Microsoft Word - RL-SM02BD-8723BS-V1.0 规格书.doc

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1 SPECIFICATION IEEE B/G/N 2.4GHz 1T1R WiFi with Bluetooth2.1/3.0/4.0, and FM controller with SDIO interface, and HS-UART mixed interface NT-SM02BD-8723BS-12 WF+ BT+ FM Combo Module Version 1.0

2 PRODUCT DESCRIPTION SM02BD is a small size and low profile of WF+BT+FM combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0. SM02BD uses Realtek RTL8723BS, a highly integrated WiFi/BT single MODULE based on advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. PRODUCT FEATURES Operate at ISM frequency bands (2.4GHz) GSPI/SDIO for WiFi and UART for Bluetooth IEEE standards support: IEEE b, IEEE g, IEEE n, IEEE d, IEEE802.11e, IEEE h, IEEE i Fully Qualified for Bluetooth EDR specification including both 2Mbps and 3Mbps modulation mode Fully qualified for Bluetooth 3.0 Fully qualified for Bluetooth 4.0 Dual mode Full speed Bluetooth operation with Piconet and Scatternet support. Enterprise level security which can apply WPA/WPA2 certification for WiFi. WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates For WiFi/BT, it uses fixed path for WiFi and BT, which means one antenna assigned for WiFi and the other is assigned for BT. Support Bluetooth adaptive power management mechanism Full-featured software utility for easy configuration and management RoHS compliance Low Halogen compliance

3 Diagram Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250 C Number of Times : 2 times

4 PRODUCT SPECIFICATIONS Module Name Main chipset Standards NT-SM02BS-8723BS-12 RTL8723BS (WiFi/BT/FM Single Chips) WiFi: IEEE b, IEEE g, IEEE n, IEEE d, IEEE e, IEEE h, IEEE i BT: V2.1+EDR/BT v3.0/bt v3.0+hs/bt v4.0 Bus Interface WiFi: GSPI/SDIO BT: UART Data Rate WiFi: b: 11, 5.5, 2, 1 Mbps g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps n: MCS 0 to 7 for HT20MHz MCS 0 to 7 for HT40MHz BT: 1 Mbps for Basic Rate 2,3 Mbps for Enhanced Data Rate 6,9,12,18,24,36,48,54 Mbps for High Speed Media Access Control Modulation Techniques Network Architecture OS supported Frequency Range Operating Channel Operating Voltage Transmit Output Power 1x1 (Tolerance:±1.5dBm) Receiver Sensitivity Security Power Consumption (3.3V) (Typical) WiFi: CSMA/CA with ACK BT: AFH, Time Division WiFi: b: CCK, DQPSK, DBPSK g: 64 QAM, 16 QAM, QPSK, BPSK n: 64 QAM, 16 QAM, QPSK, BPSK BT: 8DPSK, π/4 DQPSK, GFSK WiFi: Ad-hoc mode (Peer-to-Peer ) Infrastructure mode Software AP WiFi Direct BT: Pico Net Scatter Net Linux/Android 2.400GHz ~ GHz WiFi 2.4GHz: 11: (Ch. 1-11) United States 13: (Ch. 1-13) Europe 14: (Ch. 1-14) Japan BT 2.4GHz: Ch. 0 ~ V ±9% I/O supply voltage b@11Mbps 16dBm BT: Max +10dBm b@11Mbps -82dBm Storage Temperature Ambient Operating Temperature 0-70 Junction Temperature g@6Mbps 15dBm g@54Mbps 14dBm g@54Mbps -71dBm n 13dBm (MCS 0_HT20) 13dBm (MCS 7_HT20) 12dBm (MCS 0_HT40) 12dBm (MCS 7_HT40) n -67dBm (MCS 7_HT20) -64dBm (MCS 7_HT40) BT: -89dBm@1Mbps, -90dBm@2Mbps, -83dBm@3Mbps WiFi : WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE x, IEEE i BT: Simple Paring WiFi only TX Mode: (Conituous mode) 85mA(MCS7/BW40/13dBm) RX Mode: (Conituous mode) 75mA(MCS7/BW40/-60dBm) Associated Idle with DTIM=1 2.1mA Unassociated Idle: 0.1mA RF disable Mode: 0.1mA BT : Inquiry & Page Scan: 0.9 ma ACL no traffic: 7.5mA SCO HV3: 15mA

5 Mechanical Dimensions (mm) 12 (Tolerance:±0.2mm) Length Width Height 12 (Tolerance:±0.2mm) 1.6 (Tolerance:±0.2mm) Module Pocture

6 Pin Description PIN Function Description 1 GND Grond 2 WiFi/BT_ANT 3 NC NC 4 NC NC 5 NC NC 6 BT_WAKE HOST wake-up Bluetooth device 7 BT_HOST_WAKE Bluetooth device to wake-up HOST 8 NC NC 9 VABT 3.3V±0.1V(Main power voltage source input) 10 NC NC 11 NC NC 12 WL_DSI Shared with GPIO9 This Pin Can Externally Shutdown the RTL8723BS WLAN function when BT_DISn is Pulled Low. When this pin deasserted, SDIO interface will be disabled. This pin can also support the WLAN Ra dio-off function with host interface remaining connected. 13 WL_HOST_WAKE WLAN to wake-up HOST 14 SDIO_Data_2 SDIO data line 2 15 SDIO_Data_3 SDIO data line 3 16 SDIO_CMD SDIO command line 17 SDIO_CLK 18 SDIO_Data_0 SDIO data line 0 19 SDIO_Data_1 SDIO data line 1 20 GND Grond 21 NC NC 22 VDD_IO 3.3V±0.1V 23 NC NC 24 SUSCLK_IN Shared with GPIO6. External 32K or RTC clock input with 1.8V ~ 3.3V swing. This clock source is configured by BT and WL FW, respectively. 25 PCM_DOUT PCM Data output 26 PCM_CLK PCM Clock 27 PCM_DIN PCM data input 28 PCM_SYNC PCM sync signal 29 NC NC 30 26MHz_IN Reference clock input 26MHz Active Crystals (or if pin10/11 input,pin30 NC ) 31 GND Grond 32 NC NC 33 GND Grond 34 BT_DIS# General Purpose Input/Output Pin 35 NC NC 36 GND Grond 37 NC NC 38 NC NC 39 NC NC 40 NC NC RF I/O Port 41 GND Grond SDIO CLK line 42 UART_OUT HOST Data output 43 UART_IN HOST Data input 44 UART_CTS HOST_CTS

7 WIFI\BT RF Circuit reference pictures 注 :1. 以上虚线框的部分需要进行天线匹配, 以实际天线匹配的电子元器件参数为准. 2. 以上为 RF 走线要做 50 欧姆阻抗, 走线不能走 90 度, 走线长度不能超过 15mm. Note: The RF part layout must do 50 Ωimpedance.,can't get the line go 90,can't get the line longer than 15 mm. SDIO interface Circuit reference pictures FM interface Circuit reference pictures

8 Wireless module before the SMT note: 1.When customers Open stencil must be sure the hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm. 2.Can't get the wifi module bare hands when needs,must we wear the gloves and static ring. 3.The furnace temperature according to the size of the customer the mainboard,generally like to stick on a tablet standard temperature of ,can do Wifi 模块贴片装机前注意事项 : 1. 客户在开钢网时一定要将 wifi 模块焊盘的孔开大, 请按 1 比 1 再向外扩大 0.7mm 比例开钢网, 厚度按 0.12mm. 2. 有需要拿 wifi 模块时不可以光手去拿, 一定要戴上手套以及静电环. 3. 过炉温度要根据客户主板的大小而定, 一般像平板电脑上的标准温度为 , 也可以做到 Wifi 模块储存及使用管制应注意事项如下 : Storage and use Wifi module control should pay attention to the following matters: 1.Module of the storage life of vacuum packaging: 1-1.Storage life:12 months. Storage conditions:<40. Relative humidity:<90%r.h. 1-2.After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3.Check the humidity card :stored at 20%RH.If : 30%~40%(pink)or greater than 40%(red).Labeling module has moisture absorption. 1 Mounthed within 168 hours at factory conditions of: t 30%, 60%R.H. 2 Once opened, the workshop the preservation of life for 168 hours. 1-4.If baking is required,devices may be baked for: 1 Modules must be to remove module moisture problem. 2 Baking temperature: 125, 8 hours. 3 After baking, put proper amount of desiccant to seal packages. 1-5.Module vacuum packing 2000 PCS per disc. 2.Module reel packaging items as follows. 2-1.Storage life:12 months. Storage conditions:<40. Relative humidity:<90%r.h. 2-2.Module apart packing after 168 hours,to launch patch need to bake, to remove the module hygroscopic, baking temperature conditions:125,8hours. 2-3.Reel packing 2000 PCS or 1000 PCS per disc. 3.Module pallet packaging items as follows: 3-1.Storage life : 3 months. Storage conditions:<40. Relative humidity:<90%r.h. 3-2.Module if not used within 48 hours, before launch the need for baking, baking temperature: 125, 8 hours. 3-3.Pallet packaging each plate is 100 PCS to 1000 PCS or 2000 PCS shipment. 1. 模块的真空包装之储存期限 : 1-1. 保存期限 :12 个月, 储存环境条件 : 温度在 :<40, 相对湿度 : <90%R.H 模块包装被拆后,SMT 组装之时限 : 1-3. 检查湿度卡 : 显示值应小于 30%( 蓝色 ), 如 :30%~40%( 粉红色 ) 或者大于 40%( 红色 ) 表示模块已吸湿气. 1 工厂环境温度湿度管制 : 30%, 60%R.H 2 拆封后, 车间的保存寿命为 168 小时 如在拆封后的 168 个小时内未使用完, 需要烘烤, 烘烤条件如下 : 1 模块须重新烘烤, 以除去模块吸湿问题. 2 烘烤温度条件 :125,8 小时. 3 烘烤后, 放入适量的干燥剂再密封包装 模块真空包装每盘 2000pcs, 真空包装图片 <1> 2. 模块卷盘包装事项如下 : 2-1. 保存期限 :12 个月, 储存环境条件 : 温度在 :<40, 相对湿度 : <90%R.H 模块拆开包装 168 小时后, 如要上线贴片需要重新烘烤, 以除去模块吸湿问题, 烘烤温度条件 125,8 : 小时 2-3. 卷盘包装标准为每盘 2000pcs, 也可以 1000pcs. 3. 模块托盘包装事项如下 : 3-1. 保存期限 :3 个月, 储存环境条件 : 温度在 :<40, 相对湿度 : <90%R.H 模块如在 48 小时内未使用, 在上线之前需要进行烘烤, 烘烤温度条件 :125,8 小时 3-3. 托盘包装每盘为 100pcs, 以 1000pcs 或 2000pcs 出货.

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