FSA W Low Voltage Dual DPDT Analog Switch
|
|
|
- 滕 雍
- 7 years ago
- Views:
Transcription
1 0.4: Low Voltage Dual DPDT Analog Switch General Description The FSA2467 is a Dual Double Pole Double Throw (DPDT) analog switch. The FSA2467 operates from a single 1.65V to 4.3V supply. The FSA2467 features an ultra-low On Resistance of 0.4: at a +2.7V supply and 25qC. This device is fabricated with sub-micron CMOS technology to achieve fast switching speeds and is designed for break-before-make operation. FSA2467 features very low quiescent current even when the control voltage is lower than the V CC supply. This feature services the mobile handset applications very well allowing for the direct interface with baseband processor general purpose I/Os. Features August 2005 Revised September 2005 O Typical 0.4: On Resistance (R ON ) for +2.7V supply O FSA2467 features less then 12PA I CCT current when Sn Input is lower than V CC O 0.25: maximum R ON flatness for +2.7V supply O 3x3mm 16-lead Pb-Free MLP package O Broad V CC operating range O Low THD (0.02% typical for 32: load) Applications O Cell Phone O PDA O Portable Media Player FSA : Low Voltage Dual DPDT Analog Switch Ordering Code: Order Number Package Number Package Description FSA2467MPX MLP16B Pb-Free 16-Terminal Molded Leadless Package (MLP) Quad, JEDEC MO-220, 3mm Square FSA2467MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide (Preliminary) Pb-Free package per JEDEC J-STD-020B. Application Diagram 2005 Fairchild Semiconductor Corporation DS
2 Connection Diagrams Pad Assignment for MLP Pin Assignments for TSSOP (Top Through View) (Top View) Truth Table Pin Descriptions Control Input(s) Function Pin Names Function L nb 0 Connected to na na, nb 0, nb 1 Data Ports H nb 1 Connected to na ns Control Input H = HIGH Logic Level L = LOW Logic Level Analog Symbol 2
3 Absolute Maximum Ratings(Note ) Supply Voltage (V CC ) 0.5V to +4.6V Switch Voltage (V S ) (Note ) 0.5V to V CC + 0.3V Input Voltage (V IN ) (Note ) 0.5V to +4.6V Input Diode Current 50 ma Switch Current 350 ma Peak Switch Current (Pulsed at 1 ms duration, <10% Duty Cycle) 500 ma Storage Temperature Range (T STG ) 65qC to +150qC Maximum Junction Temperature (T J ) +150qC Lead Temperature (T L ) Soldering, 10 seconds +260qC ESD Human Body Model 4500V Recommended Operating Conditions Supply Voltage (V CC ) 1.65V to 4.3V Control Input Voltage (V IN ) (Note 3) 0V to V CC Switch Input Voltage (V IN ) 0V to V CC Operating Temperature (T A ) 40qC to +85qC Note 1: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The Recommended Operating Conditions table will define the conditions for actual device operation. Note 2: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 3: Unused inputs must be held HIGH or LOW. They may not float. FSA2467 DC Electrical Characteristics (All typical values 25qC unless otherwise specified) V CC T A = +25qC T A = 40qC to +85qC Symbol Parameter (V) Min Typ Max Min Max V IH Input Voltage High to to to V IL Input