MTXC-2835XB-MKC

产品规格书 SPECIFICATION 客户名称 Customer 客户型号 Customer No. 产品型号 Type ERP 编码 ERP No. MTXC-2835XB-MKC 客户确认 APPROVED SIGNATURES 批准 APPROVE 研究开发中心 Research & Development Center 审核 CHECK 制定 DRAW 版本号 (Version NO.): A0 文件发放日期 (Release Date): 2015-11-18 确认后请回传至 0755-33910220 Please confirm and fax back to us at 86-755-33910220. 本页仅供客户确认产品规格, 如需详细的规格书, 请登录我公司网站下载 This page is only for confirming the part No., for specific data sheet please download from our website at http://www.bmtcled.com 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 1/21

Part No. Description 产品型号说明 公司代码 :M Product Series 产品系列 : L: Lighting 照明类 B: Backlight 背光类 F: Flashlight 手电筒类 S: Special 特殊类 R: SDCM 色容差类 Size 产品型号 ( 尺寸 ) Angle 角度 Identification Code 识别码 X1 X2 X3 X4 - X5 X6 X7 - X8 X9 Product Info. 产品信息 Emitting Color 发光颜色 : C=Cool White, D=Daylight White N=Nature White, W=Warm White Power 功率 Product Type 产品类别 : T:TOP LED P:POWER LED C:CERAMIC LED S:SIDE VIEW LED M:Molding A: 铝基板 COB B: 铜基板 COB D: 陶瓷基板 COB 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 2/21

深圳市兆驰节能照明有限公司 Part Number: MTXC-2835XB-MKC 0.8-1.2W TOP LED, Working Current @ IF = 150mA Features 产品特征 Package Size: 3.5 (L) 2.8(W) 0.65 (T) mm 封装尺寸 3.5 (长) 2.8(宽) 0.65 (厚) mm Silicone Packed 采用硅胶封装 Suitable for different working environment 适应多种工作环境 Super long lifetime: 30000HRs 超长寿命 30000 小时 Anti UV 防紫外线 White colors are available in (2600K- 7000K) 可供白光(2600K-7000K) Wide viewing angle (2θ1/2=120 ) 宽角度 (2θ1/2=120 ) Device Selection Guide 物料选用指南 ITEM 项目 MATERIALS 物料 Resin 胶体 Lens Color 胶体颜色 Dice 晶片 Silicone 硅胶 Yellow 黄色 InGaN ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Applications 产品应用 Indoor 室内照明 日光灯管 灯条 室内照明 商业照明显示 广告字 广告灯箱 商业照明显示 装饰照明 柔性灯条 装饰照明 汽车内部辅助照明 其它照明和显示类 lighting: Fluorescent lamp, tube Commercial illumination and displays: Advertising words, light box Decorative lighting: light strip Automotive Other interior auxiliary lighting illumination and displays 地址 深圳市龙岗区南湾街道下李朗社区兆驰产业园 邮编 518108 URL: http://www.bmtcled.com TEL: 0755-33919961 FAX: 0755-33919759 3/21

Package Outline Dimensions 封装外形尺寸 Recommended solder pad for MTXC-2835 series 建议用于 MTXC-2835 系列的焊盘 Note: 1. UNIT: MM [INCH]. 单位 : 毫米 [ 英寸 ] 2. The tolerances unless mentioned is ±0.2 mm. 除非另有说明, 以上尺寸的公差为 ±0.2 mm 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 4/21

Absolute Maximum Ratings 极限参数 (Ta=25 ) Parameter 参数 Symbol 符号 Rating 额定值 Unit 单位 Forward Current 正向电流 I F 150 ma Operating ambient temperature 工作环境温度 Storage Temperature 储存温度 Soldering Temperature 焊接温度 Junction Temperature 结点温度 Power Dissipation 功耗 Topr -40 ~ +80 Tstg -40 ~ +80 Tsol 260(for 5 seconds) Tj 115 Pd 1000 mw Electro-Optical Characteristics 光电特性 (Ta=25 ) Parameter 参数 Viewing Angle 角度 Symbol Min. Typ. Max. Unit Condition 条件 2θ1/2 ----- 120 ------ deg If=150mA 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 5/21

Bin Code of Luminous Flux 光通量等级代码 Luminous Flux Code 光通量代码 Luminous Flux Range 光通量范围 (lm) Min. Max. 013 100 110 014 110 120 013 100 110 014 110 120 014 110 120 015 120 130 014 110 120 015 120 130 014 110 120 015 120 130 014 110 120 015 120 130 CCT(K) (typ) CRI (min.) Current (ma) 2700 80 150 3000 80 150 4000 80 150 5000 80 150 6000 80 150 6500 80 150 Note: Tolerance of Luminous Flux is ±10%. 光通量的公差为 ±10% White Bin Code of CIE1931 白光 CIE 分级代码 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 6/21

