國家圖書館典藏電子全文

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1 1.1 Wire Bonding TAB(Tape Automated Bonding) Flip Chip [1] Wire Bonding IC Pad TAB LCD(Liquid Crystal Display) LCD IC Flip Chip LCD COG(Chip on Glass) IC LCD ITO Flip Chip [1] Flip Chip MBB(Micro Bump Bonding) (Anisotropic Conductive Film, ACF) LCD(Liquid Crystal Display, LCD) IC COG(Chip on 1

2 Glass) COG IC []-[4] 1. IC Bump ACF ACF 0%~90%

3 ACF COG COG 3

4 ACF COG.1 IC ITO 1. AgPd IC. IC 150 IC ITO 3. (Anisotropic Conductive Adhesive, ACA) (Anisotropic Conductive Film, ACF) [5 ] (Anisotropic Conductive Film, ACF) COG 4

5 Hitachi AC-8304Y (Double- ACF Layer ACF ) (Single-Layer ACF) (Short). [6] ITO(Indium Tin Oxide) IC Pad (LCD) ITO ITO STN-LCD(Super Twisted Nematic -LCD) ITO Photo Layout COM SEG I-CON ITO Pin [7] COG(Chip on Glass) ITO Layout IC ITO COG(Chip 5

6 on Glass) ITO [][3] R Rpu Rcu Rtu Rblk Rtb Rcb Rpb Upper plate Particle Bottom plate Rpu Upper substrate Bottom substrate Rcu Rtu Rblk 6

7 Rtb Rcb Rpb (constriction resistance) b u b b R pu = bu ρ πζ dζ = ρ πb u R pb ρ = πb b R cu = bu ru ρ πζ dζ = ρ π 1 ru 1 b u R cb = ρ π 1 rb 1 b b r b 7

8 R blk = ρ π( a x a ru = a r b dx ) ρk ( a, r r ) u, πa b k ( a, r, r u b ( a + ) = ln ( a a a r r u u )( a + )( a a a r r b b ) ) ρ R = πr u ρ + πr b + R tu + R tb ρk ( a, r, r u b ) + πa Rtu Rtb Pad r u r b ρ R = + π r R blk 1 R r.3 COG(Chip on Glass) (Anisotropic Conductive Film, ACF) COG(Chip on Glass) IC ITO 8

9 ACF Pin IC Pad IC 0.5~1 (Head) 50 ~60 IC COG kg 5 COG COG COG COG IC Pad ITO IC Pad ITO Bump 9

10 COG Bump 5 Pad Bump Pad ITO.5 COG [8] a = 3 3πP ( k1 + k) R1R 4( R + R ) 1 α = 3 9π P ( k1 + k) ( R1 + 16R R 1 R ) k 1 1 ν = πe 1 1 k 1 ν = πe a α 10

11 P k Kyung-Wook Paik [] NE * 1 3 ρ1 0.69( ρ p + ρs )( ) + Rc = FD 0.54D N 1 1 ν p 1 ν = + E * Ep Es s N D F ν ρ (s p ).6 [9] IC Pad 11

12 0% 30% 40%~60% 0%~60% IC Pad 0%.7 TAB COG LCD TAB(Tape Automated Bonding) STN-LCD Duty Pin PDA TAB 1

13 64Duty COG COG TAB TCP (Tape Carrier Package) TAB ( back light ) LCD mm 1.mm TCP 1.5mm TAB 4.1mm COG.6 mm LCD mm 1.mm COG TAB COG TAB COG LCD IC TAB LCD TAB COG [10] 13

14 COG (Head) 100 COG COG Bump ACF x 7x1.9 mm 16.7 x 4 mm DOT-16*3 + I-CON 1/5 Duty 1/5 Bias 14

15 5.3V 5 ìm 0000pcs/mm 3 ìm IC SPLC093(SUNPLUS) IC ìm Pad Pitch 75.6ìm IC Pad 3. COG COG kg

16 5 (50 90%RH 1000 ) x 7 x 1.9 (mm) 1. IC ACF IC - SPLC093C ACF AC-8304Y 3.5kg secs A C E 4 secs B D F (50 90%RH) 40hrs hrs ( ) bump

17 3.3 COG 3.5kg kg 0.5kg 9 5 (-30 [30mins]<- ->70 [30mins]) 30 cycles 10cycles 4 8 Bump 8 Pad ACF 17

