Generalinformation IGBTStackfortypicalvoltagesofupto69VRMS Ratedoutputcurrent6ARMS High power converter Wind power Motor drives PrimePACK TM 3 module with integrated NTC Extended operational temperature Low Vcesat Topology B6I Application Inverter Load type Resistive, inductive Semiconductor (Inverter Section) 3x FFR7IE4 DC Link 3.6 mf Heatsink Water cooled Implemented sensors Current, voltage, temperature Driver signals IGBT Electrical Sales - name SP - No. SP9393 DC Link Inverter Section ~ ~ ~ Signal conditioning & monitor Driver 3 phases Electrical interface
Absolutemaximumratedvalues Collector-emitter voltage IGBT; Tvj = 25 C VCES 7 V Repetitive peak reverse voltage Diode; Tvj = 25 C VRRM 7 V DC link voltage VDC 25 V Insulation management according to installation height of 2 m Vline 69 VRMS Insulation test voltage according to EN 578, f = 5 Hz, t = s VISOL 2.5 kvrms Repetitive peak collector current inverter section (IGBT) Repetitive peak forward current inverter section (Diode) I²t-value inverter section (Diode) Continuous current inverter section tp = ms ICRM2 25 A tp = ms IFRM2 25 A I²t 4 ka²s IAC2 7 ARMS Junction temperature under switching conditions Tvjop 5 C Switching frequency inverter section fsw2 5 khz Notes Further maximum ratings are specified in the following dedicated sections Characteristicvalues DCLink min. typ. max. Rated voltage VDC 25 V Over voltage shutdown within 5 µs 25 V Capacitor s, 9 p, rated tol. +/- % CDC 3.6 mf type Foil Maximum ripple current per device, Tamb = 55 C Iripple 49 ARMS Balance or discharge resistor per DC link unit Rb 47 kω Notes Operation above V subject to reduced operating time according to EN 67 InverterSection min. typ. max. Rated continuous current Continuous current at low frequency VDC = V, VAC = 69 VRMS, cos(ϕ) =.85, fac sine = 5 Hz, fsw = 3 Hz, Tinlet = 4 C, Tj 5 C VDC = V, VAC = 69 VRMS, fac sine = Hz, fsw = 3 Hz, Tinlet = 4 C, Tj 5 C IAC 6 ARMS IAC low 295 ARMS Rated continuous current for 5% overload capability Rated continuous current for 5% overload capability IAC 5% = 6 ARMS, ton over = 6 s, Tj 5 C IAC over 45 ARMS IAC 5% = 67 ARMS, ton over = 3 s, Tj 5 C IAC over2 445 ARMS Over current shutdown within 5 µs IAC OC 25 Apeak Power losses IAC = 6 A, VDC = V, VAC = 69 VRMS, cos(ϕ) =.85, fac sine = 5 Hz, fsw = 3 Hz, Tinlet = 4 C, Tj 5 C Ploss 98 W 2
Controllerinterface Driver and interface board ref. to separate Application Note DR min. typ. max. Auxiliary voltage Vaux 8 24 3 V Auxiliary power requirement Vaux = 24 V Paux 4 W Digital input level resistor to GND.8 kω, capacitor to GND 4 nf, logic high = on, min. 5 ma Vin low 4 V Vin high 5 V Digital output level open collector, logic low = no fault, max. 5 ma Vout low.5 V Vout high 5 V Analog current sensor output inverter section load max ma, @ 6 ARMS VIU ana2 VIV ana2 VIW ana2 3.4 3.5 3.6 V Analog DC link voltage sensor output load max ma, @ V VDC ana 7.7 7.9 8.. V Analog temperature sensor output inverter section (NTC) Analog temperature sensor output inverter section (Simulated) Over temperature shutdown inverter section load max ma, @TNTC = 72 C, corresponds to Tj = 48 C at rated conditions load max ma, @TNTC = 72 C, corresponds to Tj = 48 C at rated conditions VTheta NTC2 8.4 V VTheta sim2 9 V VError OT2 9.3 V Systemdata min. typ. max. EMC robustness according to IEC 68-3 at named interfaces power control aux (24V) VBurst 2 kv VBurst kv Vsurge kv Storage temperature Tstor -4 8 C Operational ambient temperature PCB, DC link capacitor, bus bar, excluding cooling medium Top amb -25 55 C Cooling air velocity PCB, DC link capacitor, bus bar, standard atmosphere Vair 2 m/s Humidity no condensation Rel. F 95 % Vibration according to IEC 672 5 m/s² Shock according to IEC 672 4 m/s² Protection degree Pollution degree 2 Dimensions width x depth x height 59 338 366 mm Weight 65 kg IP Heatsinkwatercooled min. typ. max. Water flow according to coolant specification from Infineon V/ t 5 dm³/min Water pressure 8 bar Water pressure drop at 5 dm³/min water flow p 2 mbar Coolant inlet temperature Tinlet -4 55 C Thermal resistance heatsink to ambient per switch Rth,ha.38 K/W Cooling channel material Notes Composition of coolant: Water and 52 vol. % Antifrogen N Copper 3
Overviewofoptionalcomponents Unit Inverter Section Parallel interface board Optical interface board Voltage sensor Current sensor Temperature sensor Temperature simulation DC link capacitors Collector-emitter Active Clamping Notes Setting of Active Clamping TVS-Diodes: VZ = 28 V Unit 3 4
fac sine - derating curve IGBT (motor), Diode (generator) VDC = V, VAC = 69 VRMS, fsw = 3 khz, cosϕ = ±.85 Tinlet = 4 C and nom. cooling conditions fsw - derating curve IGBT (motor), Diode (generator) VDC = V, VAC = 69 VRMS, fac sine = 5 Hz, cosϕ = ±.85 Tinlet = 4 C and nom. cooling conditions 2 4 3 IAC/Inom [%] 9 8 7 6 5 4 3 2 IGBT, cosϕ =.85 IGBT, cosϕ =.85 IAC/Inom [%] 2 9 8 7 6 5 4 3 2 IGBT, cosϕ =.85 Diode, cosϕ = -.85 5 5 2 25 3 35 4 45 5 fac sine [Hz] 2 3 4 5 fsw [Hz] Tinlet - derating curve IGBT (motor), Diode (generator) VDC = V, VAC = 69 VRMS, fac sine = 3 khz, fac sine = 5 Hz cosϕ = ±.85 and nom. cooling conditions Analog temperature sensor output VTheta NTC Sensing NTC of IGBT module 4 3 2 9 8 IAC/Inom [%] 9 8 7 6 5 4 VTheta NTC [V] 7 6 5 4 3 3 2 IGBT, cosϕ =.85 Diode, cosϕ = -.85 2-25 -5-5 5 5 25 35 45 55 Tinlet [ C] 2 4 6 8 TNTC [ C] 5
Tvj,sim vs. IAC - Simulated junction temperature VDC = V, VAC = 69 VRMS, fsw = 3 khz Tinlet = 4 C and nom. cooling conditions Analog temperature sensor output VTheta sim VDC = V, VAC = 69 VRMS, fsw = 3 khz, Tinlet = 4 C and nom. cooling conditions 5 4 fac sine = 5 Hz fac sine = 2 Hz fac sine = 5 Hz 9 fac sine = 5 Hz fac sine = 2 Hz fac sine = 5 Hz 3 8 7 2 6 Tvj,sim [ C] VTheta sim [V] 5 4 9 3 2 8 7 2 3 4 5 6 7 IAC [A] 7 8 9 2 3 4 5 Tvj,sim [ C] Zth,ha - thermal impedance heatsink to ambient per switch nom. cooling conditions.4.35.3.25 Zth,ha [K/W].2.5..5 i: ri[k/w]: τi[s]:.24.5 2.2.5299 3.268 2.729 4.43 2.884.. t [s] 6
Mechanicaldrawing Dokumentstatus siehe SAP-Dokumentenverwaltung A B C D E F G H 2 3 4 5 6 7 8 9 2 59 36.2 2 3 4 5 6 7 8 9 2 Copyright c INFINEON TECHNOLOGIES AG, All rights reserved A2 A B C D E F G H U V W 43.5 269.5 3 364.5 52 338 589 5 266 8 8 365. 36.6 G/2" water inlet G/2" water outlet DC Minus M8x27.5 DC Plus 32 :5 :5 3: Part-No. 36775 general Tolerance Surface Scale Material Assembly-No. DIN ISO 2768 -v- Material-No. Date Name Desciption 2.9.2 Pelmer Agent Checked2.9.2 gez.volke Norm ModSTACK HD Abdeckung geänd. 6.3.2 Pa. Vers. Revision Date Name Origin Constructed for Graph-No. Version Sheet 36775 Mb / 7
Circuitdiagram X2:4 PWM U BOT X2:5 PWM U TOP X2:3 PWM V BOT X2:4 PWM V TOP X2:7 PWM W BOT X2:8 PWM W TOP X2:2, X3:5 Phase U Error Signal conditioning & Gate signals EiceDRIVER TM Top Bottom T NTC U X2:6, X3:8 Phase V Error X2:5, X3:6 Phase W Error X3:9 OT Error Sensor signals X3:7 OV Error X3:7 OC Error X3:4 Sum Error X2:, X2:22 GND digital X3:2, X3:4 X4:9, X4:4 GND digital GND digital Failure management EiceDRIVER TM Top Bottom T NTC V X2:8, X2:2 P24 X3:3, X3:5 5V X4:5 5V X4:3-5V T NTC X3: V IU ana X3:2 V IV ana X3:3 V IW ana X3: V Theta NTC, V Theta sim X3:23 V DC ana Power supply EiceDRIVER TM Top Bottom W X3:24, X3:25 GND analog X5: V aux X5:2 GND X5:3 TE, Shield DR DC+ DC- V-Option Voltage measurement 3 4 25 X2 (male connector) High voltage domain Low voltage domain 3 4 25 X3 (male connector) 8 9 5 3 X4 (male connector) X5 (male connector) SV (jumper) Th Tj Setting X3: = V Theta NTC (Sensing NTC of IGBT module) Setting X3: = V Theta sim (default setting) (Simulated junction temperature) ModSTACK TM HD 8
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