编 码 Color coordinates 颜色坐标 639 DR5 606 DF2 504 DA5 405 NB6 304 WR5 212 WA6 Code X Y 0.3275 0.3697 编 码 Code X Y 0.3174 0.3522 编 码 Code X Y 0.3047 0.3302 编 码 Code X Y / / 0.3174 0.3522 0.3047 0.3302 0.2947 0.3129 / / 641 DR9 636 DR2 / / 0.3212 0.3437 0.3085 0.3217 0.2985 0.3044 / / 0.3313 0.3612 0.3212 0.3437 0.3085 0.3217 / / 0.3351 0.3619 0.3284 0.3502 0.3218 0.3386 0.3151 0.3269 0.3284 0.3502 0.3218 0.3386 0.3151 0.3269 0.3085 0.3152 607 DE2 608 DD2 609 DC2 0.3323 0.3418 0.3256 0.3301 0.319 0.3184 0.3123 0.3068 0.3389 0.3535 0.3323 0.3418 0.3256 0.3301 0.319 0.3184 0.359 0.3894 0.3513 0.3765 0.3358 0.3502 / / 0.3513 0.3765 0.3358 0.3502 0.3286 0.3379 / / 505 DA9 501 DA2 / / 0.357 0.3695 0.3415 0.3432 0.3343 0.3309 / / 0.3647 0.3824 0.357 0.3695 0.3415 0.3432 / / 0.3916 0.41 0.383 0.397 0.3651 0.3699 / / 0.383 0.397 0.3651 0.3699 0.3585 0.3599 / / 407 NB9 401 NB2 / / 0.3935 0.3913 0.3756 0.3642 0.369 0.3542 / / 0.4021 0.4043 0.3935 0.3913 0.3756 0.3642 / / 0.4532 0.4108 0.444 0.4185 0.4344 0.3884 / / 0.444 0.4185 0.4252 0.3961 0.4252 0.3961 / / 305 WR9 301 WR2 / / 0.4534 0.4297 0.4344 0.3884 0.4158 0.3849 / / 0.4626 0.422 0.4532 0.4108 0.425 0.3772 / / 0.4752 0.4437 0.4675 0.4345 0.4496 0.4132 / / 0.4675 0.4345 0.4496 0.4132 0.4423 0.4044 / / 213 WA9 209 WA3 / / 0.4767 0.4268 0.4588 0.4055 0.4515 0.3967 / / 0.4844 0.4360 0.4767 0.4268 0.4588 0.4055 / / Note: Tolerance of Color coordinates is ±0.01. 颜色坐标 xy 的公差为 ±0.01 Bin Range of Forward Voltage 电压等级代码 Group Min VF(V) Max VF(V) 24 5.7 6.0 25 6.0 6.3 26 6.3 6.6 27 6.6 6.9 Note:Tolerance of Forward Voltage is ±0.1V. 正向电压的公差为 ±0.1V 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 7/21

Relative Spectral Power Distribution 相对光谱功率 相对光谱功率 正白光谱图 自然白光谱图 暖白光谱图 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 8/21

Electrical Characteristics 电性特征 Viewing Angle 发光角度 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 9/21

Guideline for Soldering 焊接指导 Handing of an SMD LED should be done only when the package has been cooled down to below 40 or less. This is to prevent SMD LED failures due to thermal-mechanical stress during handing. SMD LED 焊接后, 请将其冷却到 40 以下进行操作, 以防止操作过程中因热应力造成 SMD LED 损坏 1. Hand Soldering 使用烙铁人手焊接 A soldering iron of less than 20W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 300 while soldering. Each terminal of the LED is to go for less than 3 second and for one time only. 推荐使用功率低于 20W 的烙铁, 焊接时烙铁的温度必须保持在 300 以下, 且每个电极只能进行一次焊接, 每次焊接的持续时间不得超过 3 秒 Be careful because the damage of the product is often started at the time of the hand soldering. 人手焊接过程中的不慎操作易引起 LED 产品的损坏, 应当小心谨慎 2. Reflow Soldering 回流焊接 Recommended reflow soldering condition(lead-free solder) 建议的回流焊条件 ( 无铅焊锡 ) Note: 1. We recommend the reflow temperature 245 (+/-5 ).The maximum soldering temperature should be limited to 260. 建议的回流焊温度 245 (+ / - 5 ) 最大的焊接温度需限制在 260 2. Reflow soldering should not be done more than two times. 回流焊次数请勿超过两次 3. When soldering, do not put stress on the LEDs during heating. 回流焊过程中, 请勿挤压 LED 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 10/21