18 x 7 x 1.9 (mm) 1. IC ACF IC - SPLC093C ACF AC-8304Y Head 90 5secs kg (-30 [30mins]<- ->70 [30mins]) 30 cycles 10cycles 6. 8 Bump Bump COG Bump Bump COG ACF 18

19 10 Bump IC 163 Pad 3.5 ACF ACF thermocouple COG ACF COG 19

20 4.1 COG COG 50 90%RH %RH (OK) (NG) % 0

21 100% / 90/5 90/4 100% 70/5 3 40% 70/4 1 80% 50/5 1 75% 50/4 60% OK 4 NG IC ITO ITO Layout COG Bump 0.18mA~0.188mA 1

22 mA~0.10mA 0.011~0.0mA 0.~0.5mA COG IC ACF 5 d(ma)/dt (ma/ ) mA 0.mA 85 Pilot Run Pilot Run

23 COG LCD ITO kg ( 1 ) COG

24 % 98.5% 4. COG ACF 5ìm Bump (t) 6 0~4 0%~90% 1~3 (%) (t) (ìm) 0 0~10 4.5~5 1 0~40 3~4 1 40~60 ~3 60~80 1~

25 (t) Deformatio n t = 0 t 100(%) t t 0 (5ìm) t t 0%~90% kg~5.0kg 0.5kg cycles COG COG

26 10.5kg 40%.5kg NG 3.0kg 30 OK 3.0kg 0%~90% 1~3 [9] ANSYS 50%~70% 1~ 60%~80% Pad 7 69 Bump 1.0kg 5.0kg 3.0kg 6

27 3 4.5kg 5.0kg 3.0kg.5kg 1 3.5kg Bump IC Pad ~ ~19 1.0kg~3.0kg /kg 3.0kg~5.0kg 7

28 0 4.5~5kg 4.3 Bump Bump Bump 3 Pad Size ìm ACF 0000 /mm Bump ACF 5000 /mm ACF 8

29 ACF 4.4 ACF ACF ACF % thermocouple COG ACF -- ACF ACF 0 ACF 15 9

31 4 5 ACF ACF % 31

32 kg %. COG 4 COG IC ACF 0.193~0.10mA 0.0~0.50mA kg 4. 0%~90% [9] ANSYS 3

33 50%~70% 60%~80% 3.0kg 5. 0%~90% 1.0kg 3.0kg 3.0kg~5.0kg 3.0kg 6. Bump 13~ ACF ACF 0000 /mm 5000 /mm ACF 33

34 8. ACF % Thermocouple ACF % 100 COG -- 3kg 80~90 3~5 34

35 [1],, 147, 88,pp93~98. [] Myung-Jin Yim andktung-wood Paik, Design and Understanding of Anisotropic Conductive Films (ACS s) for LCD Packaging,IEEE Transactions on Components, Packaging, and Manufacturing Technology-Park A, Vol.1,No.,JUNE 1988, pp.6~34. [3] Rainer Dudek,Stefan Meinel,Andreas Schubert, Bernd Michel,Lutz Dorfmuller, Peter M, Knoll and Jorg Baumbach, Flow Characterization and Thermo-Mechanical Response of Anisotropic Conductive Films, IEEE Transactions on Components and Packaging Technology, Vol.,No.,JUNE 1999, pp.177~185. [4] Rajeev Joshi, Chip on glass-interconnect for row/column driver packaging Microelectronics Journal, Vol.9,No.6,JUNE 1998, pp.343~349. [5] John H. Lau, Flip Chip Technologies, McGraw-Hill,1996,pp89~338. [6] F.G.Shi, Mikrajuddin Abdullah, S. Chungpaiboonpatana,K. Okuyama,C. Davidson,J.M.Adams, Electrical conduction of anisotropic conductive 35

36 adhesives effect of size distribution of conducting filler particles, Materials Science in Semiconductor Processing, Vol.,1999, pp.63~69. [7],,,, 85,pp3~31. [8] S. P. Timoshenko,J N. Goodier, Theory of Elasticity,3 rd, McGraw-Hill, 1970,pp409~414. [9], COG,, 89,pp33~4 pp67. [10], SMT,, 86,pp5-3~

行動電話面板產業

行動電話面板產業 TFT-LCD IC LCD TV Monitor TFT LCD IC 2005 Samsung IC - IC LCD TV LCD monitor LCD TV 2004~2007 69% LCD Monitor 2004~2007 18% IC 2004 ~2009 16.26% 2004 ~2009 10.39% ASP (Fine Pitch) IC Pin IC IC IC TCP COF