MAX3205Erev1.DS.C

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1 9-336; Rev ; 0/04 ±5kV ESD, (TVS), ESD HDTV PC ( DVI TM HDMI TM ) PC (FireWire USB 2.0) (PCI Express TM,InfiniBand ), ESD, ESD IEC ±5kV ±8kV ±5kV ESD TVS ESD, 2pF, 0.05pF, MAX3207 E, USB. USB 2.0 (480Mbps) USB OTG MAX3208E, FireWire MAX3205E, SVGA MAX3205E 9 (UCSP), 6 3mm x 3mm QFN MAX3207E 6 SOT23 MAX3208E 0 µmax, 6 3mm x 3mm -40 C +25 C DVI / PDA/ / USB FireWire IEEE 394 2pF I/O 0.05pF ESD ±5kV ±8kV IEC ±5kV IEC (TVS) -40 C +25 C UCSP PART MAX3205EABL-T MAX3205EATE MAX3207EAUT-T MAX3208EAUB MAX3208EATE *EP = TEMP RANGE - 40 C to + 25 C - 40 C to + 25 C - 40 C to + 25 C - 40 C to + 25 C - 40 C to + 25 C PIN- PACKAGE FireWire Apple Computer, Inc. µmax Maxim Integrated Products, Inc. DVI Digital Display Working Group HDMI HDMI Licensing, L.C.C. PCI Express PCI -SIG Corporation InfiniBand InfiniBand Trade Association PACKAGE CODE 9 UCSP B9-2 6 TQFN-EP* (3mm x 3mm) T SOT23-6 U6-0 µmax U0-2 6 TQFN-EP* (3mm x 3mm) T633-4 PART ESD-PROTECTED I/O PORTS TOP MARK MAX3205EABL-T 6 AES MAX3205EATE 6 ACO MAX3207EAUT 2 ABVG MAX3208EAUB 4 MAX3208EATE 4 ACN Maxim Integrated Products Maxim Maxim Maxim Maxim

2 ABSOLUTE MAXIMUM RATINGS to v to +6.0V I/O_ to v to ( + 0.3V) Continuous Power Dissipation (T A = +70 C) 9-Pin UCSP (derate 4.7mW/ C above +70 C)...379mW 0-Pin µmax (derate 5.6mW/ C above +70 C)...444mW 6-Pin SOT23 (derate 8.7mW/ C above +70 C)...696mW 6-Pin Thin QFN (derate 20.8mW/ C above +70 C).667mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Operating Temperature Range C to +25 C Storage Temperature Range C to +50 C Junction Temperature C Lead Temperature (soldering, 0s) C Bump Temperature (soldering) Infrared (5s) C Vapor Phase (60s) C ( = +5V, T A = T MIN to T MAX, unless otherwise noted. Typical values are at = +5V and T A = +25 C.) (Note ) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V Supply Current I CC 00 na Diode Forward Voltage V F I F = 0mA V Channel Clamp Voltage (Note 2) V C T A = +25 C, ±5kV Human Positive transients + 25 Body Model, I F = 0A Negative transients -25 T A = +25 C, ±8kV Contact Positive transients + 60 Discharge (IEC ), I F = 24A Negative transients -60 T A = +25 C, ±5kV Air-Gap Positive transients + 00 Discharge (IEC ), I F = 45A Negative transients -00 Channel Leakage Current µa Channel I/O Capacitance V C C = + 3.3V, b i as of V C C / 2 Channel I/O to I/O Variation in Capacitance TRANSIENT SUPPRESSOR MAX3205EABL-T MAX3207EAUT MAX3205EATE MAX3208EATE MAX3208EAUB C IN = +3.3V, bias of / 2, C I/O_ to ±0.05 pf Capacitance to 0 pf ESD Trigger Voltage dv/dt V/ns (Note 3) 9 V Note : Parameters are 00% production tested at +25 C. Limits over temperature are guaranteed by design only. Note 2: Idealized clamp voltages. See the Applications section for more information. Note 3: Guaranteed by design, not production tested. V pf 2

