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1 1 800 万像素高拍仪自动对焦模组规格书 CAM Module Product Specifications Page 1 of 13

2 2 伟达科技有限公司 (Wedatech) 是一家港资高新技术企业, 以摄像视讯应用为主业的方案设计公司, 旗下有苏州研发中心与生产中心, 深圳海瑞洋科技有限公司为其深圳子公司, 伟达科技有十几年的摄像头应用技术经验, 现自主研发高像素高清系列摄像头产品, 物理像素从 30 万 100 万 200 万 500 万 800 万 900 万等系列产品 ; 高清产品主要有 720P 1080P 高速 720P 高速 1080P 高清宽动态等系列产品 ; 主要应用领域包含 : 高清视频会议专用摄像头系列产品高拍仪摄像头方案系列产品 VTM/ATM 机专用摄像头系列产品工业相机专用摄像头系列产品笔记本电脑摄像头系列产品 3D 摄像头系列主板等高端方案产品高拍仪定焦产品系列为 : USB2.0 的 200 万像素定焦高拍仪模组 FF (SM-2M-OV01-FF) 固定焦距不用调节镜头 ; USB2.0 的 500 万像素定焦高拍仪模组 FF (SM-5M-OV06-FF) 固定焦距不用调节镜头 ; USB3.0 的 800 万像素定焦高拍仪模组 FF (SM-8M-OV01-FF) 固定焦距不用调节镜头 ; USB2.0 的 500 万像素半自动对焦模组 MF (SM-5M-OV01-MF) 手动点击鼠标菜单进行对焦清晰 ; 高拍仪自动对焦产品系列为 : USB2.0 的 500 万像素自动对焦模组 AF (SM-5M-OV01-AF) USB2.0 的 500 万像素自动对焦模组 AF (SM-5M-OV01-AF) (SM-5M-OV06-AF) 自动感应对焦最佳清晰度 ; USB3.0 的 800 万像素自动对焦模组 AF (SM-8M-OV01-AF) 自动感应对焦最佳清晰度 ; 本规格书主要描述 800 万像素自动对焦高拍仪方案产品, Page 2 of 13

3 一 Mfr M/N: SM-8M-OV01-AF 800 万像素自动对焦高拍仪模组 Revision 1.0 Customer Customer Approval 3 Approval Check Revision History Revision No.: Revised Date Revised By Description JARRY First draft Page 3 of 13

4 Contents: 1. General Description 4 2. Feature 3. Pin Description 4. Outline Dimensions 5. Image Quality Specifications 6. Inspection Standard 7. Reliability Test 8. Application Page 4 of 13

5 1. General Description 1.1 Modules Described This camera module is a USB3.0 Auto focus camera that designed for AF CAMERA. The backend IC and image sensor is adoption the WD3080 and IMX175. It is fully compliant with the USB Video Class 1.1 and 2.0 standard. The dimension of the camera module is mm(L W H). 2. Features 2.1 Sensor Specification 5 Page 5 of 13

6 6 2.2 DSP Specification TheWD3080 is a USB 3.0 High-Speed (HS) compatible PC Camera controller. The superior image signal processing engine brings sight video experience. The high performance Motion-JPEG / compression engine makes variant compression ratio to satisfy bandwidth requirement.the compliant with USB Video Class. With the integrated sensor interface and color processing engine, it can support most available CMOS sensors that range from VGA to UXGA or HD.. WD3080 is controlled by the embedded micro-controller, and the statistics for 3A (AE / AWB / AF) are built-in. The flexible architecture consists of mask ROM, internal RAM and external serial-flash which can store the customized codes and parameters. With the highly-integrated firmware architecture and the developing kit provided,it s easy for 3rd party to fulfill customized features.. Maximum Frame SXGA VGA CIF QVGA QCIF QQVGA Rate 3296x x x x x x x120 Non-compressed (YUY2) 25fps 30 fps 30 fps 60 fps 60 fps 60 fps MJPEG 15fps 30fps 60fps 60fps 60fps 60fps 60fps 万像素自动对焦高拍仪模组 AF(SM-8M-OV01-AF) 产品描述 1) 接口 :USB3.0, 兼容 USB2.0; 2) 像素 :800 万 3) 感光尺寸 :1/3.2; 4) 板型 : mm(L W H). 5) 镜头参数 :CONSTRUCTION: 5P 无畸变 ; For 1/3.2 Sensor; FOV 72º 6) 功能支持 : 线控硬件拍照录影等功能 ; 7) 捕获画面 :3296x2460( 拍照默认窗口 ); Page 6 of 13

7 8) 输出格式 :MJPG 15fps/3296x2460; 9) 支持操作系统 :Windows XP SP2 Vista Windows7.0 Windows8.0 Windows8.1 10) 驱动方式 :UVC 免驱 ; 11) 单桢捕获存储格式 :BMP/JPG; 12) 动态捕获存储格式 :AVI/WMV; 13) 适宜拍摄幅面 :A4 纸张幅面 A3 纸张幅面 ; ( 通过高拍仪外壳机构调节高度来实现 )A4 纸张幅面 ; 平行 A4 纸幅面到摄像头 PCB 的距离为 :300mm; 平行 A3 纸幅面到摄像头 PCB 距离为 :430mm; 14) 模组内容 : 含线控电路拍照电路晶振 ; 15) 高清晰度, 全幅面覆盖, 快速扫描拍照 ; 16) MIC: 有数字麦克风功能 ; 17) 工作温度 :-30~75 ; 18) 功耗 :<0.07W; 3.Pin Description Number Name Pin Type Description Pin1 USB+5V Power Power Supply for module board Pin2 USB D- IO USB differential signal Pin3 USB D+ IO USB differential signal Pin4 USB GND GND Ground of module board 7 4.Outline Dimensions Outline Dimension 50.0±0.2mm(W)x 25.0±0.2mm(L)x 8.0±0.2mm(H) Page 7 of 13

8 5.Image Quality Specifications 5.1 TEST Condition: Environment luminance: Light Box,500~800lux Inspection distance: 45cm Test chart: chart,500*332,lp Width 1.05mm,Around 1.20mm 5.

8 8 5.Image Quality Specifications 5.1 TEST Condition: Environment luminance: Light Box,500~800lux Inspection distance: 45cm Test chart: chart,500*332,lp Width 1.05mm,Around 1.20mm 5.2 Image Quality Specifications MTF Middle UL UR BL BR Spec Color/Gray/Noise ColorAverageDeltaE GrayLevel NoiseBlock0_B NoiseBlock0_G NoiseBlock0_R Blemish There should be no blemish Wound Pixel Dead and Wound Pixel criteria Page 8 of 13

9 9 Zone I H/4 Zone II V/4 Zone definition: See diagram above Table A1: Table of Grading(Under Bright Condition) Grade Dead Pixels Wound pixels Small Wound Clusters Zone I Zone II Zone I Zone II Zone I+ Zone II A <=8 Table A2: Table of Grading(Under Dark Field) Grade Dead Pixels Wound pixels Small Wound Clusters Zone I Zone II Zone I Zone II Zone I+ Zone II A <=8 Dead pixels include black pixel and bright pixel. Black Pixels are more than 30% darker than the normal mean pixel are labeled as black pixels. Bright Pixels are more than 30% brighter than the normal mean pixel are labeled as bright pixels. Wound Pixel is between 14% and 30% darker or brighter than mean pixel. A small wound cluster is defined as 1x1 to 2x2 wound pixel size in RGB raw data output and for YUV outputs are defined as 2x2 to 4x4 wound pixel size Shading Each Corner compares with the Center 50% Page 9 of 13

10 10 6.Inspection Standard 6.1 Sampling Plan Follows up MIL-STD-105E LEVEL II single and Normal plan Major AQL=0.65 ; Minor AQL= Inspection Items and Process Visual Inspection Visual inspection need to be done under illuminant 500 ~ 600 lux, Puts the sample around 30 cm far from inspector, checks it from 0 ~ 60 degree to each side at least 5 second by following the sequence from UP to DOWN, then, LEFT to RIGHT by screening. Dimensions measuring must use a Vernier and/or an Altimeter Checking list Inspection Items Label or Mark Anti-Static packing PCB surface Criteria Model name, Part number and Quantity must be filled in correctly. 1. A desiccative must put into Bag. 2.Must be a vacuum-packed after Sealed bag off. Not allow to see serious scratched, excess glue or broken Defect Maj. Min. Lens surface Must be fixed well by glue V Lens joint Total Height from Lens to PCB surface. Not allows to excess glue over the width of Lens Holder. 6±0.2 MM V Connector Not allow scratch and dirty V Width of Module 14.0±0.2 MM V V V V V Joint of Lens Holder and PCB Must be firmed, not allows to see gap or warp. V Page 10 of 13

11 Image Function(Bad Pixel, Wound Pixel Dark, Shut-down, Resolution and Blemish) 11 Must be according to Image quality specification Remark: 1. Serious Scratch: Copper or metal should be covered by painting/ coating clear to see caused by Scratch. 2. Slight scratch: Copper or metal under coating / painting can not be seen. 7. Reliability Test 7.1 Test element Each test should use a new module unless specified. 7.2 Test Schedule Qualification: During the product development and before the mass production Maintenance: when a design change can influence the function test and when the production place is changed. Vibration Test V Procedure Test parameters Procedure after test / Requirement: The Camera Module device is to be tested for all three axes, whereby a new device should be used for each axis. During the test no device part must loosen or disconnect. Set on a dummy set(100g), then test according to the condition listed below test condition: Frequency range: 5 ~ 500 Hz G value: 3 G-rms Direction: X, Y and Z-axis Duration: 15 minutes for each axis Visual inspection: No loose parts, no evidence of any damage! Functionality test: Full functionality of the Camera Module must be verified. Drop Test Purpose Scope of testing: Product requirements: Checks the robustness of the Camera Module against drop. Set on a dummy set(100g) drop from 150 cm Each 6 planes for twice. Notice that the material of the dummy set is wood. The function of the device may not be affected or impaired in any way. There may be no loose parts inside/on the test device. Page 11 of 13

12 12 Thermal Shock Purpose: Test parameters: Procedure after test / Requirement: Checks the resistance of the Camera Module against a change of the temperature. Mode of operation: Camera Module disconnected. Place test samples in Temperature Shock Chamber for 24 cycles (24 hours) at -40 for 30min, then +85 for 30min, each cycle test are 1 hour. Visual inspection: No physical change. Slight dew formation is permissible. Functionality test after the camera has returned to ambient temperature for 24hr. Full functionality of the camera must be verified. High Temperature and Humidity Storage Purpose: Test parameters: Procedure after test / Requirement: Checks the resistance of the Camera Module in a high temperature and high humidity environment. Mode of operation: Camera Module disconnected. Place test samples in Thermal/Humidity Chamber set at 65 /90%RH, 48hrs. Visual inspection: No physical change. Functionality test after the camera has returned to ambient temperature: Full functionality of the camera must be verified. Low Temperature Storage Purpose: Test parameters: Procedure after test / Requirement: Checks the resistance of the Camera Module in a low temperature environment. Mode of operation: Camera Module disconnected. Place test samples in Thermal Chamber set at -30, 48hrs. Visual inspection: No physical change. Functionality test after the camera has returned to ambient temperature: Full functionality of the camera must be verified. Connector Mating Purpose: Check the robustness of the Connecter. Page 12 of 13

13 Test parameters: (1). Mating/Un-mating male & female connector (2). Duration : 25 cycles 13 (3). Function test every 5cycles Procedure The function of the device may not be affected or impaired in anyway. after test / Requirement: Visual inspection: No loose parts, no evidence of any damage. 8 应用领域: 此产品为高拍仪主板, 主要匹配给生产高拍仪产品工厂, 银行自助终端个人自助终端, 无纸化办公设备 ; 高拍仪应用领域 : 工厂企业银行金融系统保险公司社保局档案局医院学校等 ; 无纸化办公需求场合! Page 13 of 13

HC50246_2009

HC50246_2009 Page: 1 of 7 Date: June 2, 2009 WINMATE COMMUNICATION INC. 9 F, NO. 111-6, SHING-DE RD., SAN-CHUNG CITY, TAIPEI, TAIWAN, R.O.C. The following merchandise was submitted and identified by the vendor as: