC Maximum Duty Cycle D AX Output oltage and Soft Start Output oltage Accuracy Soft Start Time Current Sense Amplifier oltage Difference Between SENSE+ and SENSE at CC Mode Operation Test Conditions Electrical Characteristics Min Typ Max Units I 8 32 IN ising 7. 5 IN Falling 7. 0 IN_O P IN_O P ising Falling No switching ma Type C detection 150 ua D D O M 6 IN = 12, = 5.2, O UT only for C2.0/QC3.0/FCP IN = 12, O UT 9, only for QC2.0/QC3. 0 IN = 12, O UT 9.2, only for FCP IN = 24, O UT 12, only for QC2.0/QC3. 0 IN = 24, O UT 12.1, only for FCP 80 mω 50 mω 125 khz % = = = = T SS Output Cable esistance Compensation Fixed Line Compensation UT Protection CC (Constant Output Current) I Limit UT Output oltage needs to collapse threshold Output Over oltage Protection OP Output Under oltage Protection P SEN O O SENSE U % 10 ms = m = 5.2, I 2.5A measured at O = 39mΩ = 10 SENSE, m = A Into CC (Constant Output Current) Limit. Only for QC2.0/3.0 and MTK measured at ENSE S % = 9.2, only for FCP 6. 7 = 12.1, only for FCP 10 8 DSC3201, Nov. 2016

9 Parameter Protection (Cont.) Thermal Shutdown Temprature Symbol Thermal Shutdown Hysteresis T DHYS High oltage Dedicated Charging Port (D+/) Data Detect oltage AT_E F Output oltagte Selection eference SEL_EF Current Limit for HDCP at I Any Output oltage HDCP_MIN Low Glitch Filter Time TGLITCHP_DM_LO W High Glitch Filter Time TGLITCHP_DM_HIG H D+ High Glitch Filter Time TGLITCHP_BC_Don e Output oltage Time Glitch Filter T Test Conditions Electrical Characteristics Min T SD S.25 D GLITCHP CHANG E Unplug bus Discharge T_UNPLU G Time for D+/ to short on HDCP ms D+ Capacitance CDCP_PW Data Line Leakage AT_LKG Pull Down esistance _DWN BC 1.2 DCP Mode (Short Mode) D+ to esistance During DCP Mode CP_DAT D+ Output oltage DP_1.2+ Output oltage DM_1.2+ D+ Output Impedance DP_1.2 Output Impedance DM_1.2+ Divider Mode (2.7/2.7) D+ Output oltage D+_2.7 Output oltage _2.7 D+ Output Impedance D+_2.7 Output Impedance _ eference for Selection HDCP oltage All HDCP's must output this current at minimum After BC1.2 Detection is complete, HDCP Time for bus to discharge to 5.2 in HDCP on unplug Typ Max Units 150 o C 20 o C ma 1 ms 40 ms s ms 500 ms After D+/ A are open and dm_dwn is asserted, how long should HDCP expect to stay low before being pulled high. After D+/ A are open and dm_dwn is asserted, how long after a portable device sees go low, before it makes first voltage request and pulls high. Glitch filter after D+/ toggle before HDCP attempts to change output voltage D+/ HDCP Short Time TD+ SHO T Equivalent capacitance on D+ and to 00 D D 2 D 1 nf kω kω Ω IN = IN = ID+ = 5uA kω I = 5uA kω IN = IN = ID+ = 5uA 36 kω I = 5uA 36 kω DSC3201, Nov