3 ( = +5V, T A = +25 C, unless otherwise noted.) CLAMP VOLTAGE (V) CLAMP VOLTAGE vs. DC CURRENT I/O_ TO TO I/O_ DC CURRENT (ma) MAX3205E toc0 LEKAGE CURRENT (pa) 0, LEAKAGE CURRENT vs. TEMPERATURE TEMPERATURE ( C) MAX3205E toc02 INPUT CAPACITANCE (pf) INPUT CAPACITANCE vs. INPUT VOLTAGE INPUT VOLTAGE (V) PIN MAX3205E MAX3207E MAX3208E TQFN UCSP SOT23 µmax TQFN 4, 5, 7, 2, 3, 5 A2, A3, B, B3, C, C2 NAME, 4, 4, 6, 9 4, 7, 2, 5 I/O_ ESD-Protected ESD Channel FUNCTION MAX3205E toc03, 3, 6, 8, 9,, 4, 6 3, 6 2, 5, 7, 0, 3, 5, 6, 8, 9,, 3, 4, 6 Not Connected B2 Not Connected. The solder sphere is omitted from ( ) this location (see the Packaging Information section). 2 A Ground. Connect with a low-impedance connection to the ground plane. Power-Supply 0.µF V Input. Bypass V 0 C CC to, with a 0.µF CC ceramic capacitor as close to the device as possible. EP EP EP Exposed Pad. EP Connect to. 3

4 ±5kV ESD, (TVS), ESD HDTV PC ( DVI HDMI) PC (FireWire USB 2.0) (PCI Express,InfiniBand), ESD, ESD MAX3205E MAX3207E MAX3208E ( ) ESD, ESD ±25V IEC , ±60V ±00V MAX3205E/MAX3207E/ MAX3208E, TVS, ESD, ESD, ESD, 0.µF MAX3207E MAX3208E MAX3205E I/O I/O2 I/O I/O2 I/O3 I/O4 I/O I/O2 I/O3 I/O4 I/O5 I/O6 4

5 , ESD ( ), ESD,MAX3205E/MAX3207E/ MAX3208E ESD,, (V C ) (V F ), ESD : V C = + V F ESD : V C =-V F ( ) ESD : V V V L x di ( ESD) L x di ( ESD) C = CC + F D + + dt ( ) 2 dt ESD : V V L x di ( ESD) L x di ( ESD) C = F D + + dt ( 2) 3 dt ESD, 0 ( 2), 5kV IEC-6000 ESD, ns 45A (di/dt = 45 x 0 9 ) 0nH 450V, 0.5in, MAX3205E/MAX3207E/ MAX3208E ( ESD ), ESD, ESR 0.µF ESD, ( ) ESD, Ω, V = I x R, V C V C = I ESD x R OUT +8kV IEC ESD 24A V C = 24A x Ω, V C = 24V,,I ESD ESD POSITIVE SUPPLY RAIL L2 I 00% 90% PROTECTED LINE L D I/O_ D2 IPEAK 0% L3 t R = 0.7ns to ns 30ns 60ns t GROUND RAIL. 2. IEC ESD 5

6 ±5kV ESD ESD MAX3205E/ MAX3207E/MAX3208E : ±5kV, ±8kV, IEC ±5kV, IEC ESD ESD, Maxim 3, 4 00pF, ESD,.5kΩ IEC IEC ESD IEC IEC , IEC IEC ESD ( 5), ESD 2 ±8kV,IEC ,ESD AMPERES I P 00% 90% 36.8% 0% 0 0 t RL 4. Ir TIME t DL CURRENT WAVEFORM PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) R C MΩ R D.5kΩ R C 50Ω to 00Ω R D 330Ω CHARGE-CURRENT- LIMIT RESISTOR DISCHARGE RESISTANCE CHARGE-CURRENT- LIMIT RESISTOR DISCHARGE RESISTANCE HIGH- VOLTAGE DC SOURCE Cs 00pF STORAGE CAPACITOR DEVICE UNDER TEST HIGH- VOLTAGE DC SOURCE Cs 50pF STORAGE CAPACITOR DEVICE UNDER TEST 3. ESD 5. IEC ESD 6

