SPECIFICATION IEEE 802.11 B/G/N 2.4GHz 1T1R WiFi with Bluetooth2.1/3.0/4.0, and FM controller with SDIO interface, and HS-UART mixed interface NT-SM02BD-8723BS-12 WF+ BT+ FM Combo Module Version 1.0
PRODUCT DESCRIPTION SM02BD is a small size and low profile of WF+BT+FM combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0. SM02BD uses Realtek RTL8723BS, a highly integrated WiFi/BT single MODULE based on advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. PRODUCT FEATURES Operate at ISM frequency bands (2.4GHz) GSPI/SDIO for WiFi and UART for Bluetooth IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE802.11e, IEEE 802.11h, IEEE 802.11i Fully Qualified for Bluetooth 2.1 + EDR specification including both 2Mbps and 3Mbps modulation mode Fully qualified for Bluetooth 3.0 Fully qualified for Bluetooth 4.0 Dual mode Full speed Bluetooth operation with Piconet and Scatternet support. Enterprise level security which can apply WPA/WPA2 certification for WiFi. WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates For WiFi/BT, it uses fixed path for WiFi and BT, which means one antenna assigned for WiFi and the other is assigned for BT. Support Bluetooth adaptive power management mechanism Full-featured software utility for easy configuration and management RoHS compliance Low Halogen compliance
Diagram Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250 C Number of Times : 2 times
PRODUCT SPECIFICATIONS Module Name Main chipset Standards NT-SM02BS-8723BS-12 RTL8723BS (WiFi/BT/FM Single Chips) WiFi: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i BT: V2.1+EDR/BT v3.0/bt v3.0+hs/bt v4.0 Bus Interface WiFi: GSPI/SDIO BT: UART Data Rate WiFi: 802.11b: 11, 5.5, 2, 1 Mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: MCS 0 to 7 for HT20MHz MCS 0 to 7 for HT40MHz BT: 1 Mbps for Basic Rate 2,3 Mbps for Enhanced Data Rate 6,9,12,18,24,36,48,54 Mbps for High Speed Media Access Control Modulation Techniques Network Architecture OS supported Frequency Range Operating Channel Operating Voltage Transmit Output Power 1x1 (Tolerance:±1.5dBm) Receiver Sensitivity Security Power Consumption (3.3V) (Typical) WiFi: CSMA/CA with ACK BT: AFH, Time Division WiFi: 802.11b: CCK, DQPSK, DBPSK 802.11g: 64 QAM, 16 QAM, QPSK, BPSK 802.11n: 64 QAM, 16 QAM, QPSK, BPSK BT: 8DPSK, π/4 DQPSK, GFSK WiFi: Ad-hoc mode (Peer-to-Peer ) Infrastructure mode Software AP WiFi Direct BT: Pico Net Scatter Net Linux/Android 2.400GHz ~ 2.4835 GHz WiFi 2.4GHz: 11: (Ch. 1-11) United States 13: (Ch. 1-13) Europe 14: (Ch. 1-14) Japan BT 2.4GHz: Ch. 0 ~78 3.3 V ±9% I/O supply voltage 802.11b@11Mbps 16dBm BT: Max +10dBm 