10 Output Inductor Selection Output inductor selection is usually based on the considerations of inductance, rated current value, size requirements and DC resistance (DC). The inductance is chosen based on the desired ripple current. Large value inductors result in lower ripple currents and small value inductors result in higher ripple currents. Higher IN or also increases the ripple current as shown in the equation below. A reasonable starting point for setting ripple current is I L = 900mA (30% of 3000mA). I L = f OSC 1 L (1 Maximum current ratings of the inductor are generally specified in two methods: permissible DC current and saturation current. Permissible DC current is the allowable DC current that causes 40 o C temperature raise. The saturation current is the allowable current that causes 10% inductance loss. Make sure that the inductor will not saturate over the operation conditions including temperature range, input voltage range, and maximum output current. If possible, choose an inductor with rated current higher than 5A so that it will not saturate even under current limit condition. The size requirements refer to the area and height requirement for a particular design. For better efficiency, choose a low DC resistance inductor. DC is usually inversely proportional to size. Different core materials and shapes will change the size, current and price/current relationship of an inductor. Toroid or shielded pot cores in ferrite or permalloy materials are small and don t radiate much energy, but generally cost more than powdered iron core inductors with similar electrical characteristics. The choice of which style inductor to use often depends on the price vs. size requirements and any radiated field/emi requirements. Input Capacitor Selection The input capacitor needs to be carefully selected to maintain sufficiently low ripple at the supply input of the converter. A low ES capacitor is highly recommended. Since large current flows in and out of this capacitor during switching, its ES also affects efficiency. The input capacitance needs to be higher than 22uF. The best choice is he ceramic type and low ES electrolytic types may also be used provided that the MS ripple current rating is higher than 50% of the output current. In the case of the electrolytic types, they can be further away if a small parallel 1uF ceramic capacitor is placed right close to the IC. A 100uF elecrolytic capacitor and 1uF ceramic capacitor are recommended and placed close to IN and pins, with the shortest traces possible. IN ) Application Information Output Capacitor Selection The ES of the output capacitor determines the output ripple voltage and the initial voltage drop following a high slew rate load transient edge. The output ripple voltage can be calculated as: = I C (ES + 8 f OSC 1 C Where f OSC = operating frequency, C = output capacitance and I C = I L = ripple current in the inductor. The ceramic capacitor with low ES value provides the low output ripple and low size profile. In the case of electrolytic capacitors, the ripple is dominated by ES multiplied by the ripple current. Connect a 220uF electrolytic capacitor at output SENSE+ terminal for good performance and low output ripple and place output capacitor5s as close as possible to the device. In the case of ceramic output capacitors, ES is very small and does not contribute to the output ripple. Connect a 0.1uF ceramic capacitor at output SENSE terminal for good performance and place output capacitors as close as possible to the device. PCB Layout Consideration The PCB layout is an important step to maintain the high performance of the. High switching frequencies and relatively large peak currents make the PCB layout a very important part of all high frequency switching power supply design. Both the high current and the fast switching nodes demand full attention to the PCB layout to save the robustness of the through the PCB layout. Improper layout might show the symptoms of poor load or lineregulation, radiate excessive noise at ground or input, output voltage shifts, stability issues, unsatisfying EMI behavior or worsened efficiency. Follow the PCB layout guidelines for optiomal performances of. ) DSC3201, Nov

11 6.00 BSC θ 5.00 BSC 0.20 EF DFN6x5 8L Package Information Note 1.Package Outline Unit Description: BSC: Basic. epresents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. EF: eference. epresents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm BSC DSC3201, Nov. 2016

12 5.00 BSC 0.20 EF θ 6.00 BSC DFN5x6 10L BSC Package Information Note 1.Package Outline Unit Description: BSC: Basic. epresents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. EF: eference. epresents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. DSC3201, Nov

13 Important Notice upi and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. upi products are sold subject to the taerms and conditions of sale supplied at the time of order acknowledgment. However, no responsibility is assumed by upi or its subsidiaries for its use or application of any product or circuit; nor for any infringements of patents or other rights of third parties which may result from its use or application, including but not limited to any consequential or incidental damages. No upi components are designed, intended or authorized for use in military, aerospace, automotive applications nor in systems for surgical implantation or lifesustaining. No license is granted by implication or otherwise under any patent or patent rights of upi or its subsidiaries. COPYIGHT (C) 2016, UPI SEMICONDUCTO COP. 14 DSC3201, Nov. 2016

Pin Configurations Figure2. Pin Configuration of FS2012 (Top View) Table 1 Pin Description Pin Number Pin Name Description 1 GND 2 FB 3 SW Ground Pin.

Pin Configurations Figure2. Pin Configuration of FS2012 (Top View) Table 1 Pin Description Pin Number Pin Name Description 1 GND 2 FB 3 SW Ground Pin. Features Wide 3.6V to 32V Input Voltage Range Output Adjustable from 0.8V to 30V Maximum Duty Cycle 100% Minimum Drop Out 0.6V Fixed 300KHz Switching Frequency 12A Constant Output Current Capability Internal