Test items and results of reliability 信赖度测试项目及报告 Test Item Test conditions Test Duration Sample NO. Solderability 焊锡性 T=260 ±5,5Sec 3Time 0/22 Temperature Cycle 温度循环 -40 (30min) ~25 (5min) ~100 (30min) 100cycles 0/50 High Temperature Storage 高温贮存 Ta=100 ±3 1000 hrs 0/50 Low Temperature Storage 低温贮存 Ta=-40 ±3 1000 hrs 0/50 Temperature Humidity Storage 高温湿度贮存 Life Test 1 寿命试验 1 High Temperature Life Test 高温寿命试验 Ta=60 ±3, RH=90%±3% Ta=25 ±3, If=150mA Ta=60 ±3, RH=90%±3%, If=150mA 1000 hrs 0/50 1000 hrs 0/22 240 hrs 0/22 CRITERIA FOR JUDGING THE DAMAGE Item Symbol condition Criteria for Judgment MIN MAX Forward Voltage VF IF=150 ma - Usl(1) x 1.2 Luminous Intensity Iv IF=150 ma LSL(2) X 0.7 - Note: (1)USL: Upper Standard Level (2) LSL: Lower Standard Level 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 11/21

Tape and Reel 载带和卷盘 Note: 1. The number of loaded products in the reel is 4000ea. 每卷所载产品数量为 4000pcs 2. All dimensions are in millimeters (tolerance: ±0.2). 所有尺寸单位为 mm, 公差为 ±0.2 3. Scale: None. 产品比例 : 无 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 12/21

Dry Packaging and Packaging 干式包装和包装 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 13/21

Test Circuit 测试电路 NOTE: All temperatures refer to the topside of the package, measured on the package body surface. 注 : 所有温度是指在封装本体上表面测得的温度 Handling Precautions 处理注意事项 1. Over-current-proof 过电流保护 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 客户必须采用电阻进行保护, 否则轻微电压漂移将导致电流发生巨大变化 ( 产品将被烧坏 ) 2. Cleaning 清洗 2.1 When necessary, cleaning should occur only with isopropyl alcohol (IPA) at room temperature (25ºC) for a duration of no more than one minute. Dry at room temperature for 15 minutes before use. 产品如需清洗, 只能在室温 (25ºC) 下采用异丙醇 (IPA) 清洗, 清洗时间不超过 1 秒 使用前在室温下放置 15 分钟晾干产品 2.2 The influence of ultrasonic cleaning on the SMD LED depends on factors such as ultrasonic power and the way the SMD LEDs are mounted. Ultrasonic cleaning should be pre-qualified to ensure this will not cause damage to the SMD LEDs. 超声波清洗对 SMD LED 的影响取决于超声波功率及 SMD LED 的贴装方式等因素 超声波清洗需经过预审合格, 以确保此举不会对 SMD LED 造成损害 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 14/21

3. Storage 储存 3.1 Don t open moisture proof bag before the products are ready to use. 产品在准备使用之前, 请勿打开防潮袋 3.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less. 防潮袋打开之前 :LED 应该保存在环境温度 30 ( 含 ) 以下和相对湿度 90%( 含 ) 以下的环境 3.3 After opening the package: The LED's floor life is 24 hours under 30 or less and 70% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 防潮袋打开之后 : 在环境温度 30 ( 含 ) 以下和相对湿度 70%( 含 ) 以下,LED 的使用时间是 24 小时 ; 未使 用完的 LED 需使用防潮袋密封包装 4. Baking 烘烤 It is recommended to bake before soldering when the pack is unsealed after 24hrs. The conditions are as followings: 如包装敞开超过 24 小时, 我们建议焊接前对产品进行烘烤 烘烤条件如下 : 4.1 65 ± 3 x (24hrs) and <5%RH, taped reel type 卷带 4.2 100 ± 3 x (4hrs), bulk type 散装 4.3 130 ± 3 x (2hrs), bulk type 散装 5. Operating 操作 Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 与又硬又脆的环氧封装相比, 硅胶更软, 更具弹性 尽管它的特性明显降低热应力, 但它更易被外界压力破坏 因此, 在使用硅胶封装的 LED 产品时, 应该留意安装过程中的一些特殊处理事项 不遵守操作的话可能导致 LED 损坏和失效 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 15/21

5.1 Handle the component along the side surfaces by using forceps or appropriate tools. 用镊子或合适的工具夹在元件的侧边 5.2 Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 请勿直接触摸或操作硅胶透镜表面, 这可能会损坏内部的电路 5.3 Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 若 PCB 上已贴装了 LED 且暴露在外, 请勿将 PCB 叠成堆 相互间的挤压可能会划伤硅胶透镜表面或损坏内部电路 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 16/21