802.11b@11Mbps -82dBm Storage Temperature -55-+120 Ambient Operating Temperature 0-70 Junction Temperature 0-125 802.11g@6Mbps 15dBm 802.11g@54Mbps 14dBm 802.11g@54Mbps -71dBm 802.11n 13dBm (MCS 0_HT20) 13dBm (MCS 7_HT20) 12dBm (MCS 0_HT40) 12dBm (MCS 7_HT40) 802.11n -67dBm (MCS 7_HT20) -64dBm (MCS 7_HT40) BT: -89dBm@1Mbps, -90dBm@2Mbps, -83dBm@3Mbps WiFi : WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE 802.11x, IEEE 802.11i BT: Simple Paring WiFi only TX Mode: (Conituous mode) 85mA(MCS7/BW40/13dBm) RX Mode: (Conituous mode) 75mA(MCS7/BW40/-60dBm) Associated Idle with DTIM=1 2.1mA Unassociated Idle: 0.1mA RF disable Mode: 0.1mA BT : Inquiry & Page Scan: 0.9 ma ACL no traffic: 7.5mA SCO HV3: 15mA
Mechanical Dimensions (mm) 12 (Tolerance:±0.2mm) Length Width Height 12 (Tolerance:±0.2mm) 1.6 (Tolerance:±0.2mm) Module Pocture
Pin Description PIN Function Description 1 GND Grond 2 WiFi/BT_ANT 3 NC NC 4 NC NC 5 NC NC 6 BT_WAKE HOST wake-up Bluetooth device 7 BT_HOST_WAKE Bluetooth device to wake-up HOST 8 NC NC 9 VABT 3.3V±0.1V(Main power voltage source input) 10 NC NC 11 NC NC 12 WL_DSI Shared with GPIO9 This Pin Can Externally Shutdown the RTL8723BS WLAN function when BT_DISn is Pulled Low. When this pin deasserted, SDIO interface will be disabled. This pin can also support the WLAN Ra dio-off function with host interface remaining connected. 13 WL_HOST_WAKE WLAN to wake-up HOST 14 SDIO_Data_2 SDIO data line 2 15 SDIO_Data_3 SDIO data line 3 16 SDIO_CMD SDIO command line 17 SDIO_CLK 18 SDIO_Data_0 SDIO data line 0 19 SDIO_Data_1 SDIO data line 1 20 GND Grond 21 NC NC 22 VDD_IO 3.3V±0.1V 23 NC NC 24 SUSCLK_IN Shared with GPIO6. External 32K or RTC clock input with 1.8V ~ 3.3V swing. This clock source is configured by BT and WL FW, respectively. 25 PCM_DOUT PCM Data output 26 PCM_CLK PCM Clock 27 PCM_DIN PCM data input 28 PCM_SYNC PCM sync signal 29 NC NC 30 26MHz_IN Reference clock input 26MHz Active Crystals (or if pin10/11 input,pin30 NC ) 31 GND Grond 32 NC NC 33 GND Grond 34 BT_DIS# General Purpose Input/Output Pin 35 NC NC 36 GND Grond 37 NC NC 38 NC NC 39 NC NC 40 NC NC RF I/O Port 41 GND Grond SDIO CLK line 42 UART_OUT HOST Data output 43 UART_IN HOST Data input 44 UART_CTS HOST_CTS
WIFI\BT RF Circuit reference pictures 注 :1. 以上虚线框的部分需要进行天线匹配, 以实际天线匹配的电子元器件参数为准. 2. 以上为 RF 走线要做 50 欧姆阻抗, 走线不能走 90 度, 走线长度不能超过 15mm. Note: The RF part layout must do 50 Ωimpedance.,can't get the line go 90,can't get the line longer than 15 mm. SDIO interface Circuit reference pictures FM interface Circuit reference pictures
