深圳市芯中芯科技有限公司 SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. F-6699S V1.0 变更履历 Revision History 版本页次时间变更 Date 修订人变更内容 Change Information Version Page Edi

Size: px

Start display at page:

Download "深圳市芯中芯科技有限公司 SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. F-6699S V1.0 变更履历 Revision History 版本页次时间变更 Date 修订人变更内容 Change Information Version Page Edi"

别韩
4 years ago
Views:

2 变更履历 Revision History 版本页次时间变更 Date 修订人变更内容 Change Information Version Page Editor V.0 首次发行 initial issue / 彭昭辉 2 of 9

3 目录 (Content) 一产品概述 Product overview:... 4 二应用领域 Application area:...4 三模块方框图 Block diagram:...5 四性能参数 performance parameter:... 5 五模块尺寸图 The size of the module graph:...6 六模块脚位定义图 Module pin definition diagram:... 6 七引脚功能说明 Pin description:... 7 八电路连接注意 Design notes:...8 九注意事项 Connection circuit:...8 十推荐回流温度 Recommended reflow temperature:...9 十一应用电路 The application circuit: of 9

4 一产品概述 Product overview: F-6699S 蓝牙模块为本公司自主开发的智能型无线音频数据传输产品, 是低成本的高性价比的立体声无线传输方案, 模块采用了 BEKEN 的 BK3260S 芯片 ( 在 BK3260N 基础上增加了 PA,LNA 使能脚与 BLE 功能 ) 为模块提供了高品质的音质和兼容性, 整体性能更优越 F-6699S 蓝牙模块采用免驱动方式, 客户只需要把模块接入应用产品, 就可以快捷地实现音乐的无线传输, 享受无线音乐的乐趣 ; Intelligent wireless audio data transmission products F-6699S Bluetooth module for the independent development of the company, is a stereo radio transmission scheme of low cost and high efficiency, module uses BEKEN BK3260S chip with high quality sound and compatibility for the module, the overall performance optimization. F-6699S Bluetooth module with free driving mode, customers only need to access the application module products, wireless transmission can quickly realize the music, enjoy wireless music. TOP Bottom 二应用领域 Application area: 该模块主要用于短距离的音频传输, 可以方便地和笔记本电脑, 手机,PDA 等数码产品的蓝牙设备相连, 实现音乐的无线传输 This module is mainly used for music transmission in short distance, can be connected with mobile phone and personal computer, conveniently, the connection between PDA and other digital products, enjoy Bluetooth wireless transmission of music. 蓝牙立体声耳机 Bluetooth stereo headset 免提电话 Hands-free phone 蓝牙无线传输音频 Bluetooth wireless audio transmission 智能语音音响 Intelligent voice sound 4 of 9

2, AVRCP V.5, GAVDP V.2, HFP V.5, HSP V.

5 三模块方框图 Block diagram: 四性能参数 performance parameter: 型号 Model F-6699S 蓝牙规格 Bluetooth V4.2+EDR+BLE The Bluetooth specification 调制方式 Modulation mode GFSK,π/4 DQPSK,8DPSK 供电电压 Supply voltage Battery voltage VDD:3.3V-4.2V 支持蓝牙协议 Support Bluetooth protocol A2DP V.2, AVCTP V.4, AVDTP V.2, AVRCP V.5, GAVDP V.2, HFP V.5, HSP V.2 工作电流 Working current 30mA 待机电流 The standby current <0uA 工作温度 Working current -20ºC to 50ºC 储存温度 Storage temperature -40ºC to 80ºC 无线传输范围 The wireless transmission range 0 米 ( 可通过外接 PA,LNA 实现远距离传输 ) 0meter(Remote transmission can be achieved by connecting PA and LNA) 传输功率 Transmission power CLASS2 4dBm 灵敏度 Sensitivity -85dBm@0.%BER 频率范围 Frequency range 2.402GHz-2.480GHz 对外接口 The external interface I2C,SPI,UART,IO 音频性能 Audio performance SBC 解码 (decode) 音频信噪比 75dB The audio signal to noise ratio 模块尺寸 Module size 25X3.4X.8MM 5 of 9

6 五模块尺寸图 The size of the module graph: 六模块脚位定义图 Module pin definition diagram: 注 : 第 22,23 脚只能用 U 盘, 不能当普通 IO 口用 ; Note: the foot of 22,23 can only be used with U disk, and it can not be used as a common IO mouth. 6 of 9

