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队聆麦
5 years ago
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1 料 2008, 05, 20 料

2 Outline (Packaging) 料論

3 料類 Compound Sealant ACF Conductive paste Underfill Clear Encapsulant Conductive Paste

4 What is Packaging

5 度料度力

6 Epoxy Application IC Liquid Encapsulant IC Die attach Underfill TIM Global Top Display UV cure Adhesive Opto- Electrics LED Image Sensor A/B Casting glue Low R.I ABglue High R.I AB Glue Others 路

7 Epoxy Resin O H O C OCH 2 O C O C C O C H O C C C n O Cycloaliphatic Bisphenol F C C C O O O C C C OG CH 3 OG CH 3 OG CH 3 O CH 2 CH 2 HP-4032 n CH 3 Cresol Novolac C C C O C O C C C O CH 3 O Bisphenol A

8 Epoxy Structural v.s Properties OG CH 2 OG O H 2 C HCH 2 C O O O CH 2 CH CH 2 OG CH 3 CH 2 OG CH 3 CH 2 ( ) 80 OG CH 3 90 OG ECN 2.0 率% 1.5 GO GO CH 3 C CH 3 H 3 C CH 3 H 3 C 60 OG 65 CH 3 OG H 3 C GO C GO OG CH 2 CH 3 C CH 3 OG CH 3 ( CH 2 ) OG OG GO CH 2 OG OG GO GO OG CH 2 OG OG t_be OG CH 2 t_be CH 2 CH2 1.0 DPCP O OCH 2 CH CH 2 O OCH 2 CH CH 2 ( ) O OCH 2 CH CH 2 OG OG OG OG CH3 CH CH3 CH 3 CH 3 CH ( CH C ) T g

9 料粒流 Non Conductive Adhesives (NCA) Isotropic Conductive Adhesives (ICA) Filler 量 25~35 Vol% Conductive Adhesives Binder 金粒 Anisotropic Conductive Adhesives (ACA) Filler 量 5~10 Vol% 粒粒金 coating 金粒 coating

10 Conductive Adhesive Non-Conductive Adhesive (NCA) Isotropic Conductive Adhesive (ICA) Electrically Conductive Adhesive (ECA) Anisotropic Conductive Adhesive (ACA) Anisotropic Conductive Film (ACF) Anisotropic Conductive Paste (ACP) Thermally Conductive Adhesive (TCA) Thermal Interface Material (TIM)

11 Signal Connection Type gold wire Wire bonding Flip Chip BGA Conductive Paste Die attach adhesive IC underfill ACF or NCF Substrate Metal : leadfrme Ceramic : Al 2 O 3 PCB : FR-4, BT

12 Percolation Theory 臨度

13 Curing Behavior Gel Time DSC Surface Tension Tg/CTE TMA Tg/E DMA Ion ICP-AES Adhesion Die Shear Formulation Data Sheet Viscometer Rheology Oven Micrometer TGA PCT Viscosity Flow Curing Conductivity Filler Content Water Absorption

14 Reliability Test Lead Frame Molding THT TCT TST PCT Sample Precondition JEDEC J-STD-020A Report Post Cure Die Bonding Curing C-SAM IR-Reflow C-SAM SEM

15 度 Test Conditions Criteria Method Accelerated Aging Thermal Aging Thermal Shock Random Vibration Mechanical Shock Salt Spray 60C/90RH, 1000hrs 85C/85RH, 1000hrs 85C, 500hrs -55/+85C, 30 min soak, 10sec transition, 250 cycles 6.8G rms, 30min/axis, 90min total 100G, 6msec, 1/2 sine, 18 shock 5% salinity, ph 7, 36C, 10days < 20% resistance change < 20% resistance change < 20% resistance change < 20% resistance change < 20% resistance change < 20% resistance change MIL-STD-202 Method 103 MIL-STD-202 Method 108 MIL-STD-202 Method 107 MIL-STD-202 Method 214 MIL-STD-202 Method 215 ASTM B117 Adhesion Cross-Hatch 100% Adhesion ASTM D3359 Electromigration 70C/85RH, 1000 hrs, 10 VDC, 47 kohm series resistor < 5mV drop

16 Precondition Test Flow Initial SAT 125 /24 hrs Moisture Soak LV1 85 /85%RH/168 hrs LV2a 60 /60%RH/120hrs LV2 85 /60%RH 168hrs LV3 30 /60%RH 192hrs IR Reflow Final SAT FE-SEM

17 SAT Inspection Initial Final

18 Cross Section Inspection

19 FE-SEM Inspection

20 FE-SEM Inspection Delamination passed

FE-SEM Py-MS TGA Metal surface pollution void delamination interface

21 Material Failure Analysis De-capsulation Failure mode description Sample preparation Embedded chemical Mechanical EDX AFM FTIR X-ray SAT FE-SEM Py-MS TGA Metal surface pollution void delamination interface Outgassing composition Weight loss Define FM More analysis Trouble shutting

22 Conductive Paste for LCD

23 COG Driver IC COF ITO ACF TAB

24 What is ACF

25 ACF Structure Different shape Conductive particle Release film

26 粒 Electrode Resin Adhesive Deformed conducting particle Metal

27 Other Factors Curing degree Bonding pressure Pad size Particle placement Particle size oxiadtion hardness Layer thickness electromigration Substrate performance stiffness,.. Hydrolysis of polymer

28 Reliability Method Temperature Cycling Humidity test Humidity Cycling Mechanical Shock & Vibration test Aging test Free Fall Automotive (under hood) -55 ~ s/600 cy IEC /85%RH, 2000hrs IEC ~+65 96%RH 10cy,240h IEC (test Z/AD) Shock 100g,30ms l/direction IEC (test Ea) IEC (Fc) IEC (Fda) 1000 mm IEC Test Ed Telecom Military Industrial Purpose -10 ~+100 (<300 /min until 50% failure) 85 /85%RH 15-50V,1000h 25~55, 95%RH 144h IEC Sine vibration IEC (test Fc) Random vibr IEC (test Fda) -65~150, 1000cy mil-std-883d/method test cond. D 85 /85%RH, 1320hrs 500 g, 1s Mil-std-883D Method Test cond. A -55~85, 25 cy IEC (test Na) 85 /95%RH, 5V DC,1000hrs IPC-S-815A Class 3 25~55, 95%RH 144h IEC (test Db) 125,1000h IEC (test Ba) Brittle fracture & Fatigue Mirgation Simulation of failure during transport Mechnical force punch

29 Conductive Pate for Si Solar Cell 料

30 (Photovoltaic) 理 (I) P + P N N - 料 P N + - 量料離 P N P N 流流流 ( 亮 )

31 路 I 0 I Dark Photo V Voc Pm Isc I sc Rs + Rsh v I D 路 I R L I=I 0 (e V/aV T-1)-Isc I sc = -I ( 路流, V=0) V oc = av T ln(i sc / I 0 +1) ( 路, I=0) I 0 ( 漏流 ) n i e -Eg +V +I -V 路

32 I-V F.F.(Fill Factor) = (Vm x Im / Voc x Isc) x 100% ( ) (Efficiency) = (Vm x Im / Pin) x 100% ( ) Pin (Incident Power) = A (hc / ) N( ) d 0 : wavelength (µm), N( ): Number of photon/m 2 sec, Isc A: Area (m 2 ), h: Plank constant, c : light speed Im 流 Pm Voc 路 Isc 路流 Pm 率 Vm 率 Im 率流 * 路路不 Vm Voc

34 1.Wire-cut wafer 6.Edge isolation 2.Damage etch 7.Anti-reflection coating 3.Texturing 8.Contact formation 4.P-doping 9.Sintering and firing 5.Emitter diffusion 10.I-V testing Source:IFE, ironment/pv/cellprocess/view?searchterm=solar% 20cell

35 例 P-type wafer 1. 2.

36 例

37 P-type Si wafer Phosphor diffusion Texture formation Back side Ag Al/ Si interface (p+) Al P-n junction n p Dry & print Ag-Al paste ARC coating Dry Ag-Al bus finger Ag Conductor printing bus Co-firing by IR furnace Front side Dry & print Al paste measurement Bus area for soldering

38 Cell SEM E-ton Moretech n layer texture Mono-Si Bus bar Poly-Si H14 um, W100um H17 um, W110um Front side Ag conductor 60um 33um Back side Al conductor

39 列

40 Encapsulant for LED 料

41 LED LED 亮度 LED 亮度 LED( ) 車車 ( ) LED LED

42 LED

43 流 A+B 粒 Y 切亮亮亮冷亮度

44 LED 度率力 / 沈降 Conformal Coating / not secessary

45 LED

46 Phosphor Coating

47 料 Internal Stress Inspection Method Principle Thermal Management of Resin Clear Encapsulant Die Attach or other Adhesive ( ) CTE match

48 Durability of Clear Encapsulant High Temperature T > 250 Thermolytic Process Low Temperature T < Tg Physical Aging Middle Range UV 100 < T <200 Oxidation

49 Snell s law K R Y K T θ R X θ I θ T K I 1 2 sin sin θ T = θ I n n 1 2

51 epoxy O O C O O E = 2 1 C E 2 t B = 2 1 C B 2 t 度

52 Refractive Index of Epoxy C C O C O CH 3 C CH 3 O C C C n O Bisphenol A C C C O CH 3 C O CH 3 O C C C n O H-Bisphenol A C C C O O O C C C O naphthalene O O C O O Cycloaliphatic C C O C O O C C C O Aliphatic

53 Newton Ring 若

54 Photoelastic analysis Direction of principal stress or strains Retardation : magnitude of stresses (see ASTM D 4093 test, for instance) Polarizers and quaterwave plates: to each other black if no stress or orientation Compensator: used for measuring retardation δ Monochromator: used if white light is not sufficient. Strain field quantified by color: retardation associated to specific color. fringe order = δ/λ

55 Retardation and fringe order in a polariscope.

56 Fringe Pattern on a Notch Bar under Tension The color bands are generally called the isochromatics (from Osswaled and Menges).

57 Molecular orientation and residual stress from fringe patterns Residual stress-induced birefringence < orientation induced difficult to measure residual stress

58 Curing Stress Factors The difference of thermal conductivity Leadframe mold and epoxy Convection v.s Conductive Geometry of LED leadframe Epoxy System Epoxy Shrinkage Epoxy Structure Reaction rate v.s pot-life Process control Temperature profile Cycle time Curing Density Difference Formulation Design

59 Epoxy Curing Stress Formation leadframe Heat Flow Air convention Plastic mold conductive chip resin

60 Heat Dissipation Paths of LEDs Source: Topology Research Institute

61 Thermal Resistance Model Radiation Convection Rja Minor/Negligible Paths Encapsulant Die Die Attach Rja Major Paths Lead Substrate

62 Design Idea of Polymers with High Thermal Conductivity 1. Addition of monomers with rigid segment. 2. Addition of nano-sized inorganic fillers. 3. Increasement of the corss-linking density of polymers.

63 Effects of Nano-silica on Thermal Conductivity Dispersion of Nano-silica Effects of Nano-silica Contents on Tg Effects of Nano-silica Contents on T% Effects of Nano-silica Contents on k

64 Lamp LED Stress Distribution Stress Texture Inspect Method CCD polarize polarize Stress area light

65 不力

66 Internal Stress Distribution (real LED lamps) Left: Original Right: After TC Test

67 力 resin Cure Metal ring ( σ σ ) r σ i = Ed θ t / Different color texture Optical Inspection Delam on ring Outside ring Crack Low color with crack

Thermoplastic PPA Leadframe Polyphthalamide (PPA) H H O O N (CH 2 ) 6 N C C Semi-crystalline, reduced moisture pick-up Reinforced by glass fiber Tensile Strength

68 Thermoplastic PPA Leadframe Polyphthalamide (PPA) H H O O N (CH 2 ) 6 N C C Semi-crystalline, reduced moisture pick-up Reinforced by glass fiber Tensile Strength (MPa) Tensile Elongation (%) Tensile Modulus (GPa) Flexural Strength (MPa) Flexural Modulus (GPa) CTE, 1 (ppm/ ) CTE, 2 (ppm/ ) M.P. ( ) ~310

69 Thermoplastic Selection Source :

70 No.1 No.4 No.6 No.2 No.5 No.7 No.3 料

71 Applications of LED on Automotive

72 論不, 類, + LED 料料

Microsoft Word 電子構裝結構分析1221.doc

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