Wireless module before the SMT note: 1.When customers Open stencil must be sure the hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm. 2.Can't get the wifi module bare hands when needs,must we wear the gloves and static ring. 3.The furnace temperature according to the size of the customer the mainboard,generally like to stick on a tablet standard temperature of 250 + - 5,can do 260 + - 5. Wifi 模块贴片装机前注意事项 : 1. 客户在开钢网时一定要将 wifi 模块焊盘的孔开大, 请按 1 比 1 再向外扩大 0.7mm 比例开钢网, 厚度按 0.12mm. 2. 有需要拿 wifi 模块时不可以光手去拿, 一定要戴上手套以及静电环. 3. 过炉温度要根据客户主板的大小而定, 一般像平板电脑上的标准温度为 250+-5, 也可以做到 260+-5 Wifi 模块储存及使用管制应注意事项如下 : Storage and use Wifi module control should pay attention to the following matters: 1.Module of the storage life of vacuum packaging: 1-1.Storage life:12 months. Storage conditions:<40. Relative humidity:<90%r.h. 1-2.After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3.Check the humidity card :stored at 20%RH.If : 30%~40%(pink)or greater than 40%(red).Labeling module has moisture absorption. 1 Mounthed within 168 hours at factory conditions of: t 30%, 60%R.H. 2 Once opened, the workshop the preservation of life for 168 hours. 1-4.If baking is required,devices may be baked for: 1 Modules must be to remove module moisture problem. 2 Baking temperature: 125, 8 hours. 3 After baking, put proper amount of desiccant to seal packages. 1-5.Module vacuum packing 2000 PCS per disc. 2.Module reel packaging items as follows. 2-1.Storage life:12 months. Storage conditions:<40. Relative humidity:<90%r.h. 2-2.Module apart packing after 168 hours,to launch patch need to bake, to remove the module hygroscopic, baking temperature conditions:125,8hours. 2-3.Reel packing 2000 PCS or 1000 PCS per disc. 3.Module pallet packaging items as follows: 3-1.Storage life : 3 months. Storage conditions:<40. Relative humidity:<90%r.h. 3-2.Module if not used within 48 hours, before launch the need for baking, baking temperature: 125, 8 hours. 3-3.Pallet packaging each plate is 100 PCS to 1000 PCS or 2000 PCS shipment. 1. 模块的真空包装之储存期限 : 1-1. 保存期限 :12 个月, 储存环境条件 : 温度在 :<40, 相对湿度 : <90%R.H. 1-2. 模块包装被拆后,SMT 组装之时限 : 1-3. 检查湿度卡 : 显示值应小于 30%( 蓝色 ), 如 :30%~40%( 粉红色 ) 或者大于 40%( 红色 ) 表示模块已吸湿气. 1 工厂环境温度湿度管制 : 30%, 60%R.H 2 拆封后, 车间的保存寿命为 168 小时. 1-4. 如在拆封后的 168 个小时内未使用完, 需要烘烤, 烘烤条件如下 : 1 模块须重新烘烤, 以除去模块吸湿问题. 2 烘烤温度条件 :125,8 小时. 3 烘烤后, 放入适量的干燥剂再密封包装. 1-5. 模块真空包装每盘 2000pcs, 真空包装图片 <1> 2. 模块卷盘包装事项如下 : 2-1. 保存期限 :12 个月, 储存环境条件 : 温度在 :<40, 相对湿度 : <90%R.H. 2-2. 模块拆开包装 168 小时后, 如要上线贴片需要重新烘烤, 以除去模块吸湿问题, 烘烤温度条件 125,8 : 小时 2-3. 卷盘包装标准为每盘 2000pcs, 也可以 1000pcs. 3. 模块托盘包装事项如下 : 3-1. 保存期限 :3 个月, 储存环境条件 : 温度在 :<40, 相对湿度 : <90%R.H. 3-2. 模块如在 48 小时内未使用, 在上线之前需要进行烘烤, 烘烤温度条件 :125,8 小时 3-3. 托盘包装每盘为 100pcs, 以 1000pcs 或 2000pcs 出货.