7 七引脚功能说明 Pin description: Pin Symb I/O Description GND GND RF_GND 2 RF RF RF 3 GND GND RF_GND 4 TMS(GPIO9) Digital I/O JTAG pin 5 TCK(GPIO8) Digital I/O JTAG pin 6 TDO(GPIO2) Digital I/O JTAG pin 7 TDI(GPIO20 Digital I/O JTAG pin 8 RSTN Digital I/O JTAG pin / Reset pin-low active 9 NC NC NC 0 GPIO0(TX) Digital I/O UART TX GPIO(RX) Digital I/O UART RX 2 GPIO7 Digital I/O GPIO7 3 GPIO8 Digital I/O GPIO8 4 GPIO9 Digital I/O GPIO9 5 GPIO2 Digital I/O PA Enable Pin 6 GND GND Ground connect battery negative 7 NC NC NC 8 GPIO3 SD card command SD card command 9 GPIO24 Digital I/O GPIO24 20 GPIO4 SD card data SD card data 2 GPIO2 SD card clock SD card clock 22 USBP USB 接口 USBP 23 USBN USB 接口 USBN 24 GPIO22 Digital I/O GPIO22 25 GND GND GND 26 GPIO3 Digital I/O LNA Enable Pin 27 LINR AUX_INPUT LINR 28 LINL AUX_INPUT LINL 29 MICN MICN MICN 30 MICP MIC+ MICP 3 MICREF VMIC MICREF 32 AUDIOLN Audio output Left channel audio output nepative 33 AUDIOLP Audio output Left channel audio output positive 34 AUDIORP Audio output Right channel audio output positive 35 AUDIORN Audio output Right channel audio output nepative 36 5USB 5USB 5V input charging 7 of 9

8 37 VBAT Power supply Power supply 38 Power 3.3v output 39 NC NC NC 40 GND GND GND 八电路连接注意 Design notes: F-6699S 模块应用过程中, 请注意避免功放升压线路等干扰源对模块的影响, 避免模块供电回路同大功率电路单元形成串联回路, 以此来提高整机 SNR The F-6699S module in the application process, please pay attention to avoid the influence of power amplifier, a boost circuit to avoid interference source module, module power supply circuit with high power circuit unit to form a series circuit, in order to improve the SNR 九注意事项 Connection circuit: A. 关于无线蓝牙的使用环境, 无线信号包括蓝牙应用都受周围环境的影响很大, 如树木金属等障碍物会对无线信号有一定的吸收, 从而在实际应用中, 数据传输的距离受一定的影响 About the Bluetooth wireless application environment, wireless signal includes a Bluetooth application are influenced by the surrounding environment, such as Wood, metal and other obstacles will be absorbed on the wireless signal, thus in the practical application, influence the distance of data transmission B. 由于蓝牙模块都要配套现有的系统, 放置在外壳中由于金属外壳对无线射频信号是有屏蔽作用的所以建议不要安装在金属外壳中 Because Bluetooth module to complete the existing system, placed in the shell. Because of the metal shell on the radio frequency signal Is a shielding effect. It is recommended not to install in a metal shell. C.PCB 布板 : 蓝牙模块的天线部分的是 PCB 天线, 由于金属会削弱天线的功能, 在给模块布板的时候, 模块天线下面严禁铺地和走线, 若能挖空更好 PCB Layout:The antenna part of the Bluetooth module is the PCB antenna,the metal will weaken the function of antenna,while to the module layout,below the antenna module is prohibit paving and walk the line,if hollow out it is better 8 of 9