Voltage Low to to to Units V V Conditions I IN Control Input Leakage 1.65 to PA V IN = 0V to V CC I NO(OFF), OFF-Leakage Current na = 0.3V, V CC 0.3V 1.95 to na I NC(OFF) of Port nb 0 and nb 1 nb 0 or nb 1 = 0.3V, V CC 0.3V or Floating I A(ON) ON Leakage Current na = 0.3V, V CC 0.3V 1.95 to na of Port A nb 0 or nb 1 = 0.3V, V CC 0.3V or Floating R ON Switch On Resistance I OUT = 100 ma, (Note 4) nb 0 or nb 1 = 0V, 0.8V, 1.8V, 2.7V : I OUT = 100 ma, nb 0 or nb 1 = 0V, 0.7V, 1.2V, 2.3V I OUT = 100 ma, nb 0 or nb 1 = 1.0V 'R ON On Resistance Matching I OUT = 100 ma, nb 0 or nb 1 = 0.8V Between Channels : I OUT = 100 ma, nb 0 or nb 1 = 0.7V (Note 5) R FLAT(ON) On Resistance Flatness : I OUT = 100 ma, nb 0 or nb 1 = 0V to V CC (Note 6) I CC Quiescent Supply Current na V IN = 0V or V CC, I OUT = 0V I CCT Quiescent Supply Current V IN = 1.8 PA V IN = 2.6 Note 4: On Resistance is determined by the voltage drop between A and B pins at the indicated current through the switch. Note 5: 'R ON = R ONmax R ONmin measured at identical V CC, temperature, and voltage. Note 6: Flatness is defined as the difference between the maximum and minimum value of On Resistance over the specified range of conditions. 3
4 AC Electrical Characteristics (All typical value 25 C unless otherwise specified) V CC T A = +25 C T A = 40 C to +85 C Figure Symbol Parameter Units Conditions (V) Min Typ Max Min Max Number t ON Turn ON Time 3.6 to nb 0 or nb 1 = 1.5V, 2.7 to ns R L = 50:, C L = 35 pf Figure to t OFF Turn OFF Time 3.6 to nb 0 or nb 1 = 1.5V, 2.7 to ns R L = 50:, C L = 35 pf Figure to t B-M Break-Before-Make 3.6 to nb 0 or nb 1 = 1.5V, Time 2.7 to ns R L = 50:, C L = 35 pf Figure to Q Charge Injection 3.6 to C L = 100 pf, V GEN = 0V, R GEN = 0: 2.7 to pc C L = 100 pf, V GEN = 0V, R GEN = 0: Figure to C L = 100 pf, V GEN = 0V, R GEN = 0: OIRR OFF-Isolation 3.6 to to db f = 100kHz, R L = 50:, C L = 5 pf (Stray) Figure to Xtalk Crosstalk 3.6 to to db f = 100kHz, R L = 50:, C L = 5 pf (Stray) Figure to BW 3db Bandwidth 2.3 to MHz R L = 50: Figure 9 THD Total Harmonic 3.6 to R L = 32:, V IN = 2V P.P, f= 20Hz to 20kHz Distortion 2.7 to % R L = 32:, V IN = 1.5V P.P, f= 20Hz to 20kHz 2.3 to R L = 32:, V IN = 1.2V P.P, f= 20Hz to 20kHz Figure 10 Capacitance V CC T A = +25 C T A = 40 C to +85 C Symbol Parameter Units Conditions (V) Min Typ Max Min Max C IN Control Pin Input Capacitance pf f = 1MHz (see Figure 8) C OFF B Port OFF Capacitance pf f = 1MHz (see Figure 8) C ON A Port ON Capacitance pf f = 1MHz (see Figure 8) 4
5 FIGURE 1. R ON at 2.7V V CC FIGURE 2. R ON at 2.3V V CC FIGURE 3. R ON at 1.8V V CC 5
6 AC Loading and Waveforms Logic Input Waveforms Inverted for Switches that have the Opposite Logic Sense C L includes Fixture and Stray Capacitance FIGURE 4. Turn-On/Turn-Off Timing C L Includes Fixture and Stray Capacitance FIGURE 5. Break-Before-Make Timing FIGURE 6. OFF Isolation and Crosstalk 6