易迪拓培训 专注于微波 射频 天线设计人才的培养网址 :http://www.edatop.com 射频和天线设计培训课程推荐 易迪拓培训 (www.edatop.com) 由数名来自于研发第一线的资深工程师发起成立, 致力并专注于微波 射频 天线设计研发人才的培养 ; 我们于 2006 年整合合并微波 EDA 网 (www.mweda.com), 现已发展成为国内最大的微波射频和天线设计人才培养基地, 成功推出多套微波射频以及天线设计经典培训课程和 ADS HFSS 等专业软件使用培训课程, 广受客户好评 ; 并先后与人民邮电出版社 电子工业出版社合作出版了多本专业图书, 帮助数万名工程师提升了专业技术能力 客户遍布中兴通讯 研通高频 埃威航电 国人通信等多家国内知名公司, 以及台湾工业技术研究院 永业科技 全一电子等多家台湾地区企业 易迪拓培训推荐课程列表 : http://www.edatop.com/peixun/tuijian/ 射频工程师养成培训课程套装该套装精选了射频专业基础培训课程 射频仿真设计培训课程和射频电路测量培训课程三个类别共 30 门视频培训课程和 3 本图书教材 ; 旨在引领学员全面学习一个射频工程师需要熟悉 理解和掌握的专业知识和研发设计能力 通过套装的学习, 能够让学员完全达到和胜任一个合格的射频工程师的要求 课程网址 :http://www.edatop.com/peixun/rfe/110.html 手机天线设计培训视频课程该套课程全面讲授了当前手机天线相关设计技术, 内容涵盖了早期的外置螺旋手机天线设计, 最常用的几种手机内置天线类型 如 monopole 天线 PIFA 天线 Loop 天线和 FICA 天线的设计, 以及当前高端智能手机中较常用的金属边框和全金属外壳手机天线的设计 ; 通过该套课程的学习, 可以帮助您快速 全面 系统地学习 了解和掌握各种类型的手机天线设计, 以及天线及其匹配电路的设计和调试... 课程网址 : http://www.edatop.com/peixun/antenna/133.html WiFi 和蓝牙天线设计培训课程该套课程是李明洋老师应邀给惠普 (HP) 公司工程师讲授的 3 天员工内训课程录像, 课程内容是李明洋老师十多年工作经验积累和总结, 主要讲解了 WiFi 天线设计 HFSS 天线设计软件的使用, 匹配电路设计调试 矢量网络分析仪的使用操作 WiFi 射频电路和 PCB Layout 知识, 以及 EMC 问题的分析解决思路等内容 对于正在从事射频设计和天线设计领域工作的您, 绝对值得拥有和学习! 课程网址 :http://www.edatop.com/peixun/antenna/134.html
` 易迪拓培训 专注于微波 射频 天线设计人才的培养网址 :http://www.edatop.com CST 学习培训课程套装该培训套装由易迪拓培训联合微波 EDA 网共同推出, 是最全面 系统 专业的 CST 微波工作室培训课程套装, 所有课程都由经验丰富的专家授课, 视频教学, 可以帮助您从零开始, 全面系统地学习 CST 微波工作的各项功能及其在微波射频 天线设计等领域的设计应用 且购买该套装, 还可超值赠送 3 个月免费学习答疑 课程网址 :http://www.edatop.com/peixun/cst/24.html HFSS 学习培训课程套装该套课程套装包含了本站全部 HFSS 培训课程, 是迄今国内最全面 最专业的 HFSS 培训教程套装, 可以帮助您从零开始, 全面深入学习 HFSS 的各项功能和在多个方面的工程应用 购买套装, 更可超值赠送 3 个月免费学习答疑, 随时解答您学习过程中遇到的棘手问题, 让您的 HFSS 学习更加轻松顺畅 课程网址 :http://www.edatop.com/peixun/hfss/11.html ADS 学习培训课程套装该套装是迄今国内最全面 最权威的 ADS 培训教程, 共包含 10 门 ADS 学习培训课程 课程是由具有多年 ADS 使用经验的微波射频与通信系统设计领域资深专家讲解, 并多结合设计实例, 由浅入深 详细而又全面地讲解了 ADS 在微波射频电路设计 通信系统设计和电磁仿真设计方面的内容 能让您在最短的时间内学会使用 ADS, 迅速提升个人技术能力, 把 ADS 真正应用到实际研发工作中去, 成为 ADS 设计专家... 课程网址 : http://www.edatop.com/peixun/ads/13.html 我们的课程优势 : 成立于 2004 年,10 多年丰富的行业经验, 一直致力并专注于微波射频和天线设计工程师的培养, 更了解该行业对人才的要求 经验丰富的一线资深工程师讲授, 结合实际工程案例, 直观 实用 易学 联系我们 : 易迪拓培训官网 :http://www.edatop.com 微波 EDA 网 :http://www.mweda.com 官方淘宝店 :http://shop36920890.taobao.com 专注于微波 射频 天线设计人才的培养易迪拓培训官方网址 :http://www.edatop.com 淘宝网店 :http://shop36920890.taobao.com