9 十推荐回流温度 Recommended reflow temperature: 十一应用电路 The application circuit: 9 of 9

10 ç RX TX RSTNRSTN TDI TDI TDOTDO TCKTCK TMSTMS GNDGND F-6699S U C4 C0 REVISION RECORD LTR ECO NO: APPROVED/DATE: v.0 The first á C8 GPIO9 GPIO8 GPIO2 GPIO20 TX RX BT_MUTE LED_BLUE LED_RED GPIO2 *** GPIO2 GPIO2 2 GPIO2 Ÿ 4.7K ½ 3 GPIO2 TX-EN ÅÅ PA R22 4.7K GND 2 RF 3 GND 4 TMS/GPIO9 5 TCK/GPIO8 6 TDO/GPIO2 7 TDI/GPIO20 8 RSTN 9 NC 0 GPIO0/TX GPIO/RX 2 GPIO7 3 GPIO8 4 GPIO9 5 GPIO2 6 GND 7 NC 8 GPIO3 9 GPIO24 20 GPIO4 2 GPIO2 22 USBP 23 USBN 24 GPIO22 GND NC/ADC VBAT 5USB AUDIORN AUDIORP AUDIOLP AUDIOLN VMIC MICP MICN AUXL AUXR GPIO3 GND VBUS AUDIO_RN AUDIO_RP AUDIO_LP AUDIO_LN MIC_BIAS MIC_P MIC_N AUX_L AUX_R AUX_DET MIC_BIAS MIC_P MIC_N C22 NC MIC C2 225 C2 225 C43 05 R20 2.2K C400P R 2.2K MIC 2 2 MIC_BIAS MIC_P C C25 05 R9 3.6K C24 NC MIC2 2 2 K R25 S4 GPIO2 SD_CMD DC_DET SD_DO SD_CLK USBP USBM IR S 2 BAT 3 U4 IR LED_BLUE LED_RED LED R5 R2 K K BLUE LED4 RED LED J PJ_3504 DET L R GND K C38 20K C 20K AUX R42 AUX_DET R40 AUX_L R4 AUX_R IO IO ADKEY ADKEYã S7 GPIO8 R23 K IR S 2 G 3 V IR R5 0K GPIO9 S3 * Ÿ { z * GND GPIO2 GPIO20 KEY S5 S6 22K R57 R53 0R S8 R52.8K% S2 R7 3.6K% S R55 6.8K% S2 R54 5K% S3 GPIO9 MODE P/P PLAY(DOUBLE) NEXT/V+ PREV/V- FILE NO. DRA-BT-RD-006 COMPANY: C-CHIP TECH. BUYER NAME: ALL BUYER DRAWN NAME: F-6699S DRAWN/DATE: á CHECKED/DATE: ö p R56 68K% S9 RELEASED/DATE: REV: V.0 SHEET: OF 2

11 REVISION RECORD LTR ECO NO: APPROVED/DATE: v.0 The first á TX ANT CHG USB D- 2 D+ 3 ID 4 GND 5 8 C5 06 Ÿ R3 33K S4 D 4 3 BAT 2 GND R29 2.2K 5 PROG CHG U3 RED LED2 R3 K 2 RX DC_DET 5VBUS + - Lithium battery BATT BAT BAT TX RX C48 8P L5 00nH C49 00P K K GPIOGPIO2 6 2 GND VA 5 3 GND GND 4 4 FMIN ROUT 3 5 GND LOUT 2 6 XTAL GND 7 SCLK VDD 0 8 SDIO RCLK 9 BK080 VER:H FM FM sio IO R2 R6 U KHZY2 C50 4.7P C55 05 C54 NC C53 NC FM_R FM_L L6 600ohm@00MHz SHEET WP CD 2 0 TF R34 3.3k SD_CLK C34 02 C33 02 SPKR D 8 D0/DO 7 VSS 6 CLK 5 VDD 4 VSS 3 CMD/DI 2 D3/CS D2 9 SD_MMC_2 SD_DO SD_CLK R2 2.2R TF ß Å 475 C9 SD_CMD AUDIO_RP FM_R GPIO2 2 : L GPIO2 2 s : H R7 k BT_MUTE C28 05 C46 05 GPIO2 R5 k R24 2K C26 04 R4 4.7K C52 05 R8 3.3K M887 U2 CTRL VOP 8 2 BYPASS GND 7 3 AB/D VDD 6 4 INN VON 5 00M/00R L3 L400M/00R C3 05 C6 06 SPKR- SPKR+ USB 5 USBM USBP USBDM/DP DP IO IO C8 225 R3 0R/NC U7 M320 6 C+ VOUT 5 2 VIN GND 4 3 C- EN D- 3 D+ 4 GND C2 05 C7 06 USB USB_A 5 AUDIO_LP FM_L AMP GPIO2 2 : L GPIO2 2 s : H R6 4.7K C 05 GPIO2 C5 05 R k R9 2K C7 04 R8 4.7K C6 05 R0 3.3K M887 U5 CTRL VOP 8 2 BYPASS GND 7 3 AB/D VDD 6 4 INN VON 5 C4 02 C M/00R L L200M/00R C9 05 C20 06 SPKL SPKR- SPKR+ FILE NO. DRA-BT-RD-006 COMPANY: C-CHIP TECH. BUYER NAME: ALL BUYER DRAWN NAME: F-6699S DRAWN/DATE: á CHECKED/DATE: GPIO2 R4 k RELEASED/DATE: REV: V.0 SHEET: 2 OF 2

GH1220 Hall Switch

GH1220 Hall Switch Unipolar Hall Switch - Medium Sensitivity Product Description The DH220 is a unipolar h all switch designed in CMOS technology. The IC internally includes a voltage regulator, Hall sensor with dynamic