7 AC Loading and Waveforms (Continued) FSA2467 Q = ('V OUT )(C L ) FIGURE 7. Charge Injection FIGURE 8. ON/OFF Capacitance Measurement Setup FIGURE 9. Bandwidth FIGURE 10. Harmonic Distortion 7
8 Tape and Reel Specification Tape Format For MLP Package Tape Number Cavity Cover Tape Designator Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed MPX Carrier 2500/3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed REEL DIMENSIONS inches (millimeters) Tape Size A B C D N W1 W mm (330) (1.50) (13.00) (20.20) (178) (12.4) (18.4) 8
9 Physical Dimensions inches (millimeters) unless otherwise noted FSA2467 Pb-Free 16-Terminal Molded Leadless Package (MLP) Quad, JEDEC MO-220, 3mm Square Package Number MLP16B 9
10 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC
11 0.4: Low Voltage Dual DPDT Analog Switch DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION As used herein: provided in the labeling, can be reasonably expected to 1. Life support devices or systems are devices or systems result in significant injury to the user. which, (a) are intended for surgical implant into the body, or 2. A critical component is any component of a life support (b) support or sustain life, or (c) whose failure to perform device or system whose failure to perform can be reasonably expected to cause the failure of the life support device when properly used in accordance with instructions for use or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. 11
12 易迪拓培训 专注于微波 射频 天线设计人才的培养网址 : 射频和天线设计培训课程推荐 易迪拓培训 ( 由数名来自于研发第一线的资深工程师发起成立, 致力并专注于微波 射频 天线设计研发人才的培养 ; 我们于 2006 年整合合并微波 EDA 网 ( 现已发展成为国内最大的微波射频和天线设计人才培养基地, 成功推出多套微波射频以及天线设计经典培训课程和 ADS HFSS 等专业软件使用培训课程, 广受客户好评 ; 并先后与人民邮电出版社 电子工业出版社合作出版了多本专业图书, 帮助数万名工程师提升了专业技术能力 客户遍布中兴通讯 研通高频 埃威航电 国人通信等多家国内知名公司, 以及台湾工业技术研究院 永业科技 全一电子等多家台湾地区企业 易迪拓培训课程列表 : 射频工程师养成培训课程套装该套装精选了射频专业基础培训课程 射频仿真设计培训课程和射频电路测量培训课程三个类别共 30 门视频培训课程和 3 本图书教材 ; 旨在引领学员全面学习一个射频工程师需要熟悉 理解和掌握的专业知识和研发设计能力 通过套装的学习, 能够让学员完全达到和胜任一个合格的射频工程师的要求 课程网址 : ADS 学习培训课程套装该套装是迄今国内最全面 最权威的 ADS 培训教程, 共包含 10 门 ADS 学习培训课程 课程是由具有多年 ADS 使用经验的微波射频与通信系统设计领域资深专家讲解, 并多结合设计实例, 由浅入深 详细而又全面地讲解了 ADS 在微波射频电路设计 通信系统设计和电磁仿真设计方面的内容 能让您在最短的时间内学会使用 ADS, 迅速提升个人技术能力, 把 ADS 真正应用到实际研发工作中去, 成为 ADS 设计专家... 课程网址 : HFSS 学习培训课程套装该套课程套装包含了本站全部 HFSS 培训课程, 是迄今国内最全面 最专业的 HFSS 培训教程套装, 可以帮助您从零开始, 全面深入学习 HFSS 的各项功能和在多个方面的工程应用 购买套装, 更可超值赠送 3 个月免费学习答疑, 随时解答您学习过程中遇到的棘手问题, 让您的 HFSS 学习更加轻松顺畅 课程网址 : `
13 易迪拓培训 专注于微波 射频 天线设计人才的培养网址 : CST 学习培训课程套装该培训套装由易迪拓培训联合微波 EDA 网共同推出, 是最全面 系统 专业的 CST 微波工作室培训课程套装, 所有课程都由经验丰富的专家授课, 视频教学, 可以帮助您从零开始, 全面系统地学习 CST 微波工作的各项功能及其在微波射频 天线设计等领域的设计应用 且购买该套装, 还可超值赠送 3 个月免费学习答疑 课程网址 : HFSS 天线设计培训课程套装套装包含 6 门视频课程和 1 本图书, 课程从基础讲起, 内容由浅入深, 理论介绍和实际操作讲解相结合, 全面系统的讲解了 HFSS 天线设计的全过程 是国内最全面 最专业的 HFSS 天线设计课程, 可以帮助您快速学习掌握如何使用 HFSS 设计天线, 让天线设计不再难 课程网址 : MHz NFC/RFID 线圈天线设计培训课程套装套装包含 4 门视频培训课程, 培训将 13.56MHz 线圈天线设计原理和仿真设计实践相结合, 全面系统地讲解了 13.56MHz 线圈天线的工作原理 设计方法 设计考量以及使用 HFSS 和 CST 仿真分析线圈天线的具体操作, 同时还介绍了 13.56MHz 线圈天线匹配电路的设计和调试 通过该套课程的学习, 可以帮助您快速学习掌握 13.56MHz 线圈天线及其匹配电路的原理 设计和调试 详情浏览 : 我们的课程优势 : 成立于 2004 年,10 多年丰富的行业经验, 一直致力并专注于微波射频和天线设计工程师的培养, 更了解该行业对人才的要求 经验丰富的一线资深工程师讲授, 结合实际工程案例, 直观 实用 易学 联系我们 : 易迪拓培训官网 : 微波 EDA 网 : 官方淘宝店 : 专注于微波 射频 天线设计人才的培养易迪拓培训官方网址 : 淘宝网店 :
ANSYS 在航空航天器电磁兼容、电磁干扰分析中的应
易迪拓培训 专注于微波 射频 天线设计人才的培养网址 :http://www.edatop.com 射频和天线设计培训课程推荐 易迪拓培训 (www.edatop.com) 由数名来自于研发第一线的资深工程师发起成立, 致力并专注于微波 射频 天线设计研发人才的培养 ; 我们于 2006 年整合合并微波 EDA 网 (www.mweda.com), 现已发展成为国内最大的微波射频和天线设计人才培养基地,
usbintr.PDF
USB(Universal Serial Bus) USB( ) USB, USB PCI PC USB (host) USB (device) USB 1 PC PC USB PC 2 Plug-and-Play PC Plug-and- Play USB Plug-and-Play 3 PC / USB (USB 2.0 480Mb/s) USB USB 1 1 USB Toplogy USB
,,: 65,A - 10A, 9, M1A1, 85 %: 148,35 72,1/ 6, 17 % (20 15 %) [1 ] ;1994,, 2 2,;2001, ; , ; ; F - 16 ;2 ;; F - 15 ; ;, :,,,, ,,,, M
2004 6 32 3 MODERN DEFENCE TECHNOLOGY J une 2004 Vol. 32 No. 3 Ξ,, (, 264001) :, :,,,,,,4 :; ;; : TN95911 + 7 ; TN957151 :A :10092086X(2004) 0320064205 Present situation, development and enlightenment
Ω Ω 75Ω
18 A A A 0.1 AWG10 0.001 0.7m 1 0.083 m 1 90 RC=/Kρ /P /F N+R RC K ρ / 2 1 1 ρ 2.54 P / 2 F N R 0 A 1. 2. 3. 4. 5. 1.0 0.1 0.05Ω 10 100Ω 75Ω 50Ω 12 100 0.1A 1.0V 1.0A 10V 1.0A 10V I 2 R 100V 50A 100V 1.
PCB a 2.5mm b 4.0mm A mm W/cm 3 PCB PCB 2.0mm 1.5mm PCB PCB
1. PCB PCB PCB PCB EMC EMI 2. PCB PCB PCB 3. via Blind via Buried via Through via Component hole Stand off 4. / TS S0902010001 TS SOE0199001 TS SOE0199002 IEC60194 > > > > Printed Circuit
PCB Layout using ADS November 29, 2005 PCB Layout using ADS Dr. B. Frank Department of Electrical and Computer Engineering Queen's University Slide 1
Dr. B. Frank Department of Electrical and Computer Engineering Queen's University Slide 1 Motivation Need circuit more reliable than breadboard? Working at RF/microwave frequencies? Printed circuit board
RFID Transponder operating at MHz
RF-ID Transponder operating at 13.56 MHz Radio Frequency Identification Systems (RF-ID) are widely used and allow advanced solutions for a variety of applications in the area of authentication, ticketing,
CAM350 CAM350 CAM350 CAM350 Export Gerber 274D 274X Fire9000 Barco DPF NC Drill Mill Excellon Sieb Meyer IPC D 350 IPC D A Modification CAM/Ger
CAM350 CAM350 CAM350 PCB CAM CAM350 CAM350 Fabrication Modules C350-750 C350-460 C350-260 C350-110 C350-050 Import X X X X X Information X X X X X Export X X X X Opt. Modification X X X X Opt. Optimization
DATASHEET SEARCH SITE |
2 18 GHz Ultra Low Noise Pseudomorphic HEMT Technical Data ATF-3677 Features PHEMT Technology Ultra-Low Noise Figure:.5 db Typical at 12 GHz.3 db Typical at 4 GHz High Associated Gain: 12 db Typical at
, V m 3,, I p R 1 = ( I p + I 1 ) / R 0 I p, R 1 / 4, R m V d, 1. 1 Doherty MRF6P21190 LDMOS,,, Doherty B Freescale M6P21190 ADS 2 Doherty 3 Doherty,
TN702 A 1009-2552(2007) 03-0045 - 06 Doherty, (, 430074) Doherty WCDMA ADS, 35 (45. 4dBm), ACLR - 55dBc WCDMA ; ; Doherty ; ; PAE Design of linearized Doherty power amplifier GENG Zhi, GUO Wei (Department
Design System Designer RF Analog - Designer Ptolemy Simulator System level - Designer E D A - s Modelsim RTL EDGE GSM WLAN Numeric Ptolemy Timed NC-Ve
Content Reprint Advanced Design System for Designer E D A 21 GPRS WCDMA TDS-CDMA IEEE 802.11a IEEE 802.11b IEEE 802.11g PDA CICeNews-23 CIC Agilent Advanced 1 Design System Designer RF Analog - Designer
3.1.doc
SMEMA FIDUCIAL MARK STANDARD Standard 3.1 1.0 SCOPE: This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards. SMEMA standards
DSCHA Jun 06
CHA3666 RoHS COMPLIANT 6-17GHz Low Noise Amplifier GaAs Monolithic Microwave IC Description The CHA3666 is a two-stage self biased wide band monolithic low noise amplifier. D1 D2 The circuit is manufactured
Yageo Chip Antenna Sum V doc
1 Yageo - Chip Antenna Version :Step. 2010 Features : Embedded antenna - small antennas with moderate gain and efficiency performance Ultra compact - various sizes (2012, 3012, 3216, 4018, 5010, 5320,
( ) T arget R ecogn ition),,,,,,, ( IFF, Iden tification F riend o r Foe),,,,,,, ( N CTR, N on2 Cooperative T arget R ecogn ition), (
V o l. 33, N o. 11 N ovem ber, 2008 F ire Contro l and Comm and Contro l 33 11 2008 11 : 100220640 (2008) 1120005203 1, 1, 1, 2, 1 (11, 100072, 21, 100072) :,,,, g :,,, : TN 97111 : A The Iden tif ication
第1讲-电磁兼容导论.ppt
Advanced EMC +62784709 13601024327 [email protected] 1 1 1.1 1.2 1.3 1.4 1.5 1.6 EMC 2 1 166.111.63.4:1021 emc 303 3 1975 7 14 25 26 50 700 21 4 0 400GHz EMC 1994 25 5 6 1.1 Electromagnetic Compatibility
Microsoft Word - AN95007.doc
Understanding VCO Concepts OSCILLATOR FUNDAMENTALS An oscillator circuit can be modeled as shown in Figure 1 as the combination of an amplifier with gain A (jω) and a feedback network β (jω), having frequency-dependent
PowerPoint Presentation
Sizing Handbook I 6 to 10 10w, w or 5w (3 to 4), w < Note: Port sizing guidelines are not inviolable rules true in all cases. For example, if meeting te eigt and widt requirements outlined result in a
amp_b3.PDF
San Jose State University Department of Electrical Engineering ELECTRICAL ENGINEERING SENIOR PROJECT Microwave Amplifier Design (part 3) by Steve Garcia Jaime Cordoba Inderpreet Obhi December 15, 2003
untitled
( RF Application list Application Wireless mouse Wireless Keyboard Wireless joystick FRS (Family Radio Service) Remote control Car alarm Home security Cordless phone Video sender Wireless earphone microphone
Microsoft PowerPoint - Pres_ansoft_elettronica.ppt
1,5-40 GHz Meander Spiral Antenna Simulation and Design Presenter: Fabrizio Trotta Ansoft Corporation Application Introduction Design Specification Antenna Topology Numerical Method Approach Design Methodology
Presentation - Advanced Planar Antenna Designs for Wireless Devices
2003-11 Ansoft Workshop Advanced Planar Antenna Designs for Wireless Devices 翁金輅 (Kin-Lu Wong) 國立中山大學電機系 Dept. of Electrical Engineering National Sun Yat-Sen University Kaohsiung 80424, Taiwan E-mail:
APPLI002.DOC
SIEGET 25 Silicon Bipolar- Dielectric Resonator Oscillator (DRO) at 10 GHz Oscillators represent the basic microwave energy source for all microwave systems such as radar, communications and navigation.
BranchLine Coupler - Quadrature
of 3 () Branchine oupler - Quadrature Zo Zo λ/4 90 NOTE This device is sensitive to load mismatches. () ange oupler (Quadrature) Output oupled φ90 Broadband coupling 3dB 0dB Quadrature Input λ/4 Directive
AWT6166_Rev_0.3.PMD
FEATURES Integrated Vreg (regulated supply) Harmonic Performance 25 High Efficiency (PAE) at Pmax: GSM850, 54% GSM900, 56% DCS, 53% PCS, 51% +35 GSM850/900 Output Power at 3.5 V +33 DCS/PCS Output Power
TB215.doc
2 1 C5 10uF +28 V C4 R3 3.9k C8 R5 1k C18 R10 3.9k C23 10uF D1 5.6V D2 5.6V C11 10uF D3 5.6V L6 B P1 10k L3 P2 10k L5 P3 10k L7 B R2 9.1k R4 C6 SP201 C7 T1 R6 9.1k C9 R8 C12 L4 C13 T2 C16 T3 T4a R11 9.1k
Balun Design
1 of 6 Balun Design In the design of mixers, push-pull amplifiers, baluns are used to link a symmetrical (balanced) circuit to a asymmetrical (unbalanced) circuit. Baluns are designed to have a precise
Microsoft PowerPoint - seminaari 26_5_04_antenniteknologiat.ppt
Antenna technologies Antenna technologies Current status trends Outlook to different antenna solutions, examples Summary, challenges for the future Current status trends dual-band GSM tri-band GSM GPS
書名:
8 I/O Circuit Package 8-2 VLSI / 8.1 I/O Circuit Schematic entry Layout I/O Circuit I/O IC [33] IC µm IC mm Bonding wire Bonding wire µm IC 8-1 Dual In line Package (DIP) Die Bonding Pad Bonding Wire Bonding
SGS-Apache BQB proposal_04_11_2003
BQB qualification FCC/CE/e-mark/ITA service 2003 Apr. 11, 2003 BQB Qualification Service Apache/SGS Bluetooth Products Qualification Service SIG Cat. A standard be performed since Jan., 2003 All of RF
Microsoft Word - SLVU2.8-4 Rev04.doc
Low Capacitance TVS Array Description The is low capacitance transient voltage suppressor for high speed data interface that designed to protect sensitive electronics from damage or latch-up due to ESD
CSTHandOut
CST DESIGN STUDIO TM, CST PARTICLE STUDIO TM - 1 - Linking MATLAB and CST STUDIO USER NOTE This user note is centered on the use of CST MICROWAVE STUDIO (CST MWS) with MATLAB. MATLAB is a scientific computing
Filter Design in Thirty Seconds
Application Report SLOA093 December 2001 Filter Design in Thirty Seconds Bruce Carter High Performance Analog ABSTRACT Need a filter fast? No theory, very little math just working filter designs, and in
A Miniature GPS Planar Chip Antenna Integrated with Low Noise Amplifier
A Miniature GPS Planar Chip Antenna Integrated with Low Noise Amplifier 1 Chao-Wei Wang*, Yen-Ming Chen, Chang-Fa Yang Department of Electrical Engineering, National Taiwan University of Science and Technology
pages.pdf
A Novel Dual-Band Microstrip Antenna for WLAN Application R.J. Lin, M. Ye School of Communication and Information Engineering, Shanghai University, Shanghai 200072, China Keywords: dual-band; microstrip
Novel 2-D Photonic Bandgap Structure For Microstrip Lines - IEEE Microwa ve and Guided Wave Letters
IEEE MICROWAVE AND GUIDED WAVE LETTERS, VOL. 8, NO. 2, FEBRUARY 1998 69 Novel 2-D Photonic Bandgap Structure for Microstrip Lines Vesna Radisic, Student Member, IEEE, Yongxi Qian, Member, IEEE, Roberto
Directional Couplers.doc
Directional ouplers [] THE QUADRATURE (90 ) HYBRID The Hybrid coupler is often made of microstrip or stripline as shown in Figure. The microstrip form is also pictured in Figure 2. These couplers are 3
A stair-shaped slot antenna for the triple-band WLAN applications
of the constructed prototype at 5800 MHz (center frequency of the 5.8-GHz band), and similar directional radiation patterns are also obtained. Figure 5 shows the measured peak antenna gain for operating
Microsoft Word - LR1122B-B.doc
UNISONIC TECHNOLOGIES CO., LTD LOW NOISE ma LDO REGULATOR DESCRIPTION The UTC is a typical LDO (linear regulator) with the features of High output voltage accuracy, low supply current, low ON-resistance,
Full Band Waveguide-to-Microstrip Probe Transitions - Microwave Symposium Digest, 1999 IEEE MTT-S International
THlB-5 Full Band Waveguide-to-Microstrip Probe Transitions Yoke-Choy Leong' and Sander Weinreb2 'Department of Electrical and Computer Engineering University of Massachusetts, Amherst, MA 01003 Jet Propulsion
untitled
Compact Metamaterial High Isolation MIMO Antenna Subsystem Cheng-Jung Lee, Maha Achour, and Ajay Gummalla Rayspan Corporation, San Diego, CA, USA [email protected] Introduction The use of multiple antennas
Integrated microstrip and rectangular waveguide in planar form - IEEE Microwave and Wireless Components Letters [see also IEEE Microwave and Guided Wave Letters]
68 IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 11, NO. 2, FEBRUARY 2001 Integrated Microstrip and Rectangular Waveguide in Planar Form Dominic Deslandes and Ke Wu, Fellow, IEEE Abstract Usually
Microsoft Word - Differential Circuit Comparison App note_B.doc
Sisonic and ECM in Circuits Date: Author: 20.Jan.2005 Bill Ryan Benefits of Circuits amplifiers are desirable to use in audio applications, especially those where signal levels are very low such as those
lumprlc.fm
Ansoft HFSS Engineering Note Lumped RLC Elements in HFSS Version 8 In Ansoft s High Frequency Structure Simulator (HFSS), a specified impedance boundary condition has always referred to field values because
Hybrid of Monopole and Dipole Antennas for Concurrent 2.4- and 5-GHz WLAN Access Point
Hybrid of Monopole and Dipole Antennas for Concurrent 2.4- and 5-GHz WLAN Access Point Saou-Wen Su 1, Jui-Hung Chou 2 Network Access Strategic Business Unit Lite-On Technology Corp., No. 9, Chien I Road,
Combline Cavity Filter Design in HFSS
Presented by Jim Reed of Optimal Designs 3 Pole Cavity Combline Filter to be used in Demonstration for Filter Tuning Simulated / Measured Data for Real World Example, Compliments of Sierra Microwave Technologies
3152 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 52, NO. 11, NOVEMBER 2004 (c) Fig. 2. y z plane radiation patterns ofoma computed using FDTD
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 52, NO. 11, NOVEMBER 2004 3151 An Omnidirectional Planar Microstrip Antenna Randy Bancroft and Blaine Bateman Abstract A new omnidirectional printed
HFSS Antenna Design Kit
Ansoft HFSS Antenna Design Kit Arien Sligar 2007 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary Overview of HFSS Antenna Design Kit GUI-based wizard tool Automates geometry creation, solution
Special Materials in CST STUDIO SUITE 2012
Modelling Thin Materials in CST STUDIO SUITE 2012 Lossy Metal Ohmic Sheets Tabulated Surface Impedance Thin Panel Various Material Types Material types Available in which solvers? * FIT TLM *Apart from
4.2 DC Bias
1 of Microwave Bipolar/FET Bias circuits F/Microwave transistors/fet s require some form of circuit to set the correct bias conditions for a particular F performance. There are two main types used an active
SILICON RF DEVICES
SILICON RF DEVICES Better Performance for Radio Communication Network Silicon RF Devices Better Performance for Radio Communication Network MITSUBISHI Silicon RF Devices are Key parts of RF Power Amplifications
High-Q RF-MEMS Tunable Evanescent-Mode Cavity Filter
High-Q RF-MEMS Tunable Evanescent-Mode Cavity Filter Sang-June Park, Isak Reines, and Gabriel Rebeiz Qualcomm Incorporated San Diego, CA 92121 University of California San Diego La Jolla, CA 92093 Abstract
Application Note template form-tc-004f
_äìé`çêé» Optimising Current Consumption in CSR Products October 2006 CSR Cambridge Science Park Milton Road Cambridge CB4 0WH United Kingdom Registered in England 4187346 Tel: +44 (0)1223 692000 Fax:
Vortrag Arpad.ppt
RF Power Amplifier Design Markus Mayer & Holger Arthaber Department of Electrical Measurements and Circuit Design Vienna University of Technology June 11, 21 Contents Basic Amplifier Concepts Class A,
CBW = Ri BW = - n*gd Table 3. Normalized coupling matrix for filter Wire diameter: 0.075inch I R1 =0.9
High Performance Helical Resonator Filters Ming Yu and Van Dokas COM DEV Ltd, 155 Sheldon Dr., Cambridge, Ontario, Canada, NIR 7H6 [email protected] Abstract - Complex filter functions are realized using
Balun Design
1 of 6 Balun Design In the design of mixers, push-pull amplifiers, baluns are used to link a symmetrical (balanced) circuit to a asymmetrical (unbalanced) circuit. Baluns are designed to have a precise
Triple-band triangular-shaped meander monopole antenna with two coupled lines
TRIPLE-BAND TRIANGULAR-SHAPED MEANDER MONOPOLE ANTENNA WITH TWO COUPLED LINES Horng-Dean Chen Department of Electronic Engineering Cheng-Shiu Institute of Technology Kaohsiung, Taiwan 833, R.O.C. Received
Practical RF Printed Circuit Board Design
PRACTICAL RF PRINTED CIRCUIT BOARD DESIGN Geoff Smithson. Overview The electrical characteristics of the printed circuit board (PCB) used to physically mount and connect the circuit components in a high
BKSD05TS / BKSD05W / SMF12A ( I ) SOD-523 (0603) SOD-323 (0805) SOD-123FL (1206) VF IF VR VZ (V) The series of TVS arrays are designed to protect sens
TVS/ESD 產品 攜帶型產品應用 Page: 1 BKSD05TS / BKSD05W / SMF12A ( I ) SOD-523 (0603) SOD-323 (0805) SOD-123FL (1206) VF IF VR VZ (V) The series of TVS arrays are designed to protect sensitive electronics from damage
Antenna Matching for the TRF7960 RFID Reader
Application Report SLOA135 May 2009 Antenna Matching for the TRF7960 RFID Reader John Schillinger... 1 Introduction This paper describes the design method for determining an antenna matching circuit. While
ims2001_TUIF_28_1659_CD.PDF
Bias Circuits for GaAs HBT Power Amplifiers Esko Järvinen, Sami Kalajo, Mikko Matilainen* Nokia Mobile Phones, Itämerenkatu 11-13, FIN-00180, Helsinki, Finland *Nokia Research Center, Itämerenkatu 11-13,
OVLFx3C7_Series_A3_bgry-KB.pub
(5 mm) x High brightness with well-defined spatial radiation patterns x U-resistant epoxy lens x Blue, green, red, yellow Product Photo Here Each device in the OLFx3C7 series is a high-intensity LED mounted
Microsoft Word - 466CEBEF-25A E.doc
代理产品选用指南 ( 所有产品 PB-FREE 符合 ROHS 标准 ) 1. 如韵电子 (CONSONANCE) A. 电池充电管理电路 型号 功能描述 封装 CN3052A 500MA 充电电流 USB 兼容 C/10 终止 温度监测 恒流 / 恒压 / 恒温模式 4.2V/1% 精度 ( 单节锂电池 ) SOP8 CN3052B 150MA 充电电流 USB 兼容 C/10 终止 温度监测 恒流
untitled
ICSP006 Proceedings Analysis and Simulation of UHF RFID System Jin Li, Cheng Tao Modern Telecommunication Institute, Beijing Jiaotong University, Beijing 100044, P. R. China Email: [email protected] Abstract
APN1013.qxd
A Differential VCO Design for GSM Handset Applications Application Note Introduction The differential pair of bipolar transistors is the common building block in modern RF integrated circuits. An advantage
50 IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 16, NO. 1, JANUARY 2006 Fig. 2. Geometry of the three-section PSL power divider. Fig. 5. Schem
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 16, NO. 1, JANUARY 2006 49 A Wideband Compact Parallel-Strip 180 Wilkinson Power Divider for Push Pull Circuitries L. Chiu, Student Member, IEEE, T.