7 ESD ( 6) 00V,, 0nH 45A 450V PC, : ) I/O_ 2),, ESD 3) ESD 4) 5) 6) ESR, L PROTECTED LINE NEGATIVE ESD- CURRENT PULSE PATH TO GROUND D D2 I/O_ L2 V C PROTECTED CIRCUIT 7) ESR, UCSP UCSP -,, Maxim : :UCSP - DIODE COUNT: MAX3205E: 7 MAX3207E: 3 MAX3208E: 5 PROCESS: BiCMOS 0.µF VCC I/0 LINE I/0_ MAX3205E MAX3207E MAX3208E 0.µF I/0 PROTECTED CIRCUIT L3 6. 7

8 TOP VIEW I/O I/O2 I/O I/O A I/O6 MAX3208E A2 A3 I/O5 B MAX3205E B3 I/O4 C C2 C3 I/O3 UCSP (BUMPS ON BOTTOM) 0 9 I/O I/O3 I/O6 I/O I/O I/O I/O3 I/O I/O MAX3205E I/O4 MAX3208E I/O2 THIN QFN I/O3 I/O 6 2 MAX3207E 3 4 SOT23 5 I/O2 µmax THIN QFN 8

9 ( ) 9LUCSP, 3x3.EPS PACKAGE OUTLINE, 3x3 UCSP I 9

10 ( ) ( ) 0.6±0. A2 0 e ±0. 0.6±0. TOP VIEW D2 D b FRONT VIEW A 4X S H A GAGE PLANE α BOTTOM VIEW E2 E 0 SIDE VIEW L L DIM A A MIN MAX MIN MAX A D D2 E E2 H L L b e c S α c INCHES MILLIMETERS REF REF BSC BSC REF REF LUMAX.EPS PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 0L umax/usop APPROVAL DOCUMENT CONTROL NO. REV I 0

11 ( ) ( ) 6LSOT.EPS PACKAGE OUTLINE, SOT-23, 6L F

12 ( ) ( ) LC D 0.0 C 0.08 C LC A A2 A D/2 E/2 E L (NE - ) X e e LC D2/2 e D2 b k 0.0 M C A B E2/2 L (ND - ) X e e C L E2 L 2x6L QFN THIN.EPS PACKAGE OUTLINE 2, 6L, THIN QFN, 3x3x0.8mm E 2 2

13 ( ) ( ) NOTES:. DIMENSIONING & TOLERANCING CONFORM TO ASME Y4.5M-994. EXPOSED PAD VARIATIONS 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL # IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95- SPP-02. DETAILS OF TERMINAL # IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL # IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.20 mm AND 0.25 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220 REVISION C. DOWN BONDS ALLOWED PACKAGE OUTLINE 2, 6L, THIN QFN, 3x3x0.8mm E 2 2 MAXIM Maxim Maxim Maxim Maxim Integrated Products, 20 San Gabriel Drive, Sunnyvale, CA (408) Maxim Integrated Products Printed USA Maxim Integrated Products, Inc.

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< B9E2BBFAD7DBBACFCDBCB2E1B6A8B8E52DC7E5CEFAB0E6312E706466> XYR XYR XYR Tel: 00 567068 www.zolix.com.cn 99 Tel: 00 567068 www.zolix.com.cn XYR500 XYR500 XYR000 XYR0000-CH XYmm.5 0 5 z 5 mm 5050 0000 0000 mm 00 00 0000 mm 6.5 76 98 8 Kg 6 8 5 XY/μm 0/5 0XYμm 0.5