例
例 Agenda Popular Simulation software in PC industry * CFD software -- Flotherm * Advantage of Flotherm Flotherm apply to Cooler design * How to build up the model * Optimal parameter in cooler design * Optimal result Flotherm apply in system design * How to build up model * Optimal parameter in system design * Optimal result 1
例 Popular Simulation software in PC industry.. Flotherm 2
Popular Simulation software in PC industry CFD software - Flotherm a. FLOMERICS b. 路 & c., 率 80% FLOTHERM a. IC b. PCB c. d. a c b d 3
Popular Simulation software in PC industry Advantage of Flotherm i. 料 FLOTHERM 料 PCB 料 行 立 料 料 Foltherm Library : Component and material data bank 4
Popular Simulation software in PC industry Advantage of Flotherm ii 路 參數 Link to http://www.smartparts3d.com 數 5 Intel & AMD CPU Flotherm model
Popular Simulation software in PC industry Advantage of Flotherm iii Command Center 不 參數 FLOTHERM 數 行 不 heatsink pitch dimension Command Center 不 Fan duct angle 6
例 Flotherm apply to cooler design 7
Flotherm apply to CPU cooler design How to build up the model VIA C7 1.5G FSB 400Mhz GIGABYTE STA Thin Clint VIA North Bridge C700N 8 Spec : 1.W x H x D : 60 x 235 x 195 mm 2. VIA C7 1.5G FSB 400Mhz 3. Support DDR 533 2G max 4. 65w Adaptor Flotherm Model
Flotherm apply to CPU cooler design How to build up the model CPU VIA C7 : 1.5G FSB 400 MHz 10w NB VIA C700N : 3w 9
Flotherm apply to CPU cooler design Optimal parameter in cooler design * Parameter 3 + parameter 4 = constant ( 度 ) Parameter 3 : Cooler fin high Parameter 1 : Cooler fin number Parameter2 Cooler fin thickness Cooler Length 10 Depend on MB layout Dimension limits Parameter 4 : Cooler base thickness Cooler Width Depend on MB layout Dimension limits
Flotherm apply to CPU cooler design Optimal Result Fin thickness CPU T Case Fin number Fin thickness 1 1.2 1.5 1.7 6 72.44 72.15 72.42 72.36 7 70.73 70.45 70.98 71.19 8 70.11 70.31 71.13 71.53 9 70.28 70.63 72.18 73.16 10 70.89 71.76 73.89 75.31 NB T Case Fin thickness 1 1.2 1.5 1.7 6 70.30 70.03 70.30 70.24 Fin number 7 68.61 68.40 68.94 69.16 8 68.06 68.29 69.09 69.51 9 68.27 68.64 70.18 71.14 10 68.89 69.75 71.84 73.23 Fix cooler fin height @ 37 mm Ambient T & Fin base thickness @ 8 mm To change fin thickness & fin number Good Parameter assembly Fin number Fin thickness 1 1.2 1.5 1.7 6 40.22 40.38 40.96 41.17 7 40.88 42.48 42.06 42.41 8 42.50 42.57 44.43 45.07 9 44.58 45.52 47.15 47.98 10 46.63 47.49 49.72 50.24 11
Flotherm apply to CPU cooler design Optimal Result Determine fin thickness = 1 mm & fin number = 8 To change fin base & fin height Fin high cooler base CPU T case NB T case Local ambient 35 10 70.6113 69.1197 42.2365 36 9 70.4462 68.6923 42.2398 37 8 70.1083 68.0586 42.4825 38 7 70.12 67.6627 42.5354 39 6 70.25 67.2758 42.6451 40 5 70.5772 66.8597 42.7684 Each assembly has its own advantage If we focus on CPU temperature, we will choose fin height = 37 mm fin base = 8 mm Cooler Spec : 1.Fin high = 37 mm 2.Fin base thickness = 8 mm 3.Fin number = 8 4. Fin thickness = 1 mm 5. Fin width = 46 mm 12
Flotherm apply to CPU cooler design Optimal Result Temperature and air flow diagram Normally one piece mockup sample needs NTD 2000~3000. 1. Tune Fin thickness and fin numbers. Total 20 models 2. Tune Fin base and fin height Total 6 models 度 We save NTD 52K at least. 13 Cooler 度 度 Cooler 度 度
Flotherm apply to CPU cooler design We use Flotherm to design all GBT coolers Design Cooler parameter 1.Fin pitch 2.Fin thickness 3.Fin number 4.Heatpipe location 5.Heatpipe number Cooler Concept : Max performance and Min noise spec 14
例 Flotherm apply to system design 15
How to build up the model XC3S1000 4W Flotherm apply to System design I-RAM BOX spec 1.W x H x D : 145 x 44 x 175 mm 2. Support DDR 266/333/400 Mhz 3. Support max 4G RAM 4. SATA interface up to 150 mb/s Battery socket 16 Can t have venting hole 4x RAM slot
Flotherm apply to System design How to build up the model 17
Flotherm apply to System design Optimal parameter in system design Case 1 Design system thermal parameter 1.Venting hole location 2.Opening rate 3.Fan type and speed setting 4.Fan duct use or no Case 2 Case 3 Three mockup chassis cost is about NTD 30k 18
Flotherm apply to System design Optimal Result Ram Chip Battery Measure point Unit Spec - RAM BOX INLET - Local front 50 Locoal back 50 XC3S1000 85 FAN1582M 117 RAM_1 85 RAM_2 85 RAM_3 85 RAM_4 85 CASE 1 50.00 53.54 57.03 77.82 92.91 64.47 64.90 64.18 62.75 CASE 2 CASE 3 39.93 37.79 42.15 41.60 45.88 45.30 67.57 66.11 80.79 80.49 54.90 52.69 54.70 52.92 54.30 52.37 52.92 50.51 PSU SYSTEM FAN CPU COOLER (Sunflower type) ODD i-ram 19 COVER HDD x2 AGP x1 & PCI x3 FDD x2 BEZEL
Flotherm apply to System design Optimal Result Air flow diagram 20