5.4 The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. SMD 吸嘴的外径不应超过 LED 的尺寸以避免漏气 吸嘴的内径应尽可能大 5.5 A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 吸嘴头建议使用柔软的材料以避免 LED 硅胶表面划伤或损坏 5.6 The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 元件的尺寸必须在贴片机器上精确地程序化, 以确保准确地拾取及避免生产中的损坏 5.7 Users should be cautioned not to stare at the light of this LED product. The bright light can damage the eye. 用户应注意,LED 发光时, 请勿直视 LED 的强光可能会伤害您的眼睛 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 17/21

Chemicals Tested as Harmful 化学测试中的有害物质 In testing, BMTC has found the following chemicals to be harmful to the LEDs. BMTC recommends not using these chemicals anywhere in an LED system. The fumes from even small amounts of these chemicals may damage the LEDs. 经过测试,BMTC 发现下列化学品会对 LED 造成损害, 建议不要在任何的 LED 系统使用这些化学品 即使这些化学品量很少, 其所释放的气体也可能会导致 LED 损害 Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) 可能会致使芳香烃化合物释气的化学物 ( 如 : 甲苯, 苯, 二甲苯 ) Methyl acetate or ethyl acetate (i.e., nail polish remover) 乙酸甲酯或乙酸乙酯 ( 如 : 指甲油清洗剂 ) Cyanoacrylates (i.e., Superglue) 氰基丙烯酸酯 ( 如 : 强力胶 ) Glycol ethers (including Precision Electronics Cleaner - dipropylene glycol monomethyl ether) 乙二醇 ( 包括精密电子清洗剂 - 二丙二醇单甲醚 ) Formaldehyde or butadiene 甲醛或丁二烯 bleach 漂白剂 Cleaner spray 清洁喷雾剂 activator 活化剂 thread locker 螺丝固定胶 Sulfur,bromide,iodine,chloride 硫, 溴, 碘, 氯 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 18/21

ESD Protection During Production 生产过程中的静电保护 Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors. 当操作人员或者其他导体接触静电敏感材料时, 容易产生静电放电 The following procedures may decrease the possibility of ESD damage: 以下操作可降低静电破坏的可能性 1. Minimize friction between the product and surroundings to avoid static buildup. 将产品和外界之间的摩擦减到最低以避免静电产生 2. All production machinery and test instruments must be electrically grounded. 所有的产品设备和测试仪器必须接地 3. Operators must wear anti-static bracelets. 操作人员必须配戴静电环 4. Wear anti-static suit when entering work areas with conductive machinery. 进入带电设备工作区域时需穿防静电服 5. Set up ESD protection areas using grounded metal plating for component handling. 使用经电镀处理的金属部件接地从而建立 ESD 保护区域 6. All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less. 所有操作 IC 和 ESD 敏感器件元器件的工作台必须保持低于 150V 的静电保护 7. Maintain a humidity level of 50% or higher in production areas. 产品区域环境需保持高于 50% 的湿度水平 8. Use anti-static packaging for transport and storage. 运输和储存需使用防静电包装 9. All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality. 防静电设备及相关操作应该定期检查及评估以确保运行正常 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 19/21

Thermal Management 热管理 1. Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making he system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. 终端产品的散热设计是极其重要的 在做整体设计时请考虑 LED 的热量处理 单位输入功率的温度系数的增加受线路板的热阻,LED 在板上布置的密度和其他元器件的影响 避免热量积累和在本规格书中指定的最大额定范围内操作是必要的 2. The equation 1 indicates correlation between Tj and Ta,and the equation 2 indicates correlation between Tj and Ts 等式 1 表明 Tj 和 Ta 的相互关系, 等式 2 表明 Tj 和 Ts 的相互关系 Tj = Ta + Rthj-a *W Tj = Ts + Rthj-s *W 1 2 Tj = dice junction temperature: C Tj = 晶片结点温度 : C Ta = ambient temperature: C Ts = solder point temperature: C Ta = 环境温度 : C Ts= 焊接点温度 : C Rthj-a = heat resistance from dice junction temperature to ambient temperature : C / W Rthj-a= 晶片结温至环境温度之间的热阻 : /W Rthj-s = heat resistance from dice junction temperature to Ts measuring point : C / W Rthj-s= 晶片结温至 Ts 测量点之间的热阻 : /W W = inputting power (IFx VF) : W W= 输入功率 (IFx VF) : W 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 20/21

Humidity Indicator Card 湿度卡 After the moisture barrier bag is opened, make sure that Humidity Indicator Card does not become red at 30%RH. Otherwise, Devices require baking again under below conditions. 65 ± 3 x (24hrs) and <5%RH, taped reel type 防潮袋开封后, 应立即确认湿度卡 30% 处是否变成淡红色, 若 30% 处开始变成淡红色, 该包产品需要在如下条件下重新烘烤 : 65 ± 3 x (24hrs) and <5%RH, 卷带 地址 : 深圳市龙岗区南湾街道下李朗社区兆驰产业园邮编 :518108 21/21