RoHS Declaration of Compliance

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1 Model:Product Server P4000CP4, Boards S2600CP2, CP4 Note: This declaration applies to all associated product codes starting on Page 2 Material Declaration Data Sheet Manufacturer: Intel Corporation Lead Free (Pb) Product: Yes/RoHS6, 6/6 Date: November 29, 2012 Restriction on Hazardous Substances (RoHS) Compliance RoHS Definition Quantity limit of 0.1% by mass (1000PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) Quantity limit of 0.01% by mass (100 PPM) for: Cadmium Intel understands RoHS requires: Lead and other materials banned in the RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. (Note: RoHS implementing details are not fully defined and may change.) RoHS Declaration 6a Lead as an alloying element in steel containing up to 0.35 % lead by weight. 6b Lead as an alloying element in aluminum containing up to 0.4 % lead by weight. 6c Lead as an alloying element in copper containing up to 4 % lead by weight. 7a Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead) 7b Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications. 7c-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. 7c-II Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher. 7c-III Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC. 8b Cadmium and its compounds in electrical contacts. 11b Lead used in other than C-press compliant pin connector systems. 13b Cadmium and lead in filter glasses and glasses used for reflectance standards. 15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 20 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs) 21 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses. 24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic capacitors 25 Lead oxide in surface conduction electron emitter displays (SED) used in structural elements: notably in the seal frit and frit ring. 31 Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting). 33 Lead in solders for the soldering of thin copper wires of 100um diameter and less in power transformers. 34 Lead in cermet-based trimmer potentiometer elements. Other (Include exemption number) Where the product is declared to meet RoHS requirements, it has been verified to be in conformance with 2011/65/EU as we currently understand the requirements. Intel has systems in place to verify conformance with all applicable environmental requirements and to the best of our knowledge the information is true and correct. INTEL ACCEPTS NO DUTY TO UPDATE THIS DECLARATION OR TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS DECLARATION THAT HAS BEEN UPDATED OR CHANGED. 1

2 Product Code Information Product Code Description *RoHS Exemption # S2600CP4 board P4000 pedestal chassis, rackable* 6a,6b,6c,7a,,15 P4308CP4MHEN 8x3.5 HSB, 1 550W PSU, Silver efficiency, RAID C600 Upgrade Key RKSATA8 S2600CP4 board P4000 Pedestal chassis, rackable* 8x3.5 6a,6b,6c,7a,,15 P4308CP4MHGC HSB, 2 750W CRPS, Platinum efficiency, RAID C600 Upgrade Key RKSATA8 S2600CP4 board P4000 Pedestal chassis, rackable* 8x2.5 6a,6b,6c,7a,,15 P4208CP4MHGC HSB, 2 750W CRPS, Platinum efficiency, RAID C600 Upgrade Key RKSAS8 P4308XXMHEN P4000 Pedestal chassis KDK 6a,6b,6c,7a, Intel Server Bd S2600CP2 Retail Single pk, Dual NIC, 6- DBS2600CP2IOC Gb/s SAS Intel Server Board S2600CP2 Retail Single pk; Dual NIC, DBS2600CP2 C600 BBS2600CP2J Intel Server Board S2600CP2 10-pack; Dual NIC, C602J BBS2600CP2 Intel Server Board S2600CP2 OEM 10-pack with Dual NIC BBS2600CP4 Intel Server Board S2600CP4 OEM 10-pack with Quad NIC DBS2600CP4 Intel Server Board S2600CP4 Retail Single pk w/quad NIC Intel Server Board S2600CP4 Rtl Single pk, Quad NIC, DBS2600CP4IOC 6Gb/s SAS FUPNRPSADP P4000 Non-Redundant Power Supply adaptor kit Compliant without exemption FUPCRPSCAGE Common Pedestal CRPS PSU cage assembly Compliant without exemption Power Distribution Board Spare (Low Current) for P4000 Compliant without exemption FUPPDBLC chassis FUPPDBHC Power Distribution Board Spare (High Current), P4000 chassis 7a, AUPSRCBTP Spare/Accessory SRC-B tower passive heat sinks Compliant without exemption BXSTS200P Intel Boxed Thermal Solutions, passive 25.5mm heat sink Compliant without exemption Intel Boxed Thermal Solutions, heat sink combo with 6c, 7a, BXSTS200C removable fan supports E processors FUPMLHSFAN 80mm system fan kit for P4000M/P4000L server 7a, FUPNHFANCPU 120mm fixed fan 6c, 7a, FUPMNHFANPCI Fixed Fan spare kit for P4000M (24 ) for PCI area fan 6c,7a,,7c2 Air duct and unique cable kit for Intel Server Board S2600CP Compliant without exemption FCPUPMAD to be used Intel Server Chassis P4000M AXXELVRAIL Value Rail Kit Compliant without exemption Advanced rail kit for P4000 Server Chassis used when Compliant without exemption AXX3U5UPRAIL converting Pedestal chassis to 4U rack chassis Rack Cable Management for use with Advanced Rail Kit Compliant without exemption AXX3U5UCMA AXX3U5UPRAIL Bezel spare for P4000 server chassis with fixed drives (no Compliant without exemption FUPBEZELFIX door) Bezel spare for P4000 server chassis with Hot Swap HDDs Compliant without exemption FUPBEZELHSD (w/door for HS bays) Rack bezel kit for converting P4000 pedestal server chassis to Compliant without exemption AUPBEZEL4UF rack chassis AUPBEZEL4UD Rack bezel accessory for P4000 chassis in rack configuration Compliant without exemption 2

3 - security door only FXXFPANEL Front Panel board spare for P4000 server chassis, 7c2 A4ULCP LCP Module (local control panel) AXX2IOS I/O Shield spare/accessory for Intel Server Board S2600CP2 Compliant without exemption AXX4IOS I/O Shield spare/accessory for Intel Server Board S2600CP4 Compliant without exemption Bracket for securing full length GPU cards to fan bulkhead, for Compliant without exemption AUPMGPUBR use in P4000M FUPMMSK Chassis Maintenance kit for UPM (Mechanical Spares Kit) Compliant without exemption FUPMESK Chassis Maintenance kit for UPM (Electric Spares Kit) Compliant without exemption FPWRCABLENA North American Power Cord Spare Compliant without exemption FUP8X35HSBP Spare 8x3.5" Hot Swap Backplane 8x2.5" hot swap HSBP spare (for R2200, and P4200 Chassis FXX8X25HSBP families) FXX8X25DPBP Spare 8x2.5" Dual Port Hot Swap Backplane FUP4X35HSDK 3.5" Hot Swap Drive Kit for P4000 server chassis FUP8X35HSDK 8x3.5" Hot Swap Drive Cage Kit for P4000 server chassis FUP8X25HSDKS 8x2.5 Hot Swap Drive Cage Kit for P4000 server chassis FXX35HSADPB 3.5 HDD Hot Swap Drive Carrier spares for P4300 chassis Compliant without exemption FXX25HSCAR 2.5 HDD Hot Swap Drive Carrier spares for P4200 Compliant without exemption FUP4X35NHDK Fixed Drive Carrier spare for P4300 server chassis (compatible with 2.5 HDDs/SSDs) Compliant without exemption RMS25PB080 Intel Integrated RAID Module RMS25PB080, PCIe Slot, LSI2208 ROC, 8P Internal SAS/SATA RMS25PB040 Intel Integrated RAID Module RMS25PB040, PCIe Slot, LSI2208 ROC, 4P Internal SAS/SATA RMT3PB080 Intel Integrated RAID Module RMT3PB080, PCIe Slot, LSI2208 ROC, 8P Internal SATA (only) RMS25KB040 Intel Integrated RAID Module RMS25KB040, PCIe Slot, LSI2308 SAS Chip, 4P Internal SAS, LSI IR RAID 0,1,1E Intel Integrated RAID Module RMS25CB080, SIOM RMS25CB080 Connector, LSI2208 ROC, 8P Internal SAS, MegaRAID SWStack, 1GB DDR3, R0,1,10,5,50,6,60 Intel Integrated RAID Module RMS25CB040, SIOM RMS25CB040 Connector, LSI2208 ROC, 4P Internal SAS, MegaRAID SWStack, 1GB DDR3, R0,1,10,5,50,6,60 Intel Integrated RAID Module RMT3CB080, SIOM RMT3CB080 Connector, LSI2208 ROC, 8P Internal SATA (only), MegaRAID SWStack, 512MB DDR3, R0,1,10,5,50,6,60 RMS25JB080 Intel Integrated RAID Module RMS25JB080, SIOM Module Slot, LSI2308 SAS Chip, 8P Internal SAS, LSI IR RAID 0,1,1E RMS25JB040 Intel Integrated RAID Module RMS25JB040, SIOM Module Slot, LSI2308 SAS Chip, 4P Internal SAS, LSI IR RAID 0,1,1E AXX1FDRIBIOM Single port, FDR speed Infiniband module with QSFP AXXTPME5 Trusted Platform Module for server systems AXX2UPCIEX16 2U PCIe x 16 riser, 1 slot, x16 electrical/x16 mechanical Compliant without exemption 2U PCIe x16 riser, 3 slots, one x8 electrical/x16 mechanical + Compliant without exemption AXX2UPCIEX8X4 two x4 electrical/x8 mechanical AXX1UPCIEX16 1U PCIe x16 riser, 1slot, x16 electrical/x16 mechanical Compliant without exemption RES2CV240 Integrated 24-port 6G SAS expander 3

4 RES2CV360 Integrated 36-port 6G SAS expander AXX4P1GBPWLIOM Quad port 1GbE IO Module,Intel Ethernet Controller I350 AXX10GBTWLIOM Dual RJ-45 port 10GBASE-T IO module, Intel I350 Ethernet AXX10GBNIAIOM Dual SFP+ port 10GbE IO module,intel Gigabit Intel RAID Smart Battery AXXRSBBU9 for mainstream 6a, AXXRSBBU9 RS25, RMS25, RT3 and RMT3 family RAID products. AXXRMFBU2 Maintenance Free Backup Unit,NAND Flash & Supercapacitor 6a, RKSATA4R5 Intel RAID C600 Upgrade Key RKSATA4R5, Black RKSATA8 Activation key for 8 SATA ports and includes RSTe SW RAID 0/1/10/5 and LSI SW RAID 0/1/10, Blue RKSATA8R5 Activation key for 8 SATA ports and includes RSTe SW RAID 0/1/10/5 and LSI SW RAID 0/1/10/5 (LSI SWR5), White RKSAS4 Intel RAID C600 Upgrade Key RKSAS4, Green RKSAS4R5 Intel RAID C600 Upgrade Key RKSAS4R5, Yellow RKSAS8 Activation key for 8 SAS ports and includes RSTe SW RAID 0/1/10 (no RAID 5) and LSI SW RAID 0/1/10, Orange RKSAS8R5 Activation key for 8 SAS ports and includes RSTe SW RAID 0/1/10 (no RAID5) & SW RAID 0/1/10/5 (LSI SWR5), Purple AXXRMM4 Remote Management Module, KVM,Dedicated NIC module AXXRMM4LITE Remote Management Module for upgrading to Remote KVM AXXRMM4IOM PCI Express x16 (164 pin) riom riser & riom carrier board kit FXX460GCRPS 460W Common Redundant PS, 80 Plus Gold Efficiency 6a,6b,6c,7a, FUP550SNRPS 550W Fixed Power Supply, 80 Plus Silver Efficiency 6a,6b,6c,7a, FXX750PCRPS 750W Common Redundant PS, 80 Plus Platinum Efficiency 6a,6b,6c,7a, FXX1200PCRPS 1200W Power Supply Spare, 80 Plus Platinum Efficiency 6a,6b,6c,7a, FHW1U16RISER Riser Spare 7a AXXCBL650MSMS AXXCBL850MS7R Kit of 2 cables, 650mm length, straight SFF-8087 to SFF-8087 Compliant without exemptions connectors. Kit of 2 cables, 850mm length, straight SFF-8087 to right angle Compliant without exemptions 7-pin SATA connectors. * RoHS Exemption # corresponds with exemption # s found on page 1. 4

5 部件名称 (Parts) 关于符合中国电子信息产品污染控制管理办法的声明 Management Methods on Control of Pollution from Electronic Information Products (China RoHS declaration) 产品中有毒有害物质的名称及含量铅 (Pb) 汞 (Hg) 有毒有害物质或元素六价铬 (Cr6+) 镉 (Cd) 多溴联苯 (PBB) 多溴二苯醚 (PBDE) 印刷板组件 Printed Board Assemblies (PBA) : 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 标准规定的限量要求以下 :Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T : 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 标准规定的限量要求 :Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 对销售之日的所售产品, 本表显示我公司供应链的电子信息产品可能包含这些物质注意 : 在所售产品中可能会也可能不会含有所有所列的部件 This table shows where these substances may be found in the supply chain of our electronic information products, as of the date of sale of the enclosed product. Note that some of the component types listed above may or may not be a part of the enclosed product. 除非另外特别的标注, 此标志为针对所涉及产品的环保使用期限标志. 某些可更换的零部件可能会有一个不同的环保使用期限 ( 例如, 电池单元模块 ). 此环保使用期限只适用于产品在产品手册中所规定的条件下工作. 20 The Environment-Friendly Use Period (EFUP) for all enclosed products and their parts are per the symbol shown here, unless otherwise marked. Certain fieldreplaceable parts may have a different EFUP (for example, battery modules) number. The Environment-Friendly Use Period is valid only when the product is operated under the conditions defined in the product manual.

6 部件名称 (Parts) 关于符合中国电子信息产品污染控制管理办法的声明 Management Methods on Control of Pollution from Electronic Information Products (China RoHS declaration) 产品中有毒有害物质的名称及含量铅 (Pb) 汞 (Hg) 有毒有害物质或元素六价铬 (Cr6+) 镉 (Cd) 多溴联苯 (PBB) 多溴二苯醚 (PBDE) 主板组件 Motherboard Assembly : 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 标准规定的限量要求以下 :Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T : 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 标准规定的限量要求 :Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 对销售之日的所售产品, 本表显示我公司供应链的电子信息产品可能包含这些物质注意 : 在所售产品中可能会也可能不会含有所有所列的部件. This table shows where these substances may be found in the supply chain of our electronic information products, as of the date of sale of the enclosed product. Note that some of the component types listed above may or may not be a part of the enclosed product. 除非另外特别的标注, 此标志为针对所涉及产品的环保使用期限标志. 某些可更换的零部件可能会有一个不同的环保使用期限 ( 例如, 电池单元模块 ). 此环保使用期限只适用于产品在产品手册中所规定的条件下工作. 20 The Environment-Friendly Use Period (EFUP) for all enclosed products and their parts are per the symbol shown here, unless otherwise marked. Certain fieldreplaceable parts may have a different EFUP (for example, battery modules) number. The Environment-Friendly Use Period is valid only when the product is operated under the conditions defined in the product manual.

7 关于符合中国电子信息产品污染控制管理办法的声明 Management Methods on Control of Pollution from Electronic Information Products (China RoHS declaration) 产品中有毒有害物质的名称及含量部件名称 (Parts) 铅 (Pb) 有毒有害物质或元素 (Hazardous Substance) 汞镉六价铬多溴联苯多溴二苯醚 (Hg) (Cd) (Cr6+) (PBB) (PBDE) 机箱子组件 Chassis subassembly 电源 Power Supply 印刷板组件 Printed Board Assemblies (PBA) : 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 标准规定的限量要求以下 :Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T : 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 标准规定的限量要求 :Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 对销售之日的所售产品, 本表显示我公司供应链的电子信息产品可能包含这些物质注意 : 在所售产品中可能会也可能不会含有所有所列的部件 This table shows where these substances may be found in the supply chain of our electronic information products, as of the date of sale of the enclosed product. Note that some of the component types listed above may or may not be a part of the enclosed product. 除非另外特别的标注, 此标志为针对所涉及产品的环保使用期限标志. 某些可更换的零部件可能会有一个不同的环保使用期限 ( 例如, 电池单元模块 ). 此环保使用期限只适用于产品在产品手册中所规定的条件下工作. 20 The Environment-Friendly Use Period (EFUP) for all enclosed products and their parts are per the symbol shown here, unless otherwise marked. Certain fieldreplaceable parts may have a different EFUP (for example, battery modules) number. The Environment-Friendly Use Period is valid only when the product is operated under the conditions defined in the product manual.

HistoCore ArcadiaH Instruction for Use, V1.